Spacing-adjustable pressure plate state acquisition unit
By designing an adjustable pitch pressure plate state acquisition unit, the sliding pressure plate state acquisition module and conductive spring connection is used to solve the problem of high cost of special-shaped pressure plate acquisition, and efficient state monitoring that flexibly adapts to different pressure plate spacing is achieved.
Patent Information
- Application Number
- CN202520845452.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-30
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2035-04-30
AI Technical Summary
The existing platen state acquisition unit cannot effectively adapt to the special-shaped platen, especially the platens with uneven quantity and inconsistent spacing, resulting in high collection cost and low efficiency.
An adjustable pitch pressure plate state acquisition unit is designed, and a freely sliding pressure plate state acquisition module is adopted. It can adapt to different pressure plate spacing through soft wire or sliding connection, and achieve stable connection with the conductive slide of the PCB base plate through conductive springs.
It realizes flexible adjustment of the spacing of the acquisition module, which is suitable for various pressure plate spacing, reduces costs and improves acquisition efficiency, and adapts to the status monitoring needs of special-shaped pressure plates.
Smart Images
Figure CN223139868U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of secondary equipment monitoring for relay protection in power systems, including substations with high voltage and extra-high voltage, and specifically relates to an adjustable-spacing pressing plate state acquisition unit. Background Technique
[0002] The statements in this part only provide background technical information related to the present disclosure and do not necessarily constitute prior art.
[0003] The on-line monitoring system for pressing plates consists of three parts: an acquisition unit, an aggregation unit, and a management unit. The acquisition unit is responsible for acquiring the state of the pressing plates within the panel; the aggregation unit is responsible for aggregating and uploading the state of the pressing plates within the panel; the management unit receives the data from the aggregation unit, accesses the on-line monitoring system for pressing plates within the substation, and uploads the pressing plate state information to the on-line monitoring master station of the pressing plates according to the DL / T860 information model and transmission protocol.
[0004] The acquisition unit adopts the magnetic induction principle. An acquisition unit cross bar is installed above the pressing plate, and a magnetic steel structure member is installed on the pressing plate. When the pressing plate is in the closing position, the magnetic steel in the magnetic steel structure member is directly opposite to the sensor in the cross bar, and at this time, the closing signal of the pressing plate can be acquired to complete the acquisition of the state information of the pressing plates in the switch cabinet panel.
[0005] Currently, the common pressing plate state acquisition units are generally centralized acquisition, suitable for the panel assembly method, mainly for the protection pressing plates in the standard switch cabinets in the protection room. There are 9 pressing plates in a row, and at most 9 columns vertically for each switch cabinet panel. The standard spacing of the pressing plates in the switch cabinet is: 50mm, 48mm, 45mm.
[0006] However, for various special-shaped pressing plates, such as 12 pressing plates in a row in the protection room switch cabinet panel; the number of pressing plates on the high-voltage switch cabinets in the high-voltage room is uneven, some are more and some are less, such as 15 pressing plates in a row or 2 pressing plates in a row on the high-voltage room switch cabinets; or pressing plates with dense spacing and large spacing, there is no good applicable solution. Generally, individual collectors or customized special acquisition boards need to be used, which is time-consuming and laborious and has a high cost. Summary of the Utility Model
[0007] In order to solve the technical problems existing in the prior art, the utility model provides an adjustable-spacing pressing plate state acquisition unit, which is provided with a freely slidable pressing plate state acquisition module, and the spacing of each pressing plate state acquisition module can be flexibly adjusted according to the actual situation.
[0008] To achieve the above object, the utility model is realized through the following technical solutions:
[0009] The utility model provides an adjustable-spacing pressing plate state acquisition unit, including a housing, and a plurality of pressing plate state acquisition modules are slidably embedded in the housing, and the plurality of pressing plate state acquisition modules are connected in series and connected to a signal processing module.
[0010] Further technical solution: The platen state acquisition module includes a magnetic induction sensor and a closing position indicator light, and the magnetic induction sensor and the closing position indicator light are respectively connected to the signal processing module.
