Efficient semiconductor forming die

Abstract

The utility model discloses an efficient semiconductor forming die which comprises a top plate, a vertical rod installed at the bottom end of the top plate, a working plate installed at the bottom end of the vertical rod, a supporting frame installed at the bottom end of the working plate, a hydraulic rod installed in the middle of the bottom end of the top plate, a pressing plate installed at the bottom end of the hydraulic rod, and a die shell installed in the middle of the top end of the working plate. A mold is arranged at the top end in the mold shell, a demolding structure is arranged at the bottom end of the mold, a connecting rod is installed at the bottom end of the top block, and limiting pulleys are arranged on the two sides of the connecting rod. According to the utility model, the top block is arranged at the bottom end of the high-efficiency semiconductor forming die, after the die is manufactured, the hydraulic rod drives the pressing plate to ascend, and the telescopic rod is stretched to the longest length and drives the limiting block to ascend while the pressing plate ascends, so that the connecting rod is lifted together and the top block is driven to ascend; therefore, the purpose of pushing the manufactured semiconductor out of the mold to realize automatic demolding is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to an efficient semiconductor forming die. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. They are used in fields such as integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion. For example, diodes are devices made of semiconductors. From the perspective of both technology and economic development, the importance of semiconductors is extremely great. The core units of most electronic products, such as computers, mobile phones, or digital recorders, are extremely closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one among various semiconductor material applications. Semiconductors can be quickly fabricated by dies, which requires an efficient semiconductor forming die.

[0003] The current efficient semiconductor forming dies can basically meet people's usage requirements, but there are still some problems, which are specifically described as follows:

[0004] 1. The efficient semiconductor forming die cannot be automatically demolded when demolding. Since the fabricated semiconductor fits perfectly with the die, it is very troublesome to take out. It is difficult to take out the semiconductor very quickly and without damaging the semiconductor while taking it out of the die.

[0005] 2. When fabricating semiconductors, the efficient semiconductor forming die needs to replace the die due to different fabrication models. The current efficient semiconductor forming die is difficult to replace the die and adapt to the different sizes of different dies. Summary of the Utility Model

[0006] The purpose of the utility model is to provide an efficient semiconductor forming die to solve the defects that the existing efficient semiconductor forming die is difficult to demold and difficult to replace the die.

[0007] To solve the above technical problems, the utility model provides the following technical solution: An efficient semiconductor forming die, including a top plate;

[0008] A vertical rod is installed at the bottom end of the top plate, a working plate is installed at the bottom end of the vertical rod, and a support frame is installed at the bottom end of the working plate;

[0009] A hydraulic rod is installed in the middle of the bottom end of the top plate, a pressing plate is installed at the bottom end of the hydraulic rod, a die housing is installed in the middle of the top end of the working plate, a die is arranged at the top end inside the die housing, and fixing structures are installed on both sides of the top end of the working plate;

[0010] A demolding structure is provided at the bottom end of the mold. The demolding structure includes a top block, limit pulleys, a connecting rod, and a rubber pad. The top block is provided at the bottom end of the mold. A connecting rod is installed at the bottom end of the top block. Limit pulleys are provided on both sides of the connecting rod. Rubber pads are provided at both ends of the connecting rod.

[0011] During use, first place the mold in the mold housing, fix the mold with the clamping block by adjusting the fixing structure, press down the pressing plate with the hydraulic rod to press the semiconductor together with the mold. After pressing is completed, lift the pressing plate, and at the same time, the telescopic rod is elongated. Use the limit block at the bottom end of the telescopic rod to drive the connecting rod to rise, so as to eject and demold the made semiconductor with the fixed block.

[0012] Furthermore, an external thread is provided on the outer side wall of the vertical rod, and an internal thread is provided on the inner side wall of the top plate. The vertical rod and the top plate are threadedly connected, enabling the overall structure to be disassembled.

[0013] Furthermore, the fixing structure includes a clamping block, a first cylinder, a connecting block, a slider, a chute, a second cylinder, and a fixing block. The fixing blocks are installed on both sides of the top end of the working plate. A second cylinder is installed on one side of the fixing block. A connecting block is installed on one side of the second cylinder. A slider is provided at the bottom end of the connecting block. A clamping block is installed at the top end of the first cylinder, facilitating the fixing of the mold.

[0014] Furthermore, a slider is installed at the bottom end of the connecting block. The chutes are provided on both sides inside the working plate. The chutes and the sliders form a sliding structure, enabling the fixing structure to move in a specific direction.

[0015] Furthermore, moving structures are provided on both sides inside the mold housing. The moving structures include guiding pulleys, telescopic rods, and limit blocks. The telescopic rods are installed at the bottom end of the pressing plate. A limit block is provided at the bottom end of the telescopic rod, allowing the telescopic rod to move up and down.

