Spraying device and atomic layer deposition equipment

Abstract

The utility model discloses a spraying device and atomic layer deposition equipment. The spraying device comprises a frame main body, a first gas uniformizing piece, a second gas uniformizing piece and a spraying assembly, wherein a gas inlet is defined in the frame main body; the first gas uniformizing piece comprises a first gas uniformizing channel, and the first gas uniformizing channel comprises a first inlet communicated with the gas inlet and a plurality of first outlets; the second gas uniformizing piece comprises a plurality of second gas uniformizing channels which are not communicated with one another, and each second gas uniformizing channel comprises a second inlet and a second outlet which are communicated with the first outlet; the spraying assembly comprises a plurality of third gas uniformizing channels which are not communicated with one another, and each third gas uniformizing channel comprises a third inlet communicated with the second outlet and a plurality of spraying holes; wherein the first gas uniformizing channel is distributed along the horizontal plane, and the third gas uniformizing channel is distributed along the vertical plane. According to the spraying device, the pressure and the flow rate of gas in each flow channel of the same stage are kept basically consistent through multi-stage shunting, so that the uniformity of a coating film is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of coating, in particular to a spraying device and an atomic layer deposition apparatus. Background Art

[0002] Atomic layer deposition technology (ALD) has been widely used in many fields such as microelectronics, optoelectronics, catalysis, energy storage, and biomedicine due to its excellent film layer uniformity and precise thickness control ability. For example, it is used for the deposition of high-k materials, metal gates, barrier layers, etc. in semiconductor device manufacturing, and the preparation of high-quality nano-thin films in nanotechnology.

[0003] In the prior art, an atomic layer deposition apparatus often includes a movable carrier plate and a spraying device for ejecting reaction gases. The spraying device is provided with a branch gas pipeline extending along the moving direction of the carrier plate, and a plurality of spraying holes are arranged on the branch gas pipeline to eject gases for film coating when the carrier plate moves relative to the spraying device. However, since one end or both ends of the branch gas pipeline are directly connected to the air inlet, the air outlet pressure and air outlet volume of the spraying holes near the air inlet are quite different from those of the spraying holes far from the air inlet, resulting in the film thickness uniformity of the atomic layer deposition apparatus not meeting the requirements. Summary of the Utility Model

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. For this purpose, the utility model provides a spraying device, which enables the gas pressure and flow rate in each flow channel of the same level to be basically consistent through multi-stage shunting, thereby greatly improving the uniformity of film coating.

[0005] The utility model also provides an atomic deposition apparatus with the above spraying device.

[0006] The spraying device according to the first aspect embodiment of the utility model includes:

[0007] A frame body, the frame body defining an air inlet;

[0008] A first air equalizing member, the first air equalizing member including a first air equalizing channel, the first air equalizing channel including a first inlet communicating with the air inlet and a plurality of first outlets;

[0009] A second air equalizing member, the second air equalizing member including a plurality of non-communicating second air equalizing channels, each of the second air equalizing channels including a second inlet communicating with the first outlet and a second outlet;

[0010] A spray assembly, the spray assembly including a plurality of non - communicating third gas - equalizing channels, each of the third gas - equalizing channels including a third inlet communicating with the second outlet and a plurality of spray holes;

[0011] Among them, the first gas - equalizing channel is distributed along the horizontal plane, and the third gas - equalizing channel is distributed along the vertical plane.

[0012] The spray device according to the embodiment of the present invention has at least the following beneficial effects:

[0013] After the first - stage shunt of the gas through the first gas - equalizing member, through the transmission of the second gas - equalizing member, it is shunted multiple times in the spray assembly, and then sprayed out of the spray device through the spray holes. Through multi - stage shunting, the gas pressure and flow rate in each flow channel of the same level are kept basically the same, thus greatly improving the uniformity of film coating. And, by intersecting the first gas - equalizing channel and the third gas - equalizing channel, and deflecting the air flow through the second gas - equalizing channel, the horizontally input air flow can be output in the vertical direction. Since the first gas - equalizing channel is a relatively complex shunt flow channel, if the first gas - equalizing channel is vertically arranged, the size of the first gas - equalizing member in the vertical direction is large, which is likely to cause the spray device to have a large volume in the vertical direction. In this application, by intersecting the first gas - equalizing channel and the third gas - equalizing channel, the first gas - equalizing member can be placed flat on the spray assembly, thereby reducing the size of the spray device in the vertical direction.

[0014] According to some embodiments of the present invention, the air inlet includes a reaction gas inlet and a cleaning gas inlet, the first gas - equalizing member includes a first sub - member connected to the reaction gas inlet and a second sub - member connected to the cleaning gas inlet, the first sub - member and the second sub - member are respectively located on both sides of the second gas - equalizing member, and are connected to the second gas - equalizing member.

