Piezoelectric micropump bottom plate structure with driving chip

Abstract

The utility model relates to a piezoelectric micropump bottom plate structure with a driving chip, which belongs to the technical field of circuit board structures, solves the problem that the piezoelectric micropump in the prior art needs to be externally connected with a circuit board and is large in size, and comprises a circuit substrate, at least two conductive through holes are formed on the circuit substrate; the driving chip is integrated on the circuit substrate; the passive device group is integrated on the circuit substrate and is arranged at the periphery of the driving chip; wherein the driving chip is connected with the passive device group; and the conductive through hole is connected with the driving chip.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board structures, and particularly relates to a piezoelectric micropump bottom plate structure with a driving chip. Background Art

[0002] Since a piezoelectric micropump does not require an additional driving motor compared with a traditional pump device, a small form factor can be achieved. Therefore, piezoelectric micropumps are currently widely used in products such as wearable electronic devices, mobile medical devices, household appliances, automobiles, and avionics devices.

[0003] However, the existing driving circuits and controllers of piezoelectric micropumps are still manufactured separately, and cables are required to connect the piezoelectric micropump to the external driving circuit and controller during assembly. Therefore, the overall installation of the components of the piezoelectric micropump occupies a large space, and faults such as loosening, fatigue, and aging are likely to occur at the connections with the external connection cables and external components, and the assembly process steps are complicated, resulting in a high manufacturing cost.

[0004] Therefore, there is a need in the art for a component structure that can serve as the bottom plate of a piezoelectric micropump and provide a driving control function. Summary of the Utility Model

[0005] In order to solve the above problems, the utility model provides a piezoelectric micropump bottom plate structure with a driving chip, which integrates the driving chip of the piezoelectric micropump by SIP packaging, and then integrates the driving chip with SIP packaging on the piezoelectric micropump bottom plate structure, simplifies the driving circuit, reduces the overall volume of the piezoelectric micropump body, and improves the device integration degree.

[0006] According to an embodiment of the utility model, there is provided a piezoelectric micropump bottom plate structure with a driving chip, including:

[0007] A circuit board, on which at least two conductive vias are formed;

[0008] A driving chip integrated on the circuit board;

[0009] A passive device group integrated on the circuit board, which is arranged around the driving chip;

[0010] Wherein, the driving chip is connected to the passive device group; and

[0011] Wherein, the conductive via is connected to the driving chip.

[0012] Optionally, the circuit board includes a circuit layer, an insulating layer, a metal layer, an insulating layer, and a circuit layer stacked and assembled in sequence from top to bottom; a circulation hole is provided at the center of the circuit board.

[0013] Optionally, the driving chip includes: a packaging substrate; an integrated control unit, a driving control unit, and a storage unit disposed on the packaging substrate in a SIP packaging manner; wherein the integrated control unit is respectively connected to the driving control unit and the storage unit; and wherein the driving chip is attached to the circuit substrate by a chip mounting method.

[0014] Optionally, the driving control unit includes: a power control unit and a boost control unit; wherein the power control unit is connected to the boost control unit to output a buck-boost control signal through the boost control unit; and wherein both the power control unit and the boost control unit are connected to the integrated control unit.

[0015] Optionally, the integrated control unit includes: an ARM processor, a barometric pressure sensor driver, an internal storage module, a power management module, a communication module, and a clock calibration module.

[0016] Optionally, the passive device group includes a boost inverter circuit and a filter circuit, wherein the boost inverter circuit is connected to the boost control unit of the driving control unit; and wherein the filter circuit is connected to the power management module of the integrated control unit, and an external power supply supplies power to the driving chip via the filter circuit.

[0017] Optionally, the conductive through-hole is formed by forming a substrate through-hole in the circuit substrate, coating an insulating adhesive on the inner wall of the substrate through-hole to form an insulating adhesive layer, and disposing a conductive core at the center of the insulating adhesive layer.

[0018] Optionally, the circuit substrate is rectangular or circular.

