Semiconductor double-head printing machine

Abstract

The utility model relates to the field of semiconductors, in particular to a semiconductor double-head printing machine which comprises two working stations which are symmetrically arranged, each working station comprises a feeding mechanism, a working table, a glue brushing mechanism and a detection mechanism, the feeding mechanism is used for feeding material pieces to the working table, and the glue brushing mechanism is used for brushing glue on the working table. The detection mechanism is used for carrying out position detection and glue point detection on the material sheets on the workbench; the glue brushing mechanism conducts glue brushing treatment on the material pieces on the workbench. By means of the integrated design, the two workstations operate at the same time, the total period of chip printing is effectively shortened, and compared with traditional split type alternate operation of 3-5 workstations, the production efficiency is remarkably improved. And the built-in detection mechanism monitors the position of the material sheet and the glue point in real time, so that the accuracy of the glue brushing position is ensured, and errors possibly caused by manual operation are avoided. In addition, the detection mechanism is combined, product quality problems can be automatically recognized and alarmed in the production process, defective product outflow is reduced, and the quality control capacity of a production line is enhanced.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to a semiconductor double-head printing machine. Background Technique

[0002] In the field of semiconductor manufacturing, the printing process has always been a crucial link. However, there are many defects in traditional semiconductor printing technologies, which seriously restrict the improvement of production efficiency and product quality.

[0003] Traditional semiconductor printing processes usually adopt a split-type workstation layout. The entire printing process needs to be alternately completed between 3-5 independent workstations. This decentralized workstation layout not only occupies a large area, increasing the investment costs of the factory building and equipment, but also has a cumbersome and complex work process, requiring frequent material transfer and manual intervention. This not only leads to low production efficiency, but also increases the labor intensity of operators, prone to human errors, and thus affects the printing quality and stability of products.

[0004] In addition, due to the lack of tight connection between workstations in traditional printing processes, it is easy to have delays and distortions in information transmission, resulting in poor coordination of the entire production line. This not only affects the control of the production progress, but also increases the difficulty and complexity of production management. Summary of the Invention

[0005] To solve the above problems, the utility model provides a semiconductor double-head printing machine. Through an integrated design, two workstations operate simultaneously, effectively shortening the total cycle of chip printing. Compared with the alternate operation of 3-5 traditional split-type workstations, the production efficiency is significantly improved.

[0006] To achieve the above object, the technical solution adopted by the utility model is: a semiconductor double-head printing machine, including two symmetrically arranged workstations. Each workstation includes a feeding mechanism, a workbench, a glue-brushing mechanism, and a detection mechanism. The feeding mechanism is used to send the wafer to the workbench, and the detection mechanism is used to perform position detection and glue point detection on the wafer located on the workbench; the glue-brushing mechanism performs glue-brushing treatment on the wafer on the workbench.

[0007] Further, the feeding mechanism includes a feeding support. One end of the feeding support is provided with a feeding bracket. The bottom surface of the feeding bracket is provided with a first guide wheel set passing through the feeding bracket, and a second guide wheel set is also provided above the feeding bracket. The wafer passes through the space between the first guide wheel set and the second guide wheel set.

[0008] Furthermore, the feeding mechanism further includes a clamping and fixing device and a linear driving device. The clamping and fixing device includes clamping cylinders and clamping and fixing brackets located on both sides of the feeding bracket. First sliding rails are provided on both sides of the feeding bracket, and first sliders are slidably arranged on each first sliding rail. The clamping and fixing brackets are assembled on the first sliders, and the clamping cylinders are fixed at the clamping and fixing brackets.

[0009] Furthermore, the linear driving device includes a linear screw motor and a motor fixing bracket. The linear screw motor is assembled on the feeding bracket. At the same time, the output end of the linear screw motor is connected to the motor fixing bracket, and both sides of the motor fixing bracket are respectively connected to the clamping and fixing brackets.

[0010] Furthermore, the workbench includes a sheet supporting plate and a supporting bracket. The supporting bracket is assembled at the bottom of the sheet supporting plate. A plurality of negative pressure holes are provided on the surface of the sheet supporting plate. A negative pressure cavity communicating with the negative pressure holes is arranged inside the sheet supporting plate, and the negative pressure cavity is connected to a negative pressure device, so that the negative pressure holes achieve a negative pressure adsorption effect.

