Graphene module

Abstract

The utility model provides a graphene module which comprises a working part, the working part comprises a graphene film, the graphene film comprises a first area and a second area which are connected in series, and the heating power of the first area is larger than that of the second area; one conductive connecting piece is connected to the first area of the graphene film, and the other conductive connecting piece is connected to the second area; and the packaging part is used for packaging the working part in an insulating manner, and the contact part of the packaging part and the conductive connecting piece is hollowed out. The graphene module can emit heat in a power-on state and dissipate heat in a power-off state, so that the heating requirement of the electronic equipment when the electronic equipment is used in a low-temperature environment and the heat dissipation requirement of the electronic equipment when the electronic equipment is used with high power consumption are met.

Description

Technical Field

[0001] The present application relates to the technical field of thermal management, and particularly relates to a graphene module. Background Art

[0002] Currently, the batteries of electronic products are mainly lithium batteries. The operating temperature range of lithium batteries is usually between -20°C and 60°C, but the operating temperature at which the performance is complete is commonly 0~40°C. Data analysis shows that for ordinary lithium batteries, at 0 degrees, their capacity will decrease by 20%. When the temperature reaches -10°C, the capacity may be only about half. This is because in a low-temperature environment, the resistance value of the battery electrolyte becomes larger, the chemical reaction rate decreases, and the generated current is also relatively reduced, resulting in a decrease in the available power. In the cold winter, when the electronic product detects that the battery capacity is low and the current is small due to the low ambient temperature, the temperature protection circuit in the battery's built-in protection board will automatically start, and the electronic product will shut down automatically, seriously affecting the user experience.

[0003] At the same time, with the development of technology, the processors of electronic products need to process more data and tasks, which causes the processors to generate more heat during operation. When overheated, the electronic product gets hot, resulting in slow device operation or untimely response. It may also have a negative impact on the battery life. The high-temperature environment will accelerate the aging of the battery and shorten its service life. Summary of the Invention

[0004] For the above reasons, the present application provides a graphene film module to solve the problem that the use of electronic devices is affected by too low or too high temperatures during use.

[0005] The present application provides a graphene film, including:

[0006] A working part, the working part includes a graphene film, the graphene film includes a first region and a second region, and the heating power of the first region is greater than that of the second region;

[0007] A pair of conductive connectors, one conductive connector is connected to the first region of the graphene film, and the other is connected to the second region;

[0008] An encapsulation part, used for insulatingly encapsulating the working part, and the encapsulation part is hollowed out at the contact with the conductive connectors.

[0009] According to the embodiments of the present application, by using the graphene module, the heating problem that needs to be solved when the electronic device is used in a low-temperature environment and the heat dissipation problem that needs to be solved when the electronic device is used with high power consumption are simultaneously solved.

[0010] In the embodiment of the graphene module provided by this application, the working part includes a graphene film. The graphene film has high electrical conductivity. When the graphene film is electrified in a low-temperature environment, the carbon atoms inside it can quickly conduct current and generate heat. The graphene film also has high thermal conductivity, and heat can be quickly transferred through the graphene material in a high-temperature environment, effectively conducting heat from the heat source area to the low-temperature area. The graphene film is composed of a first region and a second region. When the graphene module is used for heating, the heating power of the first region is relatively large, and it can be correspondingly attached to the part of the electronic device that needs auxiliary heating, mainly playing a heating role. The heating power of the second region is relatively small, and it can be correspondingly attached to the part of the electronic device that can generate heat by itself, mainly playing a temperature equalization role.

[0011] In the embodiment of the graphene module provided by this application, it includes a pair of conductive connectors. One conductive connector is connected to the first region, and the other conductive connector is connected to the second region to realize the electrical connection between the first region and the second region.

[0012] The connection points of the conductive connectors need to consider the hot spot problem. The conductive connectors may be aged or burned out when working at a high temperature for a long time. Therefore, it is necessary to minimize the heating power of the connection points of the conductive connectors. The heating power of the second region is designed to be relatively small. The heating temperature of the connection points in the first region can be reduced by increasing the resistance width, resistance thickness, resistivity, etc. of the connection points. This application does not limit this here. At the same time, the hot spot problem can also be solved by using heat-resistant materials as conductive connectors.

