Circuit board assembly and electronic equipment

Abstract

The utility model discloses a circuit board assembly and electronic equipment. The circuit board assembly comprises a circuit board body, the circuit board body comprises a plurality of wiring layers and a plurality of insulating medium layers, the plurality of wiring layers are stacked, and one insulating medium layer is arranged between any two adjacent wiring layers; in the plurality of wiring layers, the two wiring layers on the outermost side are respectively marked as a first wiring layer and a second wiring layer; the circuit board body is provided with a conductive hole group, the conductive hole group extends from one of the first wiring layer and the second wiring layer to the other one, and the conductive hole group and the other one of the first wiring layer and the second wiring layer are arranged at an interval; the conductive hole group comprises a plurality of conductive hole chains, the plurality of conductive hole chains are arranged along the direction from the middle part of the wiring layer to the outer edge of the wiring layer, any two adjacent conductive hole chains are electrically connected, and each conductive hole chain comprises a plurality of conductive blind holes; in the conductive hole chain, a plurality of conductive blind holes are stacked, and any two adjacent conductive blind holes in different layers are electrically connected.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to a circuit board assembly and an electronic device. Background Art

[0002] In the related art, a mobile phone includes a circuit board, and the circuit board is a multi-layer structure. The circuit board is connected between layers or across layers through lines and single conductive holes (such as buried holes or blind holes). This setting results in a long signal transmission path, a small network cross-sectional area, a large network DC resistance value, and low power supply efficiency of the power supply network. Summary of the Utility Model

[0003] This application aims to provide a circuit board assembly and an electronic device, and solves one of the problems of long signal transmission path, small network cross-sectional area, large network DC resistance value, and low power supply efficiency of the power supply network in the related art.

[0004] To solve the above technical problems, this application is implemented as follows:

[0005] In a first aspect, an embodiment of this application provides a circuit board assembly, including: a circuit board body, the circuit board body includes a plurality of wiring layers and a plurality of insulating dielectric layers, the plurality of wiring layers are stacked, and an insulating dielectric layer is provided between any two adjacent wiring layers; among the plurality of wiring layers, the two outermost wiring layers are respectively denoted as a first wiring layer and a second wiring layer; the circuit board body is provided with a conductive hole group, the conductive hole group extends from one of the first wiring layer and the second wiring layer to the other, and the conductive hole group is arranged at an interval from the other of the first wiring layer and the second wiring layer; the conductive hole group includes a plurality of conductive hole chains, the plurality of conductive hole chains are arranged in a direction from the middle of the wiring layer to the outer edge of the wiring layer, and any two adjacent conductive hole chains are electrically connected, each conductive hole chain includes a plurality of conductive blind holes; in the conductive hole chain, the plurality of conductive blind holes are stacked, each conductive blind hole penetrates an insulating dielectric layer, and any two adjacent and different-layer conductive blind holes are electrically connected.

[0006] In a second aspect, an embodiment of this application provides an electronic device, including: a power supply; and the circuit board assembly as in the first aspect, the circuit board assembly is electrically connected to the power supply.

[0007] In the embodiment of this application, the circuit board assembly includes a circuit board body.

[0008] The circuit board body includes a plurality of wiring layers and a plurality of insulating dielectric layers. The plurality of wiring layers are arranged at intervals in the thickness direction of the circuit board body, and an insulating dielectric layer is provided between any two adjacent wiring layers.

[0009] Among them, among the plurality of wiring layers, the two outermost wiring layers are respectively denoted as a first wiring layer and a second wiring layer.

[0010] The circuit board body is provided with a conductive hole group, the conductive hole group includes a plurality of conductive hole chains, and each conductive hole chain includes a plurality of conductive blind holes. The plurality of conductive hole chains are arranged in a direction from the middle of the wiring layer to the outer edge of the wiring layer, and any two adjacent conductive hole chains are electrically connected. Along the thickness direction of the circuit board body, the plurality of conductive blind holes in each conductive hole chain are stacked, each conductive blind hole penetrates an insulating dielectric layer, and any two adjacent and different-layer conductive blind holes are electrically connected.

[0011] It can be understood that the conductive hole group includes a plurality of conductive blind holes, and the plurality of conductive blind holes are arranged in an array.

[0012] Among them, the conductive hole group extends from one of the first wiring layer and the second wiring layer to the other, and the conductive hole group is arranged at an interval from the other of the first wiring layer and the second wiring layer. That is, the conductive hole group extends from the first wiring layer to the second wiring layer, and the conductive hole group is arranged at an interval from the second wiring layer. Or, the conductive hole group extends from the second wiring layer to the first wiring layer, and the conductive hole group is arranged at an interval from the first wiring layer.

