Novel microelectronic component detection equipment

Abstract

The utility model provides a novel microelectronic component detection device. The novel microelectronic component detection device comprises a device base. The track is arranged on the equipment base, a new material feeding port and an old material feeding port are formed in the two sides of the track respectively, new and old microelectronic devices are conveyed from two directions respectively, and the conveying directions are located on the same straight line; the material receiving unit is mounted on the equipment base and is close to the middle position of the track; the new material detection unit and the old material feeding unit are both installed on the equipment base and located on the two sides of the material receiving unit correspondingly. A probe is arranged in the new material detection unit, and the capacitance value and the resistance value of each passing microelectronic device are tested through the probe. According to the utility model, the CCD camera and the probe are used for identifying the overall dimension of a received new microelectronic component, detecting the capacitance value and the resistance value, and matching and quickly identifying the new microelectronic component with an old material for connection, so that the material receiving accuracy is effectively improved, and the condition that the performance of a memory module product fails is avoided.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor memory module product manufacturing, especially the field of capacitance and resistance detection technology, and specifically provides a new type of microelectronic component detection equipment. Background Art

[0002] In the manufacturing of semiconductor memory module products, the accurate use of each microelectronic component is crucial. There are corresponding information marked on the outer packaging of microelectronic components. Among them, when the actual capacitance / resistance value of the electronic component does not match the capacitance / resistance value required for memory module manufacturing, the manufacturing equipment cannot detect it in time, resulting in the risk of product performance failure. Specifically, the following problems exist:

[0003] 1. Before the use of microelectronic components, it is impossible to find that the actual capacitance / resistance value is inconsistent with the packaging label. When performance anomalies are found during the subsequent process operation test, a large number of products have been completed, resulting in a large number of memory strips being scrapped.

[0004] 2. For the capacitance / resistance detection of microelectronic components, it is impossible to determine whether the connection of new and old materials is consistent. It is necessary to replace the front and rear microelectronic components and compare the measured values to be consistent.

[0005] 3. The comparison data of test values cannot be quickly queried and confirmed, cannot be transmitted to the computer for calculation, and cannot analyze and confirm the usage history in time. Summary of the Invention

[0006] In view of the above-mentioned disadvantages of the prior art, the purpose of the present utility model is to provide a new type of microelectronic component detection equipment to solve the difficulties of the prior art.

[0007] To achieve the above purpose and other related purposes, the present utility model provides a new type of microelectronic component detection equipment, including:

[0008] Equipment base 1;

[0009] Track 2, the track 2 is opened on the equipment base 1. The two sides of the track 2 are respectively a new material inlet 3 and an old material inlet 4, which respectively transfer new and old microelectronic components from two directions, and the transfer directions are on the same straight line;

[0010] Material receiving unit, the material receiving unit is installed on the equipment base 1 and is close to the middle position of the track 2;

[0011] New material detection unit and old material feeding unit 5, the new material detection unit and the old material feeding unit 5 are both installed on the equipment base 1 and are respectively arranged on both sides of the material receiving unit. The new material detection unit, the old material feeding unit 5 and the material receiving unit share the same track 2;

[0012] A probe 13 is provided inside the new material detection unit, and the capacitance value and resistance value of each passing microelectronic component are tested through the probe 13.

[0013] According to the preferred solution, a conveyor chain 6 is installed at the bottom of the track 2.

[0014] According to the preferred solution, the new material detection unit includes:

[0015] An auxiliary module 7, on which a viewing hole 8 is provided;

[0016] A moving unit, the auxiliary module 7 is connected to the moving unit, and moves in the direction close to or away from the microelectronic component through a driving motor 9 inside the moving unit;

[0017] A pressing guide post 10, the pressing guide post 10 is arranged above the auxiliary module 7 through a bracket, and the pressing guide post 10 is driven by a pressing motor 11 to move downward and abut against the rear end of the auxiliary module 7;

[0018] A first CCD camera 12, the first CCD camera 12 is installed above the track 2 through a bracket. When the auxiliary module 7 below moves to below the first CCD camera 12, the first CCD camera 12 takes pictures of the microelectronic component through the viewing hole 8;

[0019] A probe 13, the probe 13 is installed at the discharge end of the first CCD camera 12 through a slider 14, and is also located directly above the track 2. The slider 14 drives the probe 13 to move up and down through a cylinder.

[0020] According to the preferred solution, the probe 13 is electrically connected to the computer system.

