Chip mounting device for laser manufacturing

Abstract

The utility model belongs to the field of chip mounting devices, and particularly relates to a chip mounting device for laser manufacturing, which comprises a bottom plate, and a first lifting device, a second lifting device, a first pushing device and a second pushing device are arranged on the bottom plate. The first pushing device is used for pushing a chip to move along a first direction during chip mounting, and the second pushing device is used for pushing the chip to move along a second direction during chip mounting; the first lifting device is used for driving the first pushing device to lift relative to the surface of the bottom plate; the second lifting device is used for driving the second pushing device to lift relative to the surface of the bottom plate; the first pushing device is arranged on the first lifting device, and the second pushing device is arranged on the second lifting device; the first lifting device and the second lifting device are arranged in a staggered mode. The first direction is not parallel to the second direction; the chip mounter is used for solving the problem that an existing chip mounter is narrow in application range.

Description

Technical Field

[0001] The utility model belongs to the field of chip mounters, and more specifically, relates to a chip mounter for laser manufacturing. Background Art

[0002] During the manufacturing process of lasers, it is necessary to perform chip mounting work on optoelectronic chips and optoelectronic devices such as lenses on the lasers to fabricate the optical path of the lasers.

[0003] Existing chip mounters are usually automatic mounters, and generally use vision recognition methods to position the chips for mounting. The main disadvantages are that the equipment is complex, and a series of vision recognition and algorithms need to be combined to position the chips for mounting, resulting in high manufacturing costs, slow chip mounting and machine adjustment speeds, and it is not suitable for chip mounting of small quantities and multiple varieties of samples. Summary of the Utility Model

[0004] The utility model aims to overcome at least one defect of the above-mentioned existing technologies, and provides a chip mounter for laser manufacturing to solve the problem of narrow application range of existing mounters.

[0005] The technical solution adopted by the utility model is as follows:

[0006] A chip mounter for laser manufacturing includes a bottom plate, and a first lifting device, a second lifting device, a first pushing device, and a second pushing device are arranged on the bottom plate;

[0007] The first pushing device is used to push the chip to move along a first direction during chip mounting, and the second pushing device is used to push the chip to move along a second direction during chip mounting;

[0008] The first lifting device is used to drive the first pushing device to perform lifting movement relative to the surface of the bottom plate, and the second lifting device is used to drive the second pushing device to perform lifting movement relative to the surface of the bottom plate;

[0009] The first pushing device is arranged on the first lifting device, and the second pushing device is arranged on the second lifting device; the first lifting device and the second lifting device are arranged in a staggered manner;

[0010] The first direction and the second direction are not parallel.

[0011] Further, the first pushing device includes a first micrometer and a first abutting member, the first micrometer is controlled by the first lifting device to perform lifting movement, and the first abutting member is connected to one end of the first micrometer facing the chip; and / or, the second pushing device includes a second micrometer and a second abutting member, the second micrometer is controlled by the second lifting device to perform lifting movement, and the second abutting member is connected to one end of the second micrometer facing the chip.

[0012] The first driving device consists of a first micrometer and a first abutting component. The first abutting component is arranged on the end face of the first micrometer facing the chip. By rotating the scale of the first micrometer, the first abutting component is driven to advance and retreat in the same direction, completing the movement of the chip. Operate the fine adjustment knob of the first micrometer to adjust the length of the first micrometer. Since the scale of the first micrometer is readable and the minimum scale is small, high-precision chip mounting can be achieved.

[0013] Further, the first abutting component is a first thimble; and / or, the second abutting component is a second thimble.

[0014] Further, the first micrometer is a micrometer with an accuracy of 10 μm, and the second micrometer is a micrometer with an accuracy of 10 μm.

[0015] The accuracy of the first micrometer is 10 μm, and the minimum unit of chip movement is 10 μm, thereby achieving high-precision chip mounting in units of 10 μm and reducing the error of the chip mounting position.

[0016] Further, the first direction is orthogonal to the second direction.

[0017] The first driving device drives the chip to move in the first direction, and the second driving device drives the chip to move in the second direction. Preferably, the bottom plate is a rectangular bottom plate, and when the first direction and the second direction are orthogonal, the included angle formed by the intersection of the first direction and the second direction has the maximum angle, and the area where the chip moves in this region is the largest. The first driving device and the second driving device drive the chip to move on the chip carrier, facilitating chip mounting.

