Fixing device for cyclic test of power semiconductor device
By designing a liquid-cooled cycle test fixture, the problem that traditional test equipment cannot meet the water-cooled heat dissipation power devices is solved, and a more realistic performance and life evaluation is achieved.
Patent Information
- Application Number
- CN202422283795.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-09-18
AI Technical Summary
Traditional power cycle testing equipment is difficult to meet the testing needs of water-cooled heat-dissipating power semiconductor devices, resulting in the inability to fully examine its packaging reliability.
A power semiconductor device cycle test fixture is designed, including a fixed platform and an insulated base. The cooling medium is circulated and flows in the placement tank using liquid cooling technology, and connected to the device electrodes through a conductive connecting piece to simulate the heat dissipation conditions in practical applications.
It realizes effective testing of water-cooled heat dissipation power devices, truly reflecting their performance and life characteristics, and improving the accuracy and reliability of the test.
Smart Images
Figure CN223139608U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of power semiconductor device detection, in particular to a circulating test fixing device for power semiconductor devices based on liquid cooling heat dissipation. Background Technique
[0002] Power cycle test is one of the important methods to evaluate the packaging reliability of power semiconductor devices, and is widely used in the establishment and life evaluation of power device life models. With the development of new energy vehicles, the requirements for the heat dissipation performance of power semiconductor devices are getting higher and higher. The traditional air-cooling or natural convection cooling methods are difficult to meet the heat dissipation requirements of high-power density devices. Therefore, the water-cooling heat dissipation technology is gradually applied to the packaging and testing of power semiconductor devices.
[0003] For example, power devices such as HPD (Hybrid Power Drive) modules that dissipate heat through water cooling have emerged on the market. These modules usually adopt the PinFin substrate Mb design and can directly perform fluid cooling, and are widely used in the traction systems of hybrid and electric vehicles.
[0004] However, the traditional power cycle test equipment is mainly designed for air-cooled or naturally cooled devices, and it is difficult to provide an ideal test environment for power devices that require water-cooling heat dissipation. This mismatch situation limits the application of water-cooling heat dissipation devices in power cycle tests, resulting in the inability to comprehensively investigate the packaging reliability of such devices.
[0005] Therefore, it is particularly important to develop a special test device for power devices that can adapt to water-cooling heat dissipation, especially new power semiconductor devices such as HPD modules. Summary of the Utility Model
[0006] The purpose of the utility model is to provide a circulating test fixing device for power semiconductor devices that can meet the test requirements of new liquid-cooled power semiconductor devices.
[0007] To achieve the above object, the present utility model provides a fixed device for cyclic testing of a power semiconductor device, which includes a fixed platform. A placement groove and an insulating base surrounding the placement groove are provided on the fixed platform; the placement groove is used for placing a device under test; a liquid inlet and a liquid outlet are provided in the placement groove. The liquid inlet is used to receive a liquid cooling medium, and the liquid outlet is used to discharge the cooling medium, so that the cooling medium in the placement groove circulates; when the device under test is placed in the placement groove, there is a gap for the cooling medium to enter between the bottom and the peripheral side of the device under test and the inner wall of the placement groove; a plurality of conductive connection pieces are provided on the insulating base. The conductive connection pieces include a first end and a second end. The first ends of the plurality of conductive connection pieces are respectively used for electrically connecting to different electrode ends on the device under test, and the second ends of the plurality of conductive connection pieces are respectively used for electrically connecting to different signal ends of a test system.
[0008] Preferably, the conductive connection piece includes at least one first electrode piece and at least two second electrode pieces. The electrode ends on the device under test include a power supply electrode, an emitter, and a collector. The power supply electrode, the emitter, and the collector are respectively located at opposite ends of the device under test; the first electrode piece is used for electrically connecting to the power supply electrode; at least two of the second electrode pieces are respectively used for electrically connecting to the emitter and the collector, and there is a height difference in the vertical direction between the ends of two adjacent second electrode pieces away from the device under test.
[0009] Preferably, positioning grooves corresponding to the electrode ends of the device under test are provided on the insulating base, and the first ends of the conductive connection pieces are located in the positioning grooves.
