Glue coating machine for wafer

Abstract

The utility model discloses a wafer glue coating machine which comprises a working table, the working table is provided with a protective cover, a turntable is arranged in the protective cover, the working table is connected with a rotating seat through a sliding arm, the rotating seat is provided with a glue coating gun, one side of the working table far away from the protective cover is provided with a rotating motor, and the rotating motor is connected with the turntable. And the adjusting assembly is arranged on the protective cover and is used for adjusting the adsorption force according to the warping of the wafer. According to the utility model, through the arrangement of the adjusting assembly, the suction force to the central part and the peripheral part of the wafer can be adaptively changed according to the warping shape of the wafer, so that the fitting effect between the wafer and the first suction rod and the second suction rod is improved, the flatness of the wafer during gluing placement is improved, glue can be uniformly diffused to the periphery, and the quality of the wafer is improved. Therefore, the gluing quality of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a glue coater for wafers. Background Technique

[0002] When coating glue on a wafer, first use a suction cup to adsorb the wafer on the workbench, then use a glue gun to drop glue droplets at the center of the wafer, and finally drive the wafer to rotate, and use centrifugal force to evenly spread the photoresist on the surface of the wafer.

[0003] During the processing and manufacturing of wafers, due to reasons such as thermal stress, material inhomogeneity, or process parameters, the wafers show warping (the main warping forms are bow warping, that is, the center of the wafer is relatively high, and the overall shape is similar to a bow, or dish warping, that is, the center of the wafer is relatively low, and the overall shape is similar to a dish, opposite to the bow warping). And under the action of factors such as the complexity of material properties, the accuracy requirements of process control, and the limitations of wafer size and structure, it is difficult to completely eliminate the warping of the wafers. Therefore, when performing glue coating operations on wafers, if each suction cup has the same suction force on the wafer, it will cause the wafer to not fit completely with the suction cup due to the existence of warping, resulting in an uneven state of the upper surface of the wafer on the suction cup, making the glue unable to spread evenly around, thus affecting the glue coating quality of the wafer.

[0004] Therefore, there is an urgent need for a glue coater for wafers to solve the above problems. Content of the Utility Model

[0005] The purpose of the utility model is to provide a glue coater for wafers to solve the problem that the wafer cannot fit completely with the suction cup due to the existence of warping mentioned in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A glue coater for wafers, including a workbench, the workbench is provided with a protective cover, a turntable is arranged inside the protective cover, the workbench is connected with a rotating seat through a sliding arm, a glue gun is arranged on the rotating seat, a rotating motor is arranged on one side of the workbench away from the protective cover, and further includes an adjusting component arranged in the protective cover for adjusting the adsorption force according to the warping of the wafer;

[0007] The adjusting component includes a circular plate rotatably connected inside the protective cover, the output end of the rotating motor is connected with the circular plate, an air pump is arranged on the side of the circular plate away from the workbench, the output end of the air pump is connected with a first suction rod through an installation pipe and is connected with a second suction rod through a plurality of bellows, each of the second suction rods is arranged in an annular array, a distance sensor is connected inside the first suction rod and each of the second suction rods through a strip plate, and the circular plate is provided with a driving component for driving the distance between each of the second suction rods.

[0008] Control valves are provided on the side walls of the first suction rod and each second suction rod, and each of the control valves is electrically connected to the distance sensor through a controller.

[0009] The turntable is connected to the first suction rod through a bearing.

[0010] The driving assembly includes a fixing plate fixedly connected to the side wall of the circular plate. The fixing plate is rotatably connected with a driving rod. One end of the driving rod close to the turntable is fixedly connected with a gear. A toothed ring is fixedly connected to the side wall of the turntable. The toothed ring and the gear are meshed with each other. A plurality of arc-shaped grooves are formed in the side wall of the turntable, and each of the second suction rods is slidably connected to the arc-shaped groove. A driving motor is provided on one side of the fixing plate close to the workbench, and the output end of the driving motor is connected to the driving rod.