[0019] Compared with the prior art, a piezoelectric micropump bottom plate structure with a driving chip provided according to an embodiment of the present invention has at least the following advantages.

[0020] 1. By directly using the piezoelectric micropump bottom plate structure with a driving chip as the bottom plate of the piezoelectric micropump, a fluid inlet and outlet channel is provided through the flow holes formed on the piezoelectric micropump bottom plate structure with a driving chip, and no additional inlet and outlet pipe structure is required. A power supply and control path for the piezoelectric micropump is provided through the conductive through-holes formed on the piezoelectric micropump bottom plate structure with a driving chip, and no additional wires and cables are required, simplifying the overall structure and improving the integration degree.

[0021] 2. The driving chip integrated on the piezoelectric micropump bottom plate structure with a driving chip can directly drive the piezoelectric micropump without the need for an additional high-voltage driving circuit. The overall electromechanical area and volume are small, and multiple functions are integrated in a single package with high integration, significantly reducing the volume and weight of electronic products. It is particularly suitable for applications with limited space such as mobile devices and wearable devices. The signal transmission path from the driving chip to the piezoelectric micropump is shortened, with small signal loss and interference, reducing the signal transmission distance and delay, improving the overall operating speed and efficiency of the system, and having higher response speed and control accuracy for the piezoelectric micropump.

[0022] 3. The multi-layer stacked structure of the circuit board has the advantages of high strength and strong toughness, and has both insulation function and circuit function. Therefore, when applied to a piezoelectric micropump, the piezoelectric micropump bottom plate structure with a driving chip can be used as the bottom plate of the piezoelectric micropump, with a simple assembly process, low production and maintenance costs, and being convenient for standardized production and quality control.

[0023] 4. When assembled to a piezoelectric micropump, the assembly steps and the need for external connectors are reduced, which can generally reduce the total cost of the system, reduce the number of components required, simplify the procurement process and inventory management, and reducing external interconnection points can reduce the failure rate and improve the long-term reliability of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required in the embodiments. By referring to the drawings, the features and advantages of the present invention can be more clearly understood. The drawings are schematic and should not be construed as any limitation to the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 is a top view of a piezoelectric micropump bottom plate structure with a driving chip provided according to the first embodiment of the present invention.

[0026] Figure 2 is a bottom view of a piezoelectric micropump bottom plate structure with a driving chip provided according to the first embodiment of the present invention.

[0027] Figure 3 is a partial cross-sectional view of the circuit board of a piezoelectric micropump bottom plate structure with a driving chip provided according to the first embodiment of the present invention.

[0028] Figure 4 is a schematic diagram of the driving chip of a piezoelectric micropump bottom plate structure with a driving chip provided according to the first embodiment of the present invention.

[0029] Figure 5 It is a logic diagram of a driving chip of a piezoelectric micropump bottom plate structure with a driving chip provided according to the first embodiment of the present invention.

[0030] Figure 6 It is a logic diagram of a piezoelectric micropump bottom plate structure with a driving chip cooperating with an external power supply and a piezoelectric pump provided according to the first embodiment of the present invention.

[0031] Figure 7 It is a top view of a piezoelectric micropump bottom plate structure with a driving chip provided according to the second embodiment of the present invention.

[0032] Explanation of reference numerals:

[0033] 1. Encapsulation substrate;

[0034] 2. Storage unit;

[0035] 3. Integrated control unit;

[0036] 4. Boost control unit;

[0037] 5. Power control unit;

[0038] 10. Conductive through-hole;

[0039] 11. Boost inverter circuit;

[0040] 12. Filter circuit;

[0041] 13. Flow-through hole;

[0042] 14. Driving chip;

[0043] 15. Output contact;

[0044] 16. Circuit substrate;

[0045] 17. Insulating adhesive layer;

[0046] 18. Conductive core;

[0047] 19. Circuit layer;

[0048] 20. Insulating layer;

[0049] 21. Metal layer;

[0050] 22. Insulating layer;

[0051] 23. Circuit layer;

[0052] 116. Circuit substrate. Detailed implementation manners

[0053] In order to more clearly understand the above-mentioned objects, features and advantages of the present utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the embodiments of the present utility model and the features in the embodiments may be combined with each other.

