Discharging table of silicon wafer degumming machine

By designing rotating components and hot air fans on the feeding table of the silicon wafer degumming machine, rapid drying of the silicon wafer is achieved, solving the problem of natural drying efficiency and ensuring that the silicon wafer smoothly enters the next process.

CN223138256UActive Publication Date: 2025-07-22YANGZHOU ZHONGHUAN NEW MATERIAL TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422178936.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-05
Publication Date
2025-07-22
Estimated Expiration
2034-09-05

AI Technical Summary

Technical Problem

In the prior art, silicon wafers are naturally drying efficiently after cleaning and degumming, resulting in a stacking of silicon wafers on the cutting table, affecting the efficiency of entering the next process.

Method used

A silicon wafer degumming machine is designed, and a rotating component is used to drive the positioning plate to swing back and forth to tilt the silicon wafer, and hot air is sent into the drying box through a hot air fan, and blow directly to both sides of the silicon wafer to accelerate drying.

Benefits of technology

The drying efficiency of the silicon wafer is improved, and the accumulation of silicon wafers on the cutting table is avoided, ensuring that the silicon wafers quickly enter the next process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223138256U_ABST
    Figure CN223138256U_ABST
Patent Text Reader

Abstract

The utility model discloses a blanking table of a silicon wafer degumming machine, which relates to the technical field of silicon wafer degumming blanking and comprises a base, vertical rods are arranged on the periphery of the top of the base, and the tops of the vertical rods are connected with a table body; a drying box and a controller are arranged on the table body, an air heater is arranged on the base, an air supply pipe is arranged on the air heater, and the air supply pipe is communicated with the bottom of the drying box; a rotating assembly is arranged on the drying box, the rotating assembly is connected with two positioning plates of the same structure, and connecting rods are arranged at the two ends of the opposite sides of the two positioning plates; the hot air blower is used for feeding hot air into the drying box, meanwhile, the silicon wafers are continuously inclined back and forth, the hot air flowing upwards can be directly blown to the two sides of the silicon wafers, the drying efficiency can be improved compared with the mode that the silicon wafers are kept vertical, and therefore the silicon wafers can be rapidly dried through the discharging table after being cleaned and degummed, silicon wafers are prevented from being stacked on the discharging table, and the working efficiency is improved. And the silicon wafer is prevented from entering the next process.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer degumming and blanking, in particular to a blanking table for a silicon wafer degumming machine. Background Art

[0002] After the silicon wafers are cleaned and degummed, they are generally placed on the blanking table for natural drying.

[0003] However, the applicant found that the efficiency of natural drying is low, resulting in an increasing accumulation of silicon wafers on the blanking table, which further reduces the efficiency of natural drying of the silicon wafers, making it impossible for the silicon wafers to quickly enter the next process. For this reason, we propose a blanking table for a silicon wafer degumming machine. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a blanking table for a silicon wafer degumming machine to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A blanking table for a silicon wafer degumming machine, including a base, vertical rods are arranged at the four circumferences of the top of the base, and the top of the vertical rods is connected with a table body;

[0006] A drying box and a controller are arranged on the table body, a hot air blower is arranged on the base, an air delivery pipe is arranged on the hot air blower, and the air delivery pipe is communicated with the bottom of the drying box;

[0007] A rotating assembly is arranged on the drying box, the rotating assembly is connected with two positioning plates with the same structure, and connecting rods are arranged at both ends of the relative sides of the two positioning plates;

[0008] The positioning plates are uniformly vertically inserted with silicon wafers located in the drying box.

[0009] As a preferred scheme of the blanking table for a silicon wafer degumming machine of the utility model, wherein: the rotating assembly includes two rotating shafts, both rotating shafts are connected with the drying box through bearings, gears are arranged on both rotating shafts, and a rack is meshed with the gears, and an electric telescopic rod connected with the rack is arranged on the drying box.

[0010] As a preferred scheme of the blanking table for a silicon wafer degumming machine of the utility model, wherein: a baffle penetrates through the left end of the drying box, the right side of the baffle is in contact with the right inner wall of the drying box, and a groove is arranged at the top of the baffle.