[0013] In the embodiment of the graphene module provided by this application, it includes a packaging part, and the packaging part is hollowed out at the contact with the conductive connector. The internal space of the electronic device is limited. The hollow design exposes the conductive connectors connected to the graphene film, which is more convenient to realize the electrical connection of the graphene module. For example, using metal electrode sheets as conductive connectors, the metal electrode sheets exposed in the hollow part can be directly in contact with the main board of the electronic device to achieve conduction.

[0014] In some embodiments provided by this application, the resistance value of the first region is 5 times or more than 5 times that of the second region. According to the calculation formula of the power of each part of the series circuit P = I 2 R, the heating power can be regulated by controlling the resistance. Specifically, the resistance value of the second region is set to 1 / 5 or less of that of the first region, that is, the heating power of the second region is 1 / 5 or less of that of the first region. Since in the heating application process, the second region is correspondingly attached to the part of the electronic device that can generate heat by itself. If the part of the electronic device that can generate heat by itself is overheated, it may cause the temperature to be too high, resulting in slow device operation or untimely response.

[0015] In some embodiments provided by the present application, the graphene film in the first region is in a serpentine shape. Since the resistivity of the graphene film is relatively low, usually in the range of 1×10 -8 ~3×10 -6 Ω·m, while the resistivity of common heating wire materials such as nickel-chromium alloy or iron-chromium-aluminum alloy is in the range of 0.01~0.1Ω·m. When the electronic device is in use, the set heating power is small and constant. According to the resistance value calculation formula R = ρL / Wh (where R represents the resistance value, ρ represents the resistivity, L represents the resistance length, W represents the resistance width, and h represents the resistance thickness) and the heating power calculation formula P = U 2 / R, the applicant found that in order not to overheat, the graphene film needs to be made as long as possible and / or as narrow as possible. In order to ensure the heating power and the uniformity of heating or heat dissipation, the graphene film is designed in a serpentine shape so that the graphene film is bent and coiled around the components that need heating or heat dissipation.

[0016] Furthermore, in some embodiments provided by the present application, the width of the graphene film in the first region is ≥2 mm. The applicant found that the heat dissipation efficiency of the graphene film is proportional to the width of the graphene film. If the width of the graphene film decreases, its heat transfer path will also decrease accordingly. Therefore, while the width of the graphene film in the first region is as small as possible, it is necessary to ensure that its width is ≥2 mm, so as to balance the heating power and the heat dissipation efficiency. At the same time, a width of ≥2 mm for the graphene film in the first region is also more conducive to industrial waste discharge.

[0017] In some embodiments provided by the present application, the working part of the graphene module further includes a heat conducting member. The heat conducting member is connected to one side in the thickness direction of the graphene film, and the position corresponding to the orthographic projection of the heat conducting member on the conductive connecting member is hollowed out. The first region of the graphene heating film is designed in a serpentine structure. Affected by the wiring gap, its heating uniformity is relatively poor. Connecting a heat conducting member to one side in the thickness direction of the graphene film can play an auxiliary role in heat equalization. The heat conducting member is adhered to one side of the graphene film through heat-conducting glue or double-sided glue. However, when the graphene film is powered on, the glue layer at the position of the conductive connecting member is prone to the risk of electric breakdown, resulting in the connection between the heat conducting member and the graphene film, and then the resistance value of the entire working part changes and fails. A hollow design is carried out at the position corresponding to the orthographic projection of the heat conducting member and the conductive connecting member, so as to avoid the failure risk.

[0018] In some embodiments provided by the present application, the heat conducting member is any one of a graphene heat conducting film, an artificial graphite film, a VC heat sink, and a graphene superconducting film. Among them, the graphene superconducting film refers to a film material obtained by soaking a graphene oxide film in a reducing reaction solution for pore-forming treatment and then performing carbonization, graphitization, and rolling treatments in sequence.