[0018] Further, the first lifting device includes a first lifting platform and a first lifting shaft. The first lifting shaft is vertically arranged on the bottom plate. The first lifting platform is arranged on the first lifting shaft and moves up and down along the first lifting shaft. The first driving device is arranged on the first lifting platform; and / or, the second lifting device includes a second lifting platform and a second lifting shaft. The second lifting shaft is vertically arranged on the bottom plate. The second lifting platform is arranged on the second lifting shaft and moves up and down along the second lifting shaft. The second driving device is arranged on the second lifting platform.

[0019] The first lifting shaft is perpendicular to the bottom plate. The first lifting platform is arranged on the first lifting shaft and moves up and down through the first lifting shaft. The first lifting platform can adjust the appropriate height according to different chip carriers, facilitating the movement of the driving device for the chip; by increasing the height of the first lifting platform, the first micrometer and the first thimble arranged on the first lifting platform can be flush with the edge of the bottom plate, eliminating the error of the scale of the micrometer itself and making the chip mounting more accurate.

[0020] Further, a first control member for controlling the lifting of the first lifting platform is provided on the first lifting platform; and / or, a second control member for controlling the lifting of the second lifting platform is provided on the second lifting platform.

[0021] The first lifting platform moves up and down along the first lifting axis. By means of the first handle provided on the first lifting platform, it is convenient to control the height of the first lifting platform.

[0022] Further, a first fixing device for fixing the first pushing device is provided on the first lifting platform, and a second fixing device for fixing the second pushing device is provided on the second lifting platform.

[0023] The first fixing device fixes the first pushing device on the first lifting platform, preventing the first pushing device from shifting during movement and affecting the accuracy of chip movement.

[0024] Further, the bottom plate is further provided with a limiting device for fixing the chip carrier.

[0025] The limiting device is arranged on the bottom plate and is used to limit the chip carrier, preventing the chip carrier from moving due to the frictional force between the chip and the chip carrier during the chip pasting process, resulting in an error in the pasting position.

[0026] Further, the limiting device is a convex block on the bottom plate, and the convex block is provided with a notch for placing the chip carrier.

[0027] The chip carrier is arranged in the notch, and the notch and the convex block cooperate with each other to play a role in limiting the chip carrier, preventing the chip carrier from moving during the pasting process; preferably, the notch faces the first pushing device and the second pushing device, facilitating the contact between the ejector pin and the chip.

[0028] Further, the bottom surface of the notch is not higher than the upper surface of the bottom plate.

[0029] The bottom surface of the notch is on the same horizontal plane as the upper surface of the bottom plate, or the bottom surface of the notch is lower than the upper surface of the bottom plate, reducing the placement height of the chip carrier and facilitating the pushing device to push the chip on the chip carrier.

[0030] In this solution, the chip carrier is placed on the bottom plate, and the chip is placed on the chip carrier. The chip carrier is set in the angular region formed by the intersection of the first direction and the second direction. The heights of the first pushing device and the second pushing device are adjusted by the first lifting device and the second lifting device, so that the devices can adapt to the chip mounting of chip carriers with different heights. Then, the first pushing device drives the chip to move along the first direction, and the second pushing device drives the chip to move along the second direction. The first direction and the second direction are not parallel. The first pushing device and the second pushing device cooperate to push the chip to move within the angular region formed by the intersection of the first direction and the second direction, and move the chip to the correct position on the chip carrier to complete the chip mounting. Through the first lifting device and the second lifting device, this solution enables the pushing device to perform chip mounting on chip carriers with different heights, has a wide application range, and is suitable for multi-variety chip mounting carriers.

[0031] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0032] 1. The present utility model uses the first and second pushing devices to drive the chip to move to the correct position on the chip carrier, thereby completing chip mounting. When the machine is in use, it does not require long-term machine adjustment, has a high efficiency in switching the types of samples, and is suitable for chip mounting of multiple types.

[0033] 2. The present utility model combines a micrometer and a thimble to push the chip to move, and utilizes the characteristic of the small scale of the micrometer to achieve high-precision chip mounting and reduce the chip mounting position error.