[0011] As a preferred scheme of the blanking table for a silicon wafer degumming machine of the utility model, wherein: an electric guide rail is arranged at the left end of the drying box, the output end of the electric guide rail is connected with a fixed rod, and the fixed rod is connected with the baffle.

[0012] As a preferred embodiment of the blanking table of the silicon wafer degumming machine of the present utility model, wherein: the groove is located inside the drying box and below the positioning plate.

[0013] As a preferred embodiment of the blanking table of the silicon wafer degumming machine of the present utility model, wherein: the top of the drying box is detachably connected with a cover plate, and an exhaust pipe is arranged on the top of the cover plate.

[0014] As a preferred embodiment of the blanking table of the silicon wafer degumming machine of the present utility model, wherein: a dust-proof net is detachably connected to the exhaust pipe.

[0015] Compared with the prior art, the beneficial effects of the present utility model are:

[0016] 1. Insert the silicon wafer onto the positioning plate, and then drive the positioning plate to swing back and forth through the rotating assembly, so that the silicon wafer tilts back and forth, thereby facilitating the rapid shedding of surface moisture and improving the drying efficiency;

[0017] 2. After the moisture is shed, the baffle no longer blocks the air supply pipe, and then hot air is sent into the drying box through the hot air blower. At the same time, the silicon wafer continues to tilt back and forth, so that the upward flowing hot air can directly blow to both sides of the silicon wafer, which can improve the drying efficiency compared with the way of keeping the silicon wafer vertical. Therefore, after the silicon wafer is cleaned and degummed, it can be quickly dried through this blanking table to avoid the accumulation of silicon wafers on the blanking table and affect the silicon wafer entering the next process. Description of the Drawings

[0018] Figure 1 It is the overall structure schematic diagram of the blanking table of the silicon wafer degumming machine of the present utility model;

[0019] Figure 2 It is the structure schematic diagram of the silicon wafer and the positioning plate of the blanking table of the silicon wafer degumming machine of the present utility model.

[0020] In the figure: 1. Base; 2. Vertical rod; 3. Table body; 4. Drying box; 5. Hot air blower; 6. Air supply pipe; 7. Cover plate; 8. Exhaust pipe; 9. Dust-proof net; 10. Silicon wafer; 11. Controller; 12. Positioning plate; 13. Connecting rod; 14. Rotating shaft; 15. Gear; 16. Rack; 17. Electric telescopic rod; 18. Baffle; 19. Groove; 20. Fixed rod; 21. Electric guide rail. Detailed Embodiments

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0022] As mentioned in the background art, aiming at the problem that the blanking table in the prior art cannot quickly dry silicon wafers. The present invention proposes a blanking table for a silicon wafer debonding machine.

[0023] Embodiment 1

[0024] Referring to Figures 1 to 2 , a blanking table for a silicon wafer debonding machine includes a base 1. Vertical rods 2 are provided at the four peripheral parts of the top of the base 1, and the top of the vertical rod 2 is connected to a table body 3;

[0025] A drying box 4 and a controller 11 are provided on the table body 3. The controller 11 is used to control the electrical components in the text. A hot air blower 5 is provided on the base 1, and an air supply pipe 6 is provided on the hot air blower 5. The air supply pipe 6 is communicated with the bottom of the drying box 4, so that the hot air blower 5 sends hot air into the drying box 4 through the air supply pipe 6;

[0026] A rotating assembly is provided on the drying box 4. The rotating assembly is connected to two positioning plates 12 with the same structure. Connecting rods 13 are provided at both ends of the opposite sides of the two positioning plates 12;

[0027] Silicon wafers 10 are vertically inserted into the positioning plates 12 on the drying box 4 evenly. The silicon wafers 10 are positioned by the two positioning plates 12 on both sides.

[0028] The rotating assembly includes two rotating shafts 14. Both rotating shafts 14 are connected to the drying box 4 through bearings. Gears 15 are provided on both rotating shafts 14, and a rack 16 is meshed with the gear 15. An electric telescopic rod 17 connected to the rack 16 is provided on the drying box 4. The electric telescopic rod 17 moves back and forth through the rack 16, so that the gear 15 drives the rotating shaft 14 to rotate back and forth.

