Clamp for testing optical module and optical module testing equipment

Abstract

The embodiment of the utility model provides a clamp for testing an optical module and optical module testing equipment. The clamp comprises a shell; the first temperature control assembly and the second temperature control assembly are oppositely arranged in the shell in a spaced mode; the limiting structure is provided with a limiting through hole, the limiting structure is clamped between the first temperature control assembly and the second temperature control assembly, and a first limiting boss and a second limiting boss corresponding to the first temperature control assembly and the second temperature control assembly are arranged on the two opposite sides of the limiting through hole respectively; an insertion cavity for accommodating an optical module to be measured is formed between the first limiting boss and the second limiting boss; the driving mechanism is arranged in the shell, and the driving mechanism is in transmission connection with the first temperature control assembly and the second temperature control assembly so as to drive the first temperature control assembly and the second temperature control assembly to move in the direction close to the limiting structure to abut against the optical module to be measured.

Description

Technical Field

[0001] The embodiments of the present disclosure belong to the technical field of optoelectronic device performance testing, and specifically relate to a fixture for optical module testing and an optical module testing device. Background Art

[0002] The optical module test equipment includes a bit error tester. The optical module to be tested inserted into the fixture is connected to a test circuit board (DUT board) to establish a communication connection with the bit error tester to test the optical module to be tested.

[0003] Generally, different optical modules to be tested may have dimensional errors during manufacturing. When different optical modules to be tested are inserted into the fixture manually or by a robot to be plugged into the test circuit board socket, not every optical module to be tested matches the fixture slot, so it is impossible to ensure that the positions of each optical module to be tested are consistent in the three directions of X, Y, and Z. In this way, when the optical module to be tested is plugged into the test circuit board, its position deviation in any direction of X, Y or Z will, on the one hand, cause the test circuit board to be stressed and reduce its lifespan. More importantly, the poor contact caused by the deviation will seriously affect the signal transmission channel, resulting in the accuracy of the test signal transmission, which will directly affect the accuracy of the test results.

[0004] Therefore, how to solve the above problems has become a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0005] The embodiments of the present disclosure aim to solve at least one of the technical problems existing in the prior art, and provide a fixture for testing an optical module and an optical module testing device.

[0006] According to a first aspect of an embodiment of the present disclosure, there is provided a fixture for testing an optical module, comprising: a housing;

[0007] A first temperature control component and a second temperature control component are arranged in the housing with a relative spacing;

[0008] A limiting structure of a limiting through hole is provided, the limiting structure is sandwiched between the first temperature control component and the second temperature control component, and first limiting bosses and second limiting bosses corresponding to the first temperature control component and the second temperature control component are respectively provided on opposite sides of the limiting through hole, and an insertion cavity for accommodating the optical module to be measured is formed between the first limiting boss and the second limiting boss;

[0009] A driving mechanism is disposed in the housing, and is respectively connected to the first temperature control component and the second temperature control component to drive the first temperature control component and the second temperature control component to move toward the limiting structure to abut against the optical module to be measured.

[0010] Optionally, the limiting structure includes a first limiting block and a second limiting block which are arranged relatively at an interval;

[0011] The first limiting block and the second limiting block are respectively provided with the first limiting boss on one side close to the first temperature control component;

[0012] The second limiting bosses are respectively arranged on one side of the first limiting block and the second limiting block close to the second temperature control component.

[0013] Optionally, the first limiting boss and the second limiting boss both extend along the depth direction of the insertion cavity.

[0014] Optionally, the driving mechanism includes a first cylinder and a second cylinder;

[0015] The cylinder body of the first cylinder is located at a side of the first temperature control component away from the second temperature control component and is connected to the housing, and the first piston rod of the first cylinder corresponds to the first temperature control component;

[0016] The cylinder body of the second cylinder is located at a side of the second temperature control component away from the first temperature control component and is connected to the shell, and the second piston rod of the second cylinder corresponds to the second temperature control component.

[0017] Optionally, the first temperature control component includes a first water cooling module, a first semiconductor refrigeration module and a first heat sink module; the first water cooling module is transmission-connected to the driving mechanism, the first heat sink module is located on a side of the limiting structure away from the second temperature control component, and the first semiconductor refrigeration module is sandwiched between the first water cooling module and the first heat sink module;

[0018] The second temperature control component includes a second water cooling module, a second semiconductor refrigeration module and a second heat sink module; the second water cooling module is transmission-connected to the driving mechanism, the second heat sink module is located on the side of the limiting structure away from the first temperature control component, and the second semiconductor refrigeration module is sandwiched between the second water cooling module and the second heat sink module.

[0019] Optionally, the first heat sink module includes a first heat sink and a first heat sink cover plate covered on the first heat sink, a first end of the first heat sink abuts against the first semiconductor refrigeration module, and a second end of the first heat sink passes through the first heat sink cover plate and corresponds to the limiting through hole of the limiting structure;

[0020] The second heat sink module includes a second heat sink and a second heat sink cover plate covering the second heat sink, the first end of the second heat sink abuts against the second semiconductor refrigeration module, and the second end of the second heat sink passes through the second heat sink cover plate and corresponds to the limiting through hole of the limiting structure.