[0015] According to some embodiments of the present invention, the number of the reaction gas inlets is two, and the two reaction gas inlets are respectively used for introducing different reaction gases; first gas - equalizing channels are arranged on opposite side walls of the first sub - member, and the two first gas - equalizing channels are respectively in one - to - one correspondence and communication with the two reaction gas inlets.

[0016] According to some embodiments of the present invention, the first gas - equalizing channel includes N - stage shunt channels, each stage of shunt channel including a first section symmetrically extending from the air - inlet position to both sides and a second section communicating with the end of the first section, the air inlet serving as the air - inlet position of the first - stage shunt channel, the outlet of the second section serving as the air - inlet position of the next - stage shunt channel, the outlet of the second section of the N - th stage shunt channel serving as the first outlet, and, in each N - th stage shunt channel, the adjacent first sections are sequentially connected, where N is a positive integer greater than or equal to 2.

[0017] According to some embodiments of the present utility model, a first groove is provided on one side of the second air distribution member, and the first groove serves as the second outlet. The second air distribution channel includes a third section extending along a horizontal plane from the second inlet, and a fourth section connected to the tail end of the third section and extending along a vertical plane. The tail end of the fourth section is connected to the first groove.

[0018] According to some embodiments of the present utility model, the spraying assembly is disposed in contact with the side of the second air distribution member where the first groove is provided. The spraying assembly includes M spraying members stacked in sequence in the vertical direction. The spraying members are sequentially designated as the first-stage spraying member to the M-stage spraying member in the direction away from the second air distribution member. A diversion hole is provided on the side of each spraying member close to the second air distribution member, and a diversion groove is provided on the side of each spraying member away from the second air distribution member. The diversion holes of the same spraying member are all connected to the diversion groove;

[0019] Among them, the diversion holes of the first-stage spraying member serve as the third inlet and are connected to the first groove. The diversion groove of the (M - 1)-stage spraying member is connected to the diversion holes of the M-stage spraying member. The diversion holes of the M-stage spraying member serve as the spraying holes, and M is a positive integer greater than or equal to 2.

[0020] According to some embodiments of the present utility model, the spraying device is further provided with a recovery mechanism. The recovery mechanism defines an exhaust passage. Each spraying member is further provided with a first exhaust groove penetrating in the vertical direction. The first exhaust groove is connected to the exhaust passage, and the first exhaust groove and the diversion groove are alternately arranged.

[0021] According to some embodiments of the present utility model, the spraying device further includes a protective member. The protective member is connected to the side of the spraying assembly where the spraying holes are provided. The protective member is provided with a plurality of avoidance grooves penetrating in the vertical direction, and the avoidance grooves are not connected to each other. The spraying holes of the same third air distribution channel are set as a group, and each avoidance groove corresponds to each group of spraying holes.

[0022] An atomic deposition device according to the second aspect embodiment of the present utility model includes:

[0023] The spraying device as described in any one of the above embodiments;

[0024] A carrier plate for carrying a substrate;

[0025] A driving mechanism for driving the carrier plate to move relative to the spraying device so that the substrate can be coated with a film.

[0026] According to some embodiments of the present utility model, the spray holes of the spray device include a first reaction gas spray hole, a second reaction gas spray hole, and a cleaning gas spray hole. Along the moving direction of the carrier plate, the first reaction gas spray holes and the second reaction gas spray holes are alternately arranged, and a cleaning gas spray hole is arranged between the first reaction gas spray hole and the adjacent second reaction gas spray hole.

[0027] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The following further describes the present utility model in conjunction with the drawings and embodiments, where:

[0029] Figure 1 is a schematic structural diagram of the spray device according to an embodiment of the present utility model;

[0030] Figure 2 is an exploded schematic diagram of the spray device according to an embodiment of the present utility model;

[0031] Figure 3 is a top view and a schematic cross-sectional view taken along line A-A of the spray device according to an embodiment of the present utility model;

[0032] Figure 4 is Figure 3 schematic cross-sectional views taken along lines B-B, C-C, and D-D in

[0033] Figure 5 is a bottom view and a schematic cross-sectional view taken along line E-E of the first gas distribution member (first sub-member) according to an embodiment of the present utility model;

[0034] Figure 6 is a bottom view and a schematic cross-sectional view taken along line F-F of the first gas distribution member (second sub-member) according to an embodiment of the present utility model;

[0035] Figure 7 is a bottom view, a schematic cross-sectional view taken along line G-G, a schematic cross-sectional view taken along line H-H, and an enlarged view of region I of the second gas distribution member according to an embodiment of the present utility model;

[0036] Figure 8 is a bottom view and a schematic cross-sectional view taken along line J-J of the first-stage spray member according to an embodiment of the present utility model;

[0037] Figure 9 is a bottom view, a schematic cross-sectional view taken along line K-K, an enlarged view of region L, and an enlarged view of region M of the second-stage spray member according to an embodiment of the present utility model;

[0038] Figure 10The bottom view of the third-stage spraying part of the embodiment of the present utility model, the schematic sectional view taken along the P-P direction, and the enlarged schematic view of the Q area;

[0039] Figure 11 The bottom view of the protection part of the embodiment of the present utility model and the enlarged schematic view of the P area;

[0040] Figure 12 The schematic diagram of the mixed gas recovery of the embodiment of the present utility model;

[0041] Figure 13 The explosion schematic diagram of the atomic layer deposition equipment of the embodiment of the present utility model;

[0042] Figure 14 The schematic diagram of the coating process of the atomic layer deposition equipment of the embodiment of the present utility model.

