Composite chip radiator

Through the combination of the refrigeration sheet, microporous filter and heat dissipation fins of the composite chip radiator, the problems of slow replacement speed and low heat dissipation efficiency are solved, and the efficient chip heat dissipation effect is achieved.

CN223140769UActive Publication Date: 2025-07-22JILIN UNIVERSITY
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Patent Information

Application Number
CN202422371576.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-27
Publication Date
2025-07-22
Estimated Expiration
2034-09-27

AI Technical Summary

Technical Problem

In the prior art, silicon grease replacement speed is slow and heat dissipation efficiency is limited, making it difficult to meet the heat dissipation needs of high-energy-consuming chips.

Method used

A composite chip radiator is designed, including a combined structure of refrigeration sheet, microporous filter, heat dissipation fin and heat dissipation fan. The microporous filter is used to uniformly apply the silicon grease, the refrigeration sheet accelerates the temperature transfer, and the heat dissipation fins and fan blades improve heat dissipation efficiency.

Benefits of technology

The uniform application and efficient replacement of silicon grease are achieved, which significantly improves the heat dissipation efficiency of the chip and avoids damage to the chip surface by the residual silicon grease.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a composite chip radiator, which comprises a base, a refrigeration sheet is arranged in the base, a microporous filter screen is arranged at the bottom of the refrigeration sheet, silicone grease is filled in meshes of the microporous filter screen, two ends of the top of the base are fixedly connected with side frames, radiating fins are fixedly connected in the side frames in a penetrating manner, and the radiating fins are arranged in the side frames in a penetrating manner. And a cooling fan is arranged at the tops of the cooling fins, the base comprises two supports, and insertion pieces are fixedly connected to the two sides of the refrigeration piece. According to the utility model, the refrigeration sheet, the microporous filter screen, the heat dissipation fan and the heat dissipation fins are matched with one another, the refrigeration sheet is arranged outside the chip, so that the temperature of the chip can be conveniently transmitted to the other side of the refrigeration sheet for heat dissipation, the heat dissipation efficiency of the chip is greatly improved by combining the heat dissipation fins and the heat dissipation fan, and meanwhile, when silicone grease is coated, the microporous filter screen is covered, so that the heat dissipation efficiency of the chip is greatly improved. The silicone grease can be uniformly and fully smeared, residues can be conveniently removed when the silicone grease is subsequently replaced, and the replacement speed of the silicone grease is increased.
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Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation devices, and particularly relates to a composite chip radiator. Background Art

[0002] A chip is a general term for a way of miniaturizing circuits (mainly including semiconductor devices, but also including passive components, etc.) and is often a semiconductor component product manufactured on the surface of a semiconductor wafer. Chips play a core role in modern electronic devices and computing systems. They are widely used in various aspects such as data processing, storage, control, communication, and sensing.

[0003] An increase in temperature will cause an increase in the internal current of the chip, thereby increasing the chip power consumption. This will cause the chip to generate more heat during operation, further increasing the temperature, forming a vicious cycle. Therefore, some high-power-consuming chips require good heat dissipation during operation.

[0004] In order to improve the heat dissipation effect of the chip, silicone grease is often applied on the surface of the chip. When the silicone grease is consumed, it needs to be replaced in a timely manner. The residual silicone grease is likely to harden and adhere to the surface of the chip to prevent damage to the chip surface. Therefore, extra care is required during removal, resulting in a decrease in the silicone grease replacement speed.

[0005] Only cooling the chip through silicone grease and an external cooling fan, the heat dissipation efficiency is always limited. Therefore, we propose to design a composite chip radiator to cope with chips with greater heat dissipation requirements. Summary of the Utility Model

[0006] The purpose of this part is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part, as well as in the abstract and the title of the specification of this application, to avoid obscuring the purpose of this part, the abstract, and the title of the utility model. However, such simplifications or omissions cannot be used to limit the scope of the utility model.

[0007] To solve the above technical problems, according to one aspect of the utility model, the utility model provides the following technical solutions:

[0008] A composite chip radiator includes a base. A refrigerating sheet is arranged inside the base. A microporous filter screen is arranged at the bottom of the refrigerating sheet. The inner pores of the microporous filter screen are filled with silicone grease. Both ends of the top of the base are fixedly connected with side frames. A heat dissipation fin is fixedly connected through the inside of the side frame. A cooling fan is arranged at the top of the heat dissipation fin.