[0011] The circular plate is provided with a guiding assembly for guiding the movement of each second suction rod. The guiding assembly includes an L-shaped plate fixedly connected to the side wall of the circular plate. The L-shaped plate is fixedly connected with a rectangular plate close to the side wall of the turntable. The second suction rod is slidably connected to the rectangular plate, and the rectangular plate is provided with a connecting assembly for connecting with the second suction rod.

[0012] The connecting assembly includes a connecting groove formed between opposite inner walls of the rectangular plate. Two connecting plates are slidably connected to the two connecting grooves, and one end of the two connecting plates opposite to each other is connected to the second suction rod.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] Through the setting of the adjusting assembly, the present utility model is convenient to adaptively change the suction force on the central part and the peripheral part of the wafer according to the warping shape of the wafer, thereby improving the fitting effect between the wafer and the first suction rod and the second suction rod, enhancing the flatness of the wafer during glue coating and placement, enabling the glue to uniformly diffuse around, and thus improving the glue coating quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0016] Figure 2 is a schematic diagram of the structure of the adjusting assembly of the present utility model;

[0017] Figure 3 is a schematic diagram of the structure of the moving assembly of the present utility model;

[0018] Figure 4 is a schematic diagram of the structure of the distance sensor of the present utility model.

[0019] In the figure: 101, workbench; 102, protective cover; 103, sliding arm; 104, rotating base; 105, glue gun; 106, turntable; 107, rotating motor; 201, circular plate; 202, air pump; 204, installation pipe; 205, first suction rod; 206, bellows; 207, second suction rod; 208, strip plate; 209, distance sensor; 210, control valve; 211, bearing; 301, fixing plate; 302, driving rod; 303, gear; 304, gear ring; 305, arc groove; 306, driving motor; 401, L-shaped plate; 402, U-shaped plate; 501, connecting groove; 502, connecting plate. Specific embodiments

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] Embodiment 1

[0022] Please refer to Figures 1-4 , a glue coater for wafers shown in the figure, including a workbench 101, a protective cover 102 is provided on the workbench 101, a turntable 106 is provided inside the protective cover 102, the workbench 101 is connected with a rotating base 104 through a sliding arm 103, a glue gun 105 is provided on the rotating base 104, a rotating motor 107 is provided on one side of the workbench 101 away from the protective cover 102, and an adjusting assembly is further provided in the protective cover 102 for adjusting the adsorption force according to the warping of the wafer;

[0023] The adjusting assembly includes a circular plate 201 rotatably connected inside the protective cover 102, the output end of the rotating motor 107 is connected with the circular plate 201, an air pump 202 is provided on the side of the circular plate 201 away from the workbench 101, the output end of the air pump 202 is connected with a first suction rod 205 through an installation pipe 204 and is connected with a second suction rod 207 through a plurality of bellows 206, each second suction rod 207 is arranged in an annular array, a distance sensor 209 is connected inside the first suction rod 205 and each second suction rod 207 through a strip plate 208, and a driving assembly for driving the distance between each second suction rod 207 is provided on the circular plate 201;

[0024] It should be noted here that: by adjusting the settings of the components, it is convenient to adaptively change the suction force on the central part and the peripheral part of the wafer according to the warping shape of the wafer, thereby improving the fitting effect between the wafer and the first suction rod 205 and the second suction rod 207, enhancing the flatness of the wafer during glue coating placement, enabling the glue to uniformly diffuse around, and thus improving the glue coating quality of the wafer.

[0025] What is more optimized is that for wafers with special warping shapes such as twisted warping, the change in the warping shape of the wafer can be achieved by adding multiple groups of second suction rods 207.

[0026] Please refer to Figure 4 , on the side walls of the first suction rod 205 and each second suction rod 207 in the figure, control valves 210 are provided, and each control valve 210 is electrically connected to a distance sensor 209 through a controller;

[0027] It should be noted here that: through the setting of the control valve 210, it is convenient to control the gas throughput of the suction channels of the first suction rod 205 or the second suction rod 207 according to the distance detection of the distance sensor 209.

[0028] Please refer to Figure 3 , in the figure, the turntable 106 and the first suction rod 205 are connected through a bearing 211;

[0029] It should be noted here that: through the setting of the bearing 211, after realizing the connection and support between the first suction rod 205 and the turntable 106, the first suction rod 205 and the turntable 106 are rotatably connected.