[0043] Reference numerals:

[0044] Spraying device 10; Carrier plate 20; Driving mechanism 30; Substrate 40;

[0045] Frame body 100; Reaction gas inlet 110; Cleaning gas inlet 120;

[0046] First gas distribution part 200; First sub-part 201; Second sub-part 202; First gas distribution channel 210; First channel 2101; Second channel 2102; Third channel 2103; First inlet 211; First outlet 212; First-stage shunt channel 213; Second-stage shunt channel 214; Third-stage shunt channel 215; First section 216; Second section 217;

[0047] Second gas distribution part 300; Second gas distribution channel 310; Fourth channel 3101; Sixth channel 3103; Second inlet 311; Second outlet 312; Third section 313; Fourth section 314; First groove 315; Second exhaust groove 320;

[0048] Spraying assembly 400; Shunt hole 401; Shunt groove 402; First exhaust groove 403; Third gas distribution channel 404;

[0049] First-stage spraying part 410; Third inlet 411;

[0050] Second-stage spraying part 420;

[0051] Third-stage spraying part 430; Spraying holes 431; First reaction gas spraying holes 4311; Second reaction gas spraying holes 4312; Cleaning gas spraying holes 4313;

[0052] Protection part 500; Avoidance groove 510; Third exhaust groove 520;

[0053] Partition plate 600;

[0054] First manifold 700; Second manifold 710. Detailed implementation mode

[0055] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0056] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms related to orientation, such as up, down, front, back, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0057] In the description of the present utility model, the meaning of several is more than one, the meaning of multiple is more than two, and understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0058] In the description of the present utility model, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present utility model in combination with the specific content of the technical solution.

[0059] In the description of the present utility model, the descriptions referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0060] For the convenience of subsequent understanding, the coating principle of atomic layer deposition is outlined here first.

[0061] Atomic Layer Deposition (ALD) is an advanced material deposition technology mainly used for preparing ultra-thin films with precise thickness control and excellent step coverage performance. This technology originally originated from Chemical Vapor Deposition (CVD) technology, but through decomposing the film growth process into a series of self-limiting surface reaction steps, it achieves atomic-level precision control.

[0062] During the ALD process, two or more different reaction gases are sequentially injected into the reaction chamber. Taking two reaction gases as an example, in the first step, the first reaction gas is first introduced into the chamber, and this gas undergoes a chemisorption reaction with the substrate surface to form a monolayer. Since this process is based on the saturated adsorption of surface reaction sites, once all available surface positions are occupied, further gas will not continue to react, thus avoiding the over-thick growth of the film. Next, the chamber is cleaned by using another non-reactive gas (such as nitrogen or argon, hereinafter summarized as a cleaning gas) to remove unreacted reaction gases and by-products.

[0063] Subsequently, the second reaction gas is introduced, which undergoes a chemical reaction with the surface substance formed in the first step to generate the desired film material and reaches saturation again. After that, a second cleaning step is carried out. Such a complete "reaction gas adsorption - reaction - removal" cycle only increases the thickness of one atomic layer. By repeating such cycles, layers can be accumulated one by one, and finally a film with the desired thickness can be obtained.

[0064] Based on the above, due to its excellent film layer uniformity and precise thickness control ability, the atomic layer deposition technology has been widely used in many fields such as microelectronics, optoelectronics, catalysis, energy storage, biomedicine, etc. For example, in semiconductor device manufacturing, it is used for the deposition of high-k dielectrics, metal gates, barrier layers, etc., and in nanotechnology for preparing high-quality nanofilms, etc.

[0065] In the prior art, an atomic layer deposition device often includes a movable carrier plate and a spraying device for spraying reaction gases. The spraying device is provided with a gas distribution pipeline extending along the moving direction of the carrier plate, and a plurality of spraying holes are arranged on the gas distribution pipeline to spray gas for film coating when the carrier plate moves relative to the spraying device. However, since one end or both ends of the gas distribution pipeline are directly connected to the air inlet, there will be a large difference in the gas outlet pressure and gas outlet volume between the spraying holes close to the air inlet and those far from the air inlet, resulting in the film thickness uniformity of the atomic layer deposition device not meeting the requirements.

