Display module

Abstract

The utility model provides a display module, which comprises a substrate, enclosing pieces, solder paste layers and lamp beads, the enclosing pieces are annular and are convexly arranged on the surface of the substrate, and a plurality of enclosing pieces are arranged on the peripheries of a plurality of bonding pad areas in a one-to-one correspondence way. According to the arrangement, the glue can be blocked by the enclosure piece, diffusion of the glue is reduced, and the glue is concentrated in the bonding pad area and effectively enters the bottoms of the lamp beads, so that the lamp beads are fully bonded with the substrate, and the thrust of the lamp beads is increased; the bonding area between the substrate and the lamp beads can be increased, and the bonding force between the substrate and the lamp beads can be improved, so that the overall structural stability of the display module is effectively improved, the situation that the lamp beads are likely to fall off when the display module is collided is avoided, the normal display effect of the display module is guaranteed, and the normal and effective use experience of a user is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of display devices, and particularly relates to a display module. Background Art

[0002] LED display screens have the characteristics of high-brightness light emission, bright colors, high luminous efficiency, high contrast, short response time, wide operating temperature range, low energy consumption, etc., and are widely used in stage display devices, advertising display devices, data visualization display devices, and commercial display devices.

[0003] With the increasingly wide application of LED display screens, users' requirements for stage rental display screens are also getting higher and higher. The LED lamp beads of existing LED display screens are directly soldered with solder paste, resulting in a small thrust force of the LED lamp beads. The thrust force of the LED lamp beads refers to the adhesion force between them and the PCB board under the action of solder paste soldering.

[0004] Due to the frequent disassembly and assembly of rental display screens, the display screens are often collided. The thrust force of the LED lamp beads is small, and the collision is likely to knock off the LED lamp beads of the display unit, thus affecting the effect of the entire LED display screen and the normal use of users. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the technical problem in the prior art that the thrust force of the LED lamp beads is small, and the LED lamp beads are easily knocked off after the display unit is collided, thus affecting the effect of the entire LED display screen and the normal use of users.

[0006] To solve the above technical problem, the utility model provides a display module, which includes:

[0007] A substrate, on the surface of which a plurality of pad areas are arranged at intervals. Each of the pad areas includes a plurality of chip pads arranged at intervals, and the gap between adjacent chip pads can be used to accommodate glue;

[0008] A plurality of enclosing members, which are annular and protrude on the surface of the substrate. The plurality of enclosing members are respectively arranged around the outer perimeters of the plurality of pad areas;

[0009] A solder paste layer, which is arranged on the chip pads;

[0010] Lamp beads, including a main body part and a lead part; a plurality of lamp beads are provided, and the plurality of lamp beads are respectively arranged in the plurality of pad areas. The lead part of each lamp bead abuts against the solder paste layer of the pad area. When an external force presses the lamp bead, the glue between the chip pads flows to the bottom of the main body part and is accommodated inside the enclosing member, so that the lamp bead is adhesively fixed on the substrate.

[0011] In some embodiments of the present application, the outer contour of the enclosure member is rectangular, and the enclosure member includes four edge portions connected end to end in sequence, and each of the edge portions protrudes from the surface of the substrate.

[0012] In some embodiments of the present application, the cross-section of the edge portion is a right trapezoid, and the surface of the edge portion facing the inside of the enclosure member is an inclined surface.

[0013] In some embodiments of the present application, the height of the pin portion of the lamp bead is h, and the height H of the edge portion = 1.2h.

[0014] In some embodiments of the present application, the upper side length a of the edge portion = H / 2, and the lower side length b of the edge portion = H.

[0015] In some embodiments of the present application, the enclosure member and the substrate are of an integrally formed structure.

[0016] In some embodiments of the present application, each lamp bead includes four of the pin portions, each solder pad area includes four chip solder pads arranged at intervals, the four chip solder pads are arranged in a cross shape, and the four pin portions are correspondingly arranged on the four chip solder pads one by one.

[0017] In some embodiments of the present application, the glue flows to the bottom of the main body portion and is accommodated inside the enclosure member to form a reinforcing layer between the main body portion and the substrate and on the inner wall of the enclosure member.

