Sintered silver film slicing assembly for bonding power chip or power module
Through the design of cut-formed sintered silver diaphragm body, base diaphragm body and release diaphragm body components, the damage problem of large-format sintered silver film when taking small areas is solved, and efficient material utilization and improvement of bonded quality are achieved.
Patent Information
- Application Number
- CN202421603757.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-07-08
AI Technical Summary
In the production process of power chips or power modules, commonly used large-format sintered silver films are easily damaged when taking small areas, resulting in waste of materials and difficult to improve utilization.
The component design includes a sintered silver diaphragm body, a base diaphragm body and a release diaphragm body. The base diaphragm body is bonded to the bottom of the sintered silver diaphragm body, and the release diaphragm body is bonded to the top. It is cut into a large format rectangle to ensure that each diaphragm body can be separated independently, avoid damage, and improve the quality of the diaphragm.
By independently cut sintered silver diaphragm body corresponds to the bonded position, it avoids material waste, ensures bonded quality stability and material utilization, and improves the utilization rate of sintered silver film.
Smart Images
Figure CN223140776U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to raw materials for the production of electronic components, and in particular to a sintered silver film slicing assembly for bonding power chips or power modules. Background Art
[0002] In the production process of power chips or power modules, the bonding operation is an important link for connecting the internal circuit of the chip with external packaging pins or circuit boards, which directly determines the connection quality and reliability between the chip and the external circuit. Sintered silver is a special silver material mainly composed of nano-silver particles. After being processed by low-temperature sintering technology, it has excellent electrical conductivity, thermal conductivity, and bonding strength. Before using sintered silver for bonding operation, it is necessary to clean, degrease, and roughen the connection surfaces of the chip and the substrate, and then cover the prepared sintered silver film on the connection surfaces of the chip or the substrate. Through precise positioning, the accurate alignment between the chip and the substrate is ensured, so that the sintered silver film can cover the entire connection area. The commonly used sintered silver film has a large-area structure. When taking a small-area sintered silver film, it is easy to form breakage around the taking surface, resulting in material waste, and it is difficult to improve the utilization rate of the sintered silver film. Therefore, it is necessary to optimize the structure of this sintered silver film to overcome the above defects. Summary of the Utility Model
[0003] The purpose of the utility model is to provide a sintered silver film slicing assembly for bonding power chips or power modules.
[0004] The technical solution adopted by the utility model to solve its technical problems is as follows:
[0005] A sintered silver film slicing assembly for bonding power chips or power modules, including a sintered silver film sheet body, and further including:
[0006] A base film sheet body, which is adhered to the bottom of the sintered silver film sheet body, and the sintered silver film sheet body can be separated from the base film sheet body;
[0007] A release film sheet body, which is adhered to the top of the sintered silver film sheet body and can be separated from the sintered silver film sheet body.
[0008] In an embodiment of the utility model, the base film sheet body is made of a high-temperature resistant film material to avoid deformation during the process of taking the sintered silver film.
[0009] In an embodiment of the utility model, the sintered silver film sheet body, the base film sheet body, and the release film sheet body are cut and formed from a large-area sintered silver film sheet body, base film sheet body, and release film sheet body.
[0010] In an embodiment of the utility model, the shapes of the sintered silver film sheet body, the base film sheet body, and the release film sheet body are rectangular.
[0011] In one embodiment of the present utility model, the sizes of the sintered silver film sheet body, the base film sheet body, and the release film sheet body are 50 mm × 50 mm.
[0012] In one embodiment of the present utility model, the sizes of the sintered silver film sheet body, the base film sheet body, and the release film sheet body are 100 mm × 100 mm.
[0013] In one embodiment of the present utility model, the dimensional accuracy of the sintered silver film sheet body, the base film sheet body, and the release film sheet body is controlled within ±0.03 mm.