[0066] To solve the above problems, this application proposes a spraying device 10, as Figure 1 and Figure 2As shown, the spraying device 10 includes a frame body 100, a first gas equalizing member 200, a second gas equalizing member 300, and a spraying assembly 400. Among them, the frame body 100 is provided with air inlets, and the number of air inlets can be three, four, or more, so as to introduce clean gas and at least two reaction gases. In the Figure 1 shown embodiment, the number of air inlets is three, namely one clean gas inlet 120 and two reaction gas inlets 110. The clean gas inlet 120 and the reaction gas inlets 110 are respectively located on both sides of the frame body 100.

[0067] As Figure 2 , Figure 5 and Figure 6 shown, the first gas equalizing member 200 includes a first gas equalizing channel 210. The first gas equalizing channel 210 includes a first inlet 211 communicating with the air inlet and a plurality of first outlets 212. It should be noted that the number of the first gas equalizing channels 210 is determined according to the number of air inlets. For example, in the Figure 2 , Figure 5 and Figure 6 shown embodiment, the number of the first gas equalizing channels 210 is three, which are respectively communicated with the clean gas inlet 120 and the two reaction gas inlets 110, and the three first gas equalizing channels 210 are not communicated with each other. After the gas enters the first gas equalizing channel 210 through the first inlet 211, it flows out from the plurality of first outlets 212 after being shunted, realizing the first shunt.

[0068] For the convenience of subsequent description, the first gas equalizing channel 210 for circulating the first reaction gas is named the first channel 2101, the first gas equalizing channel 210 for circulating the second reaction gas is named the second channel 2102, and the first gas equalizing channel 210 for circulating the clean gas is named the third channel 2103.

[0069] As Figure 4 and Figure 7 shown, the second gas equalizing member 300 includes a plurality of non-communicating second gas equalizing channels 310. Each second gas equalizing channel 310 includes a second inlet 311 communicating with the first outlet 212 and a second outlet 312. It can be understood that corresponding to the Figure 5 and Figure 6 shown three channels, the second gas equalizing channels 310 are also divided into three types. For the convenience of subsequent distinction, the second gas equalizing channel 310 for circulating the first reaction gas is named the fourth channel 3101, the second gas equalizing channel 310 for circulating the second reaction gas is named the fifth channel (not shown in the figure), and the second gas equalizing channel 310 for circulating the clean gas is named the sixth channel 3103. The structures of these three types of second gas equalizing channels 310 are basically similar and are used to circulate different gases respectively.

[0070] Each second air distribution channel 310 includes a second inlet 311 and a second outlet 312. The second inlet 311 is in one-to-one correspondence and communication with the first outlet 212. Thus, the number of the fourth channels 3101 should be not less than the number of the first outlets 212 of the first channel 2101, the number of the fifth channels should be not less than the number of the first outlets 212 of the second channel 2102, and the number of the sixth channels 3103 should be not less than the number of the first outlets 212 of the third channel 2103. In the embodiment as shown in Figure 5 and Figure 6 the number of the first outlets 212 of the first channel 2101 is 7, the number of the first outlets 212 of the second channel 2102 is 7, and the number of the first outlets 212 of the third channel 2103 is 15. Correspondingly, as shown in Figure 7 the number of the fourth channels 3101 should be not less than 7, the number of the fifth channels should be not less than 7, and the number of the sixth channels 3103 should be not less than 15. The total number of the second air distribution channels 310 on the second air distribution member 300 is not less than 29. In addition, it can be understood that the number of the first outlets 212 of the first channel 2101, the second channel 2102, and the third channel 2103 can be changed according to specific situations.

[0071] As shown in Figure 4 and Figures 8 to 10 the spraying assembly 400 includes a plurality of non-connected third air distribution channels 404. Each third air distribution channel 404 includes a third inlet 411 and a plurality of spraying holes 431. The third inlet 411 is in one-to-one correspondence and communication with the second outlet 312. After the first stage of air distribution by the first air distribution member 200, through the transmission of the second air distribution member 300, the air is further distributed multiple times in the spraying assembly 400, and then is sprayed out of the spraying device 10 through the spraying holes 431. Through multiple stages of air distribution, the air pressure and flow rate in each flow channel of the same level are kept basically consistent, thereby greatly improving the uniformity of the coating.

[0072] It should be noted that, as shown in Figures 2 to 6 the first air distribution channel 210 is distributed along the horizontal plane, the third air distribution channel 404 is distributed along the vertical plane, and the second air distribution channel 310 serves to transfer the first air distribution channel 210 and the third air distribution channel 404.

[0073] By intersecting the first air - equalizing channel 210 and the third air - equalizing channel 404, and deflecting the air flow through the second air - equalizing channel 310, the horizontally - input air flow can be output in the vertical direction. Since the first air - equalizing channel 210 is a relatively complex flow - splitting channel, if the first air - equalizing channel 210 is vertically arranged, the size of the first air - equalizing member 200 in the vertical direction is large, which easily causes the volume of the spraying device 10 in the vertical direction to be large. In this application, by intersecting the first air - equalizing channel 210 and the third air - equalizing channel 404, the first air - equalizing member 200 can be placed flat on the spraying assembly 400, thereby reducing the size of the spraying device 10 in the vertical direction.

