Miniaturized structure of high-power attenuator

By dividing the PCB circuit board of the high-power attenuator into two parts and connecting it with the back bend section, the problem of the attenuator being too long is solved, and the attenuator is miniaturized and easy to install.

CN223141888UActive Publication Date: 2025-07-22SICHUAN TYT TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422365313.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-27
Publication Date
2025-07-22
Estimated Expiration
2034-09-27

AI Technical Summary

Technical Problem

The high-power attenuator is too long, resulting in limited installation and use.

Method used

The PCB circuit board arranged in a straight line is divided into a first linear PCB circuit board and a second linear PCB circuit board, and is connected through a back bend section PCB circuit board to connect the attenuation chip in series to shorten the layout length.

Benefits of technology

It realizes the miniaturization of high-power attenuators, which are easy to install and use.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223141888U_ABST
    Figure CN223141888U_ABST
Patent Text Reader

Abstract

The utility model discloses a large power attenuator miniaturization structure, comprising a first linear PCB circuit board, a second linear PCB circuit board, a back bending segment PCB circuit board and an attenuation chip, the first linear PCB circuit board and the second linear PCB circuit board are arranged side by side, one end of the back bending segment PCB circuit board is electrically connected with one end of the first linear PCB circuit board, and the other end of the back bending segment PCB circuit board is electrically connected with the attenuation chip. The other end of the back bending section PCB is electrically connected with one end of the second linear PCB; and the plurality of attenuation chips are arranged on the first linear PCB, the second linear PCB or the back bending section PCB in series. According to the high-power attenuator, the PCBs which are arranged in a straight line are divided into the first linear PCB and the second linear PCB, and then the first linear PCB and the second linear PCB are connected through the back-bending section PCB, so that the arrangement length of the PCBs can be shortened, miniaturization of the high-power attenuator is achieved, and installation and use of the attenuator are facilitated.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of high-power attenuators, and particularly relates to a miniaturized structure of a high-power attenuator. Background Art

[0002] An attenuator is an electronic component that provides attenuation and is widely used in electronic devices. Its main uses are: (1) adjusting the magnitude of signals in a circuit; (2) in a comparative measurement circuit, it can be used to directly read the attenuation value of the measured network; (3) improving impedance matching. If some circuits require a relatively stable load impedance, an attenuator can be inserted between this circuit and the actual load impedance to buffer the change in impedance. For the design of high-power attenuators, generally, multiple attenuation chips are used to form an attenuation chip group to achieve high-power attenuation step by step. However, with the increase in the number of attenuation chips, the length of the carrier of the attenuation chips, that is, the attenuator cavity, will become longer, thus restricting the installation and use of the attenuator. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a miniaturized structure of a high-power attenuator, solve the problem of the excessive length of the high-power attenuator, effectively realize the miniaturization of the high-power attenuator, and thus facilitate the installation and use of the attenuator.

[0004] The utility model is realized through the following technical solutions:

[0005] A miniaturized structure of a high-power attenuator includes a first straight PCB circuit board, a second straight PCB circuit board, a bent-section PCB circuit board, and attenuation chips. The first straight PCB circuit board and the second straight PCB circuit board are arranged side by side. One end of the bent-section PCB circuit board is electrically connected to one end of the first straight PCB circuit board, and the other end of the bent-section PCB circuit board is electrically connected to one end of the second straight PCB circuit board; several of the attenuation chips are connected in series on the first straight PCB circuit board, the second straight PCB circuit board, or the bent-section PCB circuit board. To solve the above technical problems and achieve the corresponding technical effects, the utility model divides a straight-line PCB circuit board into a first straight PCB circuit board and a second straight PCB circuit board, and then uses the bent-section PCB circuit board to connect the two, so as to be able to shorten the layout length of the PCB circuit board, and further realize the miniaturization of the high-power attenuator, thus facilitating the installation and use of the attenuator.

[0006] Further technical solution:

[0007] Both ends of the bent-section PCB circuit board are provided with bent connecting parts, and the bent connecting parts are used to connect the first straight PCB circuit board or the second straight PCB circuit board.