[0013] In this application, the conductive hole group is used to directly penetrate for wiring, and the conductive hole group is used for series conduction in the vertical direction and / or the horizontal direction. Specifically, the plurality of conductive blind holes of the conductive hole group are serially conducted in the horizontal direction, and the plurality of conductive blind holes of the conductive hole group are stacked and serially conducted in the vertical direction to form a conduction network, and the conductive hole groups in the vertical direction and the horizontal direction are formed into a network for transmission, reducing the conductor transmission path and increasing the conductor cross-sectional area.

[0014] Compared with the related art, the wiring shuttles back and forth through holes and wires between multiple wiring layers of the circuit board for connection and transmission, reducing the network DC resistance value and power consumption, changing the multi-layer transmission into a single-layer transmission (for example, the single-layer transmission is along the thickness direction of the circuit board body), and changing the three-layer or even multi-layer hole-wire transmission path into a single-layer large-area conduction transmission. In this way, the transmission path is simplified, the conductor area is increased, the resistance is reduced, the power supply efficiency of the power supply of the electronic device can be improved, which is beneficial to reducing the power consumption of the product, so as to achieve the purpose of saving electricity.

[0015] In addition, the structural setting of the conductive hole group changes the signal transmission from horizontal and cross-layer transmission to overall transmission in the vertical direction (that is, the thickness direction of the circuit board body), and the conductor cross-section increases, which is beneficial to improving the heat dissipation performance of the chip power supply of the electronic device.

[0016] Some of the additional aspects and advantages of this application will be given in the following description, some will become obvious from the following description, or will be understood through the practice of this application. Description of the Drawings

[0017] The above and / or additional aspects and advantages of this application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0018] Figure 1 is a schematic structural diagram of a circuit board assembly according to the first embodiment of the present application;

[0019] Figure 2 is a partial schematic structural diagram of a circuit board assembly according to the first embodiment of the present application;

[0020] Figure 3 is a partial schematic structural diagram of a circuit board assembly according to the second embodiment of the present application;

[0021] Figure 4 is a schematic structural diagram of a circuit board assembly according to the second embodiment of the present application;

[0022] Figure 5 is a partial schematic structural diagram of a circuit board assembly according to the third embodiment of the present application.

[0023] Reference numerals:

[0024] Figures 1 to 5 The corresponding relationship between the reference numerals and the component names in is as follows:

[0025] 1 Circuit board assembly, 10 Circuit board body, 100 Trace layer, 100a First trace layer, 100b Second trace layer, 200 Insulating dielectric layer, 300 Conductive via group, 300a First conductive via group, 300b Second conductive via group, 310 Conductive via chain, 312 Conductive blind via, 3122 Blind via, 3124 Conductive part, 400 Connection via group, 410 First through hole, 500 Second through hole, 60 Power device, 70 Heat conducting layer, 80 First signal transmission area, 90 Second signal transmission area. Detailed description of the embodiments

[0026] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present application and should not be construed as limiting the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.

[0027] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, "a plurality of" means two or more. In addition, "and / or" in the description and claims indicates at least one of the connected objects. The character " / " generally indicates an "or" relationship between the associated objects before and after.

[0028] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0029] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0030] The following will describe the circuit board assembly 1 and the electronic device provided by the embodiments of the present application in conjunction with the attached Figures 1 to 5 drawings.

[0031] As Figure 1 shown in Figure 2 and Figure 3 and Figure 4 and Figure 5 According to some embodiments of the present application, the circuit board assembly 1 includes: a circuit board body 10, the circuit board body 10 includes a plurality of wiring layers 100 and a plurality of insulating dielectric layers 200, the plurality of wiring layers 100 are stacked, and an insulating dielectric layer 200 is provided between any two adjacent wiring layers 100; among the plurality of wiring layers 100, the two outermost wiring layers 100 are respectively denoted as a first wiring layer 100a and a second wiring layer 100b; the circuit board body 10 is provided with a conductive hole group 300, the conductive hole group 300 extends from one of the first wiring layer 100a and the second wiring layer 100b to the other, and the conductive hole group 300 is arranged at intervals from the other of the first wiring layer 100a and the second wiring layer 100b; the conductive hole group 300 includes a plurality of conductive hole chains 310, the plurality of conductive hole chains 310 are arranged in the direction from the middle of the wiring layer 100 to the outer edge of the wiring layer 100, and any two adjacent conductive hole chains 310 are electrically connected, each conductive hole chain 310 includes a plurality of conductive blind holes 312; in the conductive hole chain 310, the plurality of conductive blind holes 312 are stacked, each conductive blind hole 312 penetrates through an insulating dielectric layer 200, and any two adjacent and different-layer conductive blind holes 312 are electrically connected.