[0074] Based on the foregoing, the air inlet includes a reaction gas inlet 110 and a cleaning gas inlet 120. The reaction gas inlet 110 and the cleaning gas inlet 120 are respectively located on both sides of the frame body 100. As Figures 2 to 4 shown, the first air - equalizing member 200 includes two independent sub - members to connect the air inlets on both sides, namely the first sub - member 201 connected to the reaction gas inlet 110 and the second sub - member 202 connected to the cleaning gas inlet 120. To improve the space utilization rate in the spraying device 10, the first sub - member 201, the second sub - member 202, and the second air - equalizing member 300 are arranged on the same horizontal plane. Moreover, the first sub - member 201 and the second sub - member 202 are respectively located on both sides of the second air - equalizing member 300 and are connected to the second air - equalizing member 300. The first air - equalizing channels 210 on the first sub - member 201 and the second sub - member 202 are communicated with the second air - equalizing channel 310 on the second air - equalizing member 300 to direct the gas in each flow channel to the third air - equalizing channel 404. As Figure 5 and Figure 6 shown in the embodiment, the first sub - member 201 is provided with a first channel 2101 and a second channel 2102, and the second sub - member 202 is provided with a third channel 2103.

[0075] Furthermore, as Figure 1 and Figure 2 shown, the number of reaction gas inlets 110 is two, and the two reaction gas inlets 110 are respectively used to introduce different reaction gases. Therefore, it is necessary to set the first air - equalizing channels 210 (that is, the first channel 2101 and the second channel 2102) on the first sub - member 201 that are respectively communicated with the two reaction gas inlets 110. Based on the foregoing, as a flow - splitting structure with one inlet and multiple outlets, the first air - equalizing channel 210 needs to occupy a large area on the first sub - member 201 when arranged on the first sub - member 201. If two first air - equalizing channels 210 are arranged on the same side of the first sub - member 201, the size of the first sub - member 201 will be large.

[0076] Thus, in this application, as Figure 4 and Figure 5As shown, two first air distribution channels 210 are provided on two opposite side walls of the first sub-component 201. The first outlets 212 of the two first air distribution channels 210 are staggered and distributed alternately. By arranging the two first air distribution channels 210 on different walls of the first sub-component 201, each first air distribution channel 210 has sufficient space for flow splitting, improving the space utilization rate of the first sub-component 201.

[0077] It should be noted that in this article, each flow channel can be formed inside each plate component, or corresponding grooves can be etched on the wall surface of each plate component, and relatively closed flow channels are defined by fitting with adjacent plate components. For example, in Figure 5 and Figure 6 In the first air distribution component 200 shown, each first air distribution channel 210 is formed on the wall surface of the first air distribution component 200 and processed by processes such as milling grooves and laser etching. In Figure 4 and Figure 7 In the second air distribution component 300 shown, each second air distribution channel 310 has a part formed inside the second air distribution component 300 and is processed by processes such as drilling deep holes or die casting.

[0078] In some embodiments, as Figure 5 and Figure 6 shown, the first air distribution channel 210 includes N - stage flow splitting channels. Each stage of flow splitting channels includes a first section 216 symmetrically extending from the air inlet position to both sides and a second section 217 connected to the tail end of the first section 216 and intersecting with the first section 216. Preferably, the first section 216 and the second section 217 are perpendicularly arranged. The air inlet serves as the air inlet position of the first - stage flow splitting channel 213, the outlet of the second section 217 serves as the air inlet position of the next - stage flow splitting channel, and the outlet of the second section 217 of the N - th stage flow splitting channel serves as the first outlet 212 of the first air distribution component 200, where N is a positive integer greater than or equal to 2.

[0079] Taking the first air distribution channel 210 for circulating reaction gas shown in Figure 5 as an example, the air flow enters the first air distribution channel 210 from the first inlet 211. It is divided into two in the first - stage flow splitting channel 213, and the two are respectively divided into four in the second - stage flow splitting channel 214 and into seven in the third - stage flow splitting channel 215. It can be understood that the number of the second sections 217 of each flow splitting channel can be determined according to specific situations. For example, taking the first - stage flow splitting channel 213 that divides the air flow into two as an example, each first section 216 is connected to one second section 217; in some other embodiments, each first section 216 can also be connected to two second sections 217, so as to be able to divide the air flow into four.

[0080] In addition, in the N - th stage flow splitting channel, the first sections 216 are interconnected. AsFigure 5 In the illustrated embodiment, the adjacent first segments 216 in the third-stage shunt channel 215 are connected in sequence, and seven second segments 217 are shared by eight first segments 216, so that the gas is further mixed evenly in the third-stage shunt channel 215, avoiding the uneven flow rate of the first segments 216 under different branches.

[0081] In Figure 6 In the first gas-equalizing channel 210 for circulating clean gas as shown, a four-stage shunt channel is provided, so that more jets of clean gas can be realized.

