Alloy die casting electroplating device
By introducing an infusion pump and busbar into the alloy die casting electroplating device, the circulating flow of the electroplating solution and impurity filtration are realized, which solves the problems of insufficient fluidity of the electroplating solution and inconvenient cleaning of impurities, and improves the plating speed and efficiency.
Patent Information
- Application Number
- CN202422274554.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-18
AI Technical Summary
The existing alloy die casting electroplating device stirs the electroplating solution through a stirring mechanism, which is limited in volume, has weak fluid enhancement effect, limited in electroplating speed improvement, and impurities need to be cleaned when the electroplating solution is used for a long time.
An alloy die casting electroplating device is designed, using an infusion pump, bus box and shunt box structure, and the circulating flow of the electroplating solution is realized through the infusion tube, and a filter plate is installed in the bus box to remove impurities.
It significantly enhances the fluidity of the plating solution, improves the plating speed, and simplifies the impurity cleaning process, saving time and effort.
Smart Images
Figure CN223134628U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroplating, in particular to an electroplating device for alloy die-castings. Background Technique
[0002] Electroplating is a process for surface treatment of alloy die-castings during die-casting production. Electroplating is mainly divided into two types, namely hydroelectroplating and vacuum plating. The process of hydroelectroplating is applicable to zinc alloy die-castings. The product to be electroplated can be electroplated by putting it into a chemical electroplating solution.
[0003] The process of hydroelectroplating is relatively slow. During the electroplating process, it is necessary to intermittently stir the electroplating solution to enable the alloy die-castings to be electroplated quickly and comprehensively. Some existing electroplating devices for alloy die-castings stir the electroplating solution through a stirring mechanism. Since the stirring mechanism is located in the electroplating tank, its volume is limited, the effect of enhancing the fluidity of the electroplating solution is weak, the improvement of the electroplating speed of the alloy die-castings is limited, and the impurities in the electroplating solution need to be cleaned when it is used for a long time. Therefore, an electroplating device for alloy die-castings is proposed to solve the above problems. Summary of the Invention
[0004] The purpose of the utility model is to provide an electroplating device for alloy die-castings to solve the problems that some existing electroplating devices for alloy die-castings stir the electroplating solution through a stirring mechanism. Since the stirring mechanism is located in the electroplating tank, its volume is limited, the effect of enhancing the fluidity of the electroplating solution is weak, the improvement of the electroplating speed of the alloy die-castings is limited, and the impurities in the electroplating solution need to be cleaned when it is used for a long time.
[0005] To achieve the above purpose, the utility model provides the following technical solutions:
[0006] An electroplating device for alloy die-castings, comprising an electroplating device main body, a controller and an electroplating tank. The front half of the electroplating device main body is fixedly connected with a controller. The inner side of the electroplating device main body is fixedly connected with an electroplating tank. The rear half of the electroplating device main body is fixedly connected with an infusion pump. There is a confluence box on the top of the infusion pump. There are two first infusion pipes on the top of the confluence box. There is a shunt box on the front side of the infusion pump. There are two second infusion pipes at the bottom of the shunt box. The confluence box includes a confluence shell and a limit frame. The inner side of the confluence shell is fixedly connected with a limit frame. The top of the confluence shell is detachably connected with a confluence cover. There is an installation shell inside the confluence shell. The bottom of the installation shell fits with the limit frame. The top of the installation shell fits with the confluence cover. The lowermost end inside the installation shell is fixedly connected with a filter plate. There are two horizontally distributed handles in the front-rear direction inside the installation shell. The bottom of the confluence shell is fixedly connected with the infusion pump. The first infusion pipe includes a bent pipe and a first switch valve. One end of the bent pipe at the lower side is fixedly connected with a first switch valve. One end of the bent pipe at the upper side is fixedly connected with a corrugated pipe. The lower side of the bent pipe is fixedly connected with a second switch valve. The outside of the first switch valve is fixedly connected with the electroplating tank. The lower end of the corrugated pipe is fixedly connected with the confluence cover. The shunt box includes a shunt shell and a shunt cover. The top of the shunt shell is fixedly connected with a shunt cover. The rear side of the shunt shell is fixedly connected with the infusion pump. The bottom of the shunt shell is fixedly connected with the second infusion pipe.