[0054] In the following description, many specific details are set forth in order to fully understand the present utility model. However, the present utility model may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present utility model is not limited by the specific embodiments disclosed below.

[0055] The following provides a detailed description of a piezoelectric micropump bottom plate structure with a driving chip according to an embodiment of the present utility model with reference to the accompanying drawings.

[0056] Embodiment 1

[0057] Figure 1 Fig. 1 shows a piezoelectric micropump bottom plate structure with a driving chip according to a first embodiment of the present utility model.

[0058] As Figure 1 shown, a piezoelectric micropump bottom plate structure with a driving chip according to a first embodiment of the present utility model includes: a circuit board 16, on which at least two conductive vias 10 are formed; a driving chip 14 integrated on the circuit board 16; a passive device group integrated on the circuit board 16, which is arranged around the driving chip 14; wherein, the driving chip 14 is connected to the passive device group; and wherein, the conductive via 10 is connected to the driving chip 14. Among them, the driving chip 14 can be attached to the lower left corner of the circuit board 16, and the passive device group can be arranged around the driving chip 14. The driving chip 14 can be attached to the circuit board 16 by means of chip mounting. The circuit board 16 can be provided with two conductive vias 10, which are arranged at both ends of one side of the circuit board 16, and the two conductive vias 10 are electrically connected to the piezoelectric micropump driving chip 14. In this embodiment, the conductive via 10 has a circular cross-sectional shape. However, in some other application scenarios, it can also be square, oval, polygonal, etc. When assembling the piezoelectric micropump bottom plate structure with a driving chip to the piezoelectric micropump, the conductive via 10 is electrically connected to the corresponding electrically conductive part in the pump body to provide power supply and control for the piezoelectric element, without the need for additional wire cables.

[0059] Continue to refer to Figure 1, in this embodiment, a through-flow hole 13 is formed in the central part of the circuit board 16. Optionally, the through-flow hole 13 may include a plurality of small round holes, and the plurality of small round holes are combined into a large circular form. In this embodiment, the through-flow hole 13 may include seven small round holes, but the present invention is not limited thereto, and may have more or fewer small round holes according to needs. In other embodiments, the through-flow hole may also be other suitable shapes, such as rectangular, triangular, oval, diamond, polygon, etc. When assembling the piezoelectric micropump bottom plate structure with the driving chip to the piezoelectric micropump, the through-flow hole 13 can be used as the inlet and outlet for fluid to flow in and out of the piezoelectric micropump, without the need for additional input and output pipelines. The upper surface of the circuit board 16 may have a vacant area for installing the valve body of the piezoelectric micropump when assembled to the piezoelectric micropump.

[0060] As Figure 2 shown, output contacts 15 may be provided on the bottom surface of the circuit board 16, and the output contacts 15 are symmetrically distributed on the edges of two opposite sides of the bottom surface of the circuit board 16. In this embodiment, 11 output contacts 15 are distributed on each side, but the present invention is not limited thereto, and may have more or fewer output contacts according to needs.

[0061] As Figure 3 shown, the structure of the circuit board 16 of this embodiment is shown. In this embodiment, the circuit board 16 is made by laminating. The circuit board 16 includes: a circuit layer 19, an insulating layer 20, a metal layer 21, an insulating layer 22, and a circuit layer 23 arranged in sequence from bottom to top. The multi-layer laminated structure of the circuit board 16 has the advantages of high strength and strong toughness, and has both insulating function and circuit function. Among them, circular through-holes are provided at corresponding positions of the above-mentioned circuit layers 19, insulating layers 20, metal layers 21, insulating layers 22, and circuit layer 23 with respect to the conductive through-hole 10, and conductive cores 18 are provided in the through-holes. Optionally, the conductive core 18 can be provided by electroless copper plating or silver paste filling. An insulating adhesive layer 17 is provided between the conductive core 18 and the inner wall of the through-hole to provide insulation between the conductive core 18 and the multi-layer structure of the circuit board 16. The circuit board 16, as the bottom plate of the valve body of the piezoelectric micropump, has high toughness, high strength, and high stiffness, can withstand high pressure (for example, above 60 Kpa), and has both insulating function and circuit function, and can perform electrical signal processing.