[0011] Further technical solution: The signal processing module includes a processor chip, an address DIP switch, and an IIC IO expansion module, and the processor chip is respectively connected to the address DIP switch and the IIC IO expansion module.
[0012] Further technical solution: The IIC IO expansion module is connected to control the closing position indicator light.
[0013] Further technical solution: On both sides inside the housing, a first slot, a second slot, and a third slot are sequentially provided, and there are intervals between the first slot, the second slot, and the third slot in pairs.
[0014] Further technical solution: A plurality of platen state acquisition modules are slidably embedded in the second slot.
[0015] Further technical solution: The plurality of platen state acquisition modules are connected in series one by one by flexible flat cables.
[0016] Further technical solution: A PCB bottom plate is fixedly embedded in the third slot, and a plurality of conductive chutes are provided on the PCB bottom plate.
[0017] Further technical solution: A plurality of platen state acquisition modules are slidably embedded in the second slot, and a conductive clamping spring is fixedly provided at the bottom of the platen state acquisition module.
[0018] Further technical solution: The conductive clamping spring is clamped on the conductive chute.
[0019] Advantages of the present utility model:
[0020] In the present utility model, slots are provided on the inner side of the housing, and the platen state acquisition module is embedded in the slot and can slide freely along the slot, capable of flexibly moving within a small range. Combined with the connection method of flexible flat cables or sliding connection, it is applicable to various platen spacings, making the state acquisition of various special-shaped platens simple.
[0021] The platen state acquisition module of the present utility model can be connected in series by flexible flat cables. The flexible flat cable is a flexible material, capable of bending along with the movement, and can adjust the length along with the movement of the platen state acquisition module; the platen state acquisition module can also adopt a sliding connection method, and is connected to the information processing module integrated on the PCB bottom plate through the conductive clamping spring provided at the bottom of the acquisition module and the conductive chute on the PCB bottom plate. The conductive clamping spring can slide on the conductive chute on the PCB bottom plate to realize the movement of the platen state acquisition module.
[0022] In the sliding acquisition unit of the present utility model, a conductive spring clip is provided at the bottom of the platen state acquisition module. The conductive spring clip adopts a hook-shaped elastic structure and is divided into multiple independent hook-shaped clamping parts. Each clamping part has a "V"-shaped opening, and the bottom forms a surface contact with the conductive slideway of the PCB bottom plate, increasing the conductive area. Moreover, the conductive spring clip has elasticity and always maintains stable contact when sliding on the conductive slideway, capable of maintaining long-term conductive stability. The signal processing module is connected to each platen acquisition module through the conductive slideway and the conductive spring clip to achieve centralized power supply and distributed signal acquisition.
[0023] The present utility model can flexibly set the number of platen state acquisition modules according to the actual situation of the field platens, and the outer shell can be cut and spliced. In the case of uneven numbers of platens, some more and some less, the acquisition units can be flexibly combined. Description of the Drawings
[0024] The drawings are used to provide a further understanding of the present utility model and constitute a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model and do not constitute a limitation to the present utility model.
[0025] Figure 1 It is a module diagram of the adjustable-spacing platen state acquisition unit according to the embodiment of the present utility model;
[0026] Figure 2 It is a circuit diagram of the adjustable-spacing platen state acquisition unit according to the embodiment of the present utility model;
[0027] Figure 3 It is an overall schematic diagram of the flexible cable type acquisition unit according to the embodiment of the present utility model;
[0028] Figure 4 It is a side schematic diagram of the flexible cable type acquisition unit according to the embodiment of the present utility model;
[0029] Figure 5 It is a side view of the flexible cable type acquisition unit according to the embodiment of the present utility model;
[0030] Figure 6 It is an overall schematic diagram of the sliding acquisition unit according to the embodiment of the present utility model;
[0031] Figure 7 It is a side schematic diagram of the sliding acquisition unit according to the embodiment of the present utility model;
[0032] Figure 8 It is a side view of the sliding acquisition unit according to the embodiment of the present utility model;
[0033] Figure 9 It is a schematic diagram of the connection between the platen state acquisition module and the PCB bottom plate in the sliding acquisition unit according to the embodiment of the present utility model;
[0034] Figure 10This is the structural diagram of the platen state acquisition module in the sliding acquisition unit of the embodiment of the present utility model.
