Automatic chip mounter for chip resistors

By designing a patch resistor automatic patch machine that is linked to the automatic discharge and placement mechanism and the linear module, the problems of automatic unloading and stacking of circuit boards are solved, and the continuous operation efficiency and production speed of the production line are improved.

CN223142390UActive Publication Date: 2025-07-22HUIZHOU SONGLONGXIN ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202421796850.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-29
Publication Date
2025-07-22
Estimated Expiration
2034-07-29

AI Technical Summary

Technical Problem

After placing the resistor on the circuit board, the existing automatic chip machine for chip resistor processing does not have the functions of automatic unloading and placing the circuit board, resulting in a decrease in the efficiency of the production line and the inability to maintain continuous operation.

Method used

A patch resistor automatic patch machine including an operating table, a linear module, a placing plate, a resistive patch machine and an automatic discharge placement mechanism is designed. The suction cup is driven to fix the circuit board through the linkage of the linear module and extract it from the placing plate to the placing plate to realize the automatic placing of the circuit board.

Benefits of technology

It realizes automatic stacking of circuit boards, reduces manual operation time, improves the consistency and speed of production processes, and improves overall production efficiency.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223142390U_ABST
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Abstract

The utility model discloses an automatic chip mounter for chip resistors, which comprises an operation table, a first linear module fixedly mounted on the upper surface of the operation table, a placement plate slidably mounted on the upper surface of a moving block of the first linear module, an embedded groove formed in the upper surface of the placement plate, and an overhead block fixedly mounted on the upper surface of the operation table, a second linear module is fixedly installed on the upper surfaces of every two sets of overhead blocks, an installation frame is fixedly installed on the upper surfaces of the second linear modules, a resistor chip mounter is fixedly installed at one end of the installation frame, a stacking groove is formed in one end of the operation table, and an automatic discharging and placing mechanism is fixedly installed in the stacking groove. Through the design of the automatic discharging and placing mechanism, the effect that a third linear module and a fourth linear module are linked to drive a suction cup at the lower end of a connecting arm is achieved, so that the circuit boards can be sucked, fixed, extracted and stacked from a placing plate to be placed on the upper surface of a stacking plate, and then automatic stacking and placing of the circuit boards after surface mounting are completed.
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Description

Technical Field

[0001] The utility model relates to the technical field of chip mounters, in particular to an automatic chip resistor mounter. Background Technique

[0002] A chip mounter, also known as a chip placer or surface mount system, is configured after a dispensing machine or a screen printer in a production line. It is a device that accurately places surface mount components on the PCB pads by moving the placement head. In the development of modern technology, resistor components are an important part of electronics. Therefore, the chip body is particularly important in the processing and production of resistor components.

[0003] For example, the patent with the national authorization patent publication number CN211210071U discloses an automatic chip mounter for chip resistor processing, belonging to the technical field of chip resistors. It includes a base. Bottom wheels are installed at the four corners of the bottom of the base. Both sides of the top of the base are connected with rotating rods through threaded sleeves. The top ends of the rotating rods are welded with rotating handles, and the bottom ends of the rotating rods are connected with brake pads. For this automatic chip mounter for chip resistor processing, rotating rods, rotating handles, brake pads and threaded sleeves are provided. When the user pushes the base to move to the working location through the bottom wheels, the user can rotate the rotating rod clockwise through the rotating handle, so that the rotating rod slides down inside the threaded sleeve through its own rotation, so that the rotating rod drives the brake pad to contact the ground after sliding down, so that the brake pad increases the friction with the ground, so that the brake pad brakes and fixes the chip mounter, avoiding the sliding of the chip mounter during processing, so as to improve the processing accuracy of the chip mounter.