[0034] 3. The present utility model can lift the first and second pushing devices in height, and can adjust the appropriate height according to different chip carriers, and is suitable for chip mounting of multiple types; by combining the micrometer scale with the bottom plate alignment to eliminate errors, the chip mounting accuracy is higher.

[0035] 4. The device of the present utility model has a simple structure, is easy to operate, does not require complex vision recognition and operation algorithms, and has a low manufacturing cost. Description of the Drawings

[0036] Figure 1 It is a schematic structural diagram of the present utility model.

[0037] Figure 2 It is a partial enlarged view of the present utility model.

[0038] Marking description: 1 - bottom plate, 2 - first lifting platform, 3 - first lifting shaft, 4 - first micrometer, 5 - first thimble, 6 - first fixing device, 7 - second lifting platform, 8 - second lifting shaft, 9 - second micrometer, 10 - second thimble, 11 - second fixing device, 12 - convex block, 13 - chip carrier, 14 - chip, 15 - notch, 16 - first handle, 17 - second handle. Detailed Implementation Manner

[0039] The attached drawings of the present utility model are only for illustrative purposes and should not be construed as a limitation to the present utility model. For better illustrating the following embodiments, some components in the attached drawings will be omitted, enlarged or reduced, which do not represent the dimensions of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the attached drawings may be omitted.

[0040] The embodiments of the present application can be applied to the preparation of the optical path in a laser. The above-mentioned lasers include semiconductor lasers, laser amplifiers, narrow linewidth lasers, pulsed laser amplifiers, etc.

[0041] As Figure 1 shown, the present utility model provides a chip pasting device for laser manufacturing, including a bottom plate, on which a chip carrier 13, a first lifting device, a second lifting device, a first pushing device, and a second pushing device are provided;

[0042] The first pushing device is used to push the chip to move along a first direction during pasting, and the second pushing device is used to push the chip to move along a second direction during pasting;

[0043] The first lifting device is used to drive the first pushing device to move up and down relative to the surface of the bottom plate, and the second lifting device is used to drive the second pushing device to move up and down relative to the surface of the bottom plate;

[0044] The first pushing device is arranged on the first lifting device, and the second pushing device is arranged on the second lifting device; the first lifting device and the second lifting device are arranged in a staggered manner;

[0045] The first direction is not parallel to the second direction.

[0046] During operation, the chip carrier 13 is placed on the bottom plate 1, and the chip 14 is placed on the chip carrier 13. The chip carrier 13 is arranged in the angular area formed by the intersection of the first direction and the second direction. The heights of the first pushing device and the second pushing device are adjusted through the first lifting device and the second lifting device, so that the device can adapt to the pasting of chip carriers with different heights. Then, the first pushing device drives the chip 14 to move along the first direction, and the second pushing device drives the chip 14 to move along the second direction. The first direction is not parallel to the second direction. The first pushing device and the second pushing device cooperate to push the chip 14 to move within the angular area formed by the intersection of the first direction and the second direction, and move the chip 14 to the correct position on the chip carrier 13 to complete the pasting. Through the first lifting device and the second lifting device in this solution, the pushing device can paste chip carriers with different heights, with a wide application range and suitable for pasting of multiple varieties.

[0047] In specific implementation, the chip carrier 13 can be set as an optoelectronic device such as a lens on a laser.

[0048] In this embodiment, the bottom plate 1 is a rectangular bottom plate.

[0049] Reference Figure 1 , the first pushing device includes a first micrometer 4 and a first abutting member. The first micrometer 4 is controlled by the first lifting device to move up and down, and the first abutting member is connected to one end of the first micrometer 4 facing the chip 14; and / or, the second pushing device includes a second micrometer 9 and a second abutting member. The second micrometer 9 is controlled by the second lifting device to move up and down, and the second abutting member is connected to one end of the second micrometer 9 facing the chip 14.

[0050] In specific implementation, the first abutting member is set as a first thimble 5; and / or, the second abutting member is set as a second thimble 10.