[0035] Among them, 1 - housing, 2 - first slot, 3 - second slot, 4 - third slot, 5 - platen state acquisition module, 6 - signal processing module, 7 - PCB bottom plate, 8 - conductive slideway, 9 - conductive circlip. Specific implementation mode
[0036] The following further describes the present utility model in conjunction with the accompanying drawings and specific embodiments.
[0037] Embodiment 1
[0038] The embodiment of the present utility model provides an adjustable pitch platen state acquisition unit, including a housing 1, in which a plurality of platen state acquisition modules 5 are slidably embedded, and the plurality of platen state acquisition modules 5 are connected in series and connected to a signal processing module 6.
[0039] In this embodiment, as Figure 1 shown, each platen corresponds to a platen state acquisition module. The platen state acquisition module 5 includes a magnetic induction sensor and a closing position indicator light, and the magnetic induction sensor and the closing position indicator light are respectively connected to the signal processing module.
[0040] The output end of the magnetic induction sensor is connected to the input end of the signal processing module. When the magnetic induction sensor operates normally, the output voltage of the output end OUTPUT is high. When a magnet approaches, the output voltage of its output end becomes low. The signal processing module judges the platen state by collecting the output signal. A magnetic steel structure member containing a magnetic steel is installed on the platen (which can also be called a relay protection platen). When the platen is opened and closed, the distance between the magnetic steel and the magnetic induction sensor changes. Whether the platen is opened or closed (i.e., the platen state) is judged by collecting the value of 0 / 1.
[0041] In some implementation modes, preferably, the magnetic induction sensor is implemented by KTM1302.
[0042] Furthermore, as Figure 2 shown, the power supply end VDD of the magnetic induction sensor is respectively connected to the VDD power supply, the first end of the first resistor , and the first end of the input capacitor . The second end of the input capacitor is connected to the ground end GND of the magnetic induction sensor. The second end of the first resistor is respectively connected to the output end OUTPUT of the magnetic induction sensor and the first end of the output capacitor . The second end of the output capacitor The second end of [device] is connected to the ground terminal GND of the magnetic induction sensor; the output end of the magnetic induction sensor is connected to the processor chip (low-power chip), and the processor chip is connected to the aggregation unit through the 485A and 485B buses. The aggregation unit is responsible for aggregating and uploading the status of the in-panel pressure plates. Each switchgear cabinet or switch cabinet has an in-panel aggregation unit, which is responsible for summarizing the information of the acquisition units and uploading the information to the management unit to achieve centralized monitoring of the switchgear cabinet or switch cabinet.
[0043] It should be noted that Figure 2 The circuit only exemplifies a single pressure plate status acquisition module, and the number of pressure plate status acquisition modules can be flexibly set according to the actual number of pressure plates.
[0044] The closing position indicator uses an LED indicator and has two lighting methods. One is in the normal mode (power supply), when the pressure plate status is closed, the closing position indicator is always on, and when the pressure plate status is open, the closing position indicator is off. The other is in the low-power mode (battery power supply), when the pressure plate is put in (closed) and changes, the closing position indicator lights up for a set time (set to 30s in this embodiment, which can be flexibly set), and when the pressure plate is withdrawn (open) and changes, the closing position indicator flashes (set to flash twice in this embodiment, each time lighting up for 500ms, with an interval of 500ms, which can be flexibly set).
[0045] In this embodiment, as Figure 1 shown, the signal processing module 6 includes a processor chip, an address DIP switch, an IIC IO expansion module, an operation indicator, and a communication indicator. The processor chip is respectively connected to the address DIP switch and the IIC IO expansion module, and the IIC IO expansion module is respectively connected to the operation indicator and the communication indicator for control.