[0021] According to the preferred solution, the moving unit includes:

[0022] A driving motor 9;

[0023] A lead screw 15, the lead screw 15 is installed on the driving motor 9, and the lead screw 15 is arranged parallel to the auxiliary module 7;

[0024] A connecting block 16, one end of the connecting block 16 is sleeved on the lead screw 15, and the other end is connected to the end of the auxiliary module 7 on the side away from the track 2;

[0025] A guide rail 17, the connecting block 16 is installed on the guide rail 17 through a slider directly below the lead screw 15, and the guide rail 17 is arranged parallel to the auxiliary module 7.

[0026] According to the preferred solution, sensors 18 are also arranged on the side of the guide rail 17 corresponding to the starting and ending ends of the connecting block 16.

[0027] According to the preferred solution, a second CCD camera 19 is installed in the used material feeding unit 5, and the camera of the second CCD camera 19 is arranged above the track 2.

[0028] According to the preferred solution, a probe is also installed in the used material feeding unit 5 to detect the capacitance and resistance values of the microelectronic components passing on the track 2 in the used material feeding unit 5.

[0029] According to the preferred solution, the material receiving unit includes:

[0030] A coil material tape mounting rack 20, on which a connecting tape is installed;

[0031] A guide groove 21, which is horizontally arranged at the discharge end of the coil material tape mounting rack 20 and forms a through groove for passing the tape inside;

[0032] A flat pressing block 22, which is installed on the guide groove 21, and a gap for passing the tape is formed between the bottom of the flat pressing block 22 and the guide groove 21;

[0033] A fixed pressing-down unit, which is arranged above the guide groove 21 and drives the pressing-down block 24 to abut against the material receiving ends of the new and used microelectronic components through a pressing motor 23.

[0034] According to the preferred solution, the fixed pressing-down unit includes:

[0035] A pressing motor 23;

[0036] A rotating shaft 25, which is arranged in a stepped shape, one end of which is installed on the pressing motor 23, and the rotating shaft 25 rotates through the drive of the pressing motor 23;

[0037] A pressing-down block 24, which is also arranged in a stepped shape, one end close to the pressing motor 23 is connected to the end of the rotating shaft 25, and the other end extends downward to form a pressing-down end 26, and the pressing-down end 26 is arranged directly above the track 2;

[0038] A first guide block 27, and one side of the pressing-down block 24 close to the used material feeding unit 5 moves along a vertical slideway 28 through the first guide block 27.

[0039] According to the preferred solution, a second guide block 29 is installed on one side of the equipment base 1 close to the track 2, a vertical through groove 30 is formed on one side of the second guide block 29 close to the pressing-down block 24, and the pressing-down end 26 of the pressing-down block 24 is embedded in the vertical through groove 30 and moves in a direction close to or away from the track 2 through the drive of the pressing motor 23.

[0040] The utility model uses a CCD camera and a probe to identify the contour dimensions of the received new microelectronic components, detect capacitance and resistance values, and at the same time match with the old materials for connection, quickly identify, effectively improve the accuracy of material connection, and avoid the occurrence of performance failure of memory module products.

[0041] In the following text, the optimal embodiments of implementing the utility model will be described in more detail in conjunction with the drawings, so as to easily understand the features and advantages of the utility model. Brief Description of the Drawings

[0042] Figure 1 Showing a three-dimensional structural schematic diagram of the utility model;

[0043] Figure 2 Showing an enlarged three-dimensional structural schematic diagram of the new material detection unit in the utility model;

[0044] Figure 3 Showing a partially enlarged three-dimensional structural schematic diagram of the new material detection unit in the utility model;

[0045] Figure 4 Showing a three-dimensional structural schematic diagram of another perspective of the utility model;

[0046] Figure 5 Showing a partially enlarged three-dimensional structural schematic diagram of the material connection unit in the utility model;

[0047] Label Description

[0048] 1. Equipment base; 2. Track; 3. New material inlet; 4. Old material inlet; 5. Old material feeding unit; 6. Conveyor chain; 7. Auxiliary module; 8. Sight hole; 9. Driving motor; 10. Pressing guide post; 11. Pressing motor; 12. First CCD camera; 13. Probe; 14. Slide block; 15. Lead screw; 16. Connecting block; 17. Guide rail; 18. Sensor; 19. Second CCD camera; 20. Coiled material tape mounting rack; 21. Guide groove; 22. Flat pressing block; 23. Pressing motor; 24. Pressing block; 25. Rotating shaft; 26. Pressing end; 27. First guiding block; 28. Vertical slideway; 29. Second guiding block; 30. Vertical through groove. Detailed Embodiment

[0049] In order to make the objectives, technical solutions, and advantages of the technical solutions of the present utility model clearer, the technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings of specific embodiments of the present utility model. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model.