[0021] Optionally, a first avoidance through-hole and a first mounting groove surrounding the outside of the first avoidance through-hole are provided on the side of the first heat sink cover plate facing the first heat sink; a first protruding portion protruding towards the first heat sink cover plate is provided at the second end of the first heat sink, the first heat sink is disposed in the first mounting groove, and the first protruding portion passes through the first avoidance through-hole and corresponds to the limit through-hole;

[0022] A second avoidance through-hole and a second mounting groove surrounding the outside of the second avoidance through-hole are provided on the side of the second heat sink cover plate facing the second heat sink; a second protruding portion protruding towards the second heat sink cover plate is provided at the second end of the second heat sink, the second heat sink is disposed in the second mounting groove, and the second protruding portion passes through the second avoidance through-hole and corresponds to the limit through-hole.

[0023] Optionally, the fixture further includes a guiding mechanism, the guiding mechanism is connected to the housing and is movably connected to the first temperature control component and / or the second temperature control component to guide the movement of the first temperature control component and / or the second temperature control component.

[0024] Optionally, the guiding mechanism includes a first guiding member and a second guiding member;

[0025] The first end of the first guiding member is connected to the housing, and the second end of the first guiding member passes through the first temperature control component to guide the movement of the first temperature control component;

[0026] The first end of the second guiding member is connected to the housing, and the second end of the second guiding member passes through the second temperature control component to guide the movement of the second temperature control component.

[0027] Optionally, the guiding mechanism further includes a first limiting member, a first elastic member, a second limiting member and a second elastic member;

[0028] The first limiting member is disposed at the second end of the first guiding member, and the first elastic member is clamped between the first temperature control component and the first limiting member;

[0029] The second limiting member is disposed at the second end of the second guiding member, and the second elastic member is clamped between the second temperature control component and the second limiting member.

[0030] In a second aspect of the embodiments of the present disclosure, an optical module testing device is provided. The optical module testing device includes a testing box body and the above-mentioned fixture for optical module testing; the fixture for optical module testing is detachably connected to the testing box body.

[0031] The beneficial effects of the embodiments of the present disclosure include:

[0032] In the present disclosure, the insertion cavity formed by the first limiting boss and the second limiting boss can effectively limit the position of the optical module when it is inserted into the insertion cavity, avoiding the position deviation of the optical module during the insertion process and the friction with the heat sink resulting in appearance wear. In addition, the first limiting boss can form a certain gap between the first temperature control component and the optical module, and the second limiting boss can form a certain gap between the second temperature control component and the optical module, thereby avoiding the direct contact between the heat sink and the first temperature control component and the second temperature control component, and further avoiding the wear of the heat sink. Furthermore, by utilizing the limiting effects of the first limiting boss and the second limiting boss, the accuracy of the insertion position of the optical module can be ensured, the accuracy of the error code test can be guaranteed, and the service life of the test circuit board can be prolonged. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic structural diagram of a fixture for testing an optical module according to an embodiment of the present disclosure;

[0034] Figure 2 is a schematic structural diagram of a fixture for testing an optical module according to an embodiment of the present disclosure, wherein the positional relationship between the first temperature control component, the limiting structure, and the second temperature control component is shown;

[0035] Figure 3 is Figure 2 a partially enlarged schematic diagram; wherein the positional relationship between the first limiting boss, the second limiting boss, and the insertion cavity is shown;

[0036] Figure 4 is a schematic structural diagram of a fixture for testing an optical module according to another embodiment of the present disclosure;

[0037] Figure 5 is Figure 4 an exploded structural diagram of

[0038] Figure 6 is Figure 5 a partially enlarged schematic diagram; wherein the positional relationship between the limiting through hole and the insertion cavity is shown;

[0039] Figure 7 is an exploded structural diagram of the first heat sink module and the second heat sink module;

[0040] Figure 8 is a schematic structural diagram of a fixture for testing an optical module according to an embodiment of the present disclosure; showing the positional relationship between the second temperature detection element and the second heat sink;

[0041] Figure 9 is Figure 8 a partially enlarged schematic diagram;

[0042] Figure 10 Schematic structural diagram of a fixture for optical module testing according to another embodiment of the present disclosure; the positional relationship between the first temperature detection element and the first heat sink is shown;

[0043] Figure 11 For Figure 10 Partial structure enlarged schematic diagram;

[0044] Figure 12 Schematic structural diagram of an optical module testing device according to an embodiment of the present disclosure.

[0045] In the figure, 1 is an optical module testing device; 2 is an optical module; 10 is a fixture; 11 is a housing; 12 is a first temperature control component;

[0046] 121 is a first water cooling module; 122 is a first semiconductor refrigeration module; 123 is a first heat sink module;

[0047] 1211 is a first water cooling seat; 1212 is a first water cooling head; 12111 is a first limiting groove; 1231 is a first heat sink; 1232 is a first heat sink cover plate; 1233 is a first temperature detection element; 12311 is a first protruding part; 12321 is a first avoidance through hole; 12322 is a first installation groove;

[0048] 13 is a second temperature control component; 131 is a second water cooling module; 132 is a second semiconductor refrigeration module; 133 is a second heat sink module;

[0049] 1311 is a second water cooling seat; 1312 is a second water cooling head; 1331 is a second heat sink; 1332 is a second heat sink cover plate; 1333 is a second temperature detection element; 13311 is a second protruding part; 13321 is a second avoidance through hole;

[0050] 14 is a limiting structure; 141 is a limiting through hole; 142 is a first limiting boss; 143 is a second limiting boss; 144 is an insertion cavity; 145 is a first limiting block; 146 is a second limiting block;

[0051] 15 is a first cylinder; 16 is a second cylinder; 17 is a first guiding member; 18 is a second guiding member; 19 is a first limiting member; 20 is a first elastic member; 21 is a second limiting member; 22 is a second elastic member; 23 is a third limiting member; 24 is a fourth limiting member; 25 is a fixing member; 26 is a gasket; 210 is a test box body. Detailed implementation manners

[0052] To enable those skilled in the art to better understand the technical solutions of the present disclosure, the present disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0053] The embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following detailed description of the embodiments and the drawings are used to exemplarily illustrate the principle of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments. In the description of the present application, it should be noted that unless otherwise stated, the meaning of "a plurality" is more than two; the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", etc. is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present application. In addition, terms such as "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range.