[0046] The processor chip is implemented by a low-power chip MO and is used to collect the signals output by the pressure plate status acquisition module. When the pressure plate switch changes between open and closed, the magnetic induction sensor collects the signal, causing the level of the GPIO pin of the MO chip to change. The MO chip performs corresponding processing by collecting relevant signals.
[0047] The IIC IO expansion module is implemented by an IIC chip. The IIC chip is respectively connected to multiple closing position indicators, an operation indicator, and a communication indicator. The IIC chip, the closing position indicators, the operation indicator, the communication indicator, and the VDD power supply form a display module. The IIC chip communicates with the processor chip through I2C, and the IIC chip is connected to each indicator through GPIO pins.
[0048] Furthermore, as Figure 2As shown in the figure, the IIC IO expansion module is connected to the low-power chip through I2C and to the indicator LED through GPIO pins. The indicator LED is connected to the VDD power supply in series with a resistor R. When the pressure plate changes between open and closed states, the processor chip collects the state of the pressure plate and sends control instructions to the IIC chip through I2C according to the pressure plate state. The IIC chip controls the lighting and extinguishing of the corresponding closing position indicator lights according to the control instructions. At the same time, the processor chip also sends control instructions to the IIC chip based on the power supply state and communication state of the current acquisition unit. The IIC chip controls the lighting and extinguishing of the operation indicator light and the communication indicator light according to the control instructions.
[0049] Furthermore, the power supply pin of the IIC chip is controlled by a GPIO pin of the low-power chip MO. When the acquisition unit is in the low-power mode, the power supply of the IIC chip is cut off. When the acquisition unit is in the normal working mode, the IIC power supply is normally powered.
[0050] It should be noted that Figure 2 only one indicator LED is shown in the figure. The indicator LED includes the closing position indicator light, the operation indicator light, and the communication indicator light. The actual number of closing position indicator lights is the same as the number of pressure plate state acquisition modules and can be flexibly set according to the actual number of pressure plates.
[0051] The address DIP switch is used to set the address of the entire acquisition unit and is reflected in the uploaded message. The address DIP switch is used to set the communication address of the acquisition unit through physical DIP switches, providing physical address coding to avoid data conflicts. That is to say, in the RS485 bus network, each acquisition unit needs to be assigned an independent address to distinguish the data source. When the DIP switch address is set to a certain number, the first byte of the message will display that number. The first byte of the mutation message is the DIP switch address, and the second byte represents whether it is a mutation message or a general recruitment message. The message corresponding to the closing and opening of the pressure plate starts from the fourth byte, and each byte represents the closing and opening state of a pressure plate, where 1 represents closed and 0 represents open.
[0052] The operation indicator light is used to display the operation state of the current acquisition unit. In this embodiment, in the normal mode (power supply), the operation indicator light is always on; in the low-power mode (battery power supply), the operation indicator light flashes continuously during normal operation. When the operation indicator light stops flashing, the acquisition unit enters the sleep state. In the sleep state, only when the pressure plate changes between open and closed, the operation indicator light is awakened and will light up and continue to flash.
[0053] The communication indicator light is used to reflect the communication state. When the processor chip sends data to the aggregation unit, it will send a control instruction to the IIC chip, and the IIC chip controls the communication indicator light to flash (in this embodiment, it is set to flash once and can be flexibly set according to the actual situation).
[0054] The signal processing module communicates with the platen status acquisition module via the downlink RS485 to collect the real-time platen status; the signal processing module also communicates with the aggregation unit via the uplink RS485 to send the real-time platen status to the aggregation unit.