[0004] However, after the above automatic chip mounter for chip resistor processing places the resistors on the circuit board, it does not have the functions of automatic unloading and stacking the circuit boards. It is necessary to manually intervene to unload the processed circuit boards, which reduces the overall production speed. And manual unloading and stacking will interrupt the process of pasting resistors and feeding materials, resulting in a decrease in the production line efficiency and making it unable to maintain continuous operation. Content of the Utility Model

[0005] The purpose of the utility model is to provide an automatic chip resistor mounter to solve the problem that after placing the resistors on the circuit board, it does not have automatic unloading and stacking of the circuit boards, which will lead to a decrease in the production line efficiency and make it unable to maintain continuous operation as mentioned in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solutions:

[0007] A patch resistor automatic placement machine, comprising: an operating table, on the upper surface of which a first linear module is fixedly installed, on the upper surface of the moving block of the first linear module, a placement plate is slidably installed, on the upper surface of the placement plate, an embedded groove is provided, on the upper surface of the operating table, an overhead block is fixedly installed, on the upper surface of every two groups of the overhead blocks, a second linear module is fixedly installed, on the upper surface of the second linear module, a mounting frame is fixedly installed, and at one end of the mounting frame, a resistor placement machine is fixedly installed;

[0008] Wherein, at one end of the operating table, a stacking groove is provided, and an automatic feeding and placing mechanism is fixedly installed in the stacking groove.

[0009] Preferably, a cover is fixedly installed on the upper surface of the operating table, and the cover shields the second linear module and the resistor placement machine inside.

[0010] Preferably, the lower end of the second linear module overhead by the overhead block can allow the placement plate to slide through, and the circuit board placed in the embedded groove can be flush with the resistor placement machine.

[0011] Preferably, a stacking plate is fixedly installed in the stacking groove, and the middle part of the stacking plate is hollow, so that the staff can lift and carry the stacked circuit boards from it.

[0012] Preferably, the automatic feeding and placing mechanism includes a third linear module fixedly installed in the stacking groove, at one end of the moving block of the third linear module, a fourth linear module is fixedly installed, at one end of the moving block of the fourth linear module, a connecting arm is fixedly installed, on the lower surface of the connecting arm, a vacuum pump is fixedly installed, on the outer surface of the vacuum pump, an X-shaped frame is fixedly installed, and suction cups are fixedly installed at the four corners of the X-shaped frame;

[0013] Wherein, the linkage cooperation of the third linear module and the fourth linear module can drive the suction cup at one end of the connecting arm to be flush with the placement plate.

[0014] Preferably, the air port of the vacuum pump is connected and communicated with the air port of the suction cup through a trachea.

[0015] Compared with the prior art, the beneficial effects of the present utility model are:

[0016] 1. Through the design of the first linear module, placement plate, second linear module, stacking groove, stacking plate, and automatic blanking and placement mechanism, when pasting surface-mounted resistors on the circuit board, the circuit board can be placed on the upper surface of the placement plate in cooperation with an external loading mechanism and driven by the first linear module to be flush with the resistor mounter. The resistor mounter can then accurately place the resistor components on the surface of the circuit board in cooperation with the linkage of the first linear module and the second linear module. After the resistors on the surface of the circuit board are placed, the automatic blanking and placement mechanism will move to be flush with the placement plate and suck and lift the circuit board placed on the upper surface, and then the circuit board can be extracted from the placement plate and stacked on the upper surface of the stacking plate, thus completing the automatic stacking and placement of the circuit board after pasting. This function of automatically stacking and placing the circuit board reduces the manual operation time, makes the entire production process more coherent and efficient, and thus improves the overall production speed.