[0008] Further: One end of the first straight PCB circuit board is provided with a connecting part a, and the connecting part a is connected to the bent connecting part at one end of the bent section PCB circuit board, and each circuit on the first straight PCB circuit board and the bent section PCB circuit board is correspondingly electrically connected.

[0009] Further: The bent connecting part at one end of the bent section PCB circuit board is provided with an inclined cut angle, and the connecting part a at one end of the first straight PCB circuit board is also provided with an inclined cut angle. When the inclined cut angles of the bent connecting part and the connecting part a are mutually fitted, each circuit on the first straight PCB circuit board and the bent section PCB circuit board is correspondingly electrically connected.

[0010] Further: One end of the second straight PCB circuit board is provided with a connecting part b, and the connecting part b is connected to the bent connecting part at the other end of the bent section PCB circuit board, and each circuit on the second straight PCB circuit board and the bent section PCB circuit board is correspondingly electrically connected.

[0011] Further: The bent connecting part at the other end of the bent section PCB circuit board is provided with an inclined cut angle, and the connecting part b at one end of the second straight PCB circuit board is also provided with an inclined cut angle. When the inclined cut angles of the bent connecting part and the connecting part b are mutually fitted, each circuit on the second straight PCB circuit board and the bent section PCB circuit board is correspondingly electrically connected.

[0012] Further: The cutting angle of the inclined cut angle is 45°.

[0013] Further: The other end of the first straight PCB circuit board is provided with an input port, and the input port is used for electrically connecting with an external device;

[0014] Further: The other end of the second straight PCB circuit board is provided with an output port, and the output port is used for electrically connecting with an external device.

[0015] Further: It further includes a heat dissipation plate, and the heat dissipation plate is provided on the first straight PCB circuit board, the second straight PCB circuit board and the bent section PCB circuit board.

[0016] Further: The heat dissipation plate is a flat plate structure made of aluminum material, and a plurality of heat dissipation openings are provided on the heat dissipation plate.

[0017] Compared with the prior art, the utility model has the following advantages and beneficial effects:

[0018] 1. The miniaturized structure of a high-power attenuator according to the present utility model divides a PCB circuit board arranged in a straight line into a first straight PCB circuit board and a second straight PCB circuit board, and then uses a bent-section PCB circuit board to connect the two, thereby being able to shorten the layout length of the PCB circuit board, and further realizing the miniaturization of the high-power attenuator, thus facilitating the installation and use of the attenuator. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings. In the drawings:

[0020] Figure 1 is a schematic structural diagram of the present utility model;

[0021] Figure 2 is a schematic structural diagram of the bent-section PCB circuit board;

[0022] Figure 3 is a schematic structural diagram of the first straight PCB circuit board;

[0023] Figure 4 is a schematic structural diagram of the second straight PCB circuit board;

[0024] Figure 5 is a schematic structural diagram of the heat dissipation plate.

[0025] Marks in the drawings and corresponding component names:

[0026] 1 - First straight PCB circuit board, 2 - Second straight PCB circuit board, 3 - Bent-section PCB circuit board, 4 - Attenuation chip, 5 - Heat dissipation plate, 11 - Connection part a, 12 - Input port, 21 - Connection part b, 22 - Output port, 31 - Bent connection part, 51 - Heat dissipation opening. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] To make the objectives, technical solutions, and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with the embodiments and the drawings. The illustrative embodiments of the present utility model and their descriptions are only used to explain the present utility model and do not limit the present utility model.

[0028] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. However, it will be apparent to those of ordinary skill in the art that: the present utility model may be practiced without these specific details. In other embodiments, well-known structures, circuits, materials, or methods have not been specifically described in order to avoid obscuring the present utility model.

[0029] Throughout the specification, references to "one embodiment", "an embodiment", "an example", or "an example" mean that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment of the present utility model. Thus, the phrases "one embodiment", "an embodiment", "an example", or "an example" appearing throughout the specification are not necessarily all referring to the same embodiment or example. Additionally, the specific features, structures, or characteristics may be combined in any suitable combination and / or sub-combination in one or more embodiments or examples. Moreover, those of ordinary skill in the art should understand that the diagrams provided herein are for illustrative purposes only and are not necessarily drawn to scale. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0030] In the description of the present utility model, the orientation or positional relationship indicated by the terms "front", "rear", "left", "right", "upper", "lower", "vertical", "horizontal", "high", "low", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present utility model.