[0014] The advantages of the present utility model are as follows:
[0015] The sintered silver film sheet body, the base film sheet body, and the release film sheet body of the sintered silver film slicing assembly are cut and formed from large-format sintered silver film sheet bodies, base film sheet bodies, and release film sheet bodies. The corresponding sintered silver film slicing assemblies can be prepared according to the number of bonding positions. The sintered silver film sheet body completely corresponds to the bonding positions, and each sintered silver film sheet body is separated from each other. They can be placed in a special packaging box and can be independently and completely taken for use, without the need to take a small area from the large-format sintered silver film, avoiding damage around the taken surface, thereby avoiding waste of sintered silver material. Moreover, the sintered silver obtained at each bonding position is more balanced and stable, which is beneficial to improving the bonding quality. Description of the Drawings
[0016] Figure 1 is a schematic structural diagram of a sintered silver film slicing assembly for bonding power chips or power modules proposed by the present utility model. Detailed Embodiments
[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the present utility model to be protected, but merely represents selected embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0018] Such as Figure 1As shown in the figure, the sintered silver film slicing assembly for bonding power chips or power modules proposed by the present utility model includes a sintered silver film sheet body 100, and further includes a base film sheet body 200 and a release film sheet body 300. The base film sheet body 200 is bonded to the bottom of the sintered silver film sheet body 100, and the sintered silver film sheet body 100 can be separated from the base film sheet body 200. The release film sheet body 300 is bonded to the top of the sintered silver film sheet body 100 and can be separated from the sintered silver film sheet body 100.
[0019] In this embodiment, the base film sheet body 200 is made of a high-temperature resistant film material to avoid deformation during the process of taking the sintered silver film.
[0020] In this embodiment, the sintered silver film sheet body 100, the base film sheet body 200 and the release film sheet body 300 are cut and formed from large-format sintered silver film sheet bodies, base film sheet bodies and release film sheet bodies.
[0021] In this embodiment, the shapes of the sintered silver film sheet body 100, the base film sheet body 200 and the release film sheet body 300 are rectangular.
[0022] In one embodiment, the sizes of the sintered silver film sheet body 100, the base film sheet body 200 and the release film sheet body 300 are 50 mm × 50 mm, and their dimensional accuracy is controlled within ±0.03 mm.
[0023] In another embodiment, the sizes of the sintered silver film sheet body 100, the base film sheet body 200 and the release film sheet body 300 are 100 mm × 100 mm, and their dimensional accuracy is controlled within ±0.03 mm.
[0024] In the description of the present utility model, it should be noted that when terms indicating orientation or positional relationship such as "upper", "lower", "inner", "outer", "left", "right", etc. appear, they should be understood as based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed during use, or the orientation or positional relationship commonly understood by those skilled in the art. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, when terms such as "first", "second", etc. appear, they are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance. In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, terms such as "installation", "setting", "connection", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
Claims
1. A sintered silver film slicing component for power chip or power module bonding, comprising a sintered silver film sheet body, characterized in that, It further includes: A base film sheet, which is adhered to the bottom of the sintered silver film sheet, and the sintered silver film sheet can be separated from the base film sheet; A release film sheet, which is adhered to the top of the sintered silver film sheet and can be separated from the sintered silver film sheet.
2. The sintered silver film slicing assembly for power chip or power module bonding according to claim 1, wherein: The base film sheet is made of a high-temperature resistant film material to avoid deformation during the process of taking the sintered silver film.
3. The sintered silver film slicing assembly for power chip or power module bonding according to claim 1, wherein: The sintered silver film sheet, the base film sheet and the release film sheet are formed by cutting large-format sintered silver film sheets, base film sheets and release film sheets.
4. The sintered silver film slicing assembly for power chip or power module bonding according to claim 1, wherein: The shapes of the sintered silver film sheet, the base film sheet and the release film sheet are rectangular.
5. The sintered silver film slicing assembly for power chip or power module bonding according to claim 1, wherein: The sizes of the sintered silver film sheet, the base film sheet and the release film sheet are 50mm×50mm.
6. The sintered silver film slicing assembly for power chip or power module bonding according to claim 1, wherein: The sizes of the sintered silver film sheet, the base film sheet and the release film sheet are 100mm×100mm.
7. The sintered silver film slicing assembly for power chip or power module bonding according to claim 5 or 6, wherein: The dimensional accuracy of the sintered silver film sheet, the base film sheet and the release film sheet is controlled within ±0.03mm.