[0017] 2. Through the design of the third linear module, fourth linear module, connecting arm, vacuum pump, and suction cup, after the resistors on the surface of the circuit board are placed, the third linear module will drive the connecting arm on one side of the fourth linear module to be above the placement plate. Subsequently, the fourth linear module can be started to drive the connecting arm to slide and insert directly above the placement plate and be flush with the circuit board. Then, the third linear module can be started to drive the suction cup at the lower end of the connecting arm of the fourth linear module to fit on the surface of the circuit board. Then, the air between the suction cup and the circuit board can be pumped out by starting the vacuum pump, so that the suction cup can firmly suck and fix the circuit board. Then, the third linear module is started again to drive the fourth linear module to lift the circuit board from the embedded groove of the placement plate by the connecting arm. Subsequently, the fourth linear module can be started to drive the connecting arm to slide back to be flush with the stacking groove, and then the third linear module can drive the circuit board at the lower end of the connecting arm of the fourth linear module to fit and place on the upper surface of the stacking plate, and the vacuum pump is used to inflate the suction cup to make the suction cup release the suction and fixation of the circuit board, thus completing the placement operation of the circuit board. Subsequently, as the circuit board is continuously sucked and unloaded, the function of stacking and placing multiple groups of circuit boards is achieved. After the circuit boards are stacked to a certain height, the staff can insert their hands from the lower end of the stacking plate and lift the circuit boards out through the hollow opening in the middle of the stacking plate, and then the staff can centrally transport and store the circuit boards after pasting. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Structural schematic diagram of the stacking groove and stacking plate of the present utility model;

[0019] Figure 2 Structural schematic diagram of the first linear module and the second linear module of the present utility model;

[0020] Figure 3 Structural schematic diagram of the placement plate of the present utility model;

[0021] Figure 4 Schematic diagram of the structure for the automatic blanking and placement mechanism of the present utility model to suck the circuit board;

[0022] Figure 5 Schematic diagram of the structure of the automatic blanking and placement mechanism of the present utility model.

[0023] In the figure: 1. Operating table; 101. Cover; 102. Stacking groove; 103. Stacking plate; 104. Placing plate; 105. Overhead block; 106. Second linear module; 107. Mounting rack; 108. Resistance mounter; 109. First linear module; 2. Automatic blanking and placement mechanism; 201. Third linear module; 202. Fourth linear module; 203. Connecting arm; 204. Vacuum pump; 205. X-shaped frame; 206. Suction cup. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Please refer to Figures 1-5 , the present utility model provides a technical solution:

[0026] As Figures 1-4 shown, a chip resistor automatic mounter includes: an operating table 1, a first linear module 109 is fixedly installed on the upper surface of the operating table 1, a placing plate 104 is slidably installed on the upper surface of the moving block of the first linear module 109, an embedded groove is opened on the upper surface of the placing plate 104, an overhead block 105 is fixedly installed on the upper surface of the operating table 1, a second linear module 106 is fixedly installed on the upper surface of every two groups of overhead blocks 105, a mounting rack 107 is fixedly installed on the upper surface of the second linear module 106, and a resistance mounter 108 is fixedly installed at one end of the mounting rack 107;

[0027] Among them, a stacking groove 102 is opened at one end of the operating table 1, and an automatic blanking and placement mechanism 2 is fixedly installed in the stacking groove 102.

[0028] A cover 101 is fixedly installed on the upper surface of the operating table 1, and the cover 101 shields the second linear module 106 and the resistance mounter 108 inside.

[0029] The lower end of the second linear module 106 that is overhead by the overhead block 105 can be penetrated by the placing plate 104, and the circuit board placed in the embedded groove can be flush with the resistance mounter 108.

[0030] A stacked plate 103 is fixedly installed inside the stacked groove 102. The middle part of the stacked plate 103 is hollow, allowing the staff to lift and carry the stacked circuit boards from it.

[0031] Through the design of the first linear module 109, the placement plate 104, the second linear module 106, the stacked groove 102, the stacked plate 103 and the automatic blanking and placement mechanism 2, when pasting surface mount resistors on the circuit board, the circuit board can be placed on the upper surface of the placement plate 104 in cooperation with the external feeding mechanism and driven by the first linear module 109 to be flush with the resistor mounter 108. Then, the resistor mounter 108 can cooperate with the linkage of the first linear module 109 and the second linear module 106 to accurately place the resistor components on the surface of the circuit board. After the placement of the resistors on the surface of the circuit board is completed, the automatic blanking and placement mechanism 2 will move to be flush with the placement plate 104 and suck and lift the circuit board placed on the upper surface. Thus, the circuit board can be extracted from the placement plate 104 and stacked on the upper surface of the stacked plate 103, completing the automatic stacking and placement of the pasted circuit board. This function of automatically stacking and placing the circuit board reduces the time of manual operation, makes the whole production process more coherent and efficient, and thus improves the overall production speed.