[0018] In some embodiments of the present application, the display module further includes a solder mask layer, the solder mask layer is made of a black insulating material, and the solder mask layer is disposed on the surface of the substrate.

[0019] In some embodiments of the present application, the enclosure member is an epoxy resin member.

[0020] As can be seen from the above technical solutions, the beneficial effects of the present utility model are as follows: The display module of the present utility model includes a substrate, an enclosure member, a solder paste layer, and lamp beads. Among them, the enclosure member is annular and protrudes on the surface of the substrate, and a plurality of enclosure members are correspondingly arranged around the outer periphery of a plurality of solder pad areas. Such a setting can not only prevent the glue from spreading by the enclosure member, reduce the diffusion of the glue, make the glue concentrate in the solder pad area and effectively enter the bottom of the lamp beads, so that the lamp beads are fully bonded to the substrate and the thrust of the lamp beads is increased; but also increase the bonding area between the substrate and the lamp beads, improve the bonding force between the two, thereby effectively improving the overall structural stability of the display module to avoid the situation that the lamp beads are easily knocked off when the display module is collided, ensure the normal display effect of the display module, and ensure the normal and effective use experience of the user. Description of the Drawings

[0021] Figure 1 It is a schematic structural diagram of an embodiment of the display module of the present utility model.

[0022] Figure 2 It is Figure 1 a top view of the display module shown.

[0023] Figure 3 It is Figure 1 a schematic structural diagram of the substrate and the enclosure member in the display module shown.

[0024] Figure 4 It is Figure 3 an enlarged view of position B in

[0025] Figure 5 It is a schematic diagram of the preparation process of an embodiment of the display module of the present utility model.

[0026] Figure 6 It is a thrust test diagram of an embodiment of the display module of the present utility model.

[0027] Explanation of the reference numerals is as follows: 100, display module; 10, substrate; 101, pad area; 11, chip pad; 20, enclosure member; 21, rib portion; 30, solder paste layer; 40, lamp bead; 41, main body portion; 42, pin portion; 50, glue; 60, solder mask layer. Specific Embodiments

[0028] Typical embodiments embodying the features and advantages of the present utility model will be described in detail in the following description. It should be understood that the present utility model can have various variations in different embodiments, all of which do not depart from the scope of the present utility model, and the descriptions and illustrations therein are for illustrative purposes in essence and not for limiting the present utility model.

[0029] In the description of the present application, it should be understood that in the embodiments shown in the drawings, the indication of the direction or position relationship (such as up, down, left, right, front and back, etc.) is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. When these elements are in the positions shown in the drawings, these descriptions are appropriate. If the description of the positions of these elements changes, then the indication of these directions also changes accordingly.

[0030] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0031] Refer to Figure 1 , an embodiment of the present application provides a display module 100, which includes a substrate 10, a surrounding member 20, a solder paste layer 30, and a lamp bead 40.

[0032] Among them, a plurality of pad areas 101 are provided on the surface of the substrate 10 at intervals. Each pad area 101 includes a plurality of chip pads 11 arranged at intervals. The gap between two adjacent chip pads 11 can be used to accommodate glue 50. A plurality of surrounding members 20 are provided. The surrounding members 20 are annular and protrude from the surface of the substrate 10. The plurality of surrounding members 20 are respectively arranged around the outer periphery of the plurality of pad areas 101. The solder paste layer 30 is disposed on the chip pads 11.

[0033] The lamp bead 40 includes a main body portion 41 and a lead portion 42. A plurality of lamp beads 40 are provided. The plurality of lamp beads 40 are respectively arranged on the plurality of pad areas 101. The lead portion 42 of each lamp bead 40 abuts against the solder paste layer 30 of the pad area 101. When an external force presses the lamp bead 40, the glue 50 between the chip pads 11 flows to the bottom of the main body portion 41 and is accommodated inside the surrounding member 20, so that the lamp bead 40 is adhesively fixed on the substrate 10.

[0034] In some embodiments of the present application, the substrate 10 may be a flat substrate 10, a multi-layer circuit board substrate 10, or a multi-layer circuit board substrate 10 with a driving IC. A plurality of pad areas 101 are provided on the surface of the substrate 10 at intervals. Each pad area 101 includes a plurality of chip pads 11 arranged at intervals. The chip pads 11 are used for welding and connecting each lamp bead 40.