[0010] Preferably, the conductive connection piece and the positioning groove are connected by a first bolt and a nut. A first through hole is provided in the positioning groove, and a second through hole is provided in the conductive connection piece. The screw rod of the first bolt passes upward through the second through hole from the bottom of the first through hole, so that the top of the screw rod is located above the conductive connection piece, and the nut is screwed to the top of the screw rod.
[0011] Preferably, the nut of the first bolt has a regular polygon structure, and a limiting frame adapted to the edge contour of the nut is provided at the bottom of the first through hole to limit the rotation of the nut.
[0012] Preferably, in the first through hole, there is a sealing portion with a certain depth between the limiting frame and the orifice of the first through hole at the bottom of the insulating base. A sealing member is provided in the sealing portion, and the sealing member is used to prevent the first bolt from falling out of the first through hole.
[0013] Preferably, the electrode terminal of the device under test is connected to the conductive connecting piece through a second bolt; a sliding groove is provided at one end of the positioning groove close to the placement groove, and a slider capable of sliding along the sliding groove is provided in the sliding groove so that the slider can approach or move away from the placement groove. A screw hole is provided on the slider, a third through hole is provided on the conductive connecting piece, and a fourth through hole is provided at the electrode terminal of the device under test. The screw rod of the second bolt sequentially passes through the fourth through hole, the third through hole, and the screw hole from top to bottom to tightly connect the conductive connecting piece, the electrode terminal of the device under test, and the slider.
[0014] Preferably, an elastic member is further provided between the bottom wall of the positioning groove and the conductive connecting piece.
[0015] Preferably, a plurality of the placement grooves and the insulating bases corresponding to the placement grooves are arranged side by side on the fixed platform, and the liquid outlet of the former and the liquid inlet of the latter in two adjacent placement grooves are communicated with each other.
[0016] Compared with the prior art, the power semiconductor device cyclic test fixing device provided by the above technical solution of the present invention has a placement groove for placing the device under test on the fixed platform, and a liquid cooling medium can circulate in the placement groove, so as to achieve continuous and effective heat dissipation during the test, which helps to simulate the heat dissipation conditions of the device under test in actual applications and more truly reflect the performance and life characteristics of the device. Description of the Drawings
[0017] Figure 1 It is a structural diagram of the use state of the fixing device in one embodiment of the present invention.
[0018] Figure 2 It is an assembly structural diagram of the insulating base in an embodiment of the present invention.
[0019] Figure 3 It is a three-dimensional structural diagram of the device under test in an embodiment of the present invention.
[0020] Figure 4 It is an assembly structural diagram of the insulating base and the conductive connecting piece in an embodiment of the present invention.
[0021] Figure 5 For Figure 1 the layout structural diagram of the conductive connecting piece in
[0022] Figure 6 It is a three-dimensional structural diagram of the insulating base in an embodiment of the present invention.
[0023] Figure 7 It is a bottom structural diagram of the insulating base in an embodiment of the present invention.
[0024] Figure 8 is Figure 7 an enlarged view of part A in
[0025] Figure 9 is Figure 1 a sectional view taken along the C-C direction in , where the fixed platform has been removed.
[0026] Figure 10 is a structural diagram of the use state of the fixing device in another embodiment of the present utility model. Specific embodiments
[0027] In order to explain in detail the technical content, structural features, achieved purposes and effects of the present utility model, the following will be described in detail in conjunction with the embodiments and with reference to the accompanying drawings.
[0028] This embodiment discloses a power semiconductor device cyclic test fixing device for cooperating with a test system to perform cyclic detection on a device under test M. For example, Figure 3 , during the test, the fixing device is used to fix and protect the device under test M and provide a liquid-cooled cyclic heat dissipation environment for the device under test M. The test system provides an electronic test signal for the device under test M and detects the state parameter signal of the device under test M.
[0029] For example, Figures 1 to 3 , the fixing device includes a fixed platform 1, and a placement groove 10 and an insulating base 2 surrounding the periphery of the placement groove 10 are provided on the fixed platform 1.
[0030] The placement groove 10 is used to place the device under test M. Specifically, the device under test M includes a substrate Mb and electrode terminals D in the shape of lugs extending outward from the substrate Mb, and one side of the substrate Mb has a number of PIN-FIN pins Y arranged in an array. When the device under test M is placed in the placement groove 10, the side of the substrate Mb with the PIN-FIN pins Y faces downward, so that the PIN-FIN pins Y are located in the placement groove 10 and contact the cooling medium, and the electrode terminals D on the periphery of the substrate Mb fall to the edge outside the notch of the placement groove 10.