[0050] Compared with the embodiments shown in the accompanying drawings, the feasible embodiments within the protection scope of the present utility model may have fewer components, have other components not shown in the accompanying drawings, different components, differently arranged components, or differently connected components, etc. In addition, two or more components in the accompanying drawings may be implemented in a single component, or a single component shown in the accompanying drawings may be implemented as multiple separate components.

[0051] Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which the present utility model pertains. The "first", "second", and similar terms used in the description of the present utility model patent application specification and claims do not indicate any order, quantity, or importance, but are only used to distinguish different components. Similarly, terms such as "a" or "an" do not necessarily indicate a quantity limitation. Terms such as "comprising" or "including" mean that the elements or items appearing before the term cover the elements or items listed after the term and their equivalents, without excluding other elements or items. Terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. Terms such as "upper", "lower", "left", "right", etc. are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0052] Therefore, it is very important to develop new microelectronic component detection equipment, compare it with the computer system, and stop the manufacturing equipment when an error occurs to prevent the performance failure of memory module products caused by abnormal capacitance / resistance values.

[0053] The present utility model provides a new microelectronic component detection equipment for use in the capacitance / resistance value detection process of microelectronic components. The present utility model does not limit the type of microelectronic components, but the structure of the new microelectronic component detection equipment is particularly suitable for the needs of connecting new and old materials of memory module products.

[0054] Generally speaking, the new microelectronic component detection equipment proposed by the present utility model mainly includes an equipment base 1, a track 2, a material receiving unit, a new material detection unit, and an old material feeding unit 5. Among them, reference can be made to Figure 1 , which shows the layout relationship of the equipment base 1, the track 2, the material receiving unit, the new material detection unit, and the old material feeding unit 5.

[0055] In order to achieve the purpose of preventing the performance failure of memory module products caused by abnormal capacitance / resistance values, and to solve the problems in the background technology that the actual capacitance / resistance value and the packaging label are inconsistent before the use of microelectronic components, and when performance abnormalities are found during the subsequent process operation tests, a large number of products have been completed, resulting in a large number of memory strips being scrapped; for the capacitance / resistance detection of microelectronic components, it is impossible to determine whether the new and old materials are connected consistently, and it is necessary to replace the front and rear microelectronic components and compare the measured values to be consistent; the test value comparison data cannot be quickly queried and confirmed, cannot be transmitted to the computer for calculation, and cannot analyze and confirm the usage history in a timely manner. Therefore, in the technical solution provided in this embodiment, the received new microelectronic components are identified by a CCD camera and a probe for the contour size of the microelectronic components, and the capacitance and resistance values are detected. At the same time, they are matched with the old materials for connection, quickly identified, effectively improving the accuracy of material receiving and avoiding the occurrence of performance failure of memory module products.

[0056] As Figure 1 shown, a material receiving unit, a new material detection unit, and an old material feeding unit 5 are installed on the equipment base 1. Among them, the new material detection unit and the old material feeding unit 5 are respectively arranged on both sides of the material receiving unit. In addition, as Figure 4 shown, a recessed track 2 that is transmitted by a conveyor chain 6 is arranged on one side of the equipment base 1. The two sides of the track 2 are respectively a new material inlet 3 and an old material inlet 4, which pass under the new material detection unit, the material receiving unit, and the old material feeding unit 5 in sequence, realizing the transfer of new and old microelectronic components from two directions, and the transfer directions are on the same straight line, and the effect of receiving materials is achieved under the material receiving unit.

[0057] Since the new material detection unit provided in this embodiment can perform material identification and capacitance and resistance measurement on the input new microelectronic components to avoid errors in the components before input and avoid batch defects, therefore, in the new material detection unit, the contour size of the microelectronic components is identified by a first CCD camera 12, and the computer module end for connection calculates the detection points and selects the matching detection probes, and a probe 13 is also configured to extend for capacitance and resistance detection.

[0058] Therefore, as Figure 2As shown in the figure, the first CCD camera 12 is mounted above the track 2 through a bracket. A movable auxiliary module 7 for pressing and positioning new microelectronic components is arranged below the first CCD camera 12. The auxiliary module 7 is connected to the moving unit and moves towards or away from the microelectronic components through the drive motor 9 in the moving unit. After moving into place, the pressing motor 11 is used to drive the pressing guide post 10 to move downward and abut against the rear end of the auxiliary module 7 to prevent shaking during the shooting of the first CCD camera 12. Considering that the adjacent structures should be avoided from affecting the shooting of the first CCD camera 12, a viewing hole 8 is provided on the auxiliary module 7. The viewing hole 8 limits the shooting range of the first CCD camera 12. Only the objects within this range are the detected objects. When the auxiliary module 7 below moves to the position below the first CCD camera 12, the first CCD camera 12 shoots the microelectronic components through the viewing hole 8.