[0032] In the embodiment of the present application, the circuit board assembly 1 includes a circuit board body 10.

[0033] The circuit board body 10 includes a plurality of wiring layers 100 and a plurality of insulating dielectric layers 200. The plurality of wiring layers 100 are arranged at intervals in the thickness direction of the circuit board body 10, and an insulating dielectric layer 200 is provided between any two adjacent wiring layers 100.

[0034] Among them, among the plurality of wiring layers 100, the two outermost wiring layers 100 are respectively denoted as the first wiring layer 100a and the second wiring layer 100b.

[0035] The circuit board body 10 is provided with a conductive hole group 300. The conductive hole group 300 includes a plurality of conductive hole chains 310, and each conductive hole chain 310 includes a plurality of conductive blind holes 312. The plurality of conductive hole chains 310 are arranged in the direction from the middle of the wiring layer 100 to the outer edge of the wiring layer 100, and any two adjacent conductive hole chains 310 are electrically connected. Along the thickness direction of the circuit board body 10, the plurality of conductive blind holes 312 in each conductive hole chain 310 are stacked, each conductive blind hole 312 penetrates an insulating dielectric layer 200, and any two adjacent and different-layer conductive blind holes 312 are electrically connected.

[0036] It can be understood that the conductive hole group 300 includes a plurality of conductive blind holes 312, and the plurality of conductive blind holes 312 are arranged in an array.

[0037] Among them, the conductive hole group 300 extends from one of the first wiring layer 100a and the second wiring layer 100b to the other, and the conductive hole group 300 is arranged at intervals from the other of the first wiring layer 100a and the second wiring layer 100b. That is, the conductive hole group 300 extends from the first wiring layer 100a to the second wiring layer 100b, and the conductive hole group 300 is arranged at intervals from the second wiring layer 100b. Or, the conductive hole group 300 extends from the second wiring layer 100b to the first wiring layer 100a, and the conductive hole group 300 is arranged at intervals from the first wiring layer 100a.

[0038] As Figure 5 shown, the present application uses the conductive hole group 300 to directly penetrate for wiring, and the conductive hole group 300 is used for series conduction in the vertical direction and / or the horizontal direction. Specifically, the plurality of conductive blind holes 312 of the conductive hole group 300 are serially conducted in the horizontal direction, and the plurality of conductive blind holes 312 of the conductive hole group 300 are stacked and serially conducted in the vertical direction to form a conduction network, and the conductive hole groups 300 in the vertical direction and the horizontal direction are formed into a network for transmission, reducing the conductor transmission path and increasing the conductor cross-sectional area.

[0039] Compared with the related art, the traces shuttle back and forth between multiple trace layers of the circuit board through holes and lines for connection and transmission, reducing the network DC resistance value and power consumption, changing the multi-layer transmission into single-layer transmission (for example, the single-layer transmission is along the thickness direction of the circuit board body 10), and changing the three-layer or even multi-layer hole-line transmission path into single-layer large-area conduction transmission. In this way, the transmission path is simplified, the conductor area is increased, the resistance is reduced, the power supply efficiency of the power supply of the electronic device can be improved, which is beneficial to reducing the power consumption of the product, so as to achieve the purpose of power saving.

[0040] In addition, the structural setting of the conductive hole group 300 changes the signal transmission from horizontal and cross-layer transmission to overall transmission along the thickness direction of the circuit board body 10, increasing the cross-sectional area of the conductor, which is beneficial to improving the heat dissipation performance of the chip power supply of the electronic device.

[0041] It can be understood that according to the conductor resistance calculation formula: R = (ρ×L) / S, where ρ is the resistivity of the conductor, L is the length of the conductor, and S is the cross-sectional area of the conductor. Reducing the conductor transmission path (i.e., the length L of the conductor) and increasing the cross-sectional area S of the conductor can reduce the resistance value R of the conductor.

[0042] Optionally, the plurality of conductive hole chains 310 of the conductive hole group 300 are arranged in the horizontal direction.

[0043] Optionally, the plurality of conductive hole chains 310 of the conductive hole group 300 are arranged in the vertical direction.

[0044] Optionally, the plurality of conductive holes of the conductive hole group 300 are arranged in an N-row and M-column matrix, where N is a positive integer greater than 1 and M is a positive integer greater than 1.

[0045] Optionally, the number of the conductive hole groups 300 is one.

