Miniature water cooling device and projector equipped with same
By introducing a micro water-cooling device into the projector, the combined structure of heat conduction sheet and heat conduction pipe is used for efficient heat conduction, which solves the problem of low heat dissipation efficiency of the projector, extends the service life of the light source and improves the connection stability.
Patent Information
- Application Number
- CN202422077815.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-08-27
AI Technical Summary
The heat dissipation method of existing projectors is inefficient, resulting in a shorter service life of the light source.
A micro-water cooling device is adopted, including a condenser, water inlet pipe and water outlet pipe, and a combined structure of heat conduction sheet and heat conduction pipe is used for efficient heat conduction, and controlled by a pressure relief valve and temperature sensor to form an independent water cooling circuit.
It improves the heat dissipation efficiency of the projector, extends the service life of the light source, and ensures a stable connection between the device and the projector, making it easy to load and unload.
Smart Images

Figure CN223123360U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of water cooling, in particular to a micro water cooling device and a projector equipped with the micro water cooling device. Background Art
[0002] A projector is an electronic device that can project images or videos onto a screen. The light source is one of the core components of the projector. When working, it will generate high heat, and it is necessary to cool it through a heat dissipation device to extend the service life of the light source. At present, methods such as heat dissipation fans are usually used to exhaust and cool the air around the light source, resulting in problems such as poor heat dissipation effect. Summary of the Invention
[0003] The purpose of the utility model is to provide a micro water cooling device and a projector equipped with the micro water cooling device, aiming to overcome the above problems existing in the prior art.
[0004] To achieve the above purpose, the utility model provides the following technical solutions:
[0005] A micro water cooling device includes a condenser, a water inlet pipe and a water outlet pipe. The above-mentioned condenser includes a condenser main body and a heat dissipation mechanism, and the above-mentioned condenser main body is equipped with at least one heat dissipation mechanism;
[0006] The above-mentioned condenser main body is provided with a water passing cavity, as well as a water inlet and a water outlet communicating with the water passing cavity. The above-mentioned water inlet pipe is communicated with the water inlet, and the water outlet pipe is communicated with the water outlet to form a water cooling loop;
[0007] The above-mentioned heat dissipation mechanism includes a first connection seat, two heat conduction sheets and a heat conduction pipe. One ends of the two above-mentioned heat conduction sheets are mutually attached up and down and extend into the interior of the above-mentioned water passing cavity; the other ends of the two above-mentioned heat conduction sheets are mutually separated up and down and are respectively fixedly connected to the upper and lower ends of a first connection seat. One end of the above-mentioned heat conduction pipe is fixedly connected to one of the heat conduction sheets, and the other end is fixedly connected to the other heat conduction sheet.
[0008] Further, one ends of the two above-mentioned heat conduction sheets that are mutually attached up and down are wrapped with a heat conduction layer.
[0009] Further, the above-mentioned heat conduction pipe is in a U shape, and the middle part is a vertical section; the above-mentioned heat dissipation mechanism further includes a second connection seat. The second connection seat is provided with two connecting arms oppositely, and the connecting arms are provided with clamping grooves; the vertical section of the above-mentioned heat conduction pipe is clamped inside the clamping grooves of the two above-mentioned connecting arms.
[0010] Further, it also includes a pressure relief valve and a temperature sensor. The above-mentioned water inlet pipe is communicated with the water inlet through the pressure relief valve and is equipped with a temperature sensor.
[0011] Furthermore, the number of the above-mentioned heat dissipation mechanisms is two, and the first connection seats of the two heat dissipation mechanisms are fixedly connected, and the second connection seats of the two heat dissipation mechanisms are fixedly connected.
[0012] Furthermore, the condenser body is provided with a water passing cavity, a water inlet and a water outlet for each heat dissipation mechanism, so as to form two independent water cooling circuits.
[0013] Furthermore, both the heat conduction tube and the heat conduction fin are made of copper or copper alloy.
[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0015] The miniature water cooling device disclosed by the present utility model mainly includes a condenser, a water inlet pipe and a water outlet pipe. Among them, the condenser includes a condenser body and a heat dissipation mechanism. The condenser body is provided with a water passing cavity communicating with the water inlet pipe and the water outlet pipe. The heat dissipation mechanism includes two heat conduction fins and one heat conduction tube. One ends of the two heat conduction fins are mutually attached up and down and extend into the interior of the water passing cavity; the other ends of the two heat conduction fins are mutually separated up and down, located outside the condenser body, and are respectively fixedly connected to the upper and lower ends of the same first connection seat. By focusing on the design of the condenser, the present utility model can quickly conduct the heat of the air around the projector to dissipate the heat of the projector and delay the service life of the projector. With the cooperation of each connection seat and the fixing frame, the connection between the components of the device and between the device and the projector is firm and the disassembly is convenient. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a schematic structural diagram of the present utility model.