[0029] A baffle 18 penetrates through the left end of the drying box 4. The right side of the baffle 18 is in contact with the right inner wall of the drying box 4, and a groove 19 for collecting moisture is provided at the top of the baffle 18. The groove 19 is located inside the drying box 4 and below the positioning plate 12.

[0030] At the left end of the drying oven 4, there is an electric guide rail 21. The output end of the electric guide rail 21 is connected to a fixed rod 20, and the fixed rod 20 is connected to a baffle 18. The electric guide rail 21 is used to move the fixed rod 20 horizontally, thereby driving the baffle 18 to move horizontally, so that the baffle 18 can be moved out of the drying oven 4.

[0031] Embodiment 2

[0032] Refer to Figure 1 , the top of the drying oven 4 is detachably connected with a cover plate 7. An exhaust pipe 8 is arranged on the top of the cover plate 7, which does not affect exhaust. A dust-proof net 9 is detachably connected to the exhaust pipe 8 to prevent dust from falling on the silicon wafer 10.

[0033] The rest of the structure is the same as that of Embodiment 1.

[0034] After the silicon wafer 10 is cleaned and degummed, it is inserted on the positioning plate 12, and then the cover plate 7 is covered. The positioning plate 12 is driven by a rotating shaft 14 to swing back and forth, so that the silicon wafer 10 tilts back and forth, thereby facilitating the rapid shedding of the surface moisture and improving the drying efficiency. The moisture falls into the groove 19. After the moisture is shed, the baffle 18 is moved to the left to facilitate the cleaning of the moisture, and then hot air can be sent in. At the same time, the silicon wafer 10 continues to tilt back and forth, so that the upward flowing hot air can directly blow to both sides of the silicon wafer 10. Compared with the way that the silicon wafer 10 remains vertical, the drying efficiency can be improved. Therefore, after the silicon wafer 10 is cleaned and degummed, it can be quickly dried by this blanking table.

[0035] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A blanking table for a silicon wafer debonding machine, characterized in that: Including, a base (1), vertical rods (2) are arranged at the four surrounding sides of the top of the base (1), and the top of the vertical rod (2) is connected to a table body (3); a drying box (4) and a controller (11) are arranged on the table body (3), a hot air blower (5) is arranged on the base (1), an air delivery pipe (6) is arranged on the hot air blower (5), and the air delivery pipe (6) is communicated with the bottom of the drying box (4); a rotating assembly is arranged on the drying box (4), the rotating assembly is connected to two positioning plates (12) with the same structure, and connecting rods (13) are arranged at both ends of the opposite sides of the two positioning plates (12); silicon wafers (10) located in the drying box (4) are vertically inserted into the positioning plates (12) evenly.

2. The blanking table of a silicon wafer degumming machine according to claim 1, characterized in that: The rotating assembly includes two rotating shafts (14), both of the two rotating shafts (14) are connected to the drying box (4) through bearings, gears (15) are arranged on both of the two rotating shafts (14), a rack (16) is meshed with the gear (15), and an electric telescopic rod (17) connected to the rack (16) is arranged on the drying box (4).

3. The stock table of a silicon wafer degumming machine according to claim 1, characterized in that: A baffle (18) penetrates through the left end of the drying box (4), the right side of the baffle (18) is in contact with the right inner wall of the drying box (4), and a groove (19) is arranged at the top of the baffle (18).

4. A blanking table of a silicon wafer degumming machine according to claim 3, characterized in that: An electric guide rail (21) is arranged at the left end of the drying box (4), the output end of the electric guide rail (21) is connected to a fixing rod (20), and the fixing rod (20) is connected to the baffle (18).

5. A blanking table of a silicon wafer degumming machine according to claim 3, characterized in that: The groove (19) is located in the drying box (4) and is below the positioning plate (12).

6. The blanking table of a silicon wafer debonding machine according to claim 1, characterized in that: A cover plate (7) is detachably connected to the top of the drying box (4), and an exhaust pipe (8) is arranged at the top of the cover plate (7).

7. The blanking table of a silicon wafer degumming machine according to claim 6, characterized in that: A dust-proof net (9) is detachably connected to the exhaust pipe (8).