[0046] Optionally, the number of the conductive hole groups 300 is multiple.

[0047] In some embodiments, such as Figure 1 and Figure 4 shown, the number of the conductive hole groups 300 is multiple, and the multiple conductive hole groups 300 at least include a first conductive hole group 300a and a second conductive hole group 300b; the first conductive hole group 300a extends from the first trace layer 100a to the second trace layer 100b, and the first conductive hole group 300a is arranged at an interval from the second trace layer 100b; the second conductive hole group 300b extends from the second trace layer 100b to the first trace layer 100a, and the second conductive hole group 300b is arranged at an interval from the first trace layer 100a.

[0048] In this embodiment, the number of the conductive-via groups 300 is multiple. The types of the multiple conductive-via groups 300 are classified such that the multiple conductive-via groups 300 at least include a first conductive-via group 300a and a second conductive-via group 300b.

[0049] Among them, the first conductive-via group 300a extends from the first wiring layer 100a to the second wiring layer 100b, and the first conductive-via group 300a is arranged at intervals from the second wiring layer 100b. The second conductive-via group 300b extends from the second wiring layer 100b to the first wiring layer 100a, and the second conductive-via group 300b is arranged at intervals from the first wiring layer 100a. That is to say, the setting positions and extension directions of the first conductive-via group 300a and the second conductive-via group 300b are different.

[0050] That is to say, the number of the conductive-via groups 300 and the arrangement positions of the conductive-via groups 300 can be set according to specific actual usage requirements.

[0051] In some other embodiments, the extension directions of any two of the multiple conductive-via groups 300 are the same.

[0052] In some embodiments, along the thickness direction perpendicular to the circuit-board body 10, the first conductive-via group 300a and the second conductive-via group 300b are arranged staggeredly.

[0053] In this embodiment, the setting positions of the first conductive-via group 300a and the second conductive-via group 300b are further defined.

[0054] Specifically, along the thickness direction perpendicular to the circuit-board body 10, the first conductive-via group 300a and the second conductive-via group 300b are arranged staggeredly.

[0055] This setting increases the number of the conductive-via groups 300, simplifies the transmission path, increases the conductor area, reduces the resistance, can improve the power supply efficiency of the power supply of the electronic device, is beneficial to reducing the power consumption of the product, and thus achieves the purpose of power saving.

[0056] In some embodiments, as Figure 1 and Figure 4 shown, along the thickness direction perpendicular to the circuit-board body 10, the first conductive-via group 300a and the second conductive-via group 300b are opposite and arranged at intervals.

[0057] In this embodiment, the setting positions of the first conductive-via group 300a and the second conductive-via group 300b are further defined.

[0058] Specifically, along the thickness direction perpendicular to the circuit-board body 10, the first conductive-via group 300a and the second conductive-via group 300b are opposite and arranged at intervals.

[0059] This setting increases the number of conductive-via groups 300, simplifies the transmission path, increases the conductor area, reduces the resistance, can improve the power supply efficiency of the power supply of the electronic device, is beneficial to reducing the power consumption of the product, and thus achieves the purpose of power saving.

[0060] In some embodiments, as Figure 1 and Figure 4 shown, a connection-via group 400 is provided in a portion of the circuit-board body 10 located between the first conductive-via group 300a and the second conductive-via group 300b, and the first conductive-via group 300a and the second conductive-via group 300b are electrically connected through the connection-via group 400.

[0061] In this embodiment, the structure of the circuit-board body 10 is further defined.

[0062] Specifically, a connection-via group 400 is provided in a portion of the circuit-board body 10 located between the first conductive-via group 300a and the second conductive-via group 300b. The connection-via group 400 is electrically connected to the first conductive-via group 300a, and the connection-via group 400 is also electrically connected to the second conductive-via group 300b. That is to say, the first conductive-via group 300a and the second conductive-via group 300b are electrically connected through the connection-via group 400.

[0063] It can be seen therefrom that along the thickness direction of the circuit-board body 10, the first conductive-via group 300a, the second conductive-via group 300b, and the connection-via group 400 cooperate to penetrate through the two end faces of the circuit-board body 10 in the thickness direction. In this way, the first conductive-via group 300a, the second conductive-via group 300b, and the connection-via group 400 can be directly used for heat dissipation, reducing the investment in heat-dissipation devices, saving the overall space layout of the machine, being beneficial to reducing the production cost of the product, and being beneficial to realizing the thinning and lightening of the product.

[0064] The conductive-via group 300 can be used for heat dissipation. The conductive-via group 300 has good heat-conducting performance, which is beneficial to improving the heat-dissipation effect and realizing rapid heat dissipation.