[0054] In the description of the present application, it should also be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0055] As Figures 1-3 , as shown in FIG. 6, a fixture 10 for testing an optical module, the fixture 10 includes a housing 11, a first temperature control component 12, a second temperature control component 13, a limiting structure 14, and a driving mechanism. The first temperature control component 12 and the second temperature control component 13 are relatively spaced apart and arranged in the housing 11. Specifically, the positions of the first temperature control component 12 and the second temperature control component 13 are opposite and are respectively arranged at the top and bottom of the housing, wherein the first temperature control component 12 and the second temperature control component 13 are spaced apart by a preset distance.

[0056] The limiting structure 14 is provided with a limiting through hole 141. The limiting structure 14 is clamped between the first temperature control component 12 and the second temperature control component 13. The opposite sides of the limiting through hole 141 are respectively provided with a first limiting boss 142 and a second limiting boss 143 corresponding to the first temperature control component 12 and the second temperature control component 13. An insertion cavity 144 for accommodating the optical module 2 to be tested is formed between the first limiting boss 142 and the second limiting boss 143, wherein the shape of the insertion cavity 144 is adapted to the shape of the optical module 2 to be tested. Both the first limiting boss 142 and the second limiting boss 143 extend along the depth direction of the insertion cavity.

[0057] The driving mechanism is arranged inside the housing 11. The driving mechanism is respectively in transmission connection with the first temperature control component 12 and the second temperature control component 13 to drive the first temperature control component 12 and the second temperature control component 13 to move towards the direction close to the limiting structure 14 to abut against the optical module 2.

[0058] In the present disclosure, the insertion cavity formed by the first limiting boss 142 and the second limiting boss 143 can effectively limit the position of the optical module 2 when it is inserted into the insertion cavity 144, avoiding the position deviation of the optical module 2 during the insertion process and the appearance wear caused by friction with the heat sink. Further, the edges of the first limiting boss 142 and the second limiting boss 143 do not exceed the limiting structure 14. Thus, when the optical module 2 to be tested is inserted into the insertion cavity 144, the upper surface and the lower surface of the optical module 2 to be tested are respectively lower than the upper surface and the lower surface of the limiting structure 14. Therefore, when the optical module 2 is inserted into the insertion cavity 144, the first limiting boss 142 can form a certain gap between the first temperature control component 12 and the optical module 2, and the second limiting boss 143 can form a certain gap between the second temperature control component 13 and the optical module 2, thereby avoiding the direct contact between the heat sink and the first temperature control component 12 and the second temperature control component 13, and further avoiding the wear of the heat sink. Furthermore, by using the limiting effect of the first limiting boss 142 and the second limiting boss 143, the accuracy of the insertion position of the optical module 2 can be ensured, the accuracy of the error code test can be guaranteed, and the service life of the test circuit board can be prolonged. The test circuit board is a DUT board (Device Under Test). The DUT board receives the test signals from the BERT board, processes these signals according to its functions, and then feeds back the processed signals to the BERT board.

[0059] In some embodiments, the material of the limiting structure 14 is made of PIG (phosphor in glass fluorescent ceramic glass material). PIG has the characteristics of high heat resistance and high thermal conductivity of inorganic materials, which can significantly improve the wear resistance.

[0060] In some embodiments, the material of the limiting structure 14 is made of self-lubricating material. The self-lubricating material includes non-metallic self-lubricating material or polymer self-lubricating material. Using the self-lubricating material can significantly reduce the friction force between the insertion cavity 144 and the optical module 2, thereby effectively reducing the wear degree.

[0061] In some embodiments, refer to Figures 4-6, the limiting structure 14 includes a first limiting block 145 and a second limiting block 146 that are relatively spaced apart. On the side of the first limiting block 145 and the second limiting block 146 close to the first temperature control component 12, first limiting bosses 142 are respectively provided. On the side of the first limiting block 145 and the second limiting block 146 close to the second temperature control component 13, second limiting bosses 143 are respectively provided. The first limiting bosses 142 and the second limiting bosses 143 respectively extend along the length direction of the insertion cavity 144. It can be understood that the extension lengths of the first limiting bosses 142 and the second limiting bosses 143 are designed according to the actual contact lengths of the first limiting bosses 142 and the second limiting bosses 143 with the optical module 2.