[0011] Furthermore, the detection mechanism includes an X1-axis driving module, a Y1-axis driving module, a detection camera, and a detection fixing bracket. The X1-axis driving module is connected to the detection fixing bracket and drives the detection fixing bracket to move along the X-axis direction in space. At the same time, the Y1-axis driving module is assembled on the detection fixing bracket, and the detection camera moves along the Y-axis direction in space through the Y1-axis driving module. Therefore, the X1-axis driving module and the Y1-axis driving module drive the detection camera to move along the X-axis and Y-axis directions in space, and detect the sheet located on the surface of the sheet supporting plate.

[0012] Furthermore, the glue brushing mechanism includes an X2-axis driving module, an X3-axis driving component, a glue brushing fixing bracket, a Z2-axis driving module, a glue brushing screen plate, and a glue brushing component. The Z2-axis driving module is drivingly connected to the glue brushing fixing bracket. At the same time, the glue brushing component is assembled on the glue brushing fixing bracket through the X2-axis driving component, and the glue brushing screen plate is assembled on the glue brushing fixing bracket through the X3-axis driving component, and the glue brushing screen plate is located below the glue brushing component.

[0013] Furthermore, a screen plate cleaning structure is further included. The screen plate cleaning structure includes a cleaning fixing bracket arranged on one side of the detection fixing bracket, and two cleaning brush rollers for cleaning the bottom of the screen plate are also arranged on the cleaning fixing bracket.

[0014] The beneficial effects of the present utility model are as follows: Through an integrated design, two workstations operate simultaneously, effectively shortening the total cycle of chip printing. Compared with the alternating operation of 3 - 5 traditional separate workstations, the production efficiency is significantly improved. The built-in detection mechanism monitors the position of the wafer and the glue dots in real time, ensuring the accuracy of the glue application position, avoiding errors that may be introduced by manual operation, and thus improving the product yield and quality stability. Additionally, combined with the detection mechanism, the AOI defect detection system can automatically identify and alarm product quality problems during the production process, reducing the outflow of defective products and enhancing the quality control ability of the production line. Moreover, in this application, the highly automated feeding, detection, and glue application processes reduce the dependence on manual labor, lower the labor cost, and also reduce the uncertainty and risks caused by human factors. Description of the Drawings

[0015] Figure 1 is a schematic structural diagram of a semiconductor double - head printer.

[0016] Figure 2 is a schematic structural diagram of the feeding mechanism.

[0017] Figure 3 is a schematic structural diagram of the feeding mechanism from another perspective.

[0018] Figure 4 is a schematic structural diagram of the workbench.

[0019] Figure 5 is a schematic structural diagram of the detection mechanism and the stencil cleaning structure.

[0020] Figure 6 is a schematic structural diagram of the glue application mechanism.

[0021] Explanation of the Reference Numerals in the Drawings:

[0022] Feeding mechanism 1, Workbench 2, Glue application mechanism 40, Detection mechanism 3, Stencil cleaning structure 4, Feeding support 11, In - feeding support 12, First guide wheel set 13, Second guide wheel set 14, Clamping cylinder 15, Clamping fixed support 16, First slide rail 17, First slider 18, Linear screw motor 19, Motor fixed support 110, Wafer support plate 21, Support support 22, Negative pressure holes 23, X1 - axis drive module 31, Y1 - axis drive module 32, Detection camera 33, Detection fixed support 34, Cleaning fixed support 35, Cleaning brush 36, X2 - axis drive module 41, X3 - axis drive assembly 42, Glue application fixed support 43, Z2 - axis drive module 44, Glue application stencil 45, Glue application assembly 46. Detailed Embodiment

[0023] Please refer to Figures 1-6As shown in the figure, the present utility model relates to a semiconductor double-head printing machine, which includes two workstations symmetrically arranged. Each workstation includes a feeding mechanism 1, a workbench 2, a glue brushing mechanism 40, and a detection mechanism 3. The feeding mechanism 1 is used to send the wafers to the workbench 2, and the detection mechanism 3 is used to perform position detection and glue dot detection on the wafers located on the workbench 2; the glue brushing mechanism 40 performs glue brushing treatment on the wafers on the workbench 2.