[0031] An inlet J1 and an outlet J2 are provided in the placement groove 10. The inlet J1 is used to receive the liquid cooling medium, and the outlet J2 is used to discharge the cooling medium, so that the cooling medium in the placement groove 10 circulates. During the test, the cooling medium is continuously input from the inlet J1 and continuously discharged from the outlet J2, so that the cooling medium in the placement groove 10 is in a cyclic flow state, thereby performing cyclic heat dissipation on the device under test.
[0032] When the device under test M is placed in the placement groove 10, there is a gap for the cooling medium to enter between the bottom and the periphery of the device under test M and the inner wall of the placement groove 10 to ensure the smooth flow of the cooling medium in the placement groove 10.
[0033] A plurality of conductive connection pieces 3 are arranged on the insulating base 2. The conductive connection pieces 3 include a first end 32 and a second end 33. The first ends 32 of the plurality of conductive connection pieces 3 are respectively used for electrically connecting to different electrode ends D on the device under test M, and the second ends 33 of the plurality of conductive connection pieces 3 are respectively used for electrically connecting to different signal ends of a test system (not shown in the figure).
[0034] In this embodiment, a placement groove 10 for placing the device under test M is arranged on the fixed platform 1, and a liquid cooling medium can circulate in the placement groove 10, so as to achieve continuous and effective heat dissipation during the test process, which helps to simulate the heat dissipation conditions of the device under test M in actual applications and more truly reflect the performance and life characteristics of the device.
[0035] On the other hand, as Figure 4 and Figure 5 , the conductive connection piece 3 includes at least one first electrode piece 30 and at least two second electrode pieces 31. The electrode ends D on the device under test M include a power supply electrode, an emitter, and a collector. The power supply electrode, the emitter, and the collector are respectively located at opposite ends of the device under test M. The first electrode piece 30 is used for electrically connecting to the power supply electrode, and at least two second electrode pieces 31 are respectively used for electrically connecting to the emitter and the collector, and the ends of two adjacent second electrode pieces 31 away from the device under test M have a height difference in the vertical direction.
[0036] In this embodiment, the device under test M is a high-power semiconductor device used in a three-phase power circuit. Therefore, there are three power supply electrodes on the device under test M, namely U, V, and W. At the same time, there are three pairs of emitters and collectors on the device under test M. The emitters are respectively N1, N2, and N3, and the collectors are respectively P1, P2, and P3. Correspondingly, there are three first electrode pieces 30, which respectively correspond to the three power supply electrodes U, V, and W, and there are six second electrode pieces 31, which respectively correspond to the three emitters N1, N2, and N3 and the three collectors P1, P2, and P3. In addition, since the ends of two adjacent second electrode pieces 31 away from the device under test M have a height difference H in the vertical direction, interference between the adjacent emitters and collectors at the rear end (i.e., the second end 33) can be avoided, effectively utilizing the space where the insulating base 2 is located, and making the wiring with the test system more orderly.
[0037] On the other hand, positioning grooves 20 corresponding to the electrode ends D of the device under test M are arranged on the insulating base 2, and the first ends 32 of the conductive connection pieces 3 are located in the positioning grooves 20. Through the arrangement of the positioning grooves 20, it is beneficial to the orderly arrangement of the conductive connection pieces 3.
[0038] As Figure 1 , Figure 5 , Figure 6 andFigure 9 The conductive connecting piece 3 is connected to the positioning groove 20 by a first bolt 40 and a nut 41. A first through hole 21 is provided in the positioning groove 20, and a second through hole 34 is provided on the conductive connecting piece 3. The screw of the first bolt 40 passes through the second through hole 34 from the bottom of the first through hole 21 upward, so that the top of the screw is located above the conductive connecting piece 3, and the nut 41 is screwed to the top of the screw.
[0039] In this embodiment, it is only necessary to set threads on a portion of the screw located above the conductive connecting plate 3, and the nut 41 is located above the conductive connecting plate 3. In this way, even if different types of conductive connecting plates 3 are replaced multiple times, thread slippage will not occur between the screw and the first through hole 21. When thread slippage occurs between the nut 41 and the screw, the problem can be solved by simply replacing the nut 41 and / or the bolt, thereby ensuring the service life of the insulating base 2.