[0062] In a specific example, the first temperature control component 12 and the second temperature control component 13 are vertically arranged. The first temperature control component 12 is arranged at the top of the housing, and the second temperature control component 13 is arranged at the bottom of the housing. The first limiting block 145 and the second limiting block 146 are located between the first temperature control component 12 and the second temperature control component 13 and are horizontally arranged. The first limiting block 145 and the second limiting block 146 are relatively spaced apart in position and jointly define an insertion cavity 144 extending along the insertion direction of the optical module 2 and a limiting through hole 141 communicating with the insertion cavity 144. The number of the limiting through holes 141 is two. One limiting through hole 141 corresponds to the position of the first temperature control component 12, and the first temperature control component 12 abuts against the top end of the optical module 2 in the insertion cavity 144 by passing through this limiting through hole 141. The other limiting through hole 141 corresponds to the position of the second temperature control component 13, and the second temperature control component 13 abuts against the bottom end of the optical module 2 in the insertion cavity 144 by passing through this limiting through hole 141. It can be understood that the top of the housing refers to the top of the housing 11, and the bottom of the housing refers to the bottom of the housing 11. In some embodiments, the housing 11 is enclosed by a relative top plate and a bottom plate, and two relative side plates. Among them, the top of the housing is located on the top plate, and the bottom of the housing is located on the bottom plate.

[0063] In the present disclosure, by providing the first limiting boss 142 and the second limiting boss 143, circumferential positioning of the optical module 2 inserted into the insertion cavity 144 can be achieved, thereby preventing the optical module 2 from shifting in position during insertion and rubbing against the heat sink, resulting in appearance wear. Further, in the direction where the second limiting boss 143 points to the first limiting boss 142, the edges of the first limiting boss 142 and the second limiting boss 143 do not exceed the limiting structure 14. Thus, when the optical module to be tested is inserted into the insertion cavity 144, the upper surface and the lower surface of the optical module to be tested are respectively lower than the upper surface and the lower surface of the limiting structure 14, that is, the first limiting boss 142 is lower than the upper surface of the limiting structure 14, and the second limiting boss is higher than the lower surface of the limiting structure 14. Thus, the first limiting boss 142 and the second limiting boss 143 play a guiding role for the optical module 2 in the length direction of the insertion cavity 144, which can effectively ensure the insertion accuracy of the optical module 2 and avoid damage to the test circuit board caused by inaccurate insertion.

[0064] In some embodiments, the limiting structure 14 is an integral structural member. The limiting structure 14 is provided with an insertion cavity 144 and two limiting through holes 141 communicating with the upper and lower sides of the insertion cavity 144. The length of the insertion cavity 144 extends along the insertion direction of the optical module 2. Using the integral structural member as the limiting structure 14 can effectively ensure the structural strength of the limiting structure 14 and is also beneficial to the maintenance of the device.

[0065] In some embodiments, referring to Figures 7-11 , the driving mechanism includes a first air cylinder 15 and a second air cylinder 16. The cylinder body of the first air cylinder 15 is located on the side of the first temperature control component 12 away from the second temperature control component 13 and is connected to the housing 11. The first piston rod of the first air cylinder 15 corresponds to the first temperature control component 12. The cylinder body of the second air cylinder 16 is located on the side of the second temperature control component 13 away from the first temperature control component 12 and is connected to the housing 11. The second piston rod of the second air cylinder 16 corresponds to the second temperature control component 13.

[0066] In a specific example, the cylinder body of the first air cylinder 15 is connected to the top of the housing. One end of the first piston rod is connected to the piston of the cylinder body of the first air cylinder 15, and the other end of the first piston rod is connected to the first temperature control component 12. Among them, by using the piston movement of the first piston rod in the cylinder body of the first air cylinder 15, the first temperature control component 12 is driven to move towards the insertion cavity 144 to abut against the optical module 2.

[0067] The cylinder body of the second air cylinder 16 is connected to the bottom of the housing. One end of the second piston rod is connected to the piston of the cylinder body of the second air cylinder 16, and the other end of the second piston rod is connected to the second temperature control component 13. Among them, by using the piston movement of the second piston rod in the cylinder body of the second air cylinder 16, the second temperature control component 13 is driven to move towards the insertion cavity 144 to abut against the optical module 2.

[0068] In the present disclosure, the first cylinder 15 and the second cylinder 16 are used as the transmission mechanism, which can reduce the production cost and facilitate maintenance and repair. In addition, the cylinder has the characteristics of fast response speed, which can achieve fast start and stop, and meet the test requirements of the optical module 2. Furthermore, the cylinder has the characteristics of adjustability, and the transmission speed and force can be adjusted as needed.

[0069] In some embodiments, the driving mechanism includes a first motor and a second motor. The first motor is located on a side of the first temperature control component 12 away from the second temperature control component 13 and connected to the housing 11, and the first motor is used to drive the first temperature control component 12 to move toward the insertion cavity 144. The second motor is located on a side of the second temperature control component 13 away from the first temperature control component 12 and connected to the housing 11, and the second motor is used to drive the second temperature control component 13 to move toward the insertion cavity 144.

[0070] In some embodiments, reference Figure 5 The first temperature control component 12 includes a first water cooling module 121, a first semiconductor refrigeration module 122 (TEC Thermoelectric Cooling) and a first heat sink module 123. The first water cooling module 121 is in transmission connection with the driving mechanism, the first heat sink module 123 is located on the side of the limiting structure 14 away from the second temperature control component 13, and the first semiconductor refrigeration module 122 is sandwiched between the first water cooling module 121 and the first heat sink module 123.