[0007] Preferably, the top of the electroplating device main body and the top of the electroplating tank are at the same height. The controller is electrically connected to the electroplating device main body, the infusion pump, the first switch valve and the corrugated pipe respectively. There are two connection holes at the left half of the bottom of the electroplating tank. The electroplating tank is fixedly connected with the two first switch valves through the connection holes respectively.
[0008] Preferably, there is a water suction pipe on the top of the infusion pump and a drain pipe on the front side of the infusion pump. The first infusion pipe is on the left side of the second infusion pipe.
[0009] Preferably, there is a water outlet at the right-biased position of the bottom of the confluence shell and two water inlets at the left-biased position of the confluence cover. The confluence shell is communicated with the water suction pipe on the top of the infusion pump.
[0010] Preferably, there is a water inlet at the left-biased position of the rear side of the shunt shell and two water outlets at the right-biased position of the bottom of the shunt shell. The shunt shell is communicated with the drain pipe on the front side of the infusion pump.
[0011] Compared with the prior art, the beneficial effects of the present utility model are:
[0012] In the present utility model, through the provided infusion pump, confluence box, first infusion tube, shunt box and second infusion tube, the device can provide power through the infusion pump, perform infusion through the first infusion tube and the second infusion tube, and perform flow splitting and confluence through the confluence box and the shunt box, so that the electroplating solution circulates, greatly enhancing the fluidity of the electroplating solution. At the same time, filtration can be performed through the confluence box to remove impurities in the electroplating solution, which is relatively time-saving and labor-saving. Description of the Drawings
[0013] Figure 1 is a schematic diagram of the overall structure of the present utility model;
[0014] Figure 2 is a sectional view of the overall structure of the present utility model;
[0015] Figure 3 is a sectional view of the installation structure of the infusion pump of the present utility model;
[0016] Figure 4 is a schematic diagram of the structure of the first infusion tube of the present utility model;
[0017] Figure 5 is a sectional view of the structure of the confluence box of the present utility model;
[0018] Figure 6 is a schematic diagram of the structure of the confluence shell of the present utility model;
[0019] Figure 7 is a schematic diagram of the installation structure of the filter plate of the present utility model;
[0020] Figure 8 is a sectional view of the structure of the shunt box of the present utility model;
[0021] Figure 9 is a schematic diagram of the structure of the shunt shell of the present utility model.
[0022] In the figure: 1, main body of the electroplating device; 2, controller; 3, electroplating tank; 4, infusion pump; 5, confluence box; 501, confluence shell; 502, limiting frame; 503, confluence cover; 504, installation shell; 505, filter plate; 506, handle; 6, first infusion tube; 601, bent tube; 602, first switching valve; 603, corrugated tube; 604, second switching valve; 7, shunt box; 701, shunt shell; 702, shunt cover; 8, second infusion tube. Detailed Implementation Modes
[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.
[0024] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom", etc. is usually based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description. Without contrary explanations, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the protection scope of the present utility model; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.
[0025] In addition, it should be noted that the use of words such as "first", "second", etc. to limit components is only for the convenience of distinguishing the corresponding components. Without otherwise stating, the above words have no special meanings. Therefore, it cannot be understood as a limitation on the protection scope of the present utility model.
[0026] Please refer to Figures 1-9 , the present utility model provides a technical solution:
[0027] An electroplating device for alloy die-castings, comprising an electroplating device main body 1, a controller 2 and an electroplating tank 3. The front half of the electroplating device main body 1 is fixedly connected with the controller 2, the inner side of the electroplating device main body 1 is fixedly connected with the electroplating tank 3, the rear half of the electroplating device main body 1 is fixedly connected with an infusion pump 4, the top of the infusion pump 4 is provided with a confluence box 5, the top of the confluence box 5 is provided with two first infusion pipes 6, the front side of the infusion pump 4 is provided with a shunt box 7, and the bottom of the shunt box 7 is provided with two second infusion pipes 8; The confluence box 5 includes a confluence shell 501 and a limiting frame 502. The inner side of the confluence shell 501 is fixedly connected with the limiting frame 502. The top of the confluence shell 501 is detachably connected with a confluence cover 503. An installation shell 504 is arranged inside the confluence shell 501. The bottom of the installation shell 504 is in contact with the limiting frame 502, the top of the installation shell 504 is in contact with the confluence cover 503. The lowermost end inside the installation shell 504 is fixedly connected with a filter plate 505. The inner side of the installation shell 504 is fixedly connected with two horizontally distributed handles 506 in the front-rear direction. The bottom of the confluence shell 501 is fixedly connected with the infusion pump 4. The first infusion pipe 6 includes a bent pipe 601 and a first switch valve 602. One end of the bent pipe 601 at the lower side is fixedly connected with the first switch valve 602. One end of the bent pipe 601 at the upper side is fixedly connected with a corrugated pipe 603. The lower side of the bent pipe 601 is fixedly connected with a second switch valve 604. The outer side of the first switch valve 602 is fixedly connected with the electroplating tank 3. The lower end of the corrugated pipe 603 is fixedly connected with the confluence cover 503. The shunt box 7 includes a shunt shell 701 and a shunt cover 702. The top of the shunt shell 701 is fixedly connected with the shunt cover 702. The rear side of the shunt shell 701 is fixedly connected with the infusion pump 4. The bottom of the shunt shell 701 is fixedly connected with the second infusion pipe 8.