[0035] In some examples, the display module 100 may further include a solder mask layer 60. The solder mask layer 60 is made of a black insulating material, and the solder mask layer 60 is disposed on the surface of the substrate 10.

[0036] The material used for the solder mask layer 60 may be one or a combination of black ink, black PP substrate, black epoxy resin, and black silicone resin. When the PCB solder mask layer 60 is a combination of multiple materials, it may be a combination of any two of the foregoing multiple materials, or a combination of three materials, and the combination ratio is not limited.

[0037] Setting the solder mask layer 60 on the substrate 10 can not only protect the lamp beads 40, but also prevent light crosstalk between the lamp beads 40, ensuring high-quality display effects of the display module 100.

[0038] In some embodiments of the present application, the gap between two adjacent chip pads 11 in each pad area 101 can be used to accommodate glue 50. A solder paste layer 30 is provided on each chip pad 11. Each lamp bead 40 is soldered on the chip pad 11 of each pad area 101 through the solder paste layer 30.

[0039] The lamp beads 40 of the present application can be either ordinary light-emitting diode chips or micro light-emitting diode chips with a size in the micron range (i.e., Mini-LED). Compared with mainstream display technologies such as OLED and LCD, Mini-LED has higher brightness, resolution, and color saturation, lower energy consumption, longer lifespan, and faster response speed.

[0040] When the lamp beads 40 of the present application are Mini-LEDs, the solder mask layer 60 can absorb the divergent light of the lamp beads 40 to both sides, effectively reducing the light crosstalk between Mini-LED pixels and improving the sharpness and contrast of the entire display module 100.

[0041] The lamp beads 40 can include a main body portion 41 and a lead portion 42. A plurality of lamp beads 40 are correspondingly arranged on a plurality of pad areas 101 on the substrate 10, and the lead portion 42 of each lamp bead 40 is in contact with the solder paste layer 30 on the chip pad 11 in the pad area 101 to realize the soldering of the lamp bead 40 and the chip pad 11.

[0042] Combined Figure 2 with

[0043] In some embodiments of the present application, each lamp bead 40 includes four lead portions 42. Among them, the main body portion 41 can include an R chip, a G chip, and a B chip, and the four lead portions 42 can be the negative electrode corresponding to the R chip, the negative electrode corresponding to the G chip, the negative electrode corresponding to the B chip, and a common anode respectively.

[0044] In this embodiment, each pad area 101 includes four chip pads 11 arranged at intervals, and the four lead portions 42 are correspondingly arranged on the four chip pads 11 to realize the soldering and fixing of each lamp bead 40 in the pad area 101.

[0045] In some examples, the four chip pads 11 in each pad area 101 on the substrate 10 are arranged in a cross shape, and the outer contour of each pad area 101 is rectangular.

[0045] In this example, the plurality of pad areas 101 on the substrate 10 are arranged in a matrix. This setting combined with the form that the four chip pads 11 in each pad area 101 are arranged in a cross shape can realize the uniformity and aesthetics of the arrangement of the lamp beads 40 on the substrate 10 and ensure the uniform and soft display effect of the display module 100.

[0046] Combined Figure 3 as shown in

[0047] In some embodiments of the present application, a retaining member 20 is further provided on the substrate 10. There are a plurality of retaining members 20, and the plurality of retaining members 20 are correspondingly arranged around the outer periphery of the plurality of pad areas 101.Among them, each enclosure member 20 is annular. In some examples, the enclosure member 20 can be an epoxy resin member, which can be formed by pressing a semi-cured sheet based on epoxy resin.

[0048] The enclosure member 20 protrudes from the surface of the substrate 10, and each enclosure member 20 and the surface of the substrate 10 enclose a trough-like structure with an open top. Each pad area 101 is arranged inside the trough-like structure formed by an enclosure member 20 and the substrate 10.

[0049] When each light-emitting diode 40 is placed on the pad area 101, the pin part 42 of each light-emitting diode 40 abuts against the solder paste layer 30 of the pad area 101. When an external force presses the light-emitting diode 40, the glue 50 between the chip pads 11 flows to the bottom of the main body part 41 and is accommodated inside the enclosure member 20, so that the light-emitting diode 40 is adhesively fixed to the substrate 10.