[0024] Through an integrated design, the two workstations operate simultaneously, effectively shortening the total cycle of chip printing. Compared with the traditional alternating operation of 3 - 5 split workstations, the production efficiency is significantly improved. The built-in detection mechanism 3 monitors the position and glue dots of the wafers in real time, ensuring the accuracy of the glue brushing position, avoiding errors that may be introduced by manual operation, thereby improving the yield and quality stability of the products. In addition, combined with the detection mechanism 3, the AOI defect detection system can automatically identify and alarm product quality problems during the production process, reduce the outflow of defective products, and enhance the quality control ability of the production line. Moreover, in this application, the highly automated feeding, detection, and glue brushing processes reduce the dependence on manual labor, lower the labor cost, and also reduce the uncertainty and risks caused by human factors.

[0025] Furthermore, the feeding mechanism 1 includes a feeding support 11. One end of the feeding support 11 is provided with a feeding-in support 12. The bottom surface of the feeding-in support 12 is provided with a first guide wheel group 13 passing through the feeding-in support 12, and a second guide wheel group 14 is also provided above the feeding-in support 12. The wafers pass through the space between the first guide wheel group 13 and the second guide wheel group 14.

[0026] The wafers pass through the space between the first guide wheel group 13 and the second guide wheel group 14. The main function of this design is to ensure that the wafers can enter the subsequent processing process of the workbench 2 smoothly and accurately. The first guide wheel group 13 and the second guide wheel group 14 together form an accurate guiding channel, and the space between them provides a stable transmission path for the wafers. The advantage of this design is that it can effectively guide the wafers to move along a predetermined trajectory, avoiding misalignment or deviation during the transmission process. Through the precise control of the guide wheel group, the wafers can maintain their original position and posture, thus ensuring the accuracy and reliability during position detection and glue dot detection on the workbench 2. In addition, the setting of the guide wheel group also reduces the friction and wear between the wafers and the transmission mechanism, extends the service life of the equipment, and reduces the maintenance cost. At the same time, it also improves the automation level of the entire production process, reduces the need for manual intervention, and further improves the production efficiency and product quality.

[0027] Furthermore, the feeding mechanism 1 further includes a clamping and fixing device and a linear driving device. The clamping and fixing device includes clamping cylinders 15 and clamping and fixing brackets 16 located on both sides of the feeding bracket 11. First sliding rails 17 are provided on both sides of the feeding bracket 11, and first sliders 18 are slidably arranged on each first sliding rail 17. The clamping and fixing brackets 16 are assembled on the first sliders 18, and the clamping cylinders 15 are fixed to the clamping and fixing brackets 16.

[0028] In addition to the previously mentioned first guide wheel set 13 and second guide wheel set 14, the feeding mechanism 1 also integrates a clamping and fixing device and a linear driving device. These components work together to achieve precise control and stable transmission of the sheet. The clamping and fixing device consists of clamping cylinders 15, clamping and fixing brackets 16, and first sliding rails 17 and first sliders 18 on both sides of the feeding bracket 11. The clamping cylinders 15 are fixed to the clamping and fixing brackets 16, and the clamping and fixing brackets 16 slide on the first sliding rails 17 through the first sliders 18. This design allows the clamping and fixing device to move flexibly in the horizontal direction to adapt to sheets of different sizes and positions.

[0029] After the sheet passes through the space between the first guide wheel set 13 and the second guide wheel set 14, the clamping and fixing device will respond quickly and firmly clamp the sheet through the action of the clamping cylinders 15. Subsequently, the linear driving device is activated, and by driving the clamping and fixing brackets 16 to move along the first sliding rails 17, the clamped sheet is smoothly sent to the workbench 2. This combination of clamping and fixing and linear driving not only improves the stability and accuracy of sheet transmission but also ensures the position accuracy of the sheet during subsequent processing on the workbench 2. At the same time, it reduces production interruptions and defective rates caused by sheet misalignment or offset, improving the overall production efficiency and product quality.

[0030] Furthermore, the linear driving device includes a linear screw motor 19 and a motor fixing bracket 110. The linear screw motor 19 is assembled on the feeding bracket 11. At the same time, the output end of the linear screw motor 19 is connected to the motor fixing bracket 110, and both sides of the motor fixing bracket 110 are respectively connected to the clamping and fixing brackets 16.