[0082] In some embodiments, as Figure 4 and Figure 7 shown, a first groove 315 is provided on one side of the second gas-equalizing member 300, and the first groove 315 serves as the second outlet 312 of the second gas-equalizing channel 310. It can be understood that the number of the first grooves 315 is consistent with the number of the second gas-equalizing channels 310, and the respective first grooves 315 are arranged side by side along the moving direction of the carrier plate 20. The second gas-equalizing channel 310 includes a third segment 313 extending along the horizontal plane from the second inlet 311, and a fourth segment 314 communicating with the tail end of the third segment 313 and extending along the vertical plane. The tail end of the fourth segment 314 communicates with the first groove 315. The second gas-equalizing channel 310 realizes the turning of the air flow from the horizontal direction to the vertical direction, and is discharged through the first groove 315 as the second outlet 312. After the air flow flows through the fourth segment 314 into the first groove 315, it diffuses and mixes evenly in the first groove 315.

[0083] Furthermore, the side of the second gas-equalizing member 300 provided with the first groove 315 is attached to the spraying assembly 400, so that the first groove 315 forms a relatively closed chamber. Among them, the spraying assembly 400 includes M spraying members stacked in sequence in the vertical direction. Through the superposition of the respective spraying members, a third gas-equalizing channel 404 with a shunt structure is constructed in the spraying assembly 400. For the convenience of subsequent description, the respective spraying members are sequentially set as the first-stage spraying member 410, the second-stage spraying member 420 to the M-stage spraying member along the direction away from the second gas-equalizing member 300. In Figure 2 the illustrated embodiment, the spraying assembly 400 has three spraying members, and in the direction from top to bottom, the respective spraying members are the first-stage spraying member 410, the second-stage spraying member 420, and the third-stage spraying member 430 in sequence.

[0084] On one side of each spraying member close to the second air homogenizing member 300, a diversion hole 401 is provided, and on the side far from the second air homogenizing member 300, a diversion groove 402 is provided. Each diversion hole 401 of the same spraying member communicates with the diversion groove 402. The first groove 315 communicates with the diversion holes 401 of the first-stage spraying member 410. The diversion groove 402 of the (M - 1)-th stage spraying member communicates with the diversion holes 401 of the M-th stage spraying member. The diversion holes 401 of the M-th stage spraying member serve as spraying holes 431 to eject gas.

[0085] Take, for example, as Figure 2 shown for specific illustration. In the embodiment shown as Figure 2 shown, M takes the value of 3. In other embodiments, M can also be other positive integers greater than or equal to 2. For the convenience of subsequent understanding, it is set that the upper surface of each plate member in the spraying device 10 is the first surface, and the lower surface is the second surface. The first surface of the first-stage spraying member 410 is attached to the second surface of the second air homogenizing member 300. As Figure 8 shown, two diversion holes 401 are provided on the first surface of the first-stage spraying member 410, and the distance between the two diversion holes 401 is not greater than the length of the first groove 315 on the second surface of the second air homogenizing member 300. After the first-stage spraying member 410 is attached to the second air homogenizing member 300, both diversion holes 401 can communicate with the first groove 315, thereby realizing the first-stage mixing and diversion of gas through the third section 313, the fourth section 314, the first groove 315, and the two diversion holes 401.

[0086] As Figure 2 and Figure 9 shown, then the gas flows through the two diversion holes 401 into the diversion groove 402 on the second surface of the first-stage spraying member 410 and is further mixed. The first surface of the second-stage spraying member 420 is attached to the second surface of the first-stage spraying member 410, and multiple spraying holes 431 on the second-stage spraying member 420 communicate with the diversion groove 402 of the first-stage spraying member 410. The number of diversion holes 401 on the second-stage spraying member 420 is more than the number of diversion holes 401 on the first-stage spraying member 410, and the aperture of the diversion holes 401 on the second-stage spraying member 420 is not greater than the aperture of the diversion holes 401 on the first-stage spraying member 410.

[0087] As Figure 2 and Figure 10As shown, the structure of the third-stage spraying member 430 is the same. The diversion holes 401 correspond to the diversion grooves 402 of the second-stage spraying member 420, and the number of diversion holes 401 is larger and the hole diameter is smaller. However, it should be noted that the diversion holes 401 of the third-stage spraying member 430 act as spraying holes 431 to eject the gas. The arrangement of the diversion grooves 402 on the third-stage spraying holes 431 can, on the one hand, play a role in mixing the gas, and on the other hand, is also to reduce the processing thickness of the spraying holes 431, thereby reducing the drilling depth during the processing of the spraying holes 431 to reduce the processing difficulty of the micro-holes.