[0040] Furthermore, the nut of the first bolt 40 is a regular polygonal structure, and a limit frame 212 (such as Figure 7 and Figure 8 Specifically, the nut 41 of the first bolt 40 is in a regular hexagonal structure, and a regular hexagonal limit frame 212 is provided at the bottom of the first through hole 21. The limit frame 212 can limit the rotation of the bolt in the first through hole 21, thereby effectively ensuring the fastening stability between the conductive connecting piece 3 and the insulating base 2.
[0041] Furthermore, in order to prevent the first bolt 40 from falling from the first through hole 21 under the action of gravity, a blocking portion 210 of a certain depth is provided between the limiting frame 212 and the opening of the first through hole 21 at the bottom of the insulating base 2 in the first through hole 21, such as Figure 9 , a sealing member 5 is provided in the sealing portion 210, and the sealing member 5 is used to prevent the first bolt 40 from falling from the first through hole 21. In this embodiment, a screw thread is provided on the inner side wall of the sealing portion 210, and the sealing member 5 is a fastening screw. After the first bolt 40 is inserted into the first through hole 21, the sealing member 5 is used to fill the sealing portion 210, thereby preventing the first bolt 40 from falling without reason.
[0042] On the other hand, the electrode end D of the device under test M is connected to the conductive connecting sheet 3 through the second bolt 6. Specifically, a slide groove 200 is provided at one end of the positioning groove 20 close to the placement groove 10, and a slider 7 capable of sliding along the slide groove 200 is provided in the slide groove 200, so that the slider 7 can approach or move away from the placement groove 10.
[0043] The slider 7 is provided with a screw hole 70, the conductive connecting piece 3 is provided with a third through hole 35, and the electrode terminal D of the device under test M is provided with a fourth through hole D0. The screw rod of the second bolt 6 sequentially passes through the fourth through hole D0, the third through hole 35, and the screw hole 70 from top to bottom to firmly connect the conductive connecting piece 3, the electrode terminal D of the device under test M, and the slider 7.
[0044] In this embodiment, through the cooperation of the slider 7 and the sliding groove 200, the device under test M with different lengths of electrode terminals D can be adapted.
[0045] On the other hand, since there is a height difference H between the conductive connecting piece 3 and the electrode terminal D on the device under test M, and the electrode terminal D is located above the conductive connecting piece 3. Therefore, when the electrode terminal D of the device under test M is pressed against the conductive connecting piece 3 by the second bolt 6, the electrode terminal D may be deformed, and when this deformation reaches a certain degree, it may also damage the internal structure of the device under test M. Therefore, as Figure 9 , to avoid this problem, an elastic member 8 is further provided between the bottom wall of the positioning groove 20 and the conductive connecting piece 3.
[0046] In this embodiment, the elastic member 8 provides a flexible support for the conductive connecting piece 3. Before connecting the conductive connecting piece 3 and the electrode terminal D of the device under test M together, under the elastic force of the elastic member 8, the conductive connecting piece 3 slightly disengages from the positioning groove 20 upward, and under the pressing action of the second bolt 6, the conductive connecting piece 3 is pressed back into the positioning groove 20, so that the conductive connecting piece 3 and the electrode terminal D of the device under test M are in elastic contact, thus ensuring both the close contact between the connecting ends of the conductive connecting piece 3 and the device under test M and avoiding excessive bending of the electrode terminal D of the device under test M.
[0047] On the other hand, to improve the test efficiency, as Figure 10 , a plurality of placement grooves 10 and insulating bases 2 corresponding to the placement grooves 10 are arranged side by side on the fixed platform 1, and the liquid outlet J2 of the former and the liquid inlet J1 of the latter in two adjacent placement grooves 10 are communicated.
[0048] In this embodiment, through the arrangement of the plurality of placement grooves 10, a plurality of semiconductor devices can be tested simultaneously. If there are unused placement grooves 10, the notch of the placement groove 10 can also be sealed by a cover plate 22 to prevent the coolant from overflowing.