[0055] In this embodiment, the platen status acquisition module is a movable acquisition module, and its position can slide freely within a certain range. Multiple platen status acquisition modules are connected in series via a flexible cable, and their positions can slide freely. After multiple acquisition modules are connected in series, they are connected to the information processing module. The information processing module aggregates the platen status collected by multiple platen status acquisition modules and uploads it to the aggregation unit. The entire acquisition unit can be cut and spliced in length, and the outer shell of the acquisition unit can be cut. The number of platen status acquisition modules and the length of the outer shell required can be determined according to the actual number and spacing of the platens used on-site. Then, the entire acquisition unit is cut into the required length, the corresponding number of platen status acquisition modules are installed, and multiple platen status acquisition modules are connected one by one with a flexible cable of appropriate length. Then, the signal processing module and the cable are installed, and the two ends of the acquisition unit are fixed with plastic plugs. That is to say, the number of acquisition modules is selected according to the actual number of platens. For example, when there are 1-9 platens, the outer shell of the acquisition unit can be cut to form acquisition units of different lengths to adapt to a small number of uneven platens; when there are a large number of platens, such as 15 platens, the acquisition unit can be spliced, and in the case of splicing, there may be multiple signal processing modules.
[0056] In some embodiments, each acquisition unit is provided with at most 12 platen status acquisition modules connected in series, supporting up to 12 platen circuits.
[0057] Such as Figure 3 、 Figure 4 、 Figure 5 As shown, the adjustable-spacing platen status acquisition unit (flexible cable type acquisition unit) includes a housing 1. On both sides inside the housing 1, a first slot 2, a second slot 3, and a third slot 4 are successively provided from top to bottom. There is a certain spacing between the first slot, the second slot, and the third slot. Plug heads are respectively provided at both ends of the housing, and a light-transmitting and opaque cover plate adapted to it is provided at the top of the housing. The plug heads at both ends of the housing and the light-transmitting and opaque cover plate at the top make the acquisition unit form a closed structure, preventing foreign objects from entering the inside of the housing and protecting the cables and modules.
[0058] Furthermore, the plug head is also used to prevent the internal platen status acquisition module from slipping out when sliding.
[0059] Furthermore, L-shaped convex columns are respectively provided on both sides of the bottom of the light-transmitting and opaque cover plate. The convex columns are embedded in the first slots on both sides of the housing to realize the installation and fixation of the cover plate and the housing, making the interior form a closed structure to prevent foreign objects from entering the interior of the housing and protecting the cables and modules. It should be noted that the L-shaped convex columns are adapted to the first slots. The light-transmitting and opaque cover plate allows the indicator light to pass through for easy status observation, protects the internal components, and at the same time avoids external light interference with the visibility of the indicator light.
[0060] In some embodiments, the housing material is made of insulating plastic ABS. The housing is a U-shaped housing, which provides physical support for the internal components and prevents damage caused by external force impact or environmental factors.
[0061] A plurality of platen state acquisition modules are slidably embedded in the second slots. The platen state acquisition modules can slide freely along the second slots. The lower part of the platen state acquisition modules serves as a cable slot for accommodating cables to avoid cable clutter. Flexible flat cables are used to connect between two adjacent platen state acquisition modules. After all the platen state acquisition modules are connected in series, they are connected to a single signal processing module. The flexible flat cable includes a power line and 485 communication lines (two power lines and two 485 communication lines are provided in this embodiment). It is made of a flexible material and can bend as it moves, and can adapt to the length changes after the platen state acquisition modules slide and the housing is trimmed.
[0062] It should be noted that generally, there are multiple rows of platens, with multiple in each row. From the perspective of the installation of the actual acquisition unit, each platen corresponds to a platen state acquisition module, and multiple platen state acquisition modules are connected in series to realize the acquisition of the states of multiple platens; from the perspective of circuit connection, multiple platen state acquisition modules are connected in parallel, and jointly transmit the acquired signals to the signal processing module. The signal processing module can be placed on the left or right side of the platen state acquisition module, and can be flexibly set according to the cable outlet position of the actual situation, without specific limitation.