[0009] As a preferred embodiment of the composite chip radiator of the present utility model, the base includes two brackets. Insert pieces are fixedly connected to both sides of the refrigeration chip. Slots corresponding to the insert pieces are provided on one side of the two brackets close to each other. The refrigeration chip is inserted into the brackets correspondingly, which is convenient for installing the refrigeration chip in the brackets for fixation.

[0010] As a preferred embodiment of the composite chip radiator of the present utility model, raised pieces are fixedly connected to the four corners of the microporous filter screen. The microporous filter screen is directly attached to the surface of the chip of the radiator to be installed. By applying silicone grease, it is convenient to fill the gap between the chip and the refrigeration chip to make the two fit closely.

[0011] As a preferred embodiment of the composite chip radiator of the present utility model, the cross-section of the side frame is U-shaped. The bottom of the side frame is fixed to the base by bolts, and the four corners of the top of the side frame are fixed to the radiator fan by bolts, which is convenient for installing the heat dissipation fins between the radiator fan and the refrigeration chip to improve the heat dissipation effect.

[0012] As a preferred embodiment of the composite chip radiator of the present utility model, a number of heat dissipation fins are provided. A connecting rod is fixedly connected between the two side frames. A number of the heat dissipation fins are evenly distributed in the connecting rod, and air ducts are provided between adjacent two heat dissipation fins, which is convenient for air to pass through the air ducts to improve the heat dissipation efficiency.

[0013] Compared with the prior art, the beneficial effects of the present utility model are:

[0014] Through the mutual cooperation among the refrigeration chip, the microporous filter screen, the radiator fan and the heat dissipation fins, the present utility model is provided with a refrigeration chip outside the chip, which is convenient for accelerating the transfer of the temperature of the chip to the other side of the refrigeration chip for heat dissipation. Combining the heat dissipation fins and the radiator fan greatly improves the heat dissipation efficiency of the chip. At the same time, when applying silicone grease, the microporous filter screen is covered, which can not only make the silicone grease evenly and fully applied, but also facilitate the removal of residues when replacing the silicone grease later, improving the replacement speed of the silicone grease. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the present utility model will be described in detail below in conjunction with the drawings and detailed embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts. Among them:

[0016] Figure 1 It is a three-dimensional view of a composite chip radiator of the present utility model;

[0017] Figure 2 Schematic diagram of the structure of a composite chip radiator of the present utility model;

[0018] Figure 3 Schematic diagram of the heat dissipation fin structure of a composite chip radiator of the present utility model.

[0019] Legend: 1. Base; 101. Bracket; 2. Refrigeration sheet; 201. Insertion piece; 3. Microporous filter screen; 301. Protruding piece; 4. Thermal grease; 5. Side frame; 501. Connecting rod; 6. Heat dissipation fin; 7. Cooling fan; 8. Air duct. Detailed implementation manners

[0020] In order to make the above objects, features and advantages of the present utility model more obvious and understandable, the following will describe the detailed implementation manners of the present utility model in conjunction with the accompanying drawings.

[0021] Secondly, the present utility model will be described in detail in conjunction with the schematic diagrams. When describing the implementation manners of the present utility model in detail, for the convenience of description, the cross-sectional views showing the device structure will be enlarged locally in a non-general proportion, and the schematic diagrams are only examples and should not limit the protection scope of the present utility model here. In addition, in actual production, three-dimensional spatial dimensions including length, width and depth should be included.

[0022] In order to make the purpose, technical solution and advantages of the present utility model clearer, the following will further describe the implementation manners of the present utility model in conjunction with the accompanying drawings in detail.

[0023] Please refer to Figures 1-3 , the present utility model provides a composite chip radiator, including a base 1, and a refrigeration sheet 2 is arranged inside the base 1. Among them, the base 1 includes two brackets 101, and insertion pieces 201 are fixedly connected to both sides of the refrigeration sheet 2. Slots corresponding to the insertion pieces 201 are opened on one side of the two brackets 101 close to each other, and the refrigeration sheet 2 is correspondingly inserted into the brackets 101, facilitating the installation and fixation of the refrigeration sheet 2 in the brackets 101.