[0062] The following refers to Figure 4 and Figure 5 , and the driving chip 14 in this embodiment will be described in detail.

[0063] As Figure 4As shown, the drive chip 14 includes: a packaging substrate 1; an integrated control unit 3, a drive control unit, and a storage unit 2 arranged on the packaging substrate 1 in a SIP packaging manner, wherein one end of the integrated control unit 3 is connected to the drive control unit, and the other end is connected to the storage unit 2. The integrated control unit 3, the drive control unit, and the storage unit 2 are all packaged on the packaging substrate 1 in a SIP packaging manner, and after packaging, the packaging substrate 1 is coated with a housing. Optionally, materials such as plastic and ceramic can be used as the housing. Optionally, the integrated control unit 3 can be arranged at the center of the packaging substrate 1. The piezoelectric micropump bottom plate structure with this drive chip according to the present utility model does not require an additional large-area high-voltage drive circuit externally. Under the condition of meeting the performance of the vibration element, the device integration degree is further improved, and thus the overall volume of the piezoelectric micropump pump body is reduced.

[0064] SIP packaging (System in Package) allows multiple different electronic components, including processors, memories, RF devices, sensors, etc., as well as related passive components (such as resistors and capacitors), and even microelectromechanical systems (MEMS) to be integrated in one package. SIP technology is beneficial for miniaturization and light weight, high performance, flexible design, simplified supply chain management, and high reliability. When applied to fields such as smart phones, wireless communication, medical devices, automotive electronics, and military equipment, smaller, faster, and smarter electronic products can be obtained.

[0065] Continue to refer to Figure 4 , the drive control unit may include a power control unit 5 and a boost control unit 4, and the power control unit 5 and the boost control unit 4 are connected to each other. The power control unit 5 of the drive control unit outputs a PWM wave signal to the boost control unit 4, and the boost control unit 4 controls the piezoelectric micropump through buck-boost to adjust the drive voltage of the piezoelectric micropump, and further drives and controls the speed of its expansion and contraction. Thus, the drive chip 14 can be co-packaged with the integrated control unit 3, the storage unit 2, the power control unit 5, and the boost control unit 4, wherein the storage unit 2, the power control unit 5, and the boost control unit 4 are all connected to the integrated control unit 3.

[0066] As Figure 1As shown, in this embodiment, the driving chip is rectangular after co-packaging. The integrated control unit 3 is located at the center of the packaging substrate 1. The storage unit 2 is arranged on the left side of the integrated control unit 3. The power control unit 5 and the boost control unit 4 are arranged on the right side of the integrated control unit 3. Optionally, the size of the integrated control unit 3 can be: the length-width range is from 2700um×2400um to 2750um×2450um, and the thickness range is from 90um to 110um; the size of the storage unit 2 can be: the length-width range is from 860um×840um to 860um×890um, and the thickness range is from 90um to 110um. The size of the power control unit 5 can be: the length-width range is from 1380um×780um to 1400um×800um, and the thickness range is from 90um to 110um; the size of the boost control unit 4 can be: the length-width range is from 1350um×780um to 1370um×800um, and the thickness range is from 90um to 110um. Optionally, the power control unit 5 and the boost control unit 4 can use 25um copper wire for wiring, and the integrated control unit 3 and the storage unit 2 can use 18um copper wire for wiring. After packaging, the overall size of the driving chip 14 can be in the range of length-width from 8mm×5mm to 9mm×6mm and thickness from 7mm to 7.5mm.