[0016] Furthermore, guiding pulleys are provided on both sides of the telescopic rod. The guiding pulleys are symmetrically distributed about the central axis of the telescopic rod, restricting the position of the telescopic rod.

[0017] Furthermore, the guiding pulleys and the telescopic rods form a sliding structure. The inner diameter of the guiding pulleys is larger than the outer diameter of the telescopic rods, ensuring that the up and down movement of the telescopic rods is completely vertical.

[0018] The high-efficiency semiconductor forming die provided by the utility model has the following advantages: By arranging a top block at the bottom end of the die of the high-efficiency semiconductor forming die, after the die is manufactured, the hydraulic rod drives the pressing plate to rise. While the pressing plate rises, the telescopic rod stretches to the longest, drives the limiting block to rise, lifts the connecting rod together, and drives the top block to rise, so as to eject the semiconductor inside the die, thereby achieving the purpose of pushing out the manufactured semiconductor in the die and realizing automatic demoulding.

[0019] The die is fixed by arranging a fixing structure on the working plate. After the die is placed in the die shell, the first cylinder is used to push the connecting block, so that the slider slides in the chute, and then the clamping block is lifted by the second cylinder to fix the die. When replacing a new die, the first cylinder and the second cylinder can be used to adjust the clamping block to adapt to different sizes of different dies, thereby achieving the purpose of pushing out the manufactured semiconductor in the die and facilitating the replacement of the die. Brief Description of the Drawings

[0020] Figure 1 is a three-dimensional structural schematic diagram of the utility model;

[0021] Figure 2 is a front view structural schematic diagram of the utility model;

[0022] Figure 3 is a front view sectional structural schematic diagram of the utility model;

[0023] Figure 4 is the utility model Figure 3 the enlarged partial sectional structural schematic diagram at A in;

[0024] Figure 5 is the front view partial sectional structural schematic diagram of the demoulding structure of the utility model.

[0025] Explanation of the reference numerals in the drawings: 1, top plate; 2, vertical rod; 3, working plate; 4, support frame; 5, hydraulic rod; 6, pressing plate; 7, die; 8, die shell; 9, fixing structure; 901, clamping block; 902, first cylinder; 903, connecting block; 904, slider; 905, chute; 906, second cylinder; 907, fixing block; 10, moving structure; 1001, guiding pulley; 1002, telescopic rod; 1003, limiting block; 11, demoulding structure; 1101, top block; 1102, limiting pulley; 1103, connecting rod; 1104, rubber pad. Detailed Description of the Invention

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0027] Please refer to Figures 1-5 , an embodiment provided by the present invention: a high-efficiency semiconductor forming mold, including a top plate 1.

[0028] A vertical rod 2 is installed at the bottom end of the top plate 1. An external thread is provided on the outer side wall of the vertical rod 2, and an internal thread is provided on the inner side wall of the top plate 1. The vertical rod 2 and the top plate 1 are threadedly connected. A working plate 3 is installed at the bottom end of the vertical rod 2, and a support frame 4 is installed at the bottom end of the working plate 3.

[0029] A hydraulic rod 5 is installed in the middle of the bottom end of the top plate 1. A pressing plate 6 is installed at the bottom end of the hydraulic rod 5. A mold shell 8 is installed in the middle of the top end of the working plate 3.

[0030] Moving structures 10 are provided on both sides inside the mold shell 8. The moving structure 10 includes a guiding pulley 1001, a telescopic rod 1002, and a limiting block 1003. The telescopic rod 1002 is installed at the bottom end of the pressing plate 6. A limiting block 1003 is provided at the bottom end of the telescopic rod 1002. A mold 7 is provided at the top end inside the mold shell 8.

[0031] Referring to the attached Figures 3-5 As shown, the telescopic rod 1002 is divided into three sections and can overlap with each other when compressed. The guiding pulley 1001 is arranged inside the sliding groove. In this way, when the telescopic rod 1002 moves up and down, it will maintain vertical movement due to the limitation of the guiding pulley 1001.

[0032] Fixing structures 9 are installed on both sides of the top end of the working plate 3. The fixing structure 9 includes a clamping block 901, a first cylinder 902, a connecting block 903, a slider 904, a sliding groove 905, a second cylinder 906, and a fixing block 907. The fixing blocks 907 are installed on both sides of the top end of the working plate 3. A second cylinder 906 is installed on one side of the fixing block 907. A connecting block 903 is installed on one side of the second cylinder 906. A slider 904 is installed at the bottom end of the connecting block 903. The sliding groove 905 is arranged on both sides inside the working plate 3. The sliding groove 905 and the slider 904 form a sliding structure

[0033] A slider 904 is provided at the bottom end of the connecting block 903. A clamping block 901 is installed at the top end of the first cylinder 902.