[0059] Considering that the moving unit is far from the microelectronic components, in order to ensure the linearity of the movement of the auxiliary module 7, the moving unit provided in this embodiment adopts the structure of the drive motor 9 driving the lead screw 15 to drive the connecting block 16. The lead screw 15 is installed on the drive motor 9 and is arranged parallel to the auxiliary module 7. One end of the connecting block 16 is sleeved on the lead screw 15, and the other end is connected to the end of the auxiliary module 7 away from the track 2. The connecting block 16 is located directly below the lead screw 15 and is installed on the guide rail 17 through a slider. The guide rail 17 is arranged parallel to the auxiliary module 7. During movement, since the lead screw 15, the guide rail 17 and the auxiliary module 7 are all arranged parallel to each other, the linearity during the movement can be effectively guaranteed. In addition, sensors 18 are provided on the side of the guide rail 17 corresponding to the start and end of the connecting block 16, which can quickly feedback the moving stroke and avoid the situation of excessive movement of the auxiliary module 7, improving the accuracy of detection and measurement.

[0060] It should be specifically noted that a probe 13 is provided in the new material detection unit. The capacitance value and resistance value of each passing microelectronic component are tested through the probe 13. The probe 13 is tested behind the shooting of the first CCD camera 12. Therefore, the probe 13 is installed on the discharge end of the first CCD camera 12 through a slider 14 and is also arranged directly above the track 2. The slider 14 drives the probe 13 to move up and down through a cylinder. During operation, the probe 13 extends, and during non-operation detection, the probe 13 retracts. During use, since the first CCD camera 12 and the probe 13 are electrically connected to the computer system, the detection values of the new microelectronic components can be obtained in real time.

[0061] Similarly, the old microelectronic components for paired connection are input through the old material feeding unit 5. A conveyor chain 6 is also installed in the old material feeding unit 5. The old microelectronic components passing through the old material feeding unit 5 sequentially pass through the second CCD camera 19 and the probe arranged above the track 2, so as to realize the capacitance value and resistance value detection of the microelectronic components on the track 2 in the old material feeding unit 5. The second CCD camera 19 and the probe in this unit are also electrically connected to the computer system, and the actual detection values are obtained in the computer system and compared with the received required values. When they are consistent, the equipment automatically receives the materials, and the equipment can record the receiving state as received. When the values are inconsistent, the material receiving is stopped.

[0062] On this basis, the material receiving unit is arranged between the new material detection unit and the old material feeding unit 5. A fixed pressing unit is installed on the track 2 in the material receiving unit to achieve the purpose of receiving new and old microelectronic components. A guide groove 21 is installed in the direction perpendicular to the track 2. A coiling material tape mounting rack 20 for mounting the connecting material tape is arranged at the feeding end of the guide groove 21. A through groove for passing the material tape is formed inside the guide groove 21. In order to make the coiling material tape obtain a tensioned and flat effect when passing through the guide groove 21, a flat pressing block 22 is installed on the guide groove 21, and a gap for passing the material tape is formed between the bottom of the flat pressing block 22 and the guide groove 21.

[0063] As described above, through the fixed pressing unit, the receiving ends of the new and old microelectronic components can obtain the effect of downward pressing connection. Therefore, the pressing block 24 is arranged in a stepped shape, and one end close to the track 2 forms a pressing end 26, and the other end is connected to the rotating shaft 25; the rotating shaft 25 in this embodiment is also arranged in a stepped shape, and one end is installed on the pressing motor 23. The rotating shaft 25 rotates through the drive of the pressing motor 23, so as to drive the pressing block 24 to move downward towards the track and apply pressure.

[0064] As Figure 5 shown, in order to limit the consistency of the moving position of the pressing block 24 and avoid deviation, on the one hand, one side of the pressing block 24 close to the old material feeding unit 5 moves along the vertical slideway 28 through the first guide block 27. On the other hand, a second guide block 29 is installed on one side of the equipment base 1 close to the track 2. A vertical through groove 30 is opened on one side of the second guide block 29 close to the pressing block 24. The pressing end 26 of the pressing block 24 is embedded in the vertical through groove 30. During use, the pressing end 26 can only move towards or away from the track 2 along with the drive of the pressing motor 23, thus achieving the precise connection effect of the pressing end 26.