[0088] Further, the spraying device 10 is further provided with a recovery mechanism. The recovery mechanism defines an exhaust passage. As Figure 3 and Figure 9 shown, each spraying member is further provided with a first exhaust groove 403 penetrating in the vertical direction. Each first exhaust groove 403 is arranged in parallel with the diversion groove 402 ( Figure 9 the diversion groove 402 in [[]] is located on the back surface and is not shown in the figure). The first exhaust grooves 403 are arranged on both sides of each diversion groove 402 along the moving direction of the carrier plate 20. The first exhaust grooves 403 of each spraying member are sequentially communicated, and the exhaust passage of the recovery mechanism is communicated with each first exhaust groove 403 for sucking away the mixed waste gas collected by each first exhaust groove 403 for recycling to avoid waste of resources and environmental pollution.

[0089] It should be noted that in the embodiments as Figure 3 , Figure 4 and Figure 7 shown, the mixed waste gas is divided into a first mixed gas of a first reaction gas and a clean gas, and a second mixed gas of a second reaction gas and a clean gas. These two mixed gases need to be recycled separately to avoid chemical reactions and blockage of the flow channel after the first mixed gas and the second mixed gas come into contact. As Figure 3 and Figure 7 shown, the second gas equalizing member 300 is also provided with a second exhaust groove 320 communicated with the first exhaust groove 403 of each spraying member. To avoid contact between the first mixed gas and the second mixed gas, a partition plate 600 with a certain depth is further provided above the second gas equalizing member 300. The partition plate 600 separates each second exhaust groove 320 to separate the first mixed gas and the second mixed gas and guide them respectively into the collecting pipes on the frame body 100, and then recycle them through the exhaust passage.

[0090] As Figure 2 , Figure 3 and Figure 12As shown, the partition plate 600 separates multiple flow channels, and each flow channel corresponds to each second exhaust groove 320. Adjacent flow channels are respectively used to collect the first mixed gas and the second mixed gas. For the convenience of collecting different mixed gases, a first confluence pipe 700 and a second confluence pipe 710 are respectively arranged at both ends of the partition plate 600 in the length direction. The flow channel for collecting the first mixed gas communicates with the chamber in the first confluence pipe 700, and the flow channel for collecting the second mixed gas communicates with the chamber in the second confluence pipe 710. The first mixed gas and the second mixed gas move in opposite directions respectively in the flow channels separated by the partition plate 600 to the corresponding confluence pipes, and gas is sucked through mechanisms such as a negative pressure pump for classified recovery to avoid the reaction of reaction gases with each other.

[0091] In some embodiments, the spraying device 10 further includes a protective member 500, such as Figure 2 , Figure 10 and Figure 11 As shown, the protective member 500 is connected to the side of the spraying assembly 400 where the spraying holes 431 are provided. The protective member 500 is provided with a plurality of avoidance grooves 510 penetrating in the vertical direction, and the avoidance grooves 510 do not communicate with each other. The spraying holes 431 of the same third gas equalizing channel 404 are set as a group. There are multiple groups of spraying holes 431 provided on the third-stage spraying member 430, and each group of spraying holes 431 is arranged side by side along the moving direction of the carrier plate 20. Each avoidance groove 510 corresponds to each group of spraying holes 431. It can be understood that the setting of the protective member 500 increases the path length of the gas ejected from the spraying holes 431, and reduces the probability that the two reaction gases combine and react at the outlet of the spraying holes 431 to block the spraying holes 431. Corresponding to the position of the first exhaust groove 403, a third exhaust groove 520 is provided on the protective member 500, and third exhaust grooves 520 are provided on both sides of each avoidance groove 510 along the moving direction of the carrier plate 20.

[0092] In a second aspect of the embodiments of the present application, an atomic deposition device is proposed, such as Figure 13 As shown, the atomic deposition device includes a carrier plate 20, a driving mechanism 30, and the spraying device 10 mentioned in any of the foregoing embodiments. The carrier plate 20 is used to carry the substrate 40, and the driving mechanism 30 is connected to any one of the carrier plate 20 and the spraying device 10, and is used to drive the carrier plate 20 to move relative to the spraying device 10, so that the substrate 40 can pass through the area where the reaction gas is sprayed, and thus be coated. The atomic deposition device further includes a heating device, and the heating device is arranged below the carrier plate.

[0093] Furthermore, as Figure 13 and Figure 14As shown, the spray holes 431 of the spraying device 10 include a first reaction gas spray hole 4311, a second reaction gas spray hole 4312, and a cleaning gas spray hole 4313. Along the moving direction of the carrier plate 20, the first reaction gas spray holes 4311 and the second reaction gas spray holes 4312 are alternately arranged, and a cleaning gas spray hole 4313 is arranged between the first reaction gas spray hole 4311 and the adjacent second reaction gas spray hole 4312, so that the substrate 40 can sequentially pass through the first reaction gas spray hole 4311, the cleaning gas spray hole 4313, and the second reaction gas spray hole 4312, and cycle accordingly. It should be noted that along the moving direction of the carrier plate 20, a cleaning gas spray hole 4313 can also be arranged before the first reaction gas spray hole 4311 to clean the surface of the substrate 40 before film coating. A cleaning gas spray hole 4313 is arranged after the last second reaction gas spray hole 4312 to clean the residual reaction gas on the surface of the substrate 40 after film coating.