[0019] In some embodiments provided by the present application, the number of heat-conducting members ≥ 1, and the reserved gap for the heat dissipation / heat generation member in the electronic device is 50 μm to 200 μm. Therefore, when the graphene module is used as a heat dissipation / heat generation member, it also needs to reach a preset thickness to prevent excessive air medium in the reserved gap from affecting heat transfer. When the design fails to reach the preset thickness, in some embodiments, the thickness can be increased by stacking heat-conducting members.

[0020] In some embodiments provided by the present application, the conductive connecting member is any one of an FPC cable, a silver paste electrode, a riveted wire, and a metal electrode sheet.

[0021] In some embodiments provided by the present application, the encapsulation part is any one of a PET film and a PI film. The encapsulation part plays an insulating encapsulation role for the graphene film.

[0022] In some embodiments provided by the present application, a thermistor is connected between the encapsulation part and the graphene film to achieve more accurate temperature monitoring.

[0023] According to the graphene module of the embodiment of the present application, it can be connected to the main board of the electronic device through a conductive connecting member, and the power-on and power-off of the graphene module can be controlled by the temperature monitoring mechanism on the main board of the electronic device. Specifically, when the temperature of the electronic device is in a low-temperature state (such as defining below 0 °C as a low-temperature state), the graphene film module is powered on and used as a heating component. When the electronic device is in a normal or high-temperature state (such as defining above 0 °C as a normal temperature state and above 40 °C as a high-temperature state), the graphene film module is powered off and used as a heat dissipation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 Explosion schematic diagram of the graphene module provided in Embodiment 1 of the present application

[0026] Figure 2 Schematic diagram of the working part of the graphene module provided in Embodiment 1 of the present application

[0027] Figure 3 Schematic diagram of the graphene module provided in Embodiment 2 of the present application

[0028] Figure 4 Explosion schematic diagram of the graphene module provided in Embodiment 3 of the present application

[0029] Figure 5Schematic diagram of the working part of the graphene module provided in Embodiment 3 of the present application

[0030] Figure 6 Explosion diagram of the graphene module provided in Embodiment 4 of the present application

[0031] Figure 7 Thermal imaging diagram of a group of graphene film modules provided in Experimental Example 1 of the present application

[0032] Figure 8 Thermal imaging diagram of a group of graphene film modules provided in Experimental Example 1 of the present application

[0033] Figure 9 Thermal simulation diagram of the blank control group provided in Experimental Example 2 of the present application

[0034] Figure 10 Thermal simulation diagram of a group of graphene film modules provided in Experimental Example 2 of the present application

[0035] Figure 11 Thermal simulation diagram of a group of graphene film modules provided in Experimental Example 2 of the present application

[0036] 1 - Graphene film; 11 - First region; 12 - Second region

[0037] 2 - Heat conducting member

[0038] 3 - Double - sided adhesive

[0039] 4 - Conductive connecting member

[0040] 5 - Encapsulation part Detailed implementation manners

[0041] The following detailed description of the exemplary embodiments of the present application refers to the accompanying drawings, which form a part of the description. In the drawings, exemplary embodiments in which the present application can be implemented are shown as examples. The following more detailed description of the embodiments of the present application does not limit the scope of the present application as claimed, but is merely for illustrative purposes and does not limit the description of the features and characteristics of the present application, in order to present the best mode of implementing the present application and to enable those skilled in the art to implement the present application. However, it should be understood that various modifications and variations can be made without departing from the scope of the present application defined by the appended claims. The detailed description and the drawings should be considered illustrative only, not restrictive. If there are any such modifications and variations, they will all fall within the scope of the present application described herein. In addition, the background art is intended to illustrate the research and development status and significance of the present technology and is not intended to limit the present application and the application field of the present application.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0043] It should be understood that in this application, "connection" and "being connected" can both refer to a mechanical connection relationship or a physical connection relationship. For example, A is connected to B or A is connected with B can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and it is difficult to separate A and B.