[0063] Through the above technical solution, the platen state acquisition module is embedded in the second slot to realize free sliding along the second slot, and can adapt to different platen spacings. During actual use, first basically fix the housing of the acquisition unit, roughly estimate the spacing between each platen, connect multiple platen state acquisition modules in series one by one through flexible flat cables of appropriate lengths, and then ensure that the magnetic steel on the platen is directly opposite the magnetic induction sensor of the acquisition module when the platen is closed by moving the platen state acquisition module, so as to acquire the platen state. Each platen state acquisition module responds to the communication request of the signal processing module and uploads the real-time platen state. The signal processing module summarizes the platen states uploaded by each platen state acquisition module and responds to the communication request of the aggregation unit, and uploads the platen state to the aggregation unit.
[0064] Detailed description of the working principle:
[0065] Multiple platen state acquisition modules are connected in series within the housing through a flexible cable and are connected to the signal processing module. The platen state acquisition modules can slide freely within the second slot on the inner side of the housing. The flexible cable bends as it moves, ensuring that the platen state acquisition modules are aligned with the platens. The housing can be trimmed, and the number of acquisition modules required and the spacing between each acquisition module can be determined according to the number and spacing of the platens in actual on-site use.
[0066] After the platen opens or closes, the magnetic induction sensor collects a signal, causing the level of the GPIO pin of the processor chip in the signal processing module to change. The processor chip collects relevant signals (i.e., the platen state) and aggregates and sends them to the aggregation unit. At the same time, the processor chip also controls the IIC chip according to the platen state, operating state, and communication state, and then controls the corresponding indicator lights to turn on and off.
[0067] Embodiment 2
[0068] An embodiment of the present utility model provides an adjustable-spacing platen state acquisition unit, including a housing 1. Multiple platen state acquisition modules 5 are slidably embedded within the housing 1, and the multiple platen state acquisition modules 5 are connected in series and connected to a signal processing module 6.
[0069] In this embodiment, as Figure 6 、 Figure 7 、 Figure 8 shown, the adjustable-spacing platen state acquisition unit (sliding acquisition unit) includes a housing 1. On both sides inside the housing 1, a first slot 2, a second slot 3, and a third slot 4 are provided in sequence from top to bottom. There is a certain spacing between the first slot, the second slot, and the third slot.
[0070] A PCB bottom plate 7 is fixedly embedded within the third slot. Multiple conductive slides 8 are provided on the PCB bottom plate 7. Multiple platen state acquisition modules are slidably embedded within the second slot. A conductive clamping spring 9 is fixedly provided at the bottom of the platen state acquisition module, and the conductive clamping spring 9 is clamped onto the conductive slide 8. The platen state acquisition module can slide freely along the second slot and is clamped to the PCB bottom plate 7 through the conductive clamping spring 9 to achieve electrical connection.
[0071] In some embodiments, four conductive slides are provided on the PCB bottom plate, which are two power lines and two 485 communication lines in this embodiment. The length of the PCB bottom plate can be trimmed as needed or can be spliced through cables.
[0072] As Figure 9 、 Figure 10As shown, a conductive spring is fixed at the bottom of the pressure plate state acquisition module. The conductive spring adopts a hook-type elastic structure and is divided into four independent hook-type clamping parts. Each clamping part has a "V"-shaped opening, and the bottom forms a surface contact with the conductive slide. One end of each clamping part is fixed to the bottom of the pressure plate state acquisition module, and the other end is freely suspended, using its own elasticity to cling to the surface of the conductive slide.
[0073] Furthermore, the conductive retaining spring is made of copper material, which has high conductivity and elasticity, ensuring that it is not easily deformed during repeated sliding. The conductive retaining spring is adapted to the conductive slideway, and generates clamping force through elastic deformation during clamping installation, which can adapt to the size of the conductive slideway, ensure close contact with the conductive slideway, and ensure contact stability.
[0074] Four conductive slides are arranged in parallel on the PCB bottom plate. They are printed circuits on the PCB bottom plate. The metal surface is not coated with three-proof paint. When the conductive spring is clamped on the conductive slide, it is equivalent to connecting to the corresponding contact through a cable. The length of the PCB bottom plate can be cut to fit different installation spaces, or multiple sections can be spliced through connectors, jumpers, etc. to extend the slide length.