[0034] Referring to the attached Figures 1-3As shown, a fixing structure 9 is provided on the working plate to fix the mold 7. After the mold 7 is placed in the mold housing 8, the connecting block 903 is pushed by the first cylinder 902, so that the slider 904 slides in the chute 905, and then the clamping block 901 is lifted by the second cylinder 906 to fix the mold 7. When replacing the new mold 7, the first cylinder 902 and the second cylinder 906 can be used to adjust the clamping block 901 to adapt to different sizes of different molds 7.

[0035] A demolding structure 11 is provided at the bottom end of the mold 7. The demolding structure 11 includes a top block 1101, a limiting pulley 1102, a connecting rod 1103 and a rubber pad 1104. The top block 1101 is provided at the bottom end of the mold 7, and a connecting rod 1103 is installed at the bottom end of the top block 1101. Limiting pulleys 1102 are provided on both sides of the connecting rod 1103.

[0036] Guide pulleys 1001 are provided on both sides of the telescopic rod 1002. The guide pulleys 1001 and the telescopic rod 1002 form a sliding structure, and the inner diameter of the guide pulley 1001 is greater than the outer diameter of the telescopic rod 1002.

[0037] The guide pulleys 1001 are symmetrically distributed about the central axis of the telescopic rod 1002, and rubber pads 1104 are provided at both ends of the connecting rod 1103.

[0038] Refer to the appendix Figure 3 and the appendix Figure 5 As shown, a top block 1101 is provided at the bottom end of the mold 7. After the semiconductor is manufactured, the pressing plate 6 is driven to rise by the hydraulic rod. While the pressing plate 6 rises, the telescopic rod 1002 is stretched to the longest, driving the limiting block 1003 to rise, lifting the connecting rod 1103 together, driving the top block 1101 to rise, and pushing the manufactured semiconductor out of the mold 7.

[0039] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An efficient semiconductor forming die, comprising a top plate (1); It is characterized in that: A vertical rod (2) is installed at the bottom end of the top plate (1), a working plate (3) is installed at the bottom end of the vertical rod (2), and a support frame (4) is installed at the bottom end of the working plate (3); A hydraulic rod (5) is installed in the middle of the bottom end of the top plate (1), a pressing plate (6) is installed at the bottom end of the hydraulic rod (5), a die housing (8) is installed in the middle of the top end of the working plate (3), a die (7) is arranged at the top end inside the die housing (8), and fixing structures (9) are installed on both sides of the top end of the working plate (3); A demoulding structure (11) is arranged at the bottom end of the die (7). The demoulding structure (11) includes a top block (1101), a limiting pulley (1102), a connecting rod (1103) and a rubber pad (1104). The top block (1101) is arranged at the bottom end of the die (7), a connecting rod (1103) is installed at the bottom end of the top block (1101), limiting pulleys (1102) are arranged on both sides of the connecting rod (1103), and rubber pads (1104) are arranged at both ends of the connecting rod (1103).

2. An efficient semiconductor molding die according to claim 1, wherein: External threads are arranged on the outer side wall of the vertical rod (2), internal threads are arranged on the inner side wall of the top plate (1), and the vertical rod (2) and the top plate (1) form a threaded connection.

3. An efficient semiconductor molding die according to claim 1, characterized in that: The fixing structure (9) includes a clamping block (901), a first cylinder (902), a connecting block (903), a slider (904), a chute (905), a second cylinder (906) and a fixing block (907). The fixing blocks (907) are installed on both sides of the top end of the working plate (3), a second cylinder (906) is installed on one side of the fixing block (907), a connecting block (903) is installed on one side of the second cylinder (906), a slider (904) is arranged at the bottom end of the connecting block (903), and a clamping block (901) is installed at the top end of the first cylinder (902).

4. An efficient semiconductor forming mold according to claim 3, characterized in that: A slider (904) is installed at the bottom end of the connecting block (903), the chutes (905) are arranged on both sides inside the working plate (3), and the chutes (905) and the sliders (904) form a sliding structure.

5. An efficient semiconductor molding die according to claim 1, characterized in that: Moving structures (10) are arranged on both sides inside the die housing (8). The moving structures (10) include guiding pulleys (1001), telescopic rods (1002) and limiting blocks (1003). The telescopic rods (1002) are installed at the bottom end of the pressing plate (6), and limiting blocks (1003) are arranged at the bottom ends of the telescopic rods (1002).

6. The high-efficiency semiconductor forming die according to claim 5, wherein: Guiding pulleys (1001) are arranged on both sides of the telescopic rod (1002), and the guiding pulleys (1001) are symmetrically distributed about the central axis of the telescopic rod (1002).

7. An efficient semiconductor molding die according to claim 5, characterized in that: The guiding pulleys (1001) and the telescopic rods (1002) form a sliding structure, and the inner diameter of the guiding pulleys (1001) is larger than the outer diameter of the telescopic rods (1002).

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