[0031] Specifically, the linear screw motor 19 is carefully assembled on the feeding bracket 11, and its output end is directly connected to the motor fixing bracket 110. This connection method ensures that the linear screw motor 19 can provide driving force stably and reliably. On both sides of the motor fixing bracket 110, they are respectively tightly connected to the clamping and fixing brackets 16, forming a solid mechanical structure.

[0032] When the linear screw motor 19 starts, it drives the motor fixing bracket 110 to move linearly along the predetermined track of the feeding bracket 11. Due to the firm connection between the motor fixing bracket 110 and the clamping fixing bracket 16, the clamping fixing bracket 16 will also move accordingly, and then the clamping cylinder 15 will move synchronously. In this way, the sheet clamped on the clamping cylinder 15 can be smoothly and accurately conveyed to the workbench 2. The application of the linear screw motor 19 not only improves the power transmission efficiency of the feeding mechanism 1, but also makes the whole conveying process more stable and reliable. At the same time, the cooperation between the motor fixing bracket 110 and the clamping fixing bracket 16 also ensures that the sheet will not be displaced or deviated during the conveying process, thereby further improving the production efficiency and product quality.

[0033] Furthermore, the workbench 2 includes a sheet supporting plate 21 and a supporting bracket 22. The supporting bracket 22 is assembled at the bottom of the sheet supporting plate 21, and a plurality of negative pressure holes 23 are formed on the surface of the sheet supporting plate 21. A negative pressure cavity communicated with the negative pressure holes 23 is arranged inside the sheet supporting plate 21, and the negative pressure cavity is connected with a negative pressure device, so that the negative pressure holes 23 achieve the effect of negative pressure adsorption.

[0034] The design of the sheet supporting plate 21 is particularly crucial. A plurality of negative pressure holes 23 are carefully formed on its surface. These negative pressure holes 23 do not exist in isolation, but are closely connected to the negative pressure cavity inside the sheet supporting plate 21. The negative pressure cavity is further communicated with the negative pressure device to form a complete negative pressure system. When the negative pressure device starts, the air in the negative pressure cavity is quickly pumped out to form a negative pressure environment. This negative pressure environment acts on the surface of the sheet through the negative pressure holes 23 to achieve the negative pressure adsorption effect on the sheet. This adsorption method not only ensures the stable positioning of the sheet on the workbench 2, but also avoids the displacement or falling off of the sheet caused by vibration or external force during the printing process.

[0035] Furthermore, the detection mechanism 3 includes an X1-axis driving module 31, a Y1-axis driving module 32, a detection camera 33, and a detection fixing bracket 34. The X1-axis driving module 31 is connected to the detection fixing bracket 34 and drives the detection fixing bracket 34 to move along the X-axis direction in space. At the same time, the Y1-axis driving module 32 is assembled on the detection fixing bracket 34, and the detection camera 33 moves along the Y-axis direction in space through the Y1-axis driving module 32. Therefore, the X1-axis driving module 31 and the Y1-axis driving module 32 drive the detection camera 33 to move along the X-axis and Y-axis directions in space, and detect the sheet located on the surface of the sheet supporting plate 21.

[0036] The X1-axis drive module 31 is tightly connected to the detection fixing bracket 34. Through precise drive control, it can drive the detection fixing bracket 34 to move along the X-axis direction in space. This mobility enables the detection mechanism 3 to cover different areas on the surface of the sheet support plate 21, realizing a comprehensive detection of the sheets on the entire workbench 2. At the same time, the Y1-axis drive module 32 is ingeniously installed on the detection fixing bracket 34, which is responsible for driving the detection camera 33 to move along the Y-axis direction in space. In this way, the detection camera 33 can not only move along with the detection fixing bracket 34 in the X-axis direction but also move in the Y-axis direction to ensure accurate detection of every detail of the sheet. Through the coordinated action of the X1-axis drive module 31 and the Y1-axis drive module 32, the detection camera 33 can move freely in the two-dimensional space, flexibly coping with sheets in different positions and postures. This flexibility and precision greatly improve the detection efficiency and accuracy, providing reliable data support for subsequent glue brushing treatment.