[0071] Further, the first piston rod of the first cylinder 15 is connected to the first water-cooling module 121. The first water-cooling module 121 includes a first water-cooling seat 1211 and a first water-cooling head 1212. The surface of the first water-cooling seat 1211 facing the first semiconductor refrigeration module 122 is provided with a first accommodating cavity, and the first water-cooling head 1212 is arranged in the first accommodating cavity. A cooling channel is arranged in the first water-cooling head 1212, and the cooling channel is used for the circulation of the cooling medium. The first water-cooling head 1212 also includes a pagoda head arranged at the inlet and outlet of the cooling channel, and a throat clamp arranged on the pagoda head, and the pagoda head is used to connect with the cooling pipeline. The first cylinder 15 is connected to the first water-cooling seat 1211.

[0072] In some embodiments, reference Figure 2 and Figure 8 The fixture 10 further includes a third stopper 23, which is located on a side of the first temperature control component 12 away from the second temperature control component 13 and connected to the housing 11. A first stopper groove 12111 is provided on a surface of the first water cooling seat 1211 away from the first semiconductor refrigeration module 122, and the first stopper groove 12111 corresponds to the position of the third stopper 23. When the first cylinder 15 contracts, the third stopper 23 is used to abut against the first stopper groove 12111 to limit the contraction stroke of the first temperature control component 12.

[0073] In some embodiments, there are multiple third limiting members 23. A plurality of first limiting grooves 12111 are provided on the surface of the first water-cooling base 1211 facing away from the first semiconductor refrigeration module 122, and the multiple third limiting members 23 are arranged in one-to-one correspondence with the multiple first limiting grooves 12111. In the present disclosure, by providing the third limiting member and the first limiting groove 12111, the contraction stroke of the first cylinder 15 can be effectively limited.

[0074] The second temperature control component 13 includes a second water-cooling module 131, a second semiconductor refrigeration module 132 (TE Thermoelectric Cooling), and a second heat sink module 133. The second water-cooling module 131 is in transmission connection with the driving mechanism. The second heat sink module 133 is located on the side of the limiting structure 14 facing away from the first temperature control component 12, and the second semiconductor refrigeration module 132 is clamped between the second water-cooling module 131 and the second heat sink module 133.

[0075] Further, the second piston rod of the second cylinder 16 is connected to the second water-cooling module 131. The second water-cooling module 131 includes a second water-cooling base 1311 and a second water-cooling head 1312. A second accommodation cavity is provided on the surface of the second water-cooling base 1311 facing the second semiconductor refrigeration module 132, and the second water-cooling head 1312 is arranged in the second accommodation cavity. A cooling flow channel is provided in the second water-cooling head 1312 for the circulation of the cooling medium. The second water-cooling head 1312 further includes a bell mouth provided at the inlet and outlet of the cooling flow channel, and a hose clamp provided on the bell mouth. The bell mouth is used for connecting with the cooling pipeline. The second cylinder 16 is connected to the second water-cooling base 1311.

[0076] In some embodiments, the fixture 10 further includes a fourth limiting member 24. The fourth limiting member 24 is located on the side of the second temperature control component 13 facing away from the first temperature control component 12 and is connected to the housing 11. A second limiting groove (not shown in the figure) is provided on the surface of the second water-cooling base 1311 facing away from the second semiconductor refrigeration module 132, and the position of the second limiting groove corresponds to that of the fourth limiting member 24. When the second cylinder 16 contracts, the fourth limiting member 24 is used to abut against the second limiting groove to limit the contraction stroke of the second temperature control component 13.

[0077] In some embodiments, there are multiple fourth limiting members 24. A plurality of second limiting grooves are provided on the surface of the second water-cooling base 1311 facing away from the second semiconductor refrigeration module 132, and the multiple fourth limiting members 24 are arranged in one-to-one correspondence with the multiple second limiting grooves. In the present disclosure, by providing the fourth limiting member 24 and the second limiting groove, the contraction stroke of the second cylinder 16 can be effectively limited.

[0078] In some embodiments, refer to Figure 7 and Figures 10-11, the first heat sink module 123 includes a first heat sink 1231 and a first heat sink cover plate 1232 covering the first heat sink 1231. The first end of the first heat sink 1231 abuts against the first semiconductor refrigeration module 122, and the second end of the first heat sink 1231 passes through the first heat sink cover plate 1232 and corresponds to the limiting through hole 141 of the limiting structure 14.

[0079] In a specific example provided by the present disclosure, on the side of the first heat sink cover plate 1232 facing the first heat sink 1231, there are provided a first avoidance through hole 12321 and a first installation groove 12322 surrounding the outside of the first avoidance through hole 12321. The second end of the first heat sink 1231 is provided with a first protruding portion 12311 protruding towards the first heat sink cover plate 1232. The first heat sink 1231 is disposed in the first installation groove 12322, and the first protruding portion 12311 passes through the first avoidance through hole 12321 and corresponds to the limiting through hole 141. Among them, under the drive of the first cylinder 15, the first temperature control component 12 causes the first protruding portion 12311 to penetrate into the limiting through hole 141 and extend into the insertion cavity 144 to abut against the optical module 2.

[0080] Furthermore, the first installation groove 12322 corresponds to the first accommodation cavity, and the first heat sink 1231 and the first semiconductor refrigeration module 122 are covered in the first accommodation cavity by using the first heat sink cover plate 1232. By adopting this setting method, it can play a protective role for the heat sink and the semiconductor refrigeration module, ensuring the normal use of the equipment.