[0031] Embodiment:

[0032] Such as Figures 1 to 5As shown in the figure, a miniaturized structure of a high-power attenuator of the present utility model includes a first straight PCB circuit board 1, a second straight PCB circuit board 2, a bent section PCB circuit board 3, and an attenuation chip 4. The first straight PCB circuit board 1 and the second straight PCB circuit board 2 are arranged side by side. One end of the bent section PCB circuit board 3 is electrically connected to one end of the first straight PCB circuit board 1, and the other end of the bent section PCB circuit board 3 is electrically connected to one end of the second straight PCB circuit board 2. A plurality of the attenuation chips 4 are connected in series on the first straight PCB circuit board 1, the second straight PCB circuit board 2, or the bent section PCB circuit board 3. In this embodiment, the first straight PCB circuit board 1 and the second straight PCB circuit board 2 are arranged in parallel at intervals, and then the connection between the two is realized by using the bent section PCB circuit board 3, so that the layout length of the PCB circuit board in the attenuator can be effectively shortened (the layout length in the length direction, not the actual length of the PCB circuit board), and thus the miniaturization of the high-power attenuator can be realized, which is convenient for the installation and use of the attenuator.

[0033] Specifically, bending connection parts 31 are provided at both ends of the bent-section PCB circuit board 3, and the bending connection parts 31 are used to connect the first straight PCB circuit board 1 or the second straight PCB circuit board 2. Further, a connection part a11 is provided at one end of the first straight PCB circuit board 1, and the connection part a11 is connected to the bending connection part 31 at one end of the bent-section PCB circuit board 3, and each circuit on the first straight PCB circuit board 1 and the bent-section PCB circuit board 3 is correspondingly electrically connected. An oblique cut angle is formed at the bending connection part 31 at one end of the bent-section PCB circuit board 3, and an oblique cut angle is also formed at the connection part a11 at one end of the first straight PCB circuit board 1. When the oblique cut angle of the bending connection part 31 fits with the oblique cut angle of the connection part a11, each circuit on the first straight PCB circuit board 1 and the bent-section PCB circuit board 3 is correspondingly electrically connected. Similarly, the connection structure between the second straight PCB circuit board 2 and the bent-section PCB circuit board 3 is as follows. A connection part b21 is provided at one end of the second straight PCB circuit board 2, and the connection part b21 is connected to the bending connection part 31 at the other end of the bent-section PCB circuit board 3, and each circuit on the second straight PCB circuit board 2 and the bent-section PCB circuit board 3 is correspondingly electrically connected. An oblique cut angle is formed at the bending connection part 31 at the other end of the bent-section PCB circuit board 3, and an oblique cut angle is also formed at the connection part b21 at one end of the second straight PCB circuit board 2. When the oblique cut angle of the bending connection part 31 fits with the oblique cut angle of the connection part b21, each circuit on the second straight PCB circuit board 2 and the bent-section PCB circuit board 3 is correspondingly electrically connected. In this embodiment, the cutting angle of the oblique cut angle is 45°. Selecting a cutting angle of 45° can facilitate the connection of the circuit boards and ensure that the corresponding circuits can be electrically connected after the circuit boards are connected.

[0034] An input port 12 is provided at the other end of the first straight PCB circuit board 1, and the input port 12 is used for electrically connecting with an external device; an output port 22 is provided at the other end of the second straight PCB circuit board 2, and the output port 22 is used for electrically connecting with an external device. In this embodiment, the input port 12 and the output port 22 are mainly provided to achieve the connection effect between the attenuator and the external device.