[0044] For those not specified in the embodiments, they are carried out according to conventional conditions or the conditions recommended by the manufacturer. For reagents or instruments not specified by the manufacturer, they are all conventional products that can be obtained through commercial purchase.

[0045] The technical solutions in this application will be described below in conjunction with the accompanying drawings.

[0046] The technology provided by this application is applicable to electronic devices with heat dissipation requirements and / or heat generation requirements, such as mobile phones, tablet computers, laptop computers, smart watches, smart glasses, etc. In specific applications, when the electronic device monitors that the ambient temperature is too low, which will lead to a reduction in the available battery power, the graphene module provided by the embodiments of this application is powered on and used as a heating component to assist the electronic device battery to warm up; when the electronic device monitors that the working temperature is not too low, the graphene module provided by the embodiments of this application is in a power-off state and assists the electronic device in heat dissipation as a heat dissipation component. Embodiment 1

[0047] As Figures 1 - 2 shown, Figure 1 is an exploded view of the graphene film module provided in this embodiment, Figure 2 is a structural diagram of the working part of the graphene module provided in this embodiment. The graphene module provided in this embodiment includes a working part, and the working part includes a graphene film 1. As Figure 2 shown, for ease of understanding, a dotted line is used as a dividing line. The graphene film includes a first region 11 and a second region 12 connected in series with each other, and the heating power of the first region 11 is greater than that of the second region 12;

[0048] a pair of conductive connectors 4, one of the conductive connectors 4 is connected to the first region 11 of the graphene film, and the other is connected to the second region 12;

[0049] a packaging part 5 that insulates and packages the working part, and the packaging part 5 is hollowed out at the contact with the conductive connector 4.

[0050] The graphene module provided in this embodiment is used as a heat dissipation film in normal and high-temperature environments, and both the first region and the second region play the roles of heat dissipation and temperature equalization; in a low-temperature environment, the graphene film provided in this embodiment is electrified and used as a heating film. The first region has a relatively large heating power and can be correspondingly attached to the part of the electronic device that needs auxiliary heating, mainly playing the role of heating. The second region has a relatively small heating power and can be correspondingly attached to the part of the electronic device that can generate heat by itself, mainly playing the role of temperature equalization.

[0051] In this embodiment, according to the calculation formula of the heating power of each part in a series circuit P = I 2 R, by adjusting the resistance value of the first region to be greater than that of the second region, the heating power of the first region 11 is greater than that of the second region 12. In this application, the resistance value of the first region is 8.8 times that of the second region.

[0052] Since the resistivity of the graphene film is relatively low, usually in the range of 1×10 -8 ~3×10 -6 Ω·m (the resistivity of common heating wire materials such as nickel-chromium alloy or iron-chromium-aluminum alloy is in the range of 0.01~0.1Ω·m), and the heating power set during the use of the electronic device is relatively small and constant. According to the resistance value calculation formula R = ρL / Wh and the heating power calculation formula P = U 2 / R, the applicant found that in order not to overheat, the graphene film needs to be made as long as possible and / or as narrow as possible. And in order to balance the heating power and the uniformity of heating or heat dissipation, the graphene film is designed in a serpentine winding shape, so that the graphene film is bent and coiled around the component that needs to generate heat or needs to dissipate heat.

[0053] The applicant also found that the heat dissipation efficiency of the graphene film is proportional to the width of the graphene film. If the width of the graphene film decreases, its heat transfer path will also decrease accordingly. Therefore, while the width of the graphene film in the first region is as small as possible, it is necessary to ensure that its width ≥ 2mm to balance the heating power and the heat dissipation efficiency. Typically and restrictively, the resistance widths of the first region are 2mm, 2.3mm, 2.5mm, 3mm, 4.76mm, 5mm, 6mm, 7mm, 8.37mm, 9mm, 10mm.