[0081] The second heat sink module 133 includes a second heat sink 1331 and a second heat sink cover plate 1332 covering the second heat sink 1331. The first end of the second heat sink 1331 abuts against the second semiconductor refrigeration module 132, and the second end of the second heat sink 1331 passes through the second heat sink cover plate 1332 and corresponds to the limiting through hole 141 of the limiting structure 14.

[0082] In a specific example provided by the present disclosure, on the side of the second heat sink cover plate 1332 facing the second heat sink 1331, there are provided a second avoidance through hole 13321 and a second installation groove (not shown in the figure) surrounding the outside of the second avoidance through hole 13321. The second end of the second heat sink 1331 is provided with a second protruding portion 13311 protruding towards the second heat sink cover plate 1332. The second heat sink 1331 is disposed in the second installation groove, and the second protruding portion 13311 passes through the second avoidance through hole 13321 and corresponds to the limiting through hole 141. Among them, under the drive of the second cylinder 16, the second temperature control component 13 causes the second protruding portion 13311 to penetrate into the limiting through hole 141 and extend into the insertion cavity 144 to abut against the optical module 2.

[0083] Further, the second installation groove corresponds to the second accommodation cavity, and the second heat sink 1331 and the second semiconductor refrigeration module 132 are covered in the second accommodation cavity by using the second heat sink cover plate 1332. With this setting method, the protection of the heat sink and the semiconductor refrigeration module can be achieved, ensuring the normal use of the device.

[0084] In some embodiments, the first heat sink module 123 further includes a first temperature detection element 1233, and the second heat sink module 133 further includes a second temperature detection element 1333. The first end of the first temperature detection element 1233 is inserted into the first heat sink 1231, and the second end of the first temperature detection element 1233 is fixed to the first heat sink cover plate 1232.

[0085] In some embodiments, referring to Figures 10-11 , a first insertion hole is provided on the first protrusion 12311, and the first end of the first temperature detection element 1233 is inserted into the first insertion hole.

[0086] In some other embodiments, the first temperature detection element 1233 is bonded to the first heat sink cover plate 1232. By using the bonding method, the connection reliability between the first temperature detection element 1233 and the first heat sink cover plate 1232 can be ensured.

[0087] In some embodiments, referring to Figures 8-9 , the first end of the second temperature detection element 1333 is inserted into the second heat sink 1331, and the second end of the second temperature detection element 1333 is fixed to the second heat sink cover plate 1332.

[0088] In some embodiments, a second insertion hole is provided on the second protrusion 13311, and the first end of the second temperature detection element 1333 is inserted into the second insertion hole. The second heat sink module 133 further includes a fixing member 25, and the fixing member 25 is used to fix the second temperature detection element 1333 to the second heat sink cover plate 1332.

[0089] In a specific example provided by the present disclosure, a threaded hole is provided on the second heat sink cover plate 1332, and the fixing member 25 is a threaded connection member. Among them, the second temperature detection element 1333 is fixed to the second heat sink cover plate 1332 through the threaded connection between the threaded connection member and the threaded hole. It can be understood that the fixing method of the second temperature detection element 1333 and the second heat sink cover plate 1332 includes but is not limited to the threaded connection between the threaded connection member and the threaded hole, and can also be detachably fixed to the second heat sink cover plate 1332 by means of snap connection members, magnetic connection members or hook-and-loop connection members, etc.

[0090] In some embodiments, the second heat sink module 133 further includes a gasket 26 disposed between the fixing member 25 and the second temperature detection element 1333. Among them, by connecting the threaded connector with the threaded hole, the gasket 26 is pressed against the second temperature detection element 1333 to fix the second temperature detection element 1333 to the second heat sink cover 1332. In the present disclosure, the connection between the threaded connector and the threaded hole is detachable, which facilitates subsequent maintenance of the second temperature detection element 1333 and the user experience.

[0091] In other embodiments, the second temperature detection element 1333 is bonded to the second heat sink cover 1332. By using the bonding method, the connection reliability between the second temperature detection element 1333 and the second heat sink cover 1332 can be ensured.

[0092] In some embodiments, the fixture 10 further includes a guiding mechanism connected to the housing 11 and movably connected to the first temperature control component 12 and / or the second temperature control component 13 to guide the movement of the first temperature control component 12 and / or the second temperature control component 13.

[0093] In an embodiment provided by the present disclosure, the guiding mechanism is connected to the housing 11 and movably connected to the first temperature control component 12 to guide the movement of the first temperature control component 12.

[0094] In another embodiment provided by the present disclosure, the guiding mechanism is connected to the housing 11 and movably connected to the second temperature control component 13 to guide the movement of the second temperature control component 13.

[0095] In still another embodiment provided by the present disclosure, the guiding mechanism is connected to the housing 11 and movably connected to the first temperature control component 12 and the second temperature control component 13 respectively to guide the movement of the first temperature control component 12 and the second temperature control component 13 simultaneously.

[0096] In some embodiments, referring to Figure 2 、 Figures 4-5 and Figure 8 the guiding mechanism includes a first guiding member 17 and a second guiding member 18. The first end of the first guiding member 17 is connected to the housing 11, and the second end of the first guiding member 17 passes through the first temperature control component 12 to guide the movement of the first temperature control component 12.