[0051] The first pushing device is composed of a first micrometer 4 and a first thimble 5. The first thimble 5 is arranged on the end face of one end of the first micrometer 4. By rotating the scale of the first micrometer 4, the first thimble 5 is driven to move forward and backward in the same direction to complete the movement of the chip 14. Rotate the fine adjustment knob of the first micrometer 4 to adjust the length of the first micrometer 4. Since the scale of the micrometer 4 is readable and the minimum scale is small, high-precision chip mounting can be achieved.

[0052] In specific implementation, the first micrometer 4 is a micrometer with an accuracy of 10 μm, and the second micrometer 9 is a micrometer with an accuracy of 10 μm.

[0053] The accuracy of the first micrometer 4 is 10 μm, and the minimum unit of movement of the chip 14 is 10 μm, so as to achieve high-precision chip mounting with an accuracy of 10 μm and reduce the chip mounting position error.

[0054] In specific implementation, the first direction is orthogonal to the second direction.

[0055] The first pushing device pushes the chip 14 to move in the first direction, and the second pushing device pushes the chip 14 to move in the second direction. When the first direction and the second direction are orthogonal, the included angle formed by the intersection of the first direction and the second direction has the maximum angle, and the area where the chip 14 moves within this region is the largest. The first pushing device and the second pushing device push the chip 14 to move on the chip carrier 13, which is convenient for chip mounting.

[0056] Reference Figure 1, the first lifting device includes a first lifting platform 2 and a first lifting shaft 3. The first lifting shaft 3 is vertically arranged on the bottom plate 1, and the first lifting platform 2 is arranged on the first lifting shaft 3 and moves up and down along the first lifting shaft 3. The first pushing device is arranged on the first lifting platform 2; the second lifting device includes a second lifting platform 7 and a second lifting shaft 8. The second lifting shaft 8 is vertically arranged on the bottom plate 1, and the second lifting platform 7 is arranged on the second lifting shaft 8 and moves up and down along the second lifting shaft 8. The second pushing device is arranged on the second lifting platform 7.

[0057] In this embodiment, the first lifting shaft 3 is perpendicular to the bottom plate 1. The first lifting platform 2 is arranged on the first lifting shaft 3 and moves up and down through the first lifting shaft 3. The first lifting platform 2 can adjust the appropriate height according to different chip carriers 13, which is convenient for the first pushing device to move the chip 14; by increasing the height of the first lifting platform 2, the first micrometer 4 and the first ejector pin 5 arranged on the first lifting platform 2 can be flush with the edge of the bottom plate 1, eliminating the error of the scale of the first micrometer 4 itself and making the chip mounting more accurate.

[0058] During specific implementation, a first control member for controlling the lifting of the first lifting platform 2 is provided on the first lifting platform 2; and / or, a second control member for controlling the lifting of the second lifting platform 7 is provided on the second lifting platform 7.

[0059] In this embodiment, the first control member is set as the first handle 16, and the second control member is set as the second handle 17. The first lifting platform 2 moves up and down along the first lifting shaft 3. During operation, hold the first handle 16 arranged on the first lifting platform 2 and apply force to lift or lower the height of the first lifting platform 2, thereby completing the adjustment of the height of the first lifting platform 2. Through the first handle 16 arranged on the first lifting platform 2, it is convenient to control the height of the first lifting platform 2.

[0060] Preferably, in order to prevent the first micrometer 4 from shifting during the lifting process, a first fixing device 6 for fixing the first pushing device is arranged on the first lifting platform 2, and a second fixing device 11 for fixing the second pushing device is arranged on the second lifting platform 7.

[0061] The first fixing device 6 fixes the first pushing device on the lifting platform 2, preventing the first pushing device from shifting during the movement and affecting the accuracy of chip 14 mounting.

[0062] During specific implementation, the bottom plate 1 is further provided with a limiting device for fixing the chip carrier 13.

[0063] The limiting device is arranged on the bottom plate 1 and is used to limit the chip carrier 13, so as to prevent the chip carrier 13 from moving due to the frictional force between the chip 14 and the chip carrier 13 during the chip 14 pasting process, resulting in an error in the pasting position. In this embodiment, the limiting device is arranged at a corner of the rectangular bottom plate 1.

[0064] As Figure 2 shown, the limiting device is a bump 12 on the bottom plate 1, and a notch 15 for placing the chip carrier 13 is provided on the bump 12.