[0037] First, when the sheet is accurately conveyed to the workbench 2 by the feeding mechanism 1 and stably placed on the sheet support plate 21, the detection process is immediately started. At this time, the detection camera 33 in the detection mechanism 3 moves along the X-axis and Y-axis directions in space under the precise control of the X1-axis and Y1-axis drive modules 32 to perform a full-range position detection of the sheet.

[0038] Once the detection camera 33 confirms that the position of the sheet is accurate, the control system will issue an instruction to start the glue brushing mechanism 40 for glue brushing operation. The glue brushing mechanism 40 moves the glue brushing component 46 and the glue brushing screen plate 45 to the specified position to perform uniform glue brushing on the sheet. During this process, the coordinated work of the glue brushing component 46 and the glue brushing screen plate 45 ensures the precise coating of the glue and improves the printing quality. After the glue brushing operation is completed, the detection mechanism 3 is started again to detect the glue dots on the sheet. This time, the detection camera 33 mainly focuses on key parameters such as the distribution, shape, and size of the glue dots to ensure that they meet the preset standards and requirements. Through this step, any possible glue dot defect problems can be detected and corrected in a timely manner, thereby further improving the product qualification rate and quality.

[0039] Furthermore, the glue brushing mechanism 40 includes an X2-axis drive module 41, an X3-axis drive assembly 42, a glue brushing fixing bracket 43, a Z2-axis drive module 44, a glue brushing screen plate 45, and a glue brushing component 46. Among them, the Z2-axis drive module 44 is drivingly connected to the glue brushing fixing bracket 43. At the same time, the glue brushing component 46 is installed on the glue brushing fixing bracket 43 through the X2-axis drive module 41, and the glue brushing screen plate 45 is installed on the glue brushing fixing bracket 43 through the X3-axis drive assembly 42, and the glue brushing screen plate 45 is located below the glue brushing component 46.

[0040] In the design of the glue brushing mechanism 40 of a semiconductor double - head printing machine, in order to achieve precise and efficient glue brushing operations, a multi - axis drive and modular combination method is adopted. Specifically, the glue brushing mechanism 40 consists of key components such as the X2 - axis drive module 41, X3 - axis drive assembly 42, glue brushing fixed bracket 43, Z2 - axis drive module 44, glue brushing screen plate 45, and glue brushing assembly 46. As one of the core drive components of the glue brushing mechanism 40, the Z2 - axis drive module 44 is drivingly connected to the glue brushing fixed bracket 43. Through the precise control of the Z2 - axis drive module 44, the position of the glue brushing fixed bracket 43 and the glue brushing assembly 46 and glue brushing screen plate 45 mounted on it in the vertical direction (Z - axis direction) can be adjusted. This vertical adjustment ability ensures that the glue brushing assembly 46 can perform precise glue brushing operations according to the actual position and height of the wafer.

[0041] The glue brushing assembly 46 is mounted on the glue brushing fixed bracket 43 through the X2 - axis drive assembly. The role of the X2 - axis drive assembly is to move the glue brushing assembly 46 in the horizontal direction (X - axis direction) so that it can cover different areas of the wafer and perform glue brushing. This horizontal mobility makes the glue brushing operation more flexible and efficient.

[0042] At the same time, the glue brushing screen plate 45 is also mounted on the glue brushing fixed bracket 43 through the X3 - axis drive assembly 42 and is located below the glue brushing assembly 46. The main role of the glue brushing screen plate 45 is to ensure that the glue can be evenly and stably coated on the wafer during the glue brushing process. Through the precise control of the X3 - axis drive assembly 42, the position of the glue brushing screen plate 45 in the horizontal direction can be adjusted to adapt to wafers of different sizes and shapes.

[0043] Furthermore, it also includes a screen plate cleaning structure 4, where the screen plate cleaning structure 4 includes a cleaning fixed bracket 35 arranged on one side of the detection fixed bracket 34, and two cleaning roller brushes 36 for cleaning the bottom of the screen plate are also arranged on the cleaning fixed bracket 35.