[0054] In other embodiments, the conductive connection member 4 can be any one of an FPC cable, a silver paste electrode, a riveted wire, and a metal electrode sheet. In this embodiment, the conductive connection member 4 is a metal electrode sheet, specifically a copper foil electrode sheet. When the graphene film module is in use, the graphene film 1 is connected to the main board of the electronic device through the conductive connection member, and the energization of the graphene module is controlled through the conductive connection member and the temperature monitoring mechanism on the main board of the electronic device. Specifically, when the temperature of the electronic device is in a low temperature state, the graphene film module is energized to generate heat, and when the temperature of the electronic device is in a normal or high temperature state, the graphene film module is de-energized to dissipate heat.

[0055] In other embodiments, the encapsulation part 5 can be any one of a PET film and a PI film. In this embodiment, the encapsulation part 5 is a PET film, and the encapsulation part plays an insulating encapsulation role for the graphene film.

[0056] In this embodiment, the voltage at both ends of the graphene module is 3.5V, the heating power is 5W, and the resistivity of the graphene film is 1.102×10 -6 Ω·m. Among them, the resistance length of the first region 11 is 761mm, the resistance width is 4.76mm, the thickness is 80μm, the resistance value of the first region 11 is 2.20Ω, and the heating power is 4.5W; the second region 12 has a special-shaped design, but its overall resistance width is greater than the resistance width of the first region, and the resistance length is less than the resistance length of the first region. The resistance value of the second region 11 is 0.25Ω, and the heating power is 0.5W. Embodiment 2

[0057] As Figure 3 shown, different from Embodiment 1, in this embodiment, the conductive connection member 4 is an FPC cable, and the encapsulation part 5 is a PI film. Other structures of this embodiment are the same as those of Embodiment 1 and will not be described in detail here. Embodiment 3

[0058] As Figures 4 - 5 shown, Figure 4 is an exploded view of the graphene module provided in Embodiment 3, Figure 5 and is a structural diagram of the working part of the graphene film module provided in this embodiment. Different from Embodiment 1, in this embodiment, the working part further includes a heat conducting member 2 connected to one side in the thickness direction of the graphene film 1, and in this embodiment, the thickness of the graphene film, the resistance length and width of the first region are all different from those in Embodiment 1.

[0059] The graphene heating film is designed in a serpentine structure. Affected by the wiring gap, its heating uniformity is relatively poor. Connecting the heat conducting member 2 to one side in the thickness direction of the graphene film can play an auxiliary heat equalizing effect.

[0060] The heat conducting member 2 can be any one or more of a graphene heat conducting film, an artificial graphite film, a VC heat pipe, and a graphene superconducting film. In this embodiment, the heat conducting member 2 is a 55-μm-thick graphene heat conducting film.

[0061] The heat conducting member 2 may or may not have the same contour shape as the graphene film 1. In this embodiment, the heat conducting member 2 has the same contour shape as the graphene film 1.

[0062] In this embodiment, the heat conducting member 2 is adhered to one side of the graphene film through a double-sided adhesive 3.

[0063] The other structures of this embodiment are the same as those of Embodiment 1 and will not be described in detail here.

[0064] In this embodiment, the voltage at both ends of the graphene module is 3.5 V, the heating power is 5 W, and the resistivity of the graphene film is 1.102×10 -6 Ω·m. Among them, the resistance length of the first region 11 is 458.20 mm, the resistance width is 8.37 mm, the thickness is 25 μm, the resistance value of the first region is 2.41 Ω, and the heating power is 4.92 W; the second region 12 has a special-shaped design, but its overall resistance width is greater than the resistance width of the first region, and the resistance length is less than the resistance length of the first region. The resistance value of the second region 11 is 0.04 Ω, and the heating power is 0.08 W. Embodiment 4

[0065] Figure 6 is an exploded view of the graphene module provided in Embodiment 4. As Figure 6 shown, different from Embodiment 3, in this embodiment, the projection corresponding part of the heat conducting member 2 on the conductive connecting member 4 is a hollow design, so as to avoid the failure risk caused by the electric breakdown of the double-sided adhesive. The other structures of this embodiment are the same as those of Embodiment 3 and will not be described in detail here. Embodiment 5

[0066] Different from Embodiment 3, in this embodiment, the heat conducting member is a 55-μm-thick artificial graphite film. The other structures of this embodiment are the same as those of Embodiment 3 and will not be described in detail here. Embodiment 6

[0067] Different from Embodiment 3, in this embodiment, the heat conducting member is three layers of 25-μm-thick graphene heat conducting films. The other structures of this embodiment are the same as those of Embodiment 3 and will not be described in detail here.