[0030] Working principle: When performing glue coating operation on the wafer, first, according to the size of the wafer, use the driving component to adjust the distance between each second suction rod 207, so that each second suction rod 207 arranged in an annular array is close to the edge of the wafer, then place the wafer on the turntable 106, and make its center coincide with the center of the turntable 106, and one side of the wafer faces the first suction rod 205 and each second suction rod 207;

[0031] After the wafer is opposed to the first suction rod 205 and each second suction rod 207 on one side of the wafer, the distance sensor 209 is used to detect the distance between the end face of the wafer and the first suction rod 205 and each second suction rod 207. If the distance of the wafer is closer to the first suction rod 205, it indicates that the warpage degree of the wafer is dish-shaped warpage, the center of the wafer is relatively low, and the overall shape is similar to a dish. At this time, the controller reduces the suction channel of the first suction rod 205 and increases the suction channels of each second suction rod 207, so as to reduce the suction force on the central part of the wafer and increase the suction force on the peripheral part of the wafer. If the distance of the wafer is closer to the second suction rod 207, it indicates that the warpage degree of the wafer is bow-shaped warpage, the center of the wafer is relatively high, and the overall shape is similar to a bow. At this time, the controller increases the suction channel of the first suction rod 205 and reduces the suction channels of each second suction rod 207, so as to increase the suction force on the central part of the wafer and reduce the suction force on the peripheral part of the wafer, so as to facilitate changing the suction force on the central part and the peripheral part of the wafer according to the warped shape of the wafer, thereby improving the fitting effect between the wafer and the first suction rod 205 and the second suction rod 207, enhancing the flatness of the wafer during glue coating and placement, enabling the glue to spread evenly around, and thus improving the glue coating quality of the wafer;

[0032] After the wafer is adsorbed and fixed, the sliding arm 103 and the rotating seat 104 are used to drive the glue gun 105 to drop the glue at the center of the wafer, and after the glue dropping is completed, it moves away from the wafer. As an existing technology, the specific operation can refer to the authorized publication number CN221433739U, a semiconductor wafer glue coater, and will not be elaborated here. After the glue drops onto the wafer surface, the rotation motor 107 is started to drive the adsorbed and fixed wafer to rotate, so that under the centrifugal force, the glue is evenly spread on the wafer surface, and thus the glue coating operation of the wafer is completed.

[0033] Embodiment 2

[0034] Please refer to Figure 3 , this embodiment further describes Embodiment 1. The illustrated driving assembly includes a fixing plate 301 fixedly connected to the side wall of the circular plate 201. The fixing plate 301 is rotatably connected with a driving rod 302. One end of the driving rod 302 close to the turntable 106 is fixedly connected with a gear 303. A toothed ring 304 is fixedly connected to the side wall of the turntable 106. The toothed ring 304 and the gear 303 are meshed with each other. A plurality of arc-shaped grooves 305 are formed in the side wall of the turntable 106. Each second suction rod 207 is slidably connected to the arc-shaped groove 305. A driving motor 306 is provided on one side of the fixing plate 301 close to the workbench 101. The output end of the driving motor 306 is connected to the driving rod 302;

[0035] It should be noted here that: through the setting of the driving component, when adjusting the distance between the second suction rods 207 to adapt to the adsorption and fixation of wafers of different sizes, by starting the driving motor 306, the gear 303 on the driving rod 302 is driven to rotate. Under the meshing and driving action of the gear 303 and the toothed ring 304, the turntable 106 will be driven to rotate. During the rotation of the turntable 106, under the interaction force between each second suction rod 207 and the arc-shaped groove 305 and the guiding action of the guiding component, each second suction rod 207 will be driven to move closer to or away from each other, so as to adjust the distance between the second suction rods 207 to adapt to the adsorption and fixation of wafers of different sizes, thereby improving the flexibility of wafer adsorption and fixation and increasing the adaptability to wafer gluing operations of different sizes.