[0067] Figure 5 The internal components and connection logic of the driving chip in this embodiment are shown. As Figure 5 shown, the integrated control unit 3 of this embodiment may include an ARM processor, a pressure sensor driver (not shown in the figure), an internal storage module, a power management module, a communication module, and a clock correction module (not shown in the figure). The internal storage module may include FLash flash memory and static random access memory SRAM. Among them, the capacity of the FLash flash memory can be 512KB. When the storage capacity of the internal storage module of the integrated control unit 3 is insufficient, the storage unit 2 can be called for additional data storage. The power management module of the integrated control unit 3 is connected to the drive control unit to control the operation of the voltage pump via the drive control unit. The power management module is connected to the filter circuit 12 of the passive device group and is connected to the external power supply via the filter circuit 12 to supply power to the driving chip 14. The ARM processor adjusts the driving voltage of the piezoelectric micropump through the PID algorithm to drive the pumping speed of the piezoelectric micropump. At the same time, it mobilizes the storage unit 2 and runs the functional firmware in the storage unit 2 to parse the collected data and output the parsed data through the communication module.

[0068] Continue to refer to Figure 5, the storage unit 2 can be a PSRAM, that is, a pseudo-static random access memory, for storing data. Optionally, the storage unit 2 can have a capacity of 2MB. Functional firmware, such as blood pressure firmware, can be stored in the storage unit 2. Optionally, in this embodiment, the drive chip can further include a communication module, and the communication module includes a first IIC communication interface, a second IIC communication interface, and a serial communication interface.

[0069] As Figure 6 shown, the working principle of the drive chip in this embodiment is: during operation, the ARM processor receives the data transmitted from the communication module, then controls the storage unit 2, calls the functional firmware stored in the storage unit 2 to perform algorithm processing on the received data, and then controls the power control unit 5 and the boost control unit 4 based on the algorithm processing result of the data, so as to control the piezoelectric micropump.

[0070] Figure 6 shows the logic diagram of the piezoelectric micropump bottom plate structure with a drive chip provided in this first embodiment working in cooperation with an external power supply and a piezoelectric pump. As Figure 6 shown, the passive device group of the piezoelectric micropump bottom plate structure with a drive chip in this first embodiment can include passive devices such as capacitors, resistors, crystal oscillators, etc., for assisting the operation of the system. The passive device group can include a boost inverter circuit 11 and a filter circuit 12. The boost inverter circuit 11 is connected to a conductive via 10. The power control unit 5 and the boost control unit 4 in the drive chip 14 are connected to the boost inverter circuit 11, so as to control the piezoelectric micropump. The external power supply is connected to the filter circuit 12, and thus is connected to the drive chip 14 via the filter circuit 12. Specifically, in this embodiment, the power management module of the integrated control unit 3 in the drive chip 14 is connected to the external power supply via the filter circuit 12, so as to supply power to the entire drive chip 14 and the piezoelectric micropump. The communication module of the integrated control unit 3 in the drive chip 14 includes a first IIC communication interface, a second IIC communication interface, and a serial communication interface. The first IIC communication interface transmits data to an external air pressure module, the second IIC communication interface transmits data to an external sensor module, and the serial communication interface transmits data to an external communication module.

[0071] Continue to refer to Figure 6, the working principle of the piezoelectric micropump bottom plate structure with a driving chip provided by this embodiment is as follows: during operation, external information is input into the driving chip 14 as data through the communication module; the ARM processor of the integrated control unit 3 in the driving chip 14 receives the data transmitted from the communication module, then controls the storage unit 2 in the driving chip 14, and calls the functional firmware in the storage unit 2 to perform algorithm processing on the data to obtain an algorithm processing result; based on the algorithm processing result, the ARM processor controls the power control unit 5 and the boost control unit 4 of the drive control unit in the driving chip 14; the power control unit 5 and the boost control unit 4 control the piezoelectric micropump through the boost inverter circuit 11 connected to them. Among them, the process of inputting external information into the driving chip 14 as data through the communication module specifically includes: the first IIC communication interface in the communication module receives air pressure data, and the second IIC communication interface receives data from the gravity sensor. The ARM processor performs algorithm processing on the received data and outputs the result after algorithm processing to the external communication module through the serial communication interface of the communication module.