[0028] The top of the electroplating device main body 1 and the top of the electroplating tank 3 are at the same height. The controller 2 is electrically connected to the electroplating device main body 1, the infusion pump 4, the first switch valve 602 and the corrugated pipe 603 respectively. Two connection holes are arranged in the left half of the bottom of the electroplating tank 3. The electroplating tank 3 is fixedly connected to the two first switch valves 602 through the connection holes. The electroplating tank 3 can hold electroplating solution and make the electroplating solution be pumped away or discharged from the bottom; The top of the infusion pump 4 is provided with a water suction pipe, the front side of the infusion pump 4 is provided with a drain pipe. The first infusion pipe 6 is located on the left side of the second infusion pipe 8. Both the first infusion pipe 6 and the second infusion pipe 8 can transport electroplating solution; An outlet is arranged at the right side of the bottom of the confluence shell 501. Two inlets are arranged at the left side of the confluence cover 503. The confluence shell 501 is communicated with the water suction pipe at the top of the infusion pump 4. The electroplating solution in the two first infusion pipes 6 can be collected through the confluence box 5; An inlet is arranged at the left side of the rear side of the shunt shell 701. Two outlets are arranged at the right side of the bottom of the shunt shell 701. The shunt shell 701 is communicated with the drain pipe at the front side of the infusion pump 4. The electroplating solution can be transported into the two second infusion pipes 8 through the shunt box 7.
[0029] Workflow: Connect the power supply before use. The electroplating device main body 1, controller 2, infusion pump 4, first switch valve 602, and bellows 603 of this device are all electrical appliances. The controller 2 is electrically connected to the electroplating device main body 1, infusion pump 4, first switch valve 602, and bellows 603 respectively. Manually operating the controller 2 can adjust the operating states of the electroplating device main body 1, infusion pump 4, first switch valve 602, and bellows 603 respectively. The bushing cover 503 and the shunt cover 702 of this device are both detachable components. The electroplating bath 3 of this device is filled with electroplating solution. Through the electroplating device main body 1, a chemical reaction can occur to the electroplating solution to electroplate the alloy die-castings in the electroplating solution. The above are all prior arts. When using this device, first start the electroplating device main body 1 and the infusion pump 4 through the controller 2, and place the alloy die-castings into the electroplating bath 3, then the alloy die-castings can be electroplated. By providing pumping power through the infusion pump 4, the electroplating solution can be pumped away from the bottom of the electroplating bath 3. The electroplating solution enters the interior of the infusion pump 4 after passing through the first infusion tube 6 and the bushing box 5, then passes through the shunt box 7 and the second infusion tube 8, and finally is discharged from the second infusion tube 8 and falls back into the electroplating bath 3. The bushing shell 501 and the bushing cover 503 have a bushing function, and the shunt shell 701 and the shunt cover 702 have a shunt function, which can make the electroplating solution be pumped away from the left half of the bottom of the electroplating bath 3 and then fall back into the electroplating bath 3 from the right half of the top of the electroplating bath 3, making the electroplating solution circulate and flow, and greatly enhancing the fluidity of the electroplating solution. At this time, the first switch valve 602 is opened and the bellows 603 is closed. The electroplating bath 3 can be communicated with the sealed box composed of the bushing shell 501 and the bushing cover 503 through the bent tube 601 and the bellows 603. The bushing shell 501 fixes the mounting shell 504 through the limiting frame 502. The electroplating solution is filtered through the filter plate 505, and the impurities generated by electroplating and the impurities falling into the electroplating solution from the top of the electroplating bath 3 can be filtered out. The impurities accumulate on the upper side of the filter plate 505. After a period of time, remove the bushing cover 503, and the mounting shell 504 and the filter plate 505 can be pulled out of the bushing shell 501 through the handle 506 to clean the mounting shell 504. When this device is not in use, both the first switch valve 602 and the second switch valve 604 are closed. When it is necessary to discharge the electroplating solution, just open the first switch valve 602 and the second switch valve 604 simultaneously. This device can provide power through the infusion pump 4, conduct infusion through the first infusion tube 6 and the second infusion tube 8, conduct shunting and bushing through the bushing box 5 and the shunt box 7, make the electroplating solution circulate and flow, greatly enhance the fluidity of the electroplating solution, and at the same time can filter through the bushing box 5 to clean the impurities in the electroplating solution, which is relatively time-saving and labor-saving.