[0050] By arranging the enclosure member 20 around each pad area 101, not only can the enclosure member 20 block the glue 50, reduce the diffusion of the glue 50, enable the glue 50 to concentrate in the pad area 101 and effectively enter the bottom of the light-emitting diode 40, so that the light-emitting diode 40 and the substrate 10 are fully adhered, increasing the thrust of the light-emitting diode 40; but also can increase the bonding area between the substrate 10 and the light-emitting diode 40, improve the bonding force between the two, and thus effectively improve the overall structural stability of the display module 100.

[0051] In some examples, the outer contour of the enclosure member 20 can be rectangular to adapt to the shape of the pad area 101 on the substrate 10. In other embodiments, the outer contour of the enclosure member 20 can also be set to a circular shape, a pentagonal shape, an oval shape, etc., as long as the enclosure member 20 can surround the periphery of the pad area 101.

[0052] Combined Figure 1 、 Figure 3 and Figure 4 As shown, in some embodiments of the present application, each enclosure member 20 includes four side portions 21 that are connected end to end in sequence. Each side portion 21 protrudes from the surface of the substrate 10.

[0053] In some examples, the cross-section of the side portion 21 is a right trapezoid, and the surface of the side portion 21 facing the inside of the enclosure member 20 is an inclined surface.

[0054] For each side portion 21, the surface close to the substrate 10 is the lower surface, and the surface away from the substrate 10 is the upper surface. Corresponding to the right trapezoid formed by the cross-section of each side portion 21, the length of the upper side of the side portion 21 is the width of the upper surface, and the length of the lower side of the side portion 21 is the width of the lower surface.

[0055] In this example, the upper edge length of the baffle portion 21 is less than its lower edge length, and the surface of the baffle portion 21 facing the inside of the enclosure member 20 is an inclined surface. This setting causes the baffle portion 21 to form a certain climbing resistance to the glue 50 outside the pad area 101, effectively preventing the overflow of the glue 50 and ensuring the concentration of the glue 50 inside the pad area 101.

[0056] In other examples, the cross-section of the baffle portion 21 can also be set to a right triangle, a rectangle, etc., as long as it can ensure that the baffle portion 21 protrudes from the surface of the substrate 10 and forms a stop to the glue 50 outside the pad area 101.

[0057] Further, in some examples, the height of the pin portion 42 of the lamp bead 40 is h, and the height H of the baffle portion 21 = 1.2h. This setting enables the baffle portion 21 to effectively block the glue 50 while avoiding affecting the light output of the lamp bead 40, ensuring the effective light output range of the lamp bead 40 and ensuring the normal display effect of the display module 100.

[0058] In some instances, the upper edge length of the baffle portion 21 can be set to a = H / 2, and the lower edge length of the baffle portion 21 can be set to b = H.

[0059] This setting not only enables the enclosure member 20 to effectively block the glue 50 on the outer periphery of the pad area 101, reducing the diffusion of the glue 50 and enabling the lamp bead 40 to be fully bonded to the substrate 10, but also can prevent the enclosure member 20 from occupying too much area or space on the substrate 10, ensuring the light weight and stability of the display module 100.

[0060] Further, referring to Figure 5 , when the display module 100 of the present application is prepared, first provide a substrate 10, on which a plurality of spaced-apart pad areas 101 are formed, and each pad area 101 includes four chip pads 11 arranged in a cross shape. Moreover, a solder mask layer 60 and a plurality of enclosure members 20 are further formed on the surface of the substrate 10, and the plurality of enclosure members 20 are respectively arranged to surround the outer periphery of the plurality of pad areas 101.

[0061] First, apply solder paste on the substrate 10, and the solder paste is formed into a solder paste layer 30 corresponding to the four chip pads 11 in each pad area 101; then, use a dispensing device to dispense the glue 50 into the gap between the four chip pads 11 in each pad area 101, so that the height of the glue 50 is lower than the height of the solder paste layer 30.

