Package structure

Abstract

The utility model provides a packaging structure. The packaging structure comprises a circuit structure; a plurality of electronic components disposed on the circuit structure; and the sensing module is arranged right below the intervals among the plurality of electronic elements and is positioned above the circuit structure, and the sensing module comprises a rigid layer. According to the technical scheme of the invention, the sensing module is arranged in the stress concentration area, namely right below the interval between the plurality of electronic elements and above the circuit structure, the stress value borne by the stress concentration area can be detected, and the rigid layer is arranged on the sensing module, so that the risk that the stress value cannot be sensed due to the fact that the sensing module is damaged by the fracture of the bottom filling adhesive can be avoided.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and particularly to a packaging structure. Background Art

[0002] In the chip-on-fan-out substrate packaging, due to the different CTEs (Coefficient of Thermal Expansion) of various materials, the underfill between the ASIC (Application-Specific Integrated Circuit) and HBM (High Bandwidth Memory) located in the stress concentration area is prone to cracking. Moreover, the cracks may propagate downward to the redistribution layer, resulting in disconnection of the redistribution layer. In order to distinguish whether the redistribution layer is disconnected, the current solution is to observe whether cracks occur in the underfill through P-lapping (chemical mechanical polishing) and observe whether the redistribution layer under the stress concentration area is disconnected through O / S (Observational Study) after the packaging process of the product is completed. However, the above methods can only detect whether the packaged product is a good product, and cannot further obtain the stress value borne by the stress concentration area. Summary of the Utility Model

[0003] This application proposes a packaging structure.

[0004] In a first aspect, the packaging structure provided by this application includes: a circuit structure; a plurality of electronic components disposed on the circuit structure; and a sensing module disposed directly below the interval between the plurality of electronic components and above the circuit structure, and the sensing module includes a rigid layer.

[0005] In some alternative embodiments, the sensing module is disposed to sense the stress in the area directly below the interval between the plurality of electronic components under a temperature cycle test.

[0006] In some alternative embodiments, the sensing module includes sensing lines, and the sensing lines include a first trace extending in a first direction and a second trace extending in a second direction perpendicular to the first direction.

[0007] In some alternative embodiments, the hardness and stiffness of the rigid layer are respectively greater than those of the circuit structure.

[0008] In some alternative embodiments, the rigid layer includes a semiconductor material.

[0009] In some alternative embodiments, the sensing module is configured to sense the temperature and / or humidity of the area directly below the space between multiple ones of the electronic components.

[0010] In some alternative embodiments, the temperature range of the temperature cycle test is between -40°C and 125°C.

[0011] In some alternative embodiments, underfill is filled between the circuit structure, multiple ones of the electronic components, and the sensing module.

[0012] In some alternative embodiments, an adhesive layer is provided below the sensing module, and the sensing module is fixed above the circuit structure through the adhesive layer.

[0013] In some alternative embodiments, at least one of the electronic components is configured to adjust its operating frequency according to the magnitude of the signal sensed by the sensing module.

[0014] To solve the problem of how to know the stress value borne by the stress concentration area, the present application proposes a packaging structure. By providing a sensing module above the circuit structure directly below the space between multiple electronic components, which is the stress concentration area, the stress value borne by the stress concentration area can be detected. Moreover, by providing a rigid layer for the sensing module, the risk that the underfill breaks and damages the sensing module, resulting in the inability to sense the stress value, can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Other features, objects, and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0016] Figure 1 is a schematic structural diagram of an existing packaging structure;

[0017] Figure 2 is a schematic structural diagram of Embodiment 2a of the packaging structure according to the present application;

[0018] Figure 3 is a schematic structural diagram of the sensing module according to the present application;

[0019] Figure 4 is a schematic diagram of the pattern circuit of the sensing circuit according to the present application;

[0020] Figure 5 is a schematic structural diagram of Embodiment 3a of the packaging structure according to the present application;

[0021] Figures 6 - 9 is a schematic diagram of the manufacturing steps of Embodiment 2a of the packaging structure according to the present application.