[0065] In some embodiments, as Figure 1 and Figure 4 shown, the circuit-board assembly 1 further includes: a power device 60. The power device 60 is located on one side of the circuit-board body 10, and the power device 60 is electrically connected to one of the first conductive-via group 300a and the second conductive-via group 300b.

[0066] In this embodiment, the structure of the circuit-board assembly 1 is further defined, such that the circuit-board assembly 1 further includes a power device 60.

[0067] Wherein, the power device 60 is located on one side of the circuit-board body 10, and the power device 60 is electrically connected to one of the first conductive-via group 300a and the second conductive-via group 300b.

[0068] Optionally, the number of power devices 60 is one, and the numbers of the first conductive-via group 300a, the second conductive-via group 300b, and the connection-via group 400 are all one. The connection-via group 400 connects the first conductive-via group 300a and the second conductive-via group 300b. The power device 60 is electrically connected to the first conductive-via group 300a or the power device 60 is electrically connected to the second conductive-via group 300b.

[0069] Optionally, the first conductive-via group 300a, the second conductive-via group 300b, and the connection-via group 400 are regarded as an integral structure. The number of power devices 60 is multiple, and the number of this integral structure is also multiple. Each power device 60 cooperates with one integral structure. Each power device 60 is electrically connected to one of the first conductive-via group 300a and the second conductive-via group 300b of the integral structure.

[0070] Optionally, the power device 60 includes a system-on-chip.

[0071] When the power device 60 operates, heat is generated. The heat is transferred to the first conductive-via group 300a or the second conductive-via group 300b, and is quickly transferred and dissipated between the opposite end faces of the circuit-board body 10 (that is, the two end faces of the circuit-board body 10 in the stacking direction of the plurality of wiring layers 100) through the first conductive-via group 300a or the second conductive-via group 300b. It can be understood that the cooperation of the first conductive-via group 300a, the second conductive-via group 300b, and the connection-via group 400 not only has the function of dissipating heat from the power device 60, but also can be used as a signal network for signal transmission. That is to say, the structures of the first conductive-via group 300a, the second conductive-via group 300b, and the connection-via group 400 are reused, enriching the usage functions of the first conductive-via group 300a, the second conductive-via group 300b, and the connection-via group 400, which is beneficial to reducing the investment in heat dissipation devices, can save the overall space layout of the machine, is beneficial to reducing the production cost of the product, and is beneficial to realizing the thinness and lightness of the product.

[0072] Among them, Figure 3 the arrow on the left in indicates the signal transmission direction in the related art, Figure 3 and the arrow on the right in indicates the signal transmission direction in the present application.

[0073] It can be understood that on the basis of providing the conductive-via group 300 on the circuit-board body 10 of the present application, the hole and wire cooperation structure in the related art can also be provided. That is to say, the structure of the circuit-board body 10 can be specifically set according to the actual usage requirements. Compared with the circuit-board assembly in the related art, it has the advantages of reducing resistance, improving the power supply efficiency of the power supply of the electronic device, and reducing the power consumption of the product.

[0074] In some embodiments, such as Figure 1 and Figure 4As shown, the circuit board assembly 1 further includes: a heat conduction layer 70, which is located between one of the first conductive hole group 300a and the second conductive hole group 300b and the power device 60.

[0075] In this embodiment, the structure of the circuit board assembly 1 is further defined such that the circuit board assembly 1 further includes a heat conduction layer 70.

[0076] Specifically, the heat conduction layer 70 is located between one of the first conductive hole group 300a and the second conductive hole group 300b and the power device 60. That is, the heat conduction layer 70 is located between the first conductive hole group 300a and the power device 60. Alternatively, the heat conduction layer 70 is located between the second conductive hole group 300b and the power device 60.

[0077] The heat conduction layer 70 has the function of transferring the heat of the power device 60, so that the heat generated by the operation of the power device 60 can be effectively and quickly transferred to the first conductive hole group 300a or the second conductive hole group 300b via the heat conduction layer 70, which is beneficial to improving the heat dissipation efficiency of the power device 60.

[0078] Specifically, the power device 60 transfers heat to the heat conduction layer 70, and then transfers it to the first conductive hole group 300a or the second conductive hole group 300b of the circuit board body 10 through the heat conduction layer 70 for heat dissipation (copper has good heat absorption and heat dissipation functions). The heat generated by the power device 60 is quickly transferred and dissipated between the two end faces of the circuit board body 10 (that is, the two end faces of the circuit board body 10 in the stacking direction of the plurality of wiring layers 100) through the conductive hole group 300 made of copper. At the same time, the first conductive hole group 300a, the second conductive hole group 300b and the connection hole group 400 cooperate to have the function of signal transmission for the signal network.