[0032] As Figure 5 shown, the automatic blanking and placement mechanism 2 includes a third linear module 201. The third linear module 201 is fixedly installed inside the stacked groove 102. One end of the moving block of the third linear module 201 is fixedly installed with a fourth linear module 202. One end of the moving block of the fourth linear module 202 is fixedly installed with a connecting arm 203. A vacuum pump 204 is fixedly installed on the lower surface of the connecting arm 203. An X-shaped frame 205 is fixedly installed on the outer surface of the vacuum pump 204. Suction cups 206 are fixedly installed at the four corners of the X-shaped frame 205;

[0033] Among them, the linkage cooperation of the third linear module 201 and the fourth linear module 202 can drive the suction cup 206 at one end of the connecting arm 203 to be flush with the placement plate 104.

[0034] The air port of the vacuum pump 204 is connected and communicated with the air port of the suction cup 206 through a trachea.

[0035] Through the design of the third linear module 201, the fourth linear module 202, the connecting arm 203, the vacuum pump 204 and the suction cup 206, after the resistors on the surface of the circuit board are placed, the third linear module 201 will drive the connecting arm 203 on one side of the fourth linear module 202 to be above the placement board 104. Subsequently, the fourth linear module 202 can be started to drive the connecting arm 203 to slide and insert directly above the placement board 104 and be flush with the circuit board. Then, the third linear module 201 can be started to drive the suction cup 206 at the lower end of the connecting arm 203 of the fourth linear module 202 to fit on the surface of the circuit board. Subsequently, the air between the suction cup 206 and the circuit board can be pumped out by starting the vacuum pump 204, enabling the suction cup 206 to firmly suck and fix the circuit board. The third linear module 201 is started again to drive the fourth linear module 202 to lift the circuit board from the embedded groove of the placement board 104 by the connecting arm 203. Then, the fourth linear module 202 can be started to drive the connecting arm 203 to slide back to be flush with the stacking groove 102. Furthermore, the third linear module 201 can drive the circuit board at the lower end of the connecting arm 203 of the fourth linear module 202 to be placed and fitted on the upper surface of the stacking board 103. By inflating the suction cup 206 with the vacuum pump 204, the suction cup 206 is disengaged from sucking and fixing the circuit board, thus completing the placement operation of the circuit board. Subsequently, with continuous suction and unloading of the circuit board, the function of stacking and placing multiple groups of circuit boards is achieved. After stacking the circuit boards to a certain height, the staff can insert their hands from the lower end of the stacking board 103 and lift the circuit board out through the hollow opening in the middle of the stacking board 103, thus enabling the staff to centrally transport and store the circuit boards after chip mounting.

[0036] Summarize and sort out the working steps of this solution according to the above technical solution: When pasting surface-mounted resistors on the circuit board, the circuit board can be placed on the upper surface of the placement board 104 with the cooperation of an external feeding mechanism and driven by the first linear module 109 to be flush with the resistor mounter 108. The resistor mounter 108 can accurately place the resistor components on the surface of the circuit board with the linkage of the first linear module 109 and the second linear module 106. After placing the resistors on the surface of the circuit board, the third linear module 201 can be started to drive the connecting arm 203 on one side of the fourth linear module 202 to be above the placement board 104. Subsequently, the fourth linear module 202 can be started to drive the connecting arm 203 to slide and insert directly above the placement board 104 and be flush with the circuit board. Then, the third linear module 201 can be started to drive the suction cup 206 at the lower end of the connecting arm 203 of the fourth linear module 202 to fit on the surface of the circuit board. Subsequently, the air between the suction cup 206 and the circuit board can be pumped out by starting the vacuum pump 204, so that the suction cup 206 can firmly suck and fix the circuit board. The third linear module 201 can be started again to drive the fourth linear module 202 to lift the circuit board from the inner embedded groove of the placement board 104 by the connecting arm 203. Subsequently, the fourth linear module 202 can be started to drive the connecting arm 203 to slide back to be flush with the stacking groove 102. Furthermore, the third linear module 201 can drive the circuit board at the lower end of the connecting arm 203 of the fourth linear module 202 to be placed on the upper surface of the stacking board 103. The vacuum pump 204 can be used to inflate the suction cup 206 to make the suction cup 206 release the suction on the circuit board, thus completing the placement operation of the circuit board. Subsequently, with continuous suction and unloading of the circuit board, the function of stacking multiple circuit boards is achieved. After stacking the circuit boards to a certain height, the staff can insert their hands from the lower end of the stacking board 103 and lift the circuit board out through the hollow opening in the middle of the stacking board 103, which can be used for the staff to centrally transport and store the circuit boards after pasting.