[0022] Description of reference numerals / symbols:

[0023] 101-circuit structure; 102-first electronic component; 103-second electronic component; 104-bottom filling glue; 105-molding material; 106-stress concentration area; 201-circuit structure; 202-first electronic component; 203-second electronic component; 204-sensing module; 205-electrical connector; 206-bottom filling glue; 207-molding material; 208-adhesive layer; 209-carrier; 210-solder ball; 211-gasket; 2041-rigid layer; 2042-sensing circuit; 20421-first trace; 20422-second trace. DETAILED DESCRIPTION

[0024] The specific implementation methods of the present application are described below in conjunction with the accompanying drawings and embodiments. Through the contents recorded in this specification, those skilled in the art can easily understand the technical problems solved by the present application and the technical effects produced. It is understood that the specific embodiments described herein are only used to explain the relevant inventions, rather than to limit the inventions. In addition, for ease of description, only the parts related to the relevant inventions are shown in the accompanying drawings.

[0025] It should be readily understood that the meanings of “on,” “over,” and “over” in this application should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also means “on something” including the presence of intermediate components or layers therebetween.

[0026] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0027] As used herein, the term "layer" refers to a portion of a material that includes a region having a certain thickness. A layer can extend over the entire underlying or overlying structure, or can have an extent that is less than the extent of the underlying or overlying structure. Additionally, a layer can be a region of a homogeneous or heterogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer can be located between the top and bottom surfaces of a continuous structure or between any pair of horizontal planes therebetween. A layer can extend horizontally, vertically, and / or along a tapered surface. A substrate can be a layer, can include one or more layers therein, and / or can have one or more layers thereon, thereabove, and / or therebelow. A layer can include multiple layers. For example, a semiconductor layer can include one or more doped or undoped semiconductor layers and can have the same or different materials.

[0028] As used herein, the term "substrate" refers to a material on which subsequent material layers are added. The substrate itself can be patterned. The material added on top of the substrate can be patterned or can remain unpatterned. Additionally, the substrate can include a variety of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate can be made of a non-conductive material, such as glass, plastic, or a sapphire wafer, etc. Further alternatively, the substrate can have semiconductor devices or circuits formed therein.

[0029] It should be noted that the structures, ratios, sizes, etc. shown in the drawings of the specification are only for matching the content recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present application can be implemented. Therefore, they do not have a substantial technical meaning. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present application. At the same time, the terms such as "upper", "first", "second", and "one" cited in this specification are only for the convenience of clear narration and are not used to limit the scope under which the present application can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope under which the present application can be implemented.

[0030] It should also be noted that the longitudinal section corresponding to the embodiment of the present application can be the section corresponding to the front view direction, the transverse section can be the section corresponding to the right view direction, and the horizontal section can be the section corresponding to the top view direction.

[0031] In addition, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0032] Refer to Figure 1 , Figure 1It is a schematic structural diagram of an existing packaging structure.

[0033] Such as Figure 1 The shown packaging structure includes a circuit structure 101, a first electronic component 102, a second electronic component 103, an underfill 104, a molding compound 105, and a stress concentration area 106.

[0034] In this structure, the underfill 104 located in the stress concentration area 106, that is, between the first electronic component 102 and the second electronic component 103, is prone to crack due to stress. Moreover, the crack of the underfill 104 may crack downward along the trend to the circuit structure 101 and cause the disconnection of the circuit structure 101. In order to distinguish whether the circuit structure 101 is disconnected, the current solution is to observe whether the underfill 104 generates cracks through P-lapping after the packaging process of the product is completed, and observe whether the circuit structure 101 below the stress concentration area is disconnected through O / S. However, the above method can only detect whether the packaging structure is a good product, but cannot further know the stress value borne by the stress concentration area 106, which is not conducive to understanding the material characteristics and subsequent improvement.

[0035] Refer to Figure 2 , Figure 2 It is a schematic structural diagram of an embodiment 2a of the packaging structure according to the present application.

[0036] Such as Figure 2 As shown, the packaging structure 2a provided by the present application includes a circuit structure 201; a plurality of electronic components arranged on the circuit structure 201; a sensing module 204 arranged directly below the interval between the plurality of electronic components and above the circuit structure 201, and the sensing module 204 includes a rigid layer 2041.

[0037] Here, the plurality of electronic components may include a first electronic component 202 and a second electronic component 203. The circuit structure 201 may be a redistribution layer, and the circuit structure 201 is arranged below the first electronic component 202 and the second electronic component 203.

[0038] Here, the sensing module 204 is arranged directly below the interval between the first electronic component 202 and the second electronic component 203 and above the circuit structure 201, and is used to sense the stress value of the stress concentration area between the first electronic component 202 and the second electronic component 203.

[0039] The sensing module 204 includes a rigid layer 2041, and the rigid layer 2041 is arranged above the circuit structure 201.