[0024] A microporous filter screen 3 is arranged at the bottom of the refrigeration sheet 2, the pores of the microporous filter screen 3 are filled with thermal grease 4, and protruding pieces 301 are fixedly connected to the four corners of the microporous filter screen 3. The microporous filter screen 3 is directly attached to the surface of the chip of the radiator to be installed. By applying thermal grease 4, it is convenient to fill the gap between the chip and the refrigeration sheet 2, so that the two are fully attached.

[0025] Both ends of the top of the base 1 are fixedly connected with side frames 5, and heat dissipation fins 6 are fixedly connected through the inside of the side frames 5. There are several heat dissipation fins 6, and a connecting rod 501 is fixedly connected between the two side frames 5. The several heat dissipation fins 6 are evenly distributed in the connecting rod 501, and an air duct 8 is arranged between adjacent two heat dissipation fins 6, facilitating air to pass through the air duct 8 to improve the heat dissipation efficiency.

[0026] A cooling fan 7 is arranged on the top of the cooling fin 6, and the cross section of the side frame 5 is U-shaped. The bottom of the side frame 5 is fixed to the base 1 by bolts, and the top of the side frame 5 is fixed to the cooling fan 7 at four corners by bolts, so that the cooling fin 6 can be installed between the cooling fan 7 and the refrigeration plate 2 to improve the heat dissipation effect.

[0027] When in use, the base 1 is positioned on the top of the chip. Screw holes are provided at both ends of the bracket 101. The bracket 101 can be fixed to the device on which the chip is installed by bolts. The cooling plate 2 and the heat dissipation fan 7 are connected to an external power supply.

[0028] The microporous filter 3 is attached to the top of the chip, and the inside is brushed with silicone grease 4, so that the silicone grease 4 is evenly applied on the outer surface of the chip to fully fill the gap between the cooling plate 2 and the chip.

[0029] If the silicone grease 4 is consumed and needs to be replenished later, the microporous filter 3 can be directly torn off, and the remaining silicone grease 4 can be removed together, which improves the removal speed of the residual silicone grease 4. Even if there is residual silicone grease 4, it is in the form of independent particles corresponding to the mesh of the microporous filter 3, which is convenient for removal and avoids the remaining silicone grease 4 from agglomerating and causing excessive damage to the chip surface during removal.

[0030] The cooling plate 2 is fitted with the microporous filter 3. With the filling and connection of the silicone grease 4, the high temperature on the surface of the chip can be directly transferred to the upper surface of the cooling plate 2, and then contacted and dissipated through the heat dissipation fins 6. The heat dissipation fan 7 is started to increase the air flow rate in the air duct 8, thereby further improving the heat dissipation efficiency of the heat dissipation fins 6, thereby better dissipating the heat of the chip.

[0031] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A composite chip radiator, comprising a base (1), characterized in that, Inside the base (1), a thermoelectric cooler (2) is provided. At the bottom of the thermoelectric cooler (2), a microporous filter (3) is provided. The pores of the microporous filter (3) are filled with silicone grease (4). At both ends of the top of the base (1), side frames (5) are fixedly connected. Inside the side frames (5), heat dissipation fins (6) are fixedly connected through. At the top of the heat dissipation fins (6), a cooling fan (7) is provided.

2. The composite chip radiator according to claim 1, wherein The base (1) includes two brackets (101). On both sides of the thermoelectric cooler (2), insertion pieces (201) are fixedly connected. On one side of the two brackets (101) close to each other, slots corresponding to the insertion pieces (201) are provided, and the thermoelectric cooler (2) is correspondingly inserted into the brackets (101).

3. A composite chip radiator according to claim 1, characterized in that, At four corners of the microporous filter (3), raised pieces (301) are fixedly connected.

4. A composite chip radiator according to claim 1, characterized in that, The cross-section of the side frame (5) is U-shaped. The bottom of the side frame (5) is fixed to the base (1) by bolts, and the four corners of the top of the side frame (5) are fixed to the cooling fan (7) by bolts.

5. A composite chip radiator according to claim 1, characterized in that, A number of heat dissipation fins (6) are provided. A connecting rod (501) is fixedly connected between the two side frames (5). The number of heat dissipation fins (6) are evenly distributed in the connecting rod (501). An air duct (8) is provided between adjacent two heat dissipation fins (6).