[0044] The cleaning fixed bracket 35 serves as the support foundation of the screen plate cleaning structure 4, and its design is stable and reliable. On the cleaning fixed bracket 35, two cleaning roller brushes 36 are installed, and these two roller brushes are specifically used for deep cleaning of the bottom of the screen plate. When the glue brushing operation is completed, the cleaning roller brushes 36 will be automatically started under the drive of the control system to thoroughly remove the residues attached to the bottom of the screen plate. The existence of the screen plate cleaning structure 4 not only improves the production efficiency of the semiconductor double - head printing machine but also reduces the maintenance cost. By regularly cleaning the screen plate, problems such as a decline in printing quality caused by the accumulation of glue residues can be avoided, thus ensuring the quality stability of the product. At the same time, the automated operation of the cleaning roller brushes 36 also reduces the labor intensity of the operators and improves the automation level of the production line.

[0045] The above embodiments are only descriptions of the preferred embodiments of the present invention, and do not limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of the present invention shall fall within the protection scope determined by the claims of the present invention.

Claims

1. A semiconductor double-headed printing machine, characterized in that, It includes two workstations arranged symmetrically, each of which includes a feeding mechanism, a workbench, a glue brushing mechanism, and a detection mechanism. The feeding mechanism is used to send the sheet to the workbench, and the detection mechanism is used to perform position detection and glue point detection on the sheet located on the workbench; the glue brushing mechanism performs glue brushing treatment on the sheet on the workbench.

2. A semiconductor double-head printing machine according to claim 1, characterized in that: The feeding mechanism includes a feeding support. One end of the feeding support is provided with a feeding bracket. The bottom surface of the feeding bracket is provided with a first guide wheel group passing through the feeding bracket, and a second guide wheel group is also provided above the feeding bracket. The sheet passes through the space between the first guide wheel group and the second guide wheel group.

3. A semiconductor double-headed printing machine according to claim 2, characterized in that: The feeding mechanism further includes a clamping and fixing device and a linear driving device. The clamping and fixing device includes clamping cylinders and clamping fixing brackets located on both sides of the feeding support. First sliding rails are provided on both sides of the feeding support, and a first slider is slidably arranged on each first sliding rail. The clamping fixing bracket is assembled on the first slider, and the clamping cylinder is fixed at the clamping fixing bracket.

4. A semiconductor double-headed printing machine according to claim 3, characterized in that: The linear driving device includes a linear screw motor and a motor fixing bracket. The linear screw motor is assembled on the feeding support. At the same time, the output end of the linear screw motor is connected to the motor fixing bracket, and both sides of the motor fixing bracket are respectively connected to the clamping fixing brackets.

5. A semiconductor double-headed printing machine according to claim 4, characterized in that: The workbench includes a sheet support plate and a support bracket. The support bracket is assembled at the bottom of the sheet support plate. A plurality of negative pressure holes are formed on the surface of the sheet support plate. A negative pressure cavity communicating with the negative pressure holes is arranged inside the sheet support plate, and the negative pressure cavity is connected to a negative pressure device to achieve a negative pressure adsorption effect for the negative pressure holes.

6. A semiconductor double-head printing machine according to claim 5, characterized in that: The detection mechanism includes an X1-axis driving module, a Y1-axis driving module, a detection camera, and a detection fixing bracket. The X1-axis driving module is connected to the detection fixing bracket and drives the detection fixing bracket to move along the X-axis direction in space. At the same time, the Y1-axis driving module is assembled on the detection fixing bracket, and the detection camera moves along the Y-axis direction in space through the Y1-axis driving module. Therefore, the X1-axis driving module and the Y1-axis driving module drive the detection camera to move along the X-axis and Y-axis directions in space and perform detection on the sheet located on the surface of the sheet support plate.

7. A semiconductor double-headed printing machine according to claim 6, characterized in that: The glue brushing mechanism includes an X2-axis driving module, an X3-axis driving component, a glue brushing fixing bracket, a Z2-axis driving module, a glue brushing mesh plate, and a glue brushing component. The Z2-axis driving module is drivingly connected to the glue brushing fixing bracket. At the same time, the glue brushing component is assembled on the glue brushing fixing bracket through the X2-axis driving component, the glue brushing mesh plate is assembled on the glue brushing fixing bracket through the X3-axis driving component, and the glue brushing mesh plate is located below the glue brushing component.

8. A semiconductor double-headed printing machine according to claim 7, characterized in that: It further includes a mesh plate cleaning structure. The mesh plate cleaning structure includes a cleaning fixing bracket arranged on one side of the detection fixing bracket, and two cleaning rotating brushes for cleaning the bottom of the mesh plate are also arranged on the cleaning fixing bracket.

Images