[0037] In summary: With the effect of the third linear module 201 and the fourth linear module 202 driving the suction cup 206 at the lower end of the connecting arm 203 in linkage, the circuit board can be sucked and fixed, extracted from the placement board 104, and stacked on the upper surface of the stacking board 103. Thus, the automatic stacking and placement of the circuit boards after pasting is completed. This function of automatically stacking and placing circuit boards reduces the manual operation time, makes the entire production process more coherent and efficient, and thus improves the overall production speed.

[0038] Parts not involved in the present utility model are the same as or can be implemented by using the prior art. Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An automatic chip resistor mounter, characterized in that, Including: An operating table (1), on the upper surface of which a first linear module (109) is fixedly installed. A placement plate (104) is slidably installed on the upper surface of the moving block of the first linear module (109). An embedded groove is provided on the upper surface of the placement plate (104). An overhead block (105) is fixedly installed on the upper surface of the operating table (1). A second linear module (106) is fixedly installed on the upper surfaces of every two groups of the overhead blocks (105). An installation frame (107) is fixedly installed on the upper surface of the second linear module (106). One end of the installation frame (107) is fixedly installed with a resistor mounter (108); Among them, a stacking groove (102) is provided at one end of the operating table (1). An automatic blanking and placement mechanism (2) is fixedly installed in the stacking groove (102). The automatic blanking and placement mechanism (2) includes a third linear module (201) fixedly installed in the stacking groove (102). One end of the moving block of the third linear module (201) is fixedly installed with a fourth linear module (202). One end of the moving block of the fourth linear module (202) is fixedly installed with a connecting arm (203). A vacuum pump (204) is fixedly installed on the lower surface of the connecting arm (203). An X-shaped frame (205) is fixedly installed on the outer surface of the vacuum pump (204). Suction cups (206) are fixedly installed at the four corners of the X-shaped frame (205); Among them, the interlocking cooperation of the third linear module (201) and the fourth linear module (202) can drive the suction cup (206) at one end of the connecting arm (203) to be flush with the placement plate (104).

2. The automatic chip resistor mounter according to claim 1, wherein: A cover (101) is fixedly installed on the upper surface of the operating table (1), and the second linear module (106) and the resistor mounter (108) are shielded therein.

3. The automatic chip resistor mounter according to claim 2, characterized in that: The lower end of the second linear module (106) overhead by the overhead block (105) can allow the placement plate (104) to slide through, and the circuit board placed in the embedded groove can be flush with the resistor mounter (108).

4. The automatic chip resistor mounter according to claim 3, characterized in that: A stacking plate (103) is fixedly installed in the stacking groove (102). The middle part of the stacking plate (103) is hollow, allowing the staff to lift and carry the stacked circuit boards therefrom.

5. The automatic chip resistor mounter according to claim 4, characterized in that: The air port of the vacuum pump (204) is connected and communicated with the air port of the suction cup (206) through a trachea.

Citation Information

Patent Citations

  • Automatic chip mounter for chip resistor processing

    CN211210071U