[0075] Through the above technical solution, the elastic sliding contact of the conductive retaining spring allows the pressure plate status acquisition module to move freely in the second slot, and the spacing between each acquisition module can be adjusted without disconnecting the electrical connection, which perfectly adapts to the installation scenarios of different pressure plate intervals; the surface contact design of the conductive retaining spring and the conductive slide increases the conductive area, and the conductive retaining spring has a certain elasticity and can adapt to tolerance changes (such as uneven slide surface or installation deviation) when sliding on the conductive slide, and can always maintain stable contact.
[0076] The signal processing module is integrated on the PCB base plate, responsible for summarizing the pressure plate status sent by each pressure plate acquisition module, and responding to the communication request of the aggregation unit to send the pressure plate status. The various components of the signal processing module are welded on the PCB base plate. The power supply and 485 contacts of the signal processing module are connected to the conductive slide (similar to the busbar), and are connected to each pressure plate acquisition module through the conductive slide and conductive retaining spring to achieve centralized power supply and distributed signal acquisition. The signal processing module can be installed on the left or right end of the PCB base plate, and can be flexibly set according to the actual cable outlet position during installation. The signal processing module is set at the end with the cable outlet, without specific limitation.
[0077] In some implementations, the adjustable spacing platen status acquisition unit supports up to 12 platens without cutting or splicing.
[0078] It should be noted that the number of independent hook-type clamping parts and conductive slideways can be increased or decreased according to actual conditions, and this embodiment does not specifically limit this.
[0079] Working principle details:
[0080] According to the actual number of pressure plates, insert the required number of pressure plate state acquisition modules into the second slot of the housing, and slide along the second slot and the conductive slideway to adjust the distance between the pressure plate state acquisition modules so that they correspond one by one to the positions of the pressure plates; the conductive clamping springs at the bottom of the pressure plate state acquisition modules are in contact with the conductive slideways of the PCB bottom plate, automatically completing the parallel connection of the power supply and communication lines without additional wiring.
[0081] The signal processing module is connected to each pressure plate state acquisition module through the conductive slideway to achieve the convergence of the pressure plate states.
[0082] Although the specific embodiments of the present invention are described above in conjunction with the accompanying drawings, it is not a limitation to the protection scope of the present invention. Those skilled in the art should understand that based on the technical solution of the present invention, various modifications or deformations that can be made by those skilled in the art without creative labor are still within the protection scope of the present invention.
Claims
1. An adjustable-spacing pressing plate state acquisition unit, characterized in that: It includes a housing, in which a plurality of platen state acquisition modules are slidably embedded. The plurality of platen state acquisition modules are connected in series and connected to a signal processing module; The platen state acquisition module includes a magnetic induction sensor and a closing position indicator light, and the magnetic induction sensor and the closing position indicator light are respectively connected to the signal processing module; The signal processing module includes a processor chip, an address DIP switch and an IIC IO expansion module, and the processor chip is respectively connected to the address DIP switch and the IIC IO expansion module; The IIC IO expansion module is connected to the closing position indicator light for control; On both sides inside the housing, a first slot, a second slot and a third slot are sequentially provided. There is a spacing between the first slot, the second slot and the third slot; A plurality of platen state acquisition modules are slidably embedded in the second slot, and the platen state acquisition modules can slide freely along the second slot; The plurality of platen state acquisition modules are connected in series one by one using flexible flat cables.
2. The adjustable-spacing pressing plate state acquisition unit according to claim 1, wherein: A PCB bottom plate is fixedly embedded in the third slot, and a plurality of conductive chutes are provided on the PCB bottom plate.
3. The adjustable-spacing pressing plate state acquisition unit according to claim 2, characterized in that: A plurality of platen state acquisition modules are slidably embedded in the second slot, and conductive clamping springs are fixedly provided at the bottoms of the platen state acquisition modules.
4. The adjustable-spacing platen state acquisition unit according to claim 3, wherein: The conductive clamping spring is clamped on the conductive chute.