High-resistance input high-speed differential probe

Abstract

The utility model relates to a high-resistance input high-speed differential probe. The high-resistance input high-speed differential probe comprises a first shell, a second shell, a spring ejector pin, two first main bodies, two second main bodies and two high-resistance microprobe heads, the second shell is connected to the upper end face of the first shell, the rear ends of the interiors of the first shell and the second shell are connected with the two first main bodies, the two second main bodies are connected to the front end of the first shell, the two first main bodies are connected with the two second main bodies, and the two first main bodies are connected with the two second main bodies. The two second main bodies are respectively connected with one high-resistance microprobe head; the spring ejector pin is connected to the rear end of the interior of the first shell and the rear end of the interior of the second shell. According to the high-resistance input high-speed differential probe provided by the utility model, the defects in the prior art are overcome, and during a high-speed differential test, an accurate test result can be directly obtained without a complicated verification de-embedding method.

Description

Technical Field

[0001] The utility model relates to a high-impedance input high-speed differential probe. Background Art

[0002] In microwave and high-speed test and measurement, the time delay and impedance continuity of a passive transmission system have a great impact on the signal integrity of the transmitted signal. Especially in the latest fields of AI (Artificial Intelligence) and cloud computing, PAM4_224Gbps interconnection has become a key research hotspot in the industry.

[0003] How to accurately test these high-speed interconnection systems has become the preliminary preparation work for mass production in the industry. Existing equipment cannot accurately test these high-speed interconnection systems. Therefore, a high-impedance input high-speed differential probe is proposed to solve the above problems. Content of the Utility Model

[0004] The purpose of the utility model is to provide a high-impedance input high-speed differential probe to overcome the existing defects. When performing high-speed differential testing, accurate test results can be directly obtained without complex calibration and de-embedding methods.

[0005] The technical solution for realizing the above purpose is: a high-impedance input high-speed differential probe, including a first housing, a second housing, a spring pogo pin, two first bodies, two second bodies, and two high-impedance micro probe heads;

[0006] The second housing is connected to the upper end surface of the first housing. The two first bodies are connected to the rear end inside the first housing and the second housing. The two second bodies are connected to the front end of the first housing. The two first bodies are connected to the two second bodies, and each of the two second bodies is respectively connected to one of the high-impedance micro probe heads; the spring pogo pin is connected to the rear end inside the first housing and the second housing.

[0007] Preferably, the output ends of the two first bodies are respectively connected to an SMP connector (sub-miniature push-on connector), the other ends of the two SMP connectors are respectively connected to a cable, the other ends of the two cables are respectively connected to a third body, and the other ends of the two third bodies are respectively connected to one of the second bodies.

[0008] Preferably, the output end of the spring pogo pin is connected to two high-temperature signal lines, and the other ends of the two high-temperature signal lines are respectively connected to the two second bodies.

[0009] Preferably, the high-impedance micro probe head includes a needle sleeve, the inner wall of the needle sleeve is connected to a center pin through an insulator, and a resistor is connected to the center pin.

[0010] Preferably, a roller is connected between the two third bodies.

[0011] Preferably, a pin shaft is connected between the two second bodies.

[0012] Preferably, the front ends of the two second bodies are each connected to a grounding reed through a flat head screw.

[0013] Preferably, a spring is provided between the third body and the second body.

[0014] Preferably, LED light emitting chips are respectively connected to the opposite surfaces of the two second bodies.

[0015] The beneficial effects of the present utility model are as follows: For this high-impedance input high-speed differential probe, by time-delay phase matching, two semi-rigid components are connected in parallel within the metal bodies (the first housing and the second housing) that open and close up and down. By adjusting the rollers, the differential spacing can be adjusted. Through the micro-assembly process, two high-impedance micro-probe heads are manufactured, and through the quick installation method, non-destructive testing of high-speed differential interconnection can be achieved; the influence on the original link is small, and the parameters and time-domain TDR curve of the original link can be directly and accurately extracted without complex de-embedding methods. When performing high-speed differential testing, the probe introduction does not affect the input impedance of the object under test, so there is no need for complex calibration and de-embedding methods, and accurate test results can be directly obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is an exploded view of the high-impedance input high-speed differential probe of the present utility model;

[0017] Figure 2 is a connection detail diagram of the high-impedance input high-speed differential probe of the present utility model;

[0018] Figure 3 is a schematic external view of the high-impedance input high-speed differential probe of the present utility model;

[0019] Figure 4 is Figure 3 the enlarged view at A in

[0020] In the figure: 1. LED light emitting chip; 2. Roller; 3. Spring; 4. High-temperature signal wire; 5. Spring thimble; 6. SMP connector; 7. First body; 8. First housing; 9. Cable; 11. Second body; 12. Flat head screw; 13. Grounding reed; 14. Resistor; 15. Center pin; 16. Insulator; 18. Needle sleeve; 19. Pin shaft; 20. Third body; 21. Second housing; 22. High-impedance micro-probe head. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The technical solution of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings. In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0022] The present utility model will be further described below in conjunction with the accompanying drawings.