[0035] In this embodiment, a heat dissipation plate 5 is further provided to better achieve the heat dissipation of the attenuator. The heat dissipation plate 5 is provided on the first straight PCB circuit board 1, the second straight PCB circuit board 2, and the bent-section PCB circuit board 3. Further, the heat dissipation plate 5 is a flat plate structure made of aluminum, and a plurality of heat dissipation openings 51 are formed on the heat dissipation plate 5.

[0036] The specific embodiments described above further elaborate on the object, technical solution, and beneficial effects of the present utility model. It should be understood that the above description is only for the specific embodiments of the present utility model and is not used to limit the protection scope of the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A miniaturized structure of a high-power attenuator, characterized in that, It includes a first straight PCB circuit board (1), a second straight PCB circuit board (2), a bent section PCB circuit board (3), and an attenuation chip (4). The first straight PCB circuit board (1) and the second straight PCB circuit board (2) are arranged side by side. One end of the bent section PCB circuit board (3) is electrically connected to one end of the first straight PCB circuit board (1), and the other end of the bent section PCB circuit board (3) is electrically connected to one end of the second straight PCB circuit board (2). A number of the attenuation chips (4) are connected in series on the first straight PCB circuit board (1), the second straight PCB circuit board (2), or the bent section PCB circuit board (3).

2. The miniaturized structure of a high-power attenuator according to claim 1, characterized in that, Both ends of the bent section PCB circuit board (3) are provided with bent connection parts (31), and the bent connection parts (31) are used to connect the first straight PCB circuit board (1) or the second straight PCB circuit board (2).

3. A miniaturized structure of a high-power attenuator according to claim 2, characterized in that, One end of the first straight PCB circuit board (1) is provided with a connection part a (11). The connection part a (11) is connected to the bent connection part (31) at one end of the bent section PCB circuit board (3), and each circuit on the first straight PCB circuit board (1) and the bent section PCB circuit board (3) is correspondingly electrically connected.

4. A miniaturized structure of a high-power attenuator according to claim 3, characterized in that The bent connection part (31) at one end of the bent section PCB circuit board (3) is provided with an oblique cut angle. The connection part a (11) at one end of the first straight PCB circuit board (1) is also provided with an oblique cut angle. When the oblique cut angles of the bent connection part (31) and the connection part a (11) are mutually attached, each circuit on the first straight PCB circuit board (1) and the bent section PCB circuit board (3) is correspondingly electrically connected.

5. The miniaturized structure of a high-power attenuator according to claim 2, characterized in that One end of the second straight PCB circuit board (2) is provided with a connection part b (21). The connection part b (21) is connected to the bent connection part (31) at the other end of the bent section PCB circuit board (3), and each circuit on the second straight PCB circuit board (2) and the bent section PCB circuit board (3) is correspondingly electrically connected.

6. The miniaturized structure of a high-power attenuator according to claim 5, characterized in that, The bent connection part (31) at the other end of the bent section PCB circuit board (3) is provided with an oblique cut angle. The connection part b (21) at one end of the second straight PCB circuit board (2) is also provided with an oblique cut angle. When the oblique cut angles of the bent connection part (31) and the connection part b (21) are mutually attached, each circuit on the second straight PCB circuit board (2) and the bent section PCB circuit board (3) is correspondingly electrically connected.

7. A miniaturized structure of a high-power attenuator according to any one of claims 4 or 6, characterized in that The cutting angle of the oblique cut angle is 45°.

8. A miniaturized structure of a high-power attenuator according to claim 1, characterized in that The other end of the first straight PCB circuit board (1) is provided with an input port (12), and the input port (12) is used for electrically connecting with an external device. The other end of the second straight PCB circuit board (2) is provided with an output port (22), and the output port (22) is used for electrically connecting with an external device.

9. A miniaturized structure of a high-power attenuator according to claim 1, characterized in that, It further includes a heat dissipation plate (5), and the heat dissipation plate (5) is provided on the first straight PCB circuit board (1), the second straight PCB circuit board (2), and the bent section PCB circuit board (3).

10. A miniaturized structure of a high-power attenuator according to claim 9, characterized in that, The heat dissipation plate (5) is a flat plate structure made of aluminum, and a plurality of heat dissipation openings (51) are formed in the heat dissipation plate (5).