[0065] The above embodiments are only illustrative of the principles and effects of the present utility model, and are not intended to limit the present utility model. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present utility model. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present utility model should still be covered by the claims of the present utility model.

Claims

1. A new type of microelectronic component detection equipment, characterized in that, Comprising: Equipment base (1); Track (2), the track (2) is opened on the equipment base (1), and on both sides of the track (2) are a new material inlet (3) and an old material inlet (4) respectively, which transfer new and old microelectronic components from two directions, and the transfer directions are on the same straight line; Material receiving unit, the material receiving unit is installed on the equipment base (1) and is close to the middle position of the track (2); New material detection unit and old material feeding unit (5), the new material detection unit and the old material feeding unit (5) are both installed on the equipment base (1), and are respectively arranged on both sides of the material receiving unit, and the new material detection unit, the old material feeding unit (5) and the material receiving unit share the same track (2); A probe (13) is arranged in the new material detection unit, and the capacitance value and resistance value of each passing microelectronic component are tested through the probe (13).

2. The novel microelectronic component detection equipment according to claim 1, characterized in that The new material detection unit includes: an auxiliary module (7), and a viewing hole (8) is opened on the auxiliary module (7); Moving unit, the auxiliary module (7) is connected to the moving unit and moves in the direction close to or away from the microelectronic component through a driving motor (9) in the moving unit; Pressing guide post (10), the pressing guide post (10) is arranged above the auxiliary module (7) through a bracket, and the pressing guide post (10) is driven by a pressing motor (11) to move downward and abut against the rear end of the auxiliary module (7); First CCD camera (12), the first CCD camera (12) is installed above the track (2) through a bracket. When the auxiliary module (7) below moves to below the first CCD camera (12), the first CCD camera (12) takes pictures of the microelectronic component through the viewing hole (8); Probe (13), the probe (13) is installed on the discharge end of the first CCD camera (12) through a slider (14), and is also arranged directly above the track (2). The slider (14) drives the probe (13) to move up and down through a cylinder.

3. The novel microelectronic component detection equipment according to claim 2, characterized in that, The moving unit includes: Driving motor (9); Lead screw (15), the lead screw (15) is installed on the driving motor (9), and the lead screw (15) is arranged parallel to the auxiliary module (7); Connecting block (16), one end of the connecting block (16) is sleeved on the lead screw (15), and the other end is connected to the end of the auxiliary module (7) far from the track (2); Guide rail (17), the connecting block (16) is installed on the guide rail (17) through a slider directly below the lead screw (15), and the guide rail (17) is arranged parallel to the auxiliary module (7).

4. The novel microelectronic component detection equipment according to claim 3, characterized in that, A second CCD camera (19) is installed in the old material feeding unit (5), and the camera of the second CCD camera (19) is arranged above the track (2).

5. The novel microelectronic component detection equipment according to claim 4, characterized in that, The material receiving unit includes: Coiled material tape mounting rack (20), and a connecting tape is installed on the coiled material tape mounting rack (20); Guide groove (21), the guide groove (21) is horizontally arranged at the discharge end of the coiled material tape mounting rack (20), and a through groove for the passing tape is formed inside; Flat pressing block (22), the flat pressing block (22) is installed on the guiding groove (21), and a gap for passing the strip is formed between the bottom of the flat pressing block (22) and the guiding groove (21); Fixed downward pressing unit, the fixed downward pressing unit is arranged above the guiding groove (21), and drives the downward pressing block (24) to abut against the feeding ends of the new and old microelectronic components through the pressing motor (23).

6. The novel microelectronic component detection equipment according to claim 5, characterized in that, The fixed downward pressing unit includes: a pressing motor (23); Rotating shaft (25), the rotating shaft (25) is arranged in a stepped shape, one end is installed on the pressing motor (23), and the rotating shaft (25) rotates through the drive of the pressing motor (23); Downward pressing block (24), the downward pressing block (24) is also arranged in a stepped shape, one end close to the pressing motor (23) is connected to the end of the rotating shaft (25), and the other end extends downward to form a downward pressing end (26), and the downward pressing end (26) is arranged directly above the track (2); First guiding block (27), one side of the downward pressing block (24) close to the old material feeding unit (5) moves along the vertical sliding track (28) through the first guiding block (27).

7. The novel microelectronic component detection equipment according to claim 6, characterized in that, A second guiding block (29) is installed on one side of the equipment base (1) close to the track (2), a vertical through groove (30) is opened on one side of the second guiding block (29) close to the downward pressing block (24), and the downward pressing end (26) of the downward pressing block (24) is embedded in the vertical through groove (30), and moves in the direction close to or away from the track (2) with the drive of the pressing motor (23).

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