[0049] In addition, a first connection pipe orifice 90 is provided at one end of the fixed platform 1, and a second connection pipe orifice 91 is provided at the other end of the fixed platform 1. The first connection pipe orifice 90 is communicated with the liquid inlet J1 of the adjacent placement groove 10, and the second connection pipe orifice 91 is communicated with the liquid outlet J2 of the adjacent placement groove 10. During use, the first connection pipe orifice 90 and the second connection pipe orifice 91 are respectively connected to the liquid inlet pipe and the liquid return pipe of the coolant supply device, so as to centrally supply circulating coolant to a plurality of placement grooves 10.
[0050] The above-disclosed are only the preferred embodiments of the present invention, and of course cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.
Claims
1. A fixed device for cyclic testing of a power semiconductor device, characterized in that, It includes a fixed platform, on which a placement groove and an insulating base surrounding the periphery of the placement groove are provided; the placement groove is used for placing a device under test; a liquid inlet and a liquid outlet are provided in the placement groove, the liquid inlet is used for receiving a liquid cooling medium, and the liquid outlet is used for discharging the cooling medium, so that the cooling medium in the placement groove circulates; when the device under test is placed in the placement groove, there is a gap for the cooling medium to enter between the bottom and the periphery of the device under test and the inner wall of the placement groove; a plurality of conductive connection pieces are provided on the insulating base, the conductive connection pieces include a first end and a second end, and the first ends of the plurality of conductive connection pieces are respectively used for electrically connecting with different electrode ends on the device under test, and the second ends of the plurality of conductive connection pieces are respectively used for electrically connecting with different signal ends of a test system.
2. The power semiconductor device cyclic test fixture according to claim 1, wherein The conductive connection piece includes at least one first electrode piece and at least two second electrode pieces, the electrode ends on the device under test include a power supply electrode, an emitter and a collector, and the power supply electrode, the emitter and the collector are respectively located at opposite ends of the device under test; the first electrode piece is used for electrically connecting with the power supply electrode; at least two of the second electrode pieces are respectively used for electrically connecting with the emitter and the collector, and there is a height difference in the vertical direction between the ends of two adjacent second electrode pieces away from the device under test.
3. The power semiconductor device cyclic test fixing device according to claim 2, characterized in that, Positioning grooves corresponding to the electrode ends of the device under test are provided on the insulating base, and the first ends of the conductive connection pieces are located in the positioning grooves.
4. The power semiconductor device cyclic test fixing device according to claim 3, characterized in that, The conductive connection piece and the positioning groove are connected by a first bolt and a nut. A first through hole is provided in the positioning groove, a second through hole is provided on the conductive connection piece, and the screw rod of the first bolt passes upward through the second through hole from the bottom of the first through hole, so that the top of the screw rod is located above the conductive connection piece, and the nut is screwed onto the top of the screw rod.
5. The power semiconductor device cyclic test fixing device according to claim 4, characterized in that, The nut of the first bolt has a regular polygon structure, and a limiting frame adapted to the edge contour of the nut is provided at the bottom of the first through hole to limit the rotation of the nut.
6. The power semiconductor device cyclic test fixing device according to claim 5, characterized in that, In the first through hole, there is a sealing portion with a certain depth between the limiting frame and the orifice of the first through hole at the bottom of the insulating base, and a sealing member is provided in the sealing portion, and the sealing member is used to prevent the first bolt from falling out of the first through hole.
7. The power semiconductor device cyclic test fixture according to claim 3, characterized in that, The electrode end of the device under test is connected to the conductive connection piece by a second bolt; a sliding groove is provided at one end of the positioning groove close to the placement groove, and a slider capable of sliding along the sliding groove is provided in the sliding groove, so that the slider can approach or move away from the placement groove. A screw hole is provided on the slider, a third through hole is provided on the conductive connection piece, and a fourth through hole is provided on the electrode end of the device under test. The screw rod of the second bolt passes downward through the fourth through hole, the third through hole and the screw hole in sequence to tightly connect the conductive connection piece, the electrode end of the device under test and the slider.
8. The power semiconductor device cyclic test fixing device according to claim 3, characterized in that, An elastic member is further disposed between the bottom wall of the positioning groove and the conductive connecting piece.
9. The power semiconductor device cyclic test fixing device according to claim 1, characterized in that A plurality of the placement grooves and the insulating bases corresponding to the placement grooves are arranged side by side on the fixed platform, and the liquid outlet of the former and the liquid inlet of the latter in two adjacent placement grooves are communicated with each other.