[0040] In some alternative embodiments, the hardness and stiffness of the rigid layer 2041 are greater than those of the circuit structure 201, respectively. In this way, when the underfill break 206 occurs, the sensing module 204 can be prevented from being damaged, resulting in the inability of the sensing module 204 to sense the stress value.

[0041] In some alternative embodiments, the rigid layer 2041 includes a semiconductor material. For example, the semiconductor material can be a bare chip.

[0042] In some alternative embodiments, an underfill 206 is filled between the circuit structure 201, the plurality of electronic components, and the sensing module 204. Specifically, an underfill 206 is filled between the circuit structure 201, the first electronic component 202, the second electronic component 203, and the sensing module 204. It can play a role in fixing and protecting the first electronic component 202, the second electronic component 203, and the sensing module 204.

[0043] Here, by arranging the sensing module 204 directly below the area between the first electronic component 202 and the second electronic component 203 and above the circuit structure 201 in the stress concentration area, it can be used to sense the stress value borne by the stress concentration area. Also, by arranging the rigid layer 2041 above the circuit structure 201, since the hardness and stiffness of the rigid layer 2041 are greater than those of the circuit structure 201 respectively, when the underfill break 206 occurs, the sensing module 204 can be prevented from being damaged, resulting in the inability of the sensing module 204 to sense the stress value. Moreover, the rigid layer 2041 can play a protective role for the circuit structure 201, preventing cracks from spreading downward to the circuit structure 201 and causing a disconnection of the circuit structure 201 after the underfill breaks due to excessive stress.

[0044] In some alternative embodiments, the sensing module 204 is arranged to sense the stress in the area directly below the gap between the plurality of electronic components under temperature cycle testing.

[0045] In some alternative embodiments, the temperature range of the temperature cycle test is between -40°C and 125°C.

[0046] The temperature cycle test refers to cyclically testing the packaged product through high and low temperatures. In the temperature cycle test, a disconnection may occur in the circuit structure 201. The sensing module 204 can sense the stress in the area directly below the gap between the first electronic component 202 and the second electronic component 203 at different temperatures, and the temperature cycle test can be used to determine in which temperature range the packaged product will have a disconnection.

[0047] Reference Figure 3 , Figure 3 is a schematic structural diagram of the sensing module according to the present application.

[0048] As Figure 3 shown, the sensing module 204 is electrically connected to the circuit structure 201.

[0049] In some alternative embodiments, the sensing module 204 is electrically connected to the circuit structure 201 through one of the electronic components.

[0050] Here, the sensing module 204 can be electrically connected to the circuit structure 201 through the first electronic component 202 or the second electronic component 203. Specifically, when the rigid layer 2041 is a bare chip, the sensing module 204 can be electrically connected to the circuit structure 201 through the electrical connector 205. Among them, the electrical connector 205 is disposed above the sensing module 204 and connected to the first electronic component 202 or the second electronic component 203. The electrical connector can be, for example, a copper pillar, a bump, etc.

[0051] In some alternative embodiments, an adhesive layer 208 is disposed below the sensing module 204, and the sensing module 204 is fixed above the circuit structure 201 through the adhesive layer 208 to prevent the sensing module 204 from moving.

[0052] Refer to Figure 4 , Figure 4 which is a pattern circuit schematic diagram of the sensing circuit according to the present application.

[0053] As Figure 4 shown, in some alternative embodiments, the sensing module 204 includes a sensing circuit 2042. The sensing circuit 2042 includes a first trace 20421 extending in a first direction and a second trace 20422 extending in a second direction perpendicular to the first direction.

[0054] Here, the sensing circuit 2042 can include multiple sensing circuit regions. For example, the sensing circuit 2042 can include 4 sensing circuit regions. Among them, each sensing circuit region includes a first trace 20421 extending in a first direction and a second trace 20422 extending in a second direction perpendicular to the first direction, and between the respective sensing circuit regions are interconnected through the first trace 20421 and the second trace 20422.

[0055] Here, the first trace 20421 and the second trace 20422 can be designed as serpentine traces respectively.

[0056] Here, the sensing module 204 senses the stress value of the stress concentration region between the first electronic component 202 and the second electronic component 203. Specifically, it can be through the sensing circuit 2042 to sense the stress value of the stress concentration region between the first electronic component 202 and the second electronic component 203.

[0057] Here, in a three-dimensional rectangular coordinate system, the first direction may refer to the X-axis direction or the Y-axis direction, and the second direction may refer to the Y-axis direction or the X-axis direction perpendicular to the first direction.