[0097] Specifically, the first water-cooling base 1211 is provided with a first guiding through-hole (not shown in the figure) penetrating through its thickness. The first guiding member 17 is inserted into the first guiding through-hole, and the first end of the first guiding member 17 is connected to the top of the housing, and the second end of the first guiding member 17 passes through the first water-cooling base 1211. By adopting the above setting method, it can provide guidance for the movement of the first temperature control component 12, so as to ensure that the first protruding portion 12311 of the first heat sink 1231 can accurately extend into the insertion cavity 144, and ensure the temperature regulation effect of the first temperature control component 12 on the optical module 2.

[0098] In some embodiments, there are multiple first guiding members 17, and the multiple first guiding members 17 are arranged around the circumferential side of the first cylinder 15. The first water-cooling base 1211 is provided with multiple first guiding through-holes penetrating through its thickness, and the multiple first guiding members 17 are arranged in one-to-one correspondence with the multiple first guiding through-holes. By adopting the above setting method, it can provide more accurate guidance for the movement of the first temperature control component 12, ensure that the first protruding portion 12311 of the first heat sink 1231 can more accurately extend into the insertion cavity 144, and further ensure the temperature regulation effect of the first temperature control component 12 on the optical module 2.

[0099] The first end of the second guiding member 18 is connected to the housing 11, and the second end of the second guiding member 18 passes through the second temperature control component 13 to guide the movement of the second temperature control component 13.

[0100] Specifically, the second water-cooling base 1311 is provided with a second guiding through-hole (not shown in the figure) penetrating through its thickness. The second guiding member 18 is inserted into the second guiding through-hole, and the first end of the second guiding member 18 is connected to the bottom of the housing, and the second end of the second guiding member 18 passes through the second water-cooling base 1311. By adopting the above setting method, it can provide guidance for the movement of the second temperature control component 13, so as to ensure that the second protruding portion 13311 of the second heat sink 1331 can accurately extend into the insertion cavity 144, and ensure the temperature regulation effect of the second temperature control component 13 on the optical module 2.

[0101] In some embodiments, there are multiple second guiding members 18, and the multiple second guiding members 18 are arranged around the circumferential side of the second cylinder 16. The second water-cooling base 1311 is provided with multiple second guiding through-holes penetrating through its thickness, and the multiple second guiding members 18 are arranged in one-to-one correspondence with the multiple second guiding through-holes. By adopting the above setting method, it can provide more accurate guidance for the movement of the second temperature control component 13, ensure that the second protruding portion 13311 of the second heat sink 1331 can more accurately extend into the insertion cavity 144, and further ensure the temperature regulation effect of the second temperature control component 13 on the optical module 2.

[0102] In some embodiments, the guiding mechanism further includes a first limiting member 19, a first elastic member 20, a second limiting member 21, and a second elastic member 22. The first limiting member 19 and the first elastic member 20 are located on the side of the first water-cooling base 1211 away from the top of the shell. The first limiting member 19 is disposed at the second end of the first guiding member 17. The first elastic member 20 is clamped between the first temperature control component 12 and the first limiting member 19. The first elastic member 20 is configured to provide a buffering and resetting force to the first temperature control component 12. Specifically, the first elastic member 20 is clamped between the first water-cooling base 1211 and the first limiting member 19.

[0103] The second limiting member 21 and the second elastic member 22 are located on the side of the second water-cooling base 1311 away from the bottom of the shell. The second limiting member 21 is disposed at the second end of the second guiding member 18. The second elastic member 22 is clamped between the second temperature control component 13 and the second limiting member 21. The second elastic member 22 is configured to provide a buffering and resetting force to the second temperature control component 13. Specifically, the second elastic member 22 is clamped between the second water-cooling base 1311 and the second limiting member 21.

[0104] In some embodiments, both the first limiting member 19 and the first elastic member 20 are plural. The plural first limiting members 19 and the first elastic members 20 are arranged in one-to-one correspondence with the plural first guiding members 17. In the present disclosure, the resetting force provided by the first elastic member 20 can reset the first temperature control component 12 to the initial position. The plural first elastic members 20 arranged around the circumferential side of the first cylinder 15 can also level the first temperature control component 12 to ensure the flatness of the first temperature control component 12, thereby ensuring the butt joint parallelism between the first protruding portion 12311 of the first heat sink 1231 and the optical module 2.

[0105] In some embodiments, both the second limiting member 21 and the second elastic member 22 are plural. The plural second limiting members 21 and the second elastic members 22 are arranged in one-to-one correspondence with the plural second guiding members 18. In the present disclosure, the resetting force provided by the second elastic member 22 can reset the second temperature control component 13 to the initial position. The plural second elastic members 22 arranged around the circumferential side of the second cylinder 16 can also level the second temperature control component 13 to ensure the flatness of the second temperature control component 13, thereby ensuring the butt joint parallelism between the second protruding portion 13311 of the second heat sink 1331 and the optical module 2.

[0106] In some embodiments, the first elastic member 20 and the second elastic member 22 are spring members.

[0107] In the present disclosure, the insertion state of the optical module includes: during the process of inserting the optical module into the insertion cavity of the insertion limiting structure, the heat sink moves away from the limiting structure under the drive of the driving mechanism, so as to form a gap between the heat sink and the optical module. The test state of the optical module includes: before the test, the heat sink moves towards the limiting structure under the drive of the driving mechanism, so that the heat sink is in contact with the optical module, and the semiconductor refrigeration module of the temperature control component adjusts the temperature of the optical module through the heat conduction characteristics of the heat sink.