[0068] Experimental Example 1

[0069] The graphene film modules provided in Example 1 and Example 3 were powered on to test their heat generation conditions. Specifically, the graphene film modules provided in Example 1 and Example 3 were heated at a power of 5W, and a thermal imager was used to observe their heat generation conditions. The experimental results are shown respectively as Figure 7 , Figure 8 shown.

[0070] As Figure 7 shown, the highest temperature of the graphene module provided in Example 1 was 57.9°C. The highest temperature of the graphene module was higher than that of Example 3, and the heat generation was mainly concentrated in the first region.

[0071] As Figure 8 shown, the highest temperature of the graphene film module provided in Example 3 was 44.0°C. Due to the presence of the heat conducting member 2, the overall heat generation was more uniform compared to the graphene heat generating module of Example 1.

[0072] Experimental Example 2

[0073] The graphene film modules provided in Example 1 and Example 3 and a blank control group without a graphene film module were subjected to a thermal simulation test. The graphene film modules were not powered on to test the heat dissipation conditions of the graphene film modules. The experimental results are shown as Figures 9 - 11 shown.

[0074] Figure 9 is the thermal simulation result diagram of the blank control group without a graphene film module. The temperature of the back cover of the electronic device in the main board area is about 47 - 49°C, and the temperature in the battery area is about 36 - 39.5°C;

[0075] Figure 10 is the thermal simulation result diagram of the electronic device equipped with the graphene module of Example 1. The temperature of the back cover of the electronic device in the main board area is about 38 - 39°C, and the highest temperature in the battery area is 33 - 36°C;

[0076] Figure 11 is the thermal simulation result diagram of the electronic device equipped with the graphene film module of Example 3. The temperature of the back cover of the electronic device in the main board area is about 38 - 39°C, and the highest temperature in the battery area is 33 - 36°C.

[0077] It can be seen from this that the graphene film modules provided in Example 1 and Example 3 both have good heat dissipation effects.

[0078] As described above, this is the specific implementation manner of the present application. However, the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A graphene module, characterized in that, Including: A working part, the working part includes a graphene film, the graphene film includes a first region and a second region connected in series, and the heating power of the first region is greater than that of the second region; A pair of conductive connectors, one of the conductive connectors is connected to the first region of the graphene film, and the other is connected to the second region; An encapsulation part for insulatingly encapsulating the working part, and the encapsulation part is hollowed out at the contact with the conductive connector.

2. A graphene module as described in claim 1, characterized in that, The resistance value of the first region is 5 times or more than 5 times that of the second region.

3. A graphene module as described in claim 1, characterized in that, The graphene film of the first region is in a serpentine winding shape.

4. A graphene module as described in claim 3, characterized in that, The width of the graphene film in the first region is ≥2 mm.

5. A graphene module as described in claim 1, characterized in that, The working part further includes a heat conducting part, the heat conducting part is connected to one side in the thickness direction of the graphene film, and the heat conducting part is hollowed out at the position corresponding to the orthographic projection of the conductive connector.

6. A graphene module as described in claim 5, characterized in that, The heat conducting part is any one of a graphene heat conducting film, an artificial graphite film, a VC heat pipe, and a graphene superconducting film.

7. A graphene module as described in claim 5, characterized in that, There is ≥1 heat conducting part.

8. A graphene module as described in claim 1, characterized in that, The conductive connector is any one of an FPC cable, a silver paste electrode, a riveted wire, and a metal electrode sheet.

9. A graphene module as described in claim 1, wherein, The encapsulation part is any one of a PET film and a PI film.

10. A graphene module as described in claim 1, characterized in that, A thermistor is connected between the encapsulation part and the working part.

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