[0062] Then, the lamp beads 40 are mounted on the substrate 10 by a mounting device. When the lamp beads 40 are pressed down for mounting, the pin portions 42 of the lamp beads 40 come into contact with the solder paste layer 30, and the glue 50 between the chip pads 11 is squeezed and flows to the bottom of the main body portion 41 and is received inside the enclosing member 20, so that the lamp beads 40 are adhesively fixed on the substrate 10.

[0063] Finally, through reflow soldering and curing treatment in a reflow oven, the display module 100 is obtained.

[0064] Refer to Figure 6 , after preparing the display module, the inventors of the present application measured the thrust of the lamp beads. Specifically, the thrusts of the lamp beads 40 of the existing display module and the display module 100 of the present application were measured respectively. 10 points were selected in both the existing display module and the display module of the present application, and the thrusts at the 10 points were measured.

[0065] The magnitude of the thrust of the lamp beads at each point can be seen in the table in Figure 6 . It can be known from Figure 6 that, compared with the existing display module, the thrust of the lamp beads 40 in the display module 100 of the present application can be increased by 50% - 80%.

[0066] For the display module of the present application, it includes a substrate, an enclosing member, a solder paste layer, and lamp beads. Among them, the enclosing member is annular and protrudes on the surface of the substrate, and a plurality of enclosing members are respectively disposed around the outer perimeters of a plurality of pad areas. Such a setting can not only enable the enclosing member to block the glue, reduce the diffusion of the glue, make the glue concentrate in the pad area and effectively enter the bottom of the lamp beads, so that the lamp beads are fully adhered to the substrate, increasing the thrust of the lamp beads; but also can increase the bonding area between the substrate and the lamp beads, improve the bonding force between the two, thereby effectively enhancing the overall structural stability of the display module, to avoid the situation that the lamp beads are easily knocked off when the display module is collided, ensure the normal display effect of the display module, and ensure the normal and effective use experience of users.

[0067] Although the present invention has been described with reference to several exemplary embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above-described embodiments are not limited to any of the foregoing details, but should be broadly construed within the spirit and scope defined by the appended claims. Therefore, all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A display module, characterized in that, Comprising: A substrate, on the surface of which a plurality of pad areas are spaced apart, each of the pad areas includes a plurality of chip pads arranged at intervals, and the gap between two adjacent chip pads can be used to accommodate glue; A plurality of enclosing members, which are annular and protrude from the surface of the substrate, and the plurality of enclosing members are respectively arranged around the outer perimeters of the plurality of pad areas; A solder paste layer, disposed on the chip pads; Light beads, including a main body portion and a lead portion; a plurality of the light beads are respectively disposed on the plurality of pad areas, and the lead portion of each light bead is in contact with the solder paste layer of the pad area; when an external force presses the light bead, the glue between the chip pads flows to the bottom of the main body portion and is accommodated inside the enclosing member, so that the light bead is adhesively fixed to the substrate.

2. The display module according to claim 1, wherein The outer contour of the enclosing member is rectangular, and the enclosing member includes four side portions connected end to end in sequence, and each side portion protrudes from the surface of the substrate.

3. The display module according to claim 2, wherein The cross-section of the side portion is a right trapezoid, and the surface of the side portion facing the inside of the enclosing member is an inclined surface.

4. The display module according to claim 3, wherein The height of the lead portion of the light bead is h, and the height H of the side portion = 1.2h.

5. The display module according to claim 4, characterized in that, The upper side length a of the side portion = H / 2, and the lower side length b of the side portion = H.

6. The display module according to claim 1, wherein The enclosing member and the substrate are of an integrally formed structure.

7. The display module according to claim 1, wherein Each light bead includes four lead portions, each pad area includes four chip pads arranged at intervals, the four chip pads are arranged in a square shape, and the four lead portions are respectively disposed on the four chip pads.

8. The display module according to claim 1, wherein, The glue flows to the bottom of the main body portion and is accommodated inside the enclosing member, so as to form a reinforcing layer between the main body portion and the substrate and on the inner wall of the enclosing member.

9. The display module according to claim 1, wherein The display module further includes a solder mask layer, the solder mask layer is made of a black insulating material, and the solder mask layer is disposed on the surface of the substrate.

10. The display module according to claim 1, characterized in that, The enclosing member is an epoxy resin member.

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