[0108] In some embodiments, referring to Figure 12 , the present disclosure provides an optical module testing device 1, and the optical module testing device 1 includes a testing box body 210 and a fixture 10 for testing the optical module. The fixture 10 for testing the optical module is detachably connected to the testing box body 210.

[0109] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present disclosure. However, the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also regarded as the protection scope of the present disclosure.

Claims

1. A fixture for testing an optical module, characterized in that, The fixture comprises: case; A first temperature control component and a second temperature control component are arranged in the housing with a relative spacing; A limiting structure of a limiting through hole is provided, the limiting structure is sandwiched between the first temperature control component and the second temperature control component, and first limiting bosses and second limiting bosses corresponding to the first temperature control component and the second temperature control component are respectively provided on opposite sides of the limiting through hole, and an insertion cavity for accommodating the optical module to be measured is formed between the first limiting boss and the second limiting boss; A driving mechanism is disposed in the housing, and is respectively connected to the first temperature control component and the second temperature control component to drive the first temperature control component and the second temperature control component to move toward the limiting structure to abut against the optical module to be measured.

2. The fixture for testing an optical module according to claim 1, wherein The limiting structure comprises a first limiting block and a second limiting block which are arranged at a relative interval; The first limiting block and the second limiting block are respectively provided with the first limiting boss on one side close to the first temperature control component; The second limiting bosses are respectively arranged on one side of the first limiting block and the second limiting block close to the second temperature control component.

3. The fixture for optical module testing according to claim 1 or 2, characterized in that, The first limiting boss and the second limiting boss both extend along the depth direction of the insertion cavity.

4. A fixture for testing an optical module according to claim 1 or 2, characterized in that, The driving mechanism comprises a first cylinder and a second cylinder; The cylinder body of the first cylinder is located at a side of the first temperature control component away from the second temperature control component and is connected to the housing, and the first piston rod of the first cylinder corresponds to the first temperature control component; The cylinder body of the second cylinder is located at a side of the second temperature control component away from the first temperature control component and is connected to the shell, and the second piston rod of the second cylinder corresponds to the second temperature control component.

5. The fixture for testing an optical module according to claim 1 or 2, characterized in that, The first temperature control component includes a first water cooling module, a first semiconductor refrigeration module and a first heat sink module; the first water cooling module is transmission-connected to the driving mechanism, the first heat sink module is located on a side of the limiting structure away from the second temperature control component, and the first semiconductor refrigeration module is sandwiched between the first water cooling module and the first heat sink module; The second temperature control component includes a second water cooling module, a second semiconductor refrigeration module and a second heat sink module; The second water cooling module is transmission-connected to the driving mechanism, the second heat sink module is located on the side of the limiting structure away from the first temperature control component, and the second semiconductor refrigeration module is sandwiched between the second water cooling module and the second heat sink module.

6. The fixture for testing an optical module according to claim 5, wherein The first heat sink module comprises a first heat sink and a first heat sink cover plate covered on the first heat sink, a first end of the first heat sink abuts against the first semiconductor refrigeration module, and a second end of the first heat sink passes through the first heat sink cover plate and corresponds to the limiting through hole of the limiting structure; The second heat sink module includes a second heat sink and a second heat sink cover plate covering the second heat sink, the first end of the second heat sink abuts against the second semiconductor refrigeration module, and the second end of the second heat sink passes through the second heat sink cover plate and corresponds to the limiting through hole of the limiting structure.

7. A fixture for testing an optical module according to claim 6, characterized in that, On the side of the first heat sink cover plate facing the first heat sink, a first avoidance through hole and a first installation groove surrounding the outside of the first avoidance through hole are provided; at the second end of the first heat sink, a first protruding portion protruding towards the first heat sink cover plate is provided, the first heat sink is disposed in the first installation groove, and the first protruding portion passes through the first avoidance through hole and corresponds to the limit through hole; On the side of the second heat sink cover plate facing the second heat sink, a second avoidance through hole and a second installation groove surrounding the outside of the second avoidance through hole are provided; at the second end of the second heat sink, a second protruding portion protruding towards the second heat sink cover plate is provided, the second heat sink is disposed in the second installation groove, and the second protruding portion passes through the second avoidance through hole and corresponds to the limit through hole.

8. A fixture for testing an optical module according to claim 1 or 2, characterized in that The fixture further includes a guiding mechanism, the guiding mechanism is connected to the housing and is movably connected to the first temperature control component and / or the second temperature control component to guide the movement of the first temperature control component and / or the second temperature control component.

9. The fixture for optical module testing according to claim 8, wherein The guiding mechanism includes a first guiding member and a second guiding member; The first end of the first guiding member is connected to the housing, and the second end of the first guiding member passes through the first temperature control component to guide the movement of the first temperature control component; The first end of the second guiding member is connected to the housing, and the second end of the second guiding member passes through the second temperature control component to guide the movement of the second temperature control component.

10. The fixture for testing an optical module according to claim 9, characterized in that, The guiding mechanism further includes a first limiting member, a first elastic member, a second limiting member and a second elastic member; The first limiting member is disposed at the second end of the first guiding member, and the first elastic member is clamped between the first temperature control component and the first limiting member; The second limiting member is disposed at the second end of the second guiding member, and the second elastic member is clamped between the second temperature control component and the second limiting member.

11. An optical module testing device, characterized in that, The optical module testing device includes a testing box body and the optical module testing fixture according to any one of claims 1-10; The optical module testing fixture is detachably connected to the testing box body.

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