[0023] As Figures 1-4 shown, a high-resistance input high-speed differential probe includes a first housing 8, a second housing 21, a spring pogo pin 5, two first bodies 7, two second bodies 11, and two high-resistance micro probe heads 22; the second housing 21 is connected to the upper end face of the first housing 8, the two first bodies 7 are connected to the rear end inside the first housing 8 and the second housing 21, the two second bodies 11 are connected to the front end of the first housing 8, the two first bodies 7 are connected to the two second bodies 11, and each of the two second bodies 11 is respectively connected to a high-resistance micro probe head 22; the output ends of the two first bodies 7 are respectively connected to an SMP connector 6, the other ends of the two SMP connectors 6 are respectively connected to a cable 9, the other ends of the two cables 9 are respectively connected to a third body 20, and the other ends of the two third bodies 20 are respectively connected to a second body 11.

[0024] Specifically, the spring pogo pin 5 is connected to the rear end inside the first housing 8 and the second housing 21. The output end of the spring pogo pin 5 is connected to two high-temperature signal lines 4, and the other ends of the two high-temperature signal lines 4 are respectively connected to the two second bodies 11.

[0025] Specifically, the high-resistance micro probe head 22 includes a needle sleeve 18, the inner wall of the needle sleeve 18 is connected to a center pin 15 through an insulator 16, and a resistor 14 is connected to the center pin 15.

[0026] Specifically, a roller 2 is connected between the two third bodies 20. A pin shaft 19 is connected between the two second bodies 11. The front ends of the two second bodies 11 are respectively connected to a grounding spring piece 13 through a flat head screw 12. A spring 3 is provided between the third body 20 and the second body 11. A LED light-emitting chip 1 is connected to each of the opposite faces of the two second bodies 11.

[0027] Specifically, by time-delay phase matching, two semi-steel components are connected in parallel within a metal body (the first housing 8 and the second housing 21) that opens and closes vertically. By adjusting the roller 2, the differential pitch is adjusted. Through micro-assembly technology, two high-resistance micro-probe heads 22 are manufactured, and through a quick installation method, non-destructive testing of high-speed differential interconnection is achieved.

[0028] This high-resistance input high-speed differential probe has little impact on the original link and can directly and accurately extract the parameters of the original link and the time-domain TDR curve without complex de-embedding methods. When performing high-speed differential testing, the probe introduction does not affect the input impedance of the device under test, so there is no need for complex calibration and de-embedding methods, and accurate test results can be obtained directly.

[0029] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-impedance input high-speed differential probe, characterized in that It includes a first housing (8), a second housing (21), a spring-loaded pogo pin (5), two first bodies (7), two second bodies (11) and two high-resistance microprobe heads (22); The second housing (21) is connected to the upper end face of the first housing (8). The two first bodies (7) are connected to the rear end inside the first housing (8) and the second housing (21). The two second bodies (11) are connected to the front end of the first housing (8). The two first bodies (7) are connected to the two second bodies (11). Each of the two second bodies (11) is respectively connected to one high-resistance microprobe head (22). The spring-loaded pogo pin (5) is connected to the rear end inside the first housing (8) and the second housing (21).

2. The high-impedance input high-speed differential probe according to claim 1, wherein The output ends of the two first bodies (7) are respectively connected to one SMP connector (6). The other ends of the two SMP connectors (6) are respectively connected to one cable (9). The other ends of the two cables (9) are respectively connected to a third body (20). The other ends of the two third bodies (20) are respectively connected to one second body (11).

3. The high-impedance input high-speed differential probe according to claim 1, wherein The output end of the spring-loaded pogo pin (5) is connected to two high-temperature signal lines (4). The other ends of the two high-temperature signal lines (4) are respectively connected to the two second bodies (11).

4. The high-impedance input high-speed differential probe according to claim 1, wherein The high-resistance microprobe head (22) includes a needle sleeve (18). The inner wall of the needle sleeve (18) is connected to a center pin (15) through an insulator (16). A resistor (14) is connected to the center pin (15).

5. The high-impedance input high-speed differential probe according to claim 2, wherein A roller (2) is connected between the two third bodies (20).

6. The high-impedance input high-speed differential probe according to claim 1, wherein A pin shaft (19) is connected between the two second bodies (11).

7. The high-impedance input high-speed differential probe according to claim 1, wherein The front ends of the two second bodies (11) are respectively connected to a grounding reed (13) through a flat head screw (12).

8. The high-impedance input high-speed differential probe according to claim 2, wherein A spring (3) is provided between the third body (20) and the second body (11).

9. The high-impedance input high-speed differential probe according to claim 1, wherein One LED light-emitting chip (1) is connected to each of the opposite faces of the two second bodies (11).

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