[0079] Optionally, the heat conduction layer 70 includes a heat conduction gel.

[0080] In some embodiments, as Figure 1 and Figure 4 shown, the connection hole group 400 includes a plurality of first vias 410, and each first via 410 is electrically connected to at least one conductive hole chain 310 of the first conductive hole group 300a and at least one conductive hole chain 310 of the second conductive hole group 300b.

[0081] In this embodiment, the structure of the connection hole group 400 is further defined.

[0082] Specifically, the connection hole group 400 includes a plurality of first vias 410, and the first vias 410 have the function of electrically connecting the conductive hole chain 310 of the first conductive hole group 300a and the conductive hole chain 310 of the second conductive hole group 300b.

[0083] Optionally, both the first conductive-via group 300a and the second conductive-via group 300b include N conductive-via chains 310. The connection-via group 400 includes N first through-vias 410. Each first through-via 410 cooperates with one conductive-via chain 310 of the first conductive-via group 300a and one conductive-via chain 310 of the second conductive-via group 300b. N is a positive integer greater than 1.

[0084] Optionally, as Figure 1 and Figure 4 shown, both the first conductive-via group 300a and the second conductive-via group 300b include N conductive-via chains 310. The connection-via group 400 includes M first through-vias 410. Both N and M are positive integers greater than 1, and N is greater than M. Each first through-via 410 cooperates with at least one conductive-via chain 310 of the first conductive-via group 300a and at least one conductive-via chain 310 of the second conductive-via group 300b.

[0085] In some embodiments, as Figure 5 shown, among two adjacent conductive-via chains 310 of the conductive-via group 300, along the thickness direction perpendicular to the circuit-board body 10, a part of two adjacent conductive blind vias 312 is arranged in an overlapping manner.

[0086] In this embodiment, the mating structure of the conductive-via group 300 is further defined.

[0087] Among two adjacent conductive-via chains 310 of the conductive-via group 300, along the thickness direction perpendicular to the circuit-board body 10, a part of two adjacent conductive blind vias 312 is arranged in an overlapping manner. To meet the usage requirement of electrical connection between two adjacent conductive-via chains 310 of the conductive-via group 300. So that the conductive-via group 300 is cross-connected into a network of blind vias, and the conductive-via group 300 can be used as a medium for subsequent signal transmission and heat dissipation.

[0088] In some embodiments, as Figure 1 shown, each conductive blind via 312 includes: a blind via 3122; and a conductive portion 3124 disposed in the blind via 3122.

[0089] In this embodiment, each conductive blind via 312 includes a blind via 3122 and a conductive portion 3124, and the conductive portion 3124 is disposed in the blind via 3122 to meet the usage requirement that the conductive blind via 312 has conductivity.

[0090] Optionally, the conductive portion 3124 is a copper layer.

[0091] An electronic device according to still some embodiments of the present application includes: a power supply; and a circuit-board assembly 1 as in any of the above embodiments, and the circuit-board assembly 1 is electrically connected to the power supply.

[0092] The electronic device provided by the present application includes the circuit board assembly 1 of any of the above embodiments, and thus has all the beneficial effects of the above circuit board assembly 1, which will not be elaborated one by one here.

[0093] Optionally, the electronic device may be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR device), a virtual reality device (also known as a VR device), a handheld game console, etc.

[0094] Optionally, the present application uses the conductive via group 300 to directly penetrate multiple layers of the circuit board body 10 for routing, so that multiple conductive via chains 310 are connected in series in the vertical and horizontal directions. Instead of the related art where the routing shuttles back and forth through holes and lines between multiple routing layers of the circuit board, the DC resistance value of the network and the power consumption are reduced, and the power supply efficiency of the electronic device and the chip power dissipation effect are improved. At the same time, the first conductive via group 300a and the second conductive via group 300b are connected in series through the connection via group 400. Since copper has good thermal conductivity, the heat generated by the operation of the power device 60 is transmitted from one side of the circuit board body 10 to the other side of the circuit board body 10 to achieve heat dissipation, increasing the heat dissipation effect and being beneficial to extending the service life of the power device 60.

[0095] According to the conductor resistance calculation formula: R = (ρ×L) / S, where ρ is the resistivity of the conductor, L is the length of the conductor, and S is the cross-sectional area of the conductor. Reducing the conductor transmission path (i.e., the length L of the conductor) and increasing the cross-sectional area S of the conductor can reduce the resistance value R of the conductor.