[0065] The chip carrier 13 is arranged in the notch 15, and the mutual cooperation between the notch 15 and the bump 12 plays a role in limiting the chip carrier 13 to prevent the chip carrier 13 from moving during the pasting process; preferably, the notch 15 faces the first pushing device and the second pushing device, facilitating the contact between the ejector pin 5 and the chip 13.

[0066] In this embodiment, the notch 15 is a rectangular notch.

[0067] Preferably, the bottom surface of the notch 15 is not higher than the upper surface of the bottom plate 1.

[0068] During specific implementation, the bottom surface of the notch 15 and the upper surface of the bottom plate 1 are on the same horizontal plane, or the bottom surface of the notch 15 is lower than the upper surface of the bottom plate 1, reducing the height of placing the chip carrier 13 and facilitating the pushing device to push the chip 14 on the chip carrier 13.

[0069] Obviously, the above embodiments of the present invention are only examples for clearly explaining the technical solutions of the present invention, rather than limitations on the specific implementation manners of the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the claims of the present invention shall be included within the protection scope of the claims of the present invention.

Claims

1. A chip pasting device for laser manufacturing, characterized in that, It includes a bottom plate, on which a first lifting device, a second lifting device, a first pushing device, and a second pushing device are provided; The first pushing device is used to push the chip to move in the first direction during chip placement, and the second pushing device is used to push the chip to move in the second direction during chip placement; The first lifting device is used to drive the first pushing device to move up and down relative to the surface of the bottom plate, and the second lifting device is used to drive the second pushing device to move up and down relative to the surface of the bottom plate; The first pushing device is arranged on the first lifting device, and the second pushing device is arranged on the second lifting device; the first lifting device and the second lifting device are arranged in a staggered manner; The first direction is not parallel to the second direction.

2. The chip sticking device for laser manufacturing according to claim 1, wherein The first pushing device includes a first micrometer and a first abutting member. The first micrometer is controlled by the first lifting device to move up and down, and the first abutting member is connected to the end of the first micrometer facing the chip; the second pushing device includes a second micrometer and a second abutting member. The second micrometer is controlled by the second lifting device to move up and down, and the second abutting member is connected to the end of the second micrometer facing the chip.

3. The chip pasting device for laser manufacturing according to claim 2, wherein The first abutting member is a first thimble; and / or the second abutting member is a second thimble.

4. A chip pasting device for laser manufacturing according to claim 2, characterized in that The first micrometer is a micrometer with an accuracy of 10um, and the second micrometer is a micrometer with an accuracy of 10um.

5. A chip sticking device for laser manufacturing according to claim 1, wherein, The first direction is orthogonal to the second direction.

6. A chip pasting device for laser manufacturing according to any one of claims 1-5, characterized in that, The first lifting device includes a first lifting platform and a first lifting shaft. The first lifting shaft is vertically arranged on the bottom plate, the first lifting platform is arranged on the first lifting shaft and moves up and down along the first lifting shaft, and the first pushing device is arranged on the first lifting platform; and / or the second lifting device includes a second lifting platform and a second lifting shaft. The second lifting shaft is vertically arranged on the bottom plate, the second lifting platform is arranged on the second lifting shaft and moves up and down along the second lifting shaft, and the second pushing device is arranged on the second lifting platform.

7. The chip pasting device for laser manufacturing according to claim 6, characterized in that, A first control member for controlling the lifting of the first lifting platform is provided on the first lifting platform; and / or a second control member for controlling the lifting of the second lifting platform is provided on the second lifting platform.

8. The chip sticking device for laser manufacturing according to claim 6, wherein A first fixing device for fixing the first pushing device is arranged on the first lifting platform, and a second fixing device for fixing the second pushing device is arranged on the second lifting platform.

9. A chip bonding device for laser manufacturing according to any one of claims 1-5, characterized in that, The bottom plate is further provided with a chip carrier and a limiting device for fixing the chip carrier.

10. A chip pasting device for laser manufacturing according to claim 9, characterized in that, The limiting device is a bump on the bottom plate. The bump is provided with a notch for placing the chip carrier, and the bottom surface of the notch is not higher than the upper surface of the bottom plate.

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