[0094] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made without departing from the gist of the present invention within the scope of knowledge possessed by those of ordinary skill in the art. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. Spraying device, characterized in that, Comprising: A frame body, the frame body defining an air inlet. A first air-distributing member, the first air-distributing member including a first air-distributing channel, the first air-distributing channel including a first inlet communicating with the air inlet and a plurality of first outlets. A second air-distributing member, the second air-distributing member including a plurality of non-communicating second air-distributing channels, each of the second air-distributing channels including a second inlet communicating with the first outlet and a second outlet. A spraying assembly, the spraying assembly including a plurality of non-communicating third air-distributing channels, each of the third air-distributing channels including a third inlet communicating with the second outlet and a plurality of spraying holes. Wherein, the first air-distributing channel is distributed along a horizontal plane, and the third air-distributing channel is distributed along a vertical plane.

2. The spray device according to claim 1, characterized in that, The air inlet includes a reaction gas inlet and a cleaning gas inlet, the first air-distributing member includes a first sub-member connected to the reaction gas inlet and a second sub-member connected to the cleaning gas inlet, the first sub-member and the second sub-member are respectively located on both sides of the second air-distributing member and are connected to the second air-distributing member.

3. The spray device according to claim 2, wherein, The number of the reaction gas inlets is two, and the two reaction gas inlets are respectively used for introducing different reaction gases; first air-distributing channels are arranged on opposite side walls of the first sub-member, and the two first air-distributing channels are respectively in one-to-one correspondence and communication with the two reaction gas inlets.

4. The spray device according to claim 1, wherein The first air-distributing channel includes N-stage shunt channels, each stage of shunt channel including a first section symmetrically extending from an air inlet position to both sides and a second section communicating with the tail end of the first section, the air inlet serving as the air inlet position of the first-stage shunt channel, the outlet of the second section serving as the air inlet position of the next stage of the shunt channel, the outlet of the second section of the N-stage shunt channel serving as the first outlet, and the adjacent first sections in each of the N-stage shunt channels are sequentially communicated, wherein N is a positive integer greater than or equal to 2.

5. The spray device according to claim 1, characterized in that, A first groove is arranged on one side of the second air-distributing member, the first groove serving as the second outlet, the second air-distributing channel including a third section extending along a horizontal plane from the second inlet and a fourth section communicating with the tail end of the third section and extending along a vertical plane, the tail end of the fourth section communicating with the first groove.

6. The spray device according to claim 5, wherein The spraying assembly is arranged in a fitting manner with the side of the second air-distributing member provided with the first groove, the spraying assembly including M spraying members stacked in sequence in the vertical direction, and being sequentially set as a first-stage spraying member to an M-stage spraying member in the direction away from the second air-distributing member, diversion holes are arranged on one side of each spraying member close to the second air-distributing member, diversion grooves are arranged on one side of each spraying member away from the second air-distributing member, and the diversion holes of the same spraying member are all communicated with the diversion groove. Wherein, the diversion holes of the first-stage spraying member serve as the third inlet and are communicated with the first groove, the diversion groove of the (M-1)-stage spraying member is communicated with the diversion holes of the M-stage spraying member, and the diversion holes of the M-stage spraying member serve as the spraying holes, M being a positive integer greater than or equal to 2.

7. The spraying device according to claim 6, characterized in that, The spraying device is further provided with a recovery mechanism, the recovery mechanism defines an exhaust passage, each spraying member is further provided with a first exhaust groove penetrating in the vertical direction, the first exhaust groove is communicated with the exhaust passage, and the first exhaust grooves and the diversion grooves are arranged alternately.

8. The spray device according to claim 1, wherein, The spraying device further includes a protective member, the protective member is connected to the side of the spraying assembly provided with spraying holes, the protective member is provided with a plurality of avoidance grooves penetrating in the vertical direction, and the avoidance grooves are not communicated with each other. It is set that the spraying holes of the same third gas equalizing passage are in a group, and each avoidance groove is arranged corresponding to each group of the spraying holes.

9. An atomic deposition device, characterized in that, Comprising: The spraying device according to any one of claims 1 to 8; A carrier plate for carrying a substrate; A driving mechanism for driving the carrier plate to move relative to the spraying device so that the substrate can be coated.

10. The atomic deposition apparatus according to claim 9, characterized in that, The spraying holes of the spraying device include a first reaction gas spraying hole, a second reaction gas spraying hole and a cleaning gas spraying hole. Along the moving direction of the carrier plate, the first reaction gas spraying holes and the second reaction gas spraying holes are arranged alternately, and a cleaning gas spraying hole is arranged between the first reaction gas spraying hole and the adjacent second reaction gas spraying hole.

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