[0096] Using blind via filling via chains (i.e., conductive via group 300) to change the signal transmission from multi-layer to single-layer, and changing the three-layer or even multi-layer via-line transmission path to single-layer large-area conduction transmission, simplifies the transmission path, increases the conductor area, and reduces the resistance.

[0097] Using the conductive via group 300 to change the signal transmission from horizontal and cross-layer transmission to overall transmission in the thickness direction of the circuit board body 10, the cross-sectional area of the conductor increases, which can improve the heat dissipation performance of the chip power supply.

[0098] Reducing the DC resistance can improve the power supply efficiency of the power supply of the electronic device, reduce the power consumption, and thus achieve the purpose of power saving.

[0099] The first conductive via group 300a, the second conductive via group 300b and the connection via group 400 are connected in series for heat dissipation, which can reduce the investment in the heat dissipation device of the electronic device, save the overall machine space layout, and is beneficial to reducing the cost of the product.

[0100] Using the conductive via group 300 for heat dissipation, copper has good thermal conductivity, improves the heat dissipation effect, and realizes rapid heat dissipation.

[0101] As Figure 1 shown, the left dashed box is the first signal transmission area 80 of the circuit board body 10, and the right dashed box is the second signal transmission area 90 of the circuit board body 10. The circuit board body 10 is also provided with a second via hole 500. The second signal transmission area 90 can not only transmit signals but also has a heat dissipation function.

[0102] As Figure 1 shown, a dedicated signal cross-layer area (i.e., the first signal transmission area 80) is set on one side of the circuit board body 10, and a power signal transmission and heat dissipation structure area (i.e., the second signal transmission area 90) is designed on the other side of the circuit board body 10. The number and distribution positions of the two areas are defined according to the design requirements.

[0103] The first signal transmission area 80 is provided with at least one conductive hole group 300. When there are multiple conductive hole groups 300 in the first signal transmission area 80, the number of conductive hole chains 310 of any two conductive hole groups 300 can be different or the same. When there are multiple conductive hole groups 300 in the first signal transmission area 80, the number of conductive blind holes 312 of any two conductive hole groups 300 can be different or the same.

[0104] The multiple conductive blind holes 312 of the conductive hole group 300 are conductively connected in series in the horizontal direction, and the multiple conductive blind holes 312 of the conductive hole group 300 are stacked and conductively connected in series in the vertical direction to form a conduction network. The number of conductive blind holes 312 can be set arbitrarily according to actual needs. Forming a network of multiple conductive blind holes 312 in the vertical and horizontal directions for transmission can reduce the transmission path of the conductor and increase the cross-sectional area of the conductor. In the related art, during the manufacturing process of the circuit board, the independent blind holes belong to different networks and will not be conductively connected in series.

[0105] In the related art, signal transmission is from single-layer transmission to inter-layer transmission. In this application, signal transmission becomes a whole and directly vertically transmits between different layers. That is, the transmission path of the wire and the hole is changed to the transmission path of the blind hole chain, increasing the conductor area for transmission.

[0106] As Figure 1As shown, in the second signal transmission area 90, one power device 60 is electrically connected to the first conductive via group 300a through a thermal conductive gel, and another power device 60 is electrically connected to the second conductive via group 300b through a thermal conductive gel. The power device 60 transfers heat to the thermal conductive gel, and then transfers it to the blind via chain of the circuit board body 10 (i.e., the first conductive via group 300a and the second conductive via group 300b) through the thermal conductive gel for heat dissipation. Among them, copper has good heat absorption and heat dissipation functions. The heat generated by the operation of the power device 60 is quickly transferred and dissipated between the two sides of the circuit board body 10 through the blind via chain made of copper material. At the same time, this blind via chain can be used as a signal network for rapid signal transmission.

[0107] During the manufacturing process of the circuit board body 10, multiple series-connected blind via chains (i.e., conductive via chains 310) are continuously laser drilled. Different from the blind vias and the second vias laser drilled on the inner layer core board in the related art, multiple blind vias 3122 are connected in series in a staggered manner to form an integral network. The aperture diameters of the blind vias 3122 include 50um, 75um, 85um, 90um, 100um, etc., which are not listed one by one here. A single layer can be produced in one go, and the blind vias 3122 are connected and conducted to each other through electroplated via filling copper (i.e., conductive part 3124) during the subsequent electroplating process.

[0108] After completing the single-layer blind via chain, blind via chains are laser drilled and stacked in the build-up layer in the same way to establish blind via chains in the vertical direction. N blind vias 3122 (N is greater than or equal to 2) are connected in a staggered manner in the same layer to form a network blind via chain. This blind via chain can be used for subsequent signal transmission and heat dissipation.