[0058] Here, the sensitivities of the first trace of the first direction and the second trace of the second direction are different.

[0059] Here, the fact that the sensitivities of the first trace of the first direction and the second trace of the second direction are different may mean that the stress values borne by the stress concentration region in the first direction and the second direction may be different. By setting the first trace of the first direction and the second trace of the second direction, the sensing module can sense stresses in different directions.

[0060] Here, the sensing circuit 2042 is located above the rigid layer 2041.

[0061] Here, the sensing module 204 may further include an insulating layer provided above the rigid layer 2041. The sensing circuit 2042 may be provided above the insulating layer or embedded in the insulating layer. The electrical connector 205 may be provided above the insulating layer and electrically connected to the sensing circuit 2042.

[0062] Reference Figure 5 , Figure 5 is a schematic structural diagram of an embodiment 3a of the packaging structure according to the present application.

[0063] As Figure 5 shown, the rigid layer 2041 may include surface-mounted components. When the rigid layer 2041 includes surface-mounted components, the surface-mounted components are soldered to the circuit structure 201.

[0064] Here, the surface-mounted components may be soldered to the circuit structure 201 through solder. At this time, a gasket 211 may be provided on the surface-mounted components. The gasket 211 may be an insulating material to insulate the surface-mounted components from the first electronic component 202 and the second electronic component 203.

[0065] In some alternative embodiments, the sensing module 204 may be used to sense the temperature and / or humidity in the region directly below the gap between multiple electronic components.

[0066] Continuing to refer to Figure 2 , in some alternative embodiments, solder balls 210 are provided on the side of the circuit structure 201 away from the multiple electronic components.

[0067] Here, solder balls 210 are provided on the side of the circuit structure 201 away from the first electronic component 202 and the second electronic component 203.

[0068] In some alternative embodiments, at least one electronic component is configured to adjust its operating frequency according to the magnitude of the signal sensed by the sensing module 204.

[0069] By adjusting the operating frequencies of the first electronic component 202 and the second electronic component 203, the overall energy consumption of the first electronic component 202 and the second electronic component 203 can be reduced, thereby reducing heat generation and extending the lifespan of the packaged product.

[0070] Here, the sensing module is not limited to being placed in the Fanout platform (chip - on - fan - out substrate packaging platform), and can also be placed in any new technology platform with D2D (Device - to - Device) stress, such as a 2.5D interposer and a Substrate.

[0071] Reference Figures 6 - 9 , Figures 6 - 9 is a schematic diagram of the manufacturing steps of an embodiment 2a of the packaging structure according to the present application.

[0072] Reference Figure 6 ,a circuit structure 201 and a carrier 209 are provided.

[0073] Here, the circuit structure 201 can be a redistribution layer.

[0074] Reference Figure 7 ,a first electronic component 202, a second electronic component 203, and a sensing module 204 are provided.

[0075] Here, the first electronic component 202 and the second electronic component 203 can be connected to the circuit structure 201, and the sensing module 204 can be fixed above the circuit structure 201 through an adhesive layer 208 to prevent the sensing module 204 from moving. The sensing module 204 is disposed directly below the gap between multiple electronic components and above the circuit structure 201.

[0076] Among them, the sensing module 204 may include a rigid layer 2041 and sensing lines 2042. The sensing lines 2042 are located above the rigid layer 2041. The sensing lines 2042 include first traces extending in a first direction and second traces extending in a second direction perpendicular to the first direction. Here, in a three-dimensional rectangular coordinate system, the first direction may refer to the X-axis direction or the Y-axis direction, and the second direction may refer to the Y-axis direction or the X-axis direction perpendicular to the first direction. Here, the sensitivities of the first traces in the first direction and the second traces in the second direction are different. Here, the fact that the sensitivities of the first traces in the first direction and the second traces in the second direction are different may mean that the stress values borne by the stress concentration region in the first direction and the second direction may be different. By setting the first traces in the first direction and the second traces in the second direction, the sensing module can sense stresses in different directions.

[0077] Here, the sensing module 204 may further include an insulating layer provided above the rigid layer 2041. The sensing lines 2042 may be provided above or embedded in the insulating layer. The electrical connector 205 may be provided above the insulating layer and electrically connected to the sensing lines 2042.