[0072] Embodiment 2

[0073] In Figure 7 In the shown Embodiment 2, according to the second embodiment of the present invention, a piezoelectric micropump bottom plate structure with a driving chip is provided, which integrates the driving chip 14 provided in the above first embodiment, including: a circuit board 116; the driving chip 14 integrated on the circuit board 116 and the peripheral passive device group; wherein the driving chip 14 is connected to the peripheral passive device group.

[0074] The structure of the piezoelectric micropump bottom plate structure with a driving chip provided by this second embodiment is basically the same as that of the piezoelectric micropump bottom plate structure with a driving chip in the above Embodiment 1, the difference being that in this Embodiment 2, the circuit board 116 has a circular outer shape to meet the requirements for a circular piezoelectric micropump. Among them, the flow hole 13 is provided at the center of the circuit board 116, and the conductive through hole 10 is provided at the circular edge of the circuit board 116. This embodiment is applicable to special cases where a circular piezoelectric micropump is required.

[0075] All of the above optional technical solutions can be combined arbitrarily to form optional embodiments of the present application, which will not be elaborated one by one here.

[0076] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0077] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present utility model should be covered within the protection scope of the present utility model.

Claims

1. A piezoelectric micropump bottom plate structure with a driving chip, characterized in that Comprising: A circuit board on which at least two conductive vias are formed; A driving chip integrated on the circuit board; A passive device group integrated on the circuit board, which is arranged around the driving chip; Wherein, the driving chip is connected to the passive device group; and Wherein, the conductive via is connected to the driving chip.

2. The piezoelectric micropump bottom plate structure with a driving chip according to claim 1, characterized in that The circuit board includes a circuit layer, an insulating layer, a metal layer, an insulating layer and a circuit layer which are stacked and assembled in sequence from top to bottom; A circulation hole is arranged at the center of the circuit board.

3. The piezoelectric micropump bottom plate structure with a driving chip according to claim 2, characterized in that, The driving chip includes: A packaging substrate; An integrated control unit, a driving control unit and a storage unit arranged on the packaging substrate in a SIP packaging manner; Wherein, the integrated control unit is respectively connected to the driving control unit and the storage unit; And wherein, the driving chip is attached to the circuit board by a chip mounting method.

4. The piezoelectric micropump bottom plate structure with a driving chip according to claim 3, characterized in that, The driving control unit includes: A power control unit and a boost control unit; Wherein, the power control unit is connected to the boost control unit to output a buck-boost control signal through the boost control unit; Wherein, both the power control unit and the boost control unit are connected to the integrated control unit.

5. The piezoelectric micropump bottom plate structure with a driving chip according to claim 4, characterized in that, The integrated control unit includes: an ARM processor, a barometric pressure sensor driver, an internal storage module, a power management module, a communication module and a clock correction module.

6. The piezoelectric micropump bottom plate structure with a driving chip according to claim 5, characterized in that, The passive device group includes a boost inverter circuit and a filter circuit, Wherein, the boost inverter circuit is connected to the boost control unit of the driving control unit; and Wherein, the filter circuit is connected to the power management module of the integrated control unit, and an external power supply supplies power to the driving chip through the filter circuit.

7. The piezoelectric micropump bottom plate structure with a driving chip according to claim 1, characterized in that The conductive via is formed by forming a substrate via hole on the circuit board, coating an insulating glue on the inner wall of the substrate via hole to form an insulating glue layer, and arranging a conductive core at the center of the insulating glue layer.

8. The piezoelectric micropump bottom plate structure with a driving chip according to any one of claims 1-7, characterized in that The circuit board is rectangular or circular.

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