[0017] Figure 2 is a schematic structural diagram of the condenser in the present utility model. Only one water passing cavity, its water inlet and water outlet are shown in the figure.
[0018] Figure 3 is a schematic internal structural diagram of a projector in the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0019] The following describes the specific embodiments of the present utility model with reference to the drawings. In order to fully understand the present utility model, many details are described below, but for those skilled in the art, the present utility model can be implemented without these details.
[0020] As Figure 1 and Figure 2 shown, a miniature water cooling device mainly includes a condenser 1, a water inlet pipe 5 and a water outlet pipe 6. Among them, the condenser 1 includes a condenser body 11 and a heat dissipation mechanism 10, and the condenser body 11 is equipped with two heat dissipation mechanisms 10.
[0021] AsFigure 1 and Figure 2 As shown, preferably, the condenser body 11 is provided with a water passage chamber 112, a water inlet 111 and a water outlet 113 for each heat dissipation mechanism 10 to form two independent water cooling circuits.
[0022] Of course, the number of the heat dissipation mechanisms 10 is not limited to two, and may also be one, three, four, five,....
[0023] As Figure 1 and Figure 2 shown, the condenser body 11 is provided with a water passage chamber 112, and a water inlet 111 and a water outlet 113 communicating with the water passage chamber 112. After assembly, the water inlet pipe 5 communicates with the water inlet 111, and the water outlet pipe 6 communicates with the water outlet 113, thereby forming a water cooling circuit.
[0024] As Figure 1 and Figure 2 shown, the heat dissipation mechanism 10 includes two heat conducting fins 13, a heat conducting tube 14, a first connecting seat 15 and a second connecting seat 16. The heat conducting fin 13 includes an outer connecting section 131, an inclined transition section 132 and an inner connecting section 133 connected in sequence. The inner connecting sections 133 of the two heat conducting fins 13 are mutually attached up and down and extend into the interior of the water passage chamber 112, so that the inner connecting sections 133 are immersed in the cooling water inside the water passage chamber 112. The mutual attachment of the two inner connecting sections 133 facilitates reducing the volume of the device and is convenient for assembly.
[0025] The outer connecting sections 131 of the two heat conducting fins 13 are separated from each other up and down and are respectively fixedly connected to the upper and lower ends of the same first connecting seat 15. The separation of the two outer connecting sections 131 from each other up and down can increase the contact area between the heat conducting fin 13 and the air and improve the heat dissipation effect of conducting heat from the air to the heat conducting fin 13.
[0026] A heat conducting tube 14 is fixedly connected between the outer connecting sections 131 of the two heat conducting fins 13. Specifically, one end of the heat conducting tube 14 is fixedly connected to one of the heat conducting fins 13, and the other end is fixedly connected to the other heat conducting fin 13.
[0027] As Figure 1 and Figure 2 shown, preferably, the inner connecting sections 133 of the two heat conducting fins 13 attached to each other up and down are wrapped with a heat conducting layer 12 to increase the contact area with the cooling water and improve the heat dissipation effect of conducting heat from the heat conducting fin 13 to the cooling water. The shape of the water passage chamber 112 is adapted to the heat conducting layer 12, and there is a gap for the cooling water to flow between the inner wall of the water passage chamber 112 and the outer surface of the heat conducting layer 12.
[0028] As Figure 1 and Figure 2As shown, preferably, both the heat conduction tube 14 and the heat conduction fin 13 are made of copper or copper alloy. The heat conduction layer 12 is heat conductive silica gel, which has good heat conduction performance and flexibility to improve the overall heat conduction efficiency.
[0029] As Figure 1 and Figure 2 shown, preferably, the heat conduction tube 14 is U-shaped, and the middle part is a vertical section.
[0030] As Figure 1 and Figure 2 shown, the heat dissipation mechanism 10 further includes a second connection seat 16. Two connection arms 161 are oppositely arranged on the second connection seat 16, and a clamping groove 1611 is provided on the connection arm 161. The vertical section of the heat conduction tube 14 is clamped inside the clamping grooves 1611 of the two connection arms 161.