[0078] The rigid layer 2041 includes a semiconductor material. For example, the semiconductor material may be a bare chip. When the rigid layer 2041 includes a semiconductor material, the sensing module 204 may be electrically connected to the circuit structure 201 through the first electronic component 202 or the second electronic component 203. Specifically, the sensing module 204 may be electrically connected to the circuit structure 201 through the electrical connector 205. Among them, the electrical connector 205 is disposed above the sensing module 204 and connected to the first electronic component 202 or the second electronic component 203. The electrical connector may be, for example, a copper pillar, a bump, etc. When the rigid layer 2041 includes a surface mount component, the surface mount component may be soldered to the circuit structure 201 through solder. At this time, a gasket 211 may be provided on the surface mount component. The gasket 211 may be an insulating material to insulate the surface mount component from the first electronic component 202 and the second electronic component 203.

[0079] The sensing module 204 may be used to sense the stress value of the stress concentration region between the first electronic component 202 and the second electronic component 203. The hardness and stiffness of the rigid layer 2041 are respectively greater than those of the circuit structure 201. In this way, when the underfill 206 breaks, the sensing module 204 can be prevented from being damaged, resulting in the sensing module 204 being unable to sense the stress value.

[0080] Here, by disposing a sensing module 204 directly below and above the circuit structure 201 between the first electronic component 202 and the second electronic component 203 in the stress concentration area, it can be used to sense the stress value borne by the stress concentration area. Moreover, by disposing a rigid layer 2041 above the circuit structure, since the hardness and stiffness of the rigid layer 2041 are respectively greater than those of the circuit structure 201, when the underfill 206 breaks, it can prevent the sensing module 204 from being damaged, resulting in the inability of the sensing module 204 to sense the stress value. Additionally, the rigid layer 2041 can protect the circuit structure 201 and prevent cracks from spreading downward to the circuit structure 201 along with the underfill fracture due to excessive stress, causing disconnection of the circuit structure 201.

[0081] Reference Figure 8 , an underfill 206 and a molding compound 207 are provided to stabilize and protect the first electronic component 202, the second electronic component 203, and the sensing module 204.

[0082] Reference Figure 9 , the carrier 209 is removed, and solder balls 210 are disposed on the side of the circuit structure 201 away from the first electronic component 202 and the second electronic component 203.

[0083] Although the present application has been described and illustrated with reference to specific embodiments of the present application, these descriptions and illustrations do not limit the present application. Those skilled in the art can clearly understand that various changes can be made, and equivalent elements can be substituted within the embodiments without departing from the true spirit and scope of the present application as defined by the appended claims. The drawings may not necessarily be drawn to scale. Due to variables in the manufacturing process, etc., there may be differences between the technical reproduction and the actual implementation in the present application. There may be other embodiments of the present application that are not specifically described. The specification and drawings should be regarded as illustrative rather than restrictive. Modifications can be made to adapt a particular situation, material, composition of matter, method, or process to the objectives, spirit, and scope of the present application. All such modifications fall within the scope of the appended claims herein. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations can be combined, subdivided, or reordered without departing from the teachings of the present application to form equivalent methods. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the present application.

Claims

1. An encapsulation structure, characterized in that, Comprising: A circuit structure; A plurality of electronic components, disposed on the circuit structure; A sensing module, disposed directly below the space between the plurality of electronic components and above the circuit structure, the sensing module including a rigid layer.

2. The encapsulation structure according to claim 1, wherein The sensing module is configured to sense stress in the area directly below the space between the plurality of electronic components under a temperature cycle test.

3. The encapsulation structure according to claim 1, characterized in that, The sensing module includes a sensing circuit, the sensing circuit including a first trace extending in a first direction and a second trace extending in a second direction perpendicular to the first direction.

4. The encapsulation structure according to claim 1, wherein The hardness and stiffness of the rigid layer are respectively greater than those of the circuit structure.

5. The encapsulation structure according to claim 4, wherein The rigid layer includes a semiconductor material.

6. The encapsulation structure according to claim 1, wherein, The sensing module is used to sense the temperature and / or humidity in the area directly below the space between the plurality of electronic components.

7. The encapsulation structure according to claim 1, wherein An underfill is filled between the circuit structure, the plurality of electronic components, and the sensing module.

8. The encapsulation structure according to claim 1, wherein A bonding layer is disposed below the sensing module, and the sensing module is fixed above the circuit structure through the bonding layer.

9. The encapsulation structure according to claim 1, wherein At least one of the electronic components is configured to adjust its operating frequency according to the magnitude of the signal sensed by the sensing module.

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