[0109] The use of blind via filling via chains changes multi-layer transmission to single-layer transmission, changes the three-layer or even multi-layer via line transmission path to single-layer large-area conduction transmission, simplifies the transmission path, increases the conductor area, and reduces the resistance.

[0110] Using the blind via chain, the signal transmission changes from horizontal and cross-layer transmission to overall transmission in the thickness direction of the circuit board body 10, increasing the cross-sectional area of the conductor and improving the heat dissipation performance of the chip power supply.

[0111] Reducing the DC resistance can improve the power supply efficiency of the power supply, reduce power consumption, and thus achieve the purpose of saving electricity.

[0112] Using the blind via chain for direct heat dissipation reduces the investment in heat dissipation devices, saves the overall space layout of the machine, and reduces the cost.

[0113] Using the conductive via group 300 for heat dissipation, copper has good thermal conductivity, improves the heat dissipation effect, and realizes rapid heat dissipation.

[0114] A laser process can be used to create a circular groove around the blind via stack holes on each layer, and then the copper deposition and electroplating processes can be used to electroplate and fill the groove, thereby reducing the DC resistance, saving power, and facilitating heat dissipation.

[0115] Figure 4 The arrows in [reference] indicate the heat transfer direction and the signal transfer direction.

[0116] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0117] Although the embodiments of this application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of this application, and the scope of this application is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that, Comprising: A circuit board body, the circuit board body includes a plurality of wiring layers and a plurality of insulating dielectric layers, the plurality of wiring layers are stacked, and one of the insulating dielectric layers is provided between any two adjacent wiring layers; Among the plurality of wiring layers, the two outermost wiring layers are respectively denoted as a first wiring layer and a second wiring layer; The circuit board body is provided with a conductive hole group, the conductive hole group extends from one of the first wiring layer and the second wiring layer to the other, and the conductive hole group is arranged at intervals from the other of the first wiring layer and the second wiring layer; The conductive hole group includes a plurality of conductive hole chains, the plurality of conductive hole chains are arranged in a direction from the middle of the wiring layer to the outer edge of the wiring layer, and any two adjacent conductive hole chains are electrically connected, and each conductive hole chain includes a plurality of conductive blind holes; In the conductive hole chain, the plurality of conductive blind holes are stacked, each conductive blind hole penetrates through one of the insulating dielectric layers, and any two adjacent and different-layer conductive blind holes are electrically connected.

2. The circuit board assembly according to claim 1, wherein The number of the conductive hole groups is multiple, and the multiple conductive hole groups at least include a first conductive hole group and a second conductive hole group; The first conductive hole group extends from the first wiring layer to the second wiring layer, and the first conductive hole group is arranged at intervals from the second wiring layer; The second conductive hole group extends from the second wiring layer to the first wiring layer, and the second conductive hole group is arranged at intervals from the first wiring layer.

3. The circuit board assembly according to claim 2, wherein Along the thickness direction perpendicular to the circuit board body, the first conductive hole group and the second conductive hole group are arranged staggeredly.

4. The circuit board assembly according to claim 2, wherein, Along the thickness direction perpendicular to the circuit board body, the first conductive hole group and the second conductive hole group are opposite and arranged at intervals.

5. The circuit board assembly according to claim 4, characterized in that, A connection hole group is provided in a part of the circuit board body between the first conductive hole group and the second conductive hole group, and the first conductive hole group and the second conductive hole group are electrically connected through the connection hole group.

6. The circuit board assembly according to claim 5, wherein, Further comprising: A power device, the power device is located on one side of the circuit board body, and the power device is electrically connected to one of the first conductive hole group and the second conductive hole group.

7. The circuit board assembly according to claim 6, wherein Further comprising: A heat conduction layer, the heat conduction layer is located between one of the first conductive hole group and the second conductive hole group and the power device.

8. The circuit board assembly according to claim 5, characterized in that, The connection hole group includes a plurality of first via holes, and each first via hole is electrically connected to at least one conductive hole chain of the first conductive hole group and at least one conductive hole chain of the second conductive hole group.

9. The circuit board assembly according to any one of claims 1 to 8, characterized in that, Among the adjacent two conductive hole chains of the conductive hole group, along the thickness direction perpendicular to the circuit board body, a part of the adjacent two conductive blind holes is arranged overlappingly.

10. An electronic device, characterized in that, Comprising: A power supply; And A circuit board assembly according to any one of claims 1 to 9, the circuit board assembly is electrically connected to the power supply.

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