[0030] The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art. The standard parts used in this utility model can all be purchased from the market. The special-shaped parts can all be customized according to the description in the specification and the drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, welding, etc. that are mature in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be elaborated here.
[0031] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. An electroplating device for alloy die-castings, comprising an electroplating device main body (1), a controller (2) and an electroplating bath (3), characterized in that: The front half of the electroplating device main body (1) is fixedly connected with a controller (2). The inner side of the electroplating device main body (1) is fixedly connected with an electroplating tank (3). The rear half of the electroplating device main body (1) is fixedly connected with an infusion pump (4). The top of the infusion pump (4) is provided with a confluence box (5). The top of the confluence box (5) is provided with two first infusion tubes (6). The front side of the infusion pump (4) is provided with a shunt box (7). The bottom of the shunt box (7) is provided with two second infusion tubes (8). The confluence box (5) includes a confluence shell (501) and a limit frame (502). The inner side of the confluence shell (501) is fixedly connected with the limit frame (502). The top of the confluence shell (501) is detachably connected with a confluence cover (503). The inside of the confluence shell (501) is provided with a mounting shell (504). The bottom of the mounting shell (504) fits with the limit frame (502). The top of the mounting shell (504) fits with the confluence cover (503). The lowermost end inside the mounting shell (504) is fixedly connected with a filter plate (505). The inside of the mounting shell (504) is fixedly connected with two horizontally distributed handles (506) in the front-back direction. The bottom of the confluence shell (501) is fixedly connected with the infusion pump (4). The first infusion tube (6) includes a bent tube (601) and a first switch valve (602). One end of the bent tube (601) at the lower side is fixedly connected with the first switch valve (602). One end of the bent tube (601) at the upper side is fixedly connected with a corrugated tube (603). The lower side of the bent tube (601) is fixedly connected with a second switch valve (604). The outside of the first switch valve (602) is fixedly connected with the electroplating tank (3). The lower end of the corrugated tube (603) is fixedly connected with the confluence cover (503). The shunt box (7) includes a shunt shell (701) and a shunt cover (702). The top of the shunt shell (701) is fixedly connected with the shunt cover (702). The rear side of the shunt shell (701) is fixedly connected with the infusion pump (4). The bottom of the shunt shell (701) is fixedly connected with the second infusion tube (8).
2. The electroplating device for alloy die-castings according to claim 1, characterized in that: The top of the electroplating device main body (1) and the top of the electroplating tank (3) are at the same height. The controller (2) is electrically connected to the electroplating device main body (1), the infusion pump (4), the first switch valve (602), and the corrugated tube (603) respectively. The left half of the bottom of the electroplating tank (3) is provided with two connection holes. The electroplating tank (3) is fixedly connected to the two first switch valves (602) through the connection holes respectively.
3. The electroplating device for alloy die-castings according to claim 1, characterized in that: The top of the infusion pump (4) is provided with a water suction pipe. The front side of the infusion pump (4) is provided with a drain pipe. The first infusion tube (6) is located on the left side of the second infusion tube (8).
4. The electroplating device for alloy die-castings according to claim 1, characterized in that: The right side of the bottom of the confluence shell (501) is provided with a water outlet. The left side of the confluence cover (503) is provided with two water inlets. The confluence shell (501) is communicated with the water suction pipe at the top of the infusion pump (4).
5. The electroplating device for alloy die-castings according to claim 1, characterized in that: An inlet is provided at a position on the left side of the rear side of the shunt housing (701), and two outlets are provided at a position on the right side of the bottom of the shunt housing (701). The shunt housing (701) is communicated with a drain pipe on the front side of the infusion pump (4).