[0031] As Figure 1 and Figure 2 shown, it further includes a pressure relief valve 2, a temperature sensor 3 and a fixing frame 4. The pressure relief valve 2, the temperature sensor 3 and the condenser main body 11 are all fixedly installed on the fixing frame 4. And the water inlet pipe 5 is connected to the water inlet 111 through the pressure relief valve 2, and a temperature sensor 3 is also provided. The pressure relief valve 2 is used to automatically relieve pressure when an abnormal high pressure occurs. The probe of the temperature sensor 3 extends into the water cooling circuit to detect the temperature of the cooling water. Since the pressure relief valve 2 and the temperature sensor 3 are conventional components in the liquid circuit, their specific structures will not be described in detail here.
[0032] As Figure 1 and Figure 2 shown, preferably, the first connection seats 15 of the two heat dissipation mechanisms are fixedly connected, and the second connection seats 16 of the two heat dissipation mechanisms are fixedly connected.
[0033] As Figure 1 - Figure 3 shown, the present invention also discloses and protects a projector, which includes a projector housing a, and a light source a1, a lens a2 and a micro water cooling device a3 as described above are assembled inside the projector housing a. Among them, the first connection seat 15, the second connection seat 16 and the fixing frame 4 of the micro water cooling device a3 are all detachably and fixedly installed on the projector a by screws, and the heat dissipation mechanism 10 is beside the light source a1. Of course, a water tank (not shown in the figure) for storing cooling water and a water pump (not shown in the figure) should also be assembled inside the projector housing a to form a closed loop for flowing cooling water. The water tank and the water pump are conventional components in the existing water cooling technology and will not be described in detail here.
[0034] The above is only the specific embodiment of the present invention, but the design concept of the present invention is not limited thereto. Any non-substantive modification made to the present invention using this concept shall fall within the scope of infringement of the protection scope of the present invention.
Claims
1. A micro water cooling device, characterized in that: It includes a condenser, at least one water inlet pipe and at least one water outlet pipe. The condenser includes a condenser body and a heat dissipation mechanism, and at least one heat dissipation mechanism is assembled on the condenser body; The condenser body is provided with a water passing cavity, as well as a water inlet and a water outlet communicating with the water passing cavity. The water inlet pipe communicates with the water inlet, and the water outlet pipe communicates with the water outlet, forming a water cooling circuit; The heat dissipation mechanism includes a first connecting seat, two heat conducting sheets and a heat conducting pipe. One ends of the two heat conducting sheets are mutually attached up and down and extend into the interior of the water passing cavity; the other ends of the two heat conducting sheets are mutually separated up and down and are respectively fixedly connected to the upper and lower ends of a first connecting seat. One end of the heat conducting pipe is fixedly connected to one of the heat conducting sheets, and the other end is fixedly connected to the other heat conducting sheet.
2. The miniature water cooling device according to claim 1, wherein: A heat conducting layer is wrapped around one ends of the two heat conducting sheets that are mutually attached up and down.
3. A micro water cooling device according to claim 1 or 2, characterized in that: The heat conducting pipe is U-shaped and has a vertical section in the middle; the heat dissipation mechanism further includes a second connecting seat. Two connecting arms are oppositely arranged on the second connecting seat, and the connecting arms are provided with clamping grooves; the vertical section of the heat conducting pipe is clamped inside the clamping grooves of the two connecting arms.
4. A micro water cooling device according to claim 1, characterized in that: It further includes a pressure relief valve and a temperature sensor. The water inlet pipe communicates with the water inlet through the pressure relief valve and is equipped with a temperature sensor.
5. The micro water cooling device according to claim 3, characterized in that: The number of the heat dissipation mechanisms is two. The first connecting seats of the two heat dissipation mechanisms are fixedly connected, and the second connecting seats of the two heat dissipation mechanisms are fixedly connected.
6. The miniature water cooling device according to claim 5, characterized in that: The condenser body is provided with a water passing cavity, a water inlet and a water outlet for each heat dissipation mechanism to form two independent water cooling circuits.
7. A projector, comprising a housing, and a light source is assembled inside the housing, characterized in that: The interior of the machine shell is further assembled with a micro water cooling device with the structure as described in any one of claims 1-6, and the heat dissipation mechanism of the micro water cooling device is located beside the light source.