[0036] Please refer to Figure 3 , in the illustrated circular plate 201, a guiding component for guiding the movement of each second suction rod 207 is provided. The guiding component includes an L-shaped plate 401 fixedly connected to the side wall of the circular plate 201. An annular plate 402 is fixedly connected to the side wall of the L-shaped plate 401 close to the turntable 106. The second suction rod 207 is slidably connected to the annular plate 402, and the annular plate 402 is provided with a connecting component for connecting with the second suction rod 207;

[0037] It should be noted here that: through the setting of the guiding component, it provides guiding and limiting functions for the movement of the second suction rod 207.

[0038] Please refer to Figure 3 , the connecting component in the illustration includes a connecting groove 501 opened between the opposite inner walls of the annular plate 402. Two connecting plates 502 are slidably connected to the two connecting grooves 501, and one end of the two connecting plates 502 facing each other is connected to the second suction rod 207;

[0039] It should be noted here that: through the setting of the connecting component, it is used to connect the second suction rod 207 with the annular plate 402, so as to further connect and support the second suction rod 207.

[0040] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, in any aspect, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A glue coater for wafers, comprising: A workbench (101), a protective cover (102) is provided on the workbench (101), a turntable (106) is provided inside the protective cover (102), the workbench (101) is connected to a rotating base (104) through a sliding arm (103), a glue gun (105) is provided on the rotating base (104), and a rotating motor (107) is provided on one side of the workbench (101) away from the protective cover (102); Characterized in that, it further comprises: An adjustment component provided in the protective cover (102) for adjusting the adsorption force according to the warping of the wafer; The adjustment component includes a circular plate (201) rotatably connected inside the protective cover (102), the output end of the rotating motor (107) is connected to the circular plate (201), an air pump (202) is provided on the side of the circular plate (201) away from the workbench (101), the output end of the air pump (202) is connected to a first suction rod (205) through an installation pipe (204) and is connected to a second suction rod (207) through a plurality of corrugated pipes (206), each of the second suction rods (207) is arranged in an annular array, a distance sensor (209) is connected inside the first suction rod (205) and each second suction rod (207) through a strip plate (208), and the circular plate (201) is provided with a driving component for driving the distance between each second suction rod (207).

2. The glue coater for wafers according to claim 1, wherein: Control valves (210) are provided on the side walls of the first suction rod (205) and each second suction rod (207), and each control valve (210) is electrically connected to the distance sensor (209) through a controller.

3. A glue coater for wafers according to claim 1, characterized in that: The turntable (106) is connected to the first suction rod (205) through a bearing (211).

4. A glue coater for wafers according to claim 1, characterized in that: The driving component includes a fixing plate (301) fixedly connected to the side wall of the circular plate (201), a driving rod (302) is rotatably connected to the fixing plate (301), a gear (303) is fixedly connected to one end of the driving rod (302) close to the turntable (106), a toothed ring (304) is fixedly connected to the side wall of the turntable (106), the toothed ring (304) and the gear (303) are meshed with each other, a plurality of arc-shaped grooves (305) are formed on the side wall of the turntable (106), each of the second suction rods (207) is slidably connected to the arc-shaped groove (305), and a driving motor (306) is provided on the side of the fixing plate (301) close to the workbench (101), and the output end of the driving motor (306) is connected to the driving rod (302).

5. The glue coater for wafers according to claim 4, wherein: The circular plate (201) is provided with a guiding component for guiding the movement of each second suction rod (207), the guiding component includes an L-shaped plate (401) fixedly connected to the side wall of the circular plate (201), a return-shaped plate (402) is fixedly connected to the side wall of the L-shaped plate (401) close to the turntable (106), the second suction rod (207) is slidably connected to the return-shaped plate (402), and the return-shaped plate (402) is provided with a connecting component for connecting with the second suction rod (207).

6. The glue coater for wafers according to claim 5, characterized in that: The connecting component includes a connecting groove (501) formed between two opposite inner walls of the loop-shaped plate (402). A connecting plate (502) is slidably connected to the two connecting grooves (501), and one end of the two connecting plates (502) facing each other is connected to the second suction rod (207).

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