Circuit board copper deposition equipment

Abstract

The utility model belongs to the technical field of circuit board copper deposition, and discloses circuit board copper deposition equipment, which comprises a copper deposition box, a suspensible placement assembly is arranged in the copper deposition box, the placement assembly comprises a bottom frame, the outer side of the bottom frame is fixedly connected with a plurality of vertical rods, hangers are fixed on the vertical rods, and the hangers are arranged on the bottom frame. The hanging pieces are hung on the edge of the top of the copper deposition box, positioning rods are installed at the four corners of the top of the bottom frame, the positioning rods are sequentially sleeved with a plurality of circuit boards and spacer bushes, the spacer bushes are used for separating the adjacent circuit boards, the hanging pieces are in threaded connection with first locking bolts, and the tail ends of the first locking bolts abut against the copper deposition box. According to the utility model, the suspensible placing assembly is adopted, the operation convenience and flexibility are improved, the circuit boards are sleeved on the positioning rods, the adjacent circuit boards are separated through the spacer bushes, copper deposition processing can be carried out on a plurality of circuit boards at one time, and the stability of the circuit boards in the copper deposition process can be ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of electroless copper plating for circuit boards, and particularly relates to an electroless copper plating device for circuit boards. Background Art

[0002] Electroless copper plating is a process in circuit board manufacturing, usually also called copper deposition or hole metallization, which is a self-catalytic oxidation-reduction reaction; first, the insulating substrate surface is treated with an activator to adsorb a layer of active particles, usually metal palladium particles. Copper ions are first reduced on these active metal palladium particles, and these reduced copper crystal nuclei themselves become the catalytic layer of copper ions, enabling the reduction reaction of copper to continue on the surface of these new copper crystal nuclei. Thus, it is prepared using an electroless copper plating device.

[0003] For example, the Chinese patent with the publication number CN220952053U discloses an electroless copper plating device for circuit boards. When the driving motor is started, the driving motor drives the screw to rotate, and the rotation of the screw drives the slider to slide upward to raise the placing mechanism, and the circuit board is placed between the placing plates in the square groove above the placing mechanism; although the circuit board can be placed, the stability and reliability of the circuit board are not good, which easily leads to the shaking and falling off of the circuit board during the electroless copper plating process, affecting the electroless copper plating effect. Content of the Utility Model

[0004] To solve the above technical problems, the utility model provides an electroless copper plating device for circuit boards, aiming to solve to a certain extent the technical problems in the prior art that the stability and reliability of the circuit board are not good, which easily leads to the shaking and falling off of the circuit board during the electroless copper plating process, affecting the electroless copper plating effect.

[0005] The technical solution of the utility model is: an electroless copper plating device for circuit boards, including an electroless copper plating tank, and a hangable placing component is arranged inside the electroless copper plating tank;

[0006] The placing component includes a bottom frame, multiple vertical rods are fixedly connected to the outside of the bottom frame, hanging parts are fixed on the vertical rods, and the hanging parts are hung on the edge of the top of the electroless copper plating tank;

[0007] Positioning rods are installed at the four corners of the top of the bottom frame, and multiple circuit boards and spacers are sequentially sleeved on the positioning rods, and the spacers are used to separate adjacent circuit boards.

[0008] In some embodiments, a first locking bolt is threadedly connected to the hanging part, and the end of the first locking bolt abuts against the electroless copper plating tank.

[0009] In some embodiments, the bottom frame includes a frame, multiple partition strips are linearly and equidistantly fixedly connected to the inside of the frame, and multiple fixing holes are linearly and equidistantly opened on the frame and the partition strips.

[0010] In some embodiments, the fixing hole is a threaded hole, and an external threaded portion is provided at the bottom of the vertical rod, and the external threaded portion is threadedly inserted into the internal thread hole.

[0011] In some embodiments, a locking member is sleeved on the outer surface of the positioning rod, and the bottom of the locking member abuts against the top of the uppermost circuit board.

[0012] In some embodiments, the locking member includes a pressing sleeve and a locking sleeve. The locking sleeve is fixedly connected to the top of the pressing sleeve. The pressing sleeve and the locking sleeve are sleeved on the positioning rod. A second locking bolt is threadedly connected to the outside of the locking sleeve, and the end of the second locking bolt abuts against the outer surface of the positioning rod.

[0013] In some embodiments, a vertical groove is provided in the middle of the positioning rod, and positioning strips are fixedly connected to the middle parts inside the pressing sleeve and the locking sleeve, and the positioning strips are slidably connected inside the vertical groove.

[0014] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages: The device adopts a suspendable placement component, which improves the convenience and flexibility of operation. The circuit boards are sleeved on the positioning rod, and adjacent circuit boards are separated by spacer sleeves. Multiple circuit boards can be subjected to copper deposition treatment at one time, which can ensure the stability of the circuit boards during the copper deposition process, avoid the shaking and falling off of the circuit boards during the copper deposition process, and improve the reliability and safety. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 It is a schematic structural diagram of the present utility model;

[0017] Figure 2 It is a schematic structural diagram of the placement component of the present utility model;

[0018] Figure 3 It is a schematic partial structural diagram of the placement component of the present utility model;

[0019] Figure 4 It is a schematic structural diagram of the locking member of the present utility model.

[0020] In the drawings:

[0021] 100, Copper deposition tank; 200, Placing component; 201, Underframe; 2011, Frame; 2012, Partition bar; 2013, Fixing hole; 202, Vertical rod; 203, Hanging part; 204, First locking bolt; 205, Positioning rod; 2051, Vertical groove; 206, Circuit board; 207, Spacer sleeve; 208, Locking part; 2081, Compression sleeve; 2082, Locking sleeve; 2083, Second locking bolt; 2084, Positioning bar. Detailed implementation manners

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0023] It should be noted that all the directional indications in the embodiments of the present application are only used to explain the relative position relationship, movement conditions, etc. between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0024] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present application. In addition, the present application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0025] In the electronics manufacturing industry, in the production process of circuit boards, electroless copper plating is a crucial step. Before electroless copper plating, the surface of the insulating substrate needs to be treated with an activator to adsorb a layer of active particles on the substrate surface. These particles are usually metal palladium particles. Metal palladium particles have catalytic activity and can initiate the subsequent copper ion reduction reaction.

[0026] After being treated with the activator, copper ions are first reduced on these active metal palladium particles. These reduced metal copper nuclei become a new catalytic layer, which can continue to catalyze the reduction reaction of copper ions, enabling the copper layer to gradually grow on the surface of the insulating substrate.

[0027] To perform electroless copper plating, a copper deposition device needs to be used to ensure the smooth progress of the electroless copper plating process. In the copper deposition tank, by controlling the reaction conditions, uniform deposition of the copper layer on the surface of the insulating substrate can be achieved.

[0028] During the copper deposition process, due to factors such as the temperature and concentration of the electroless copper plating solution and the bubbles generated by chemical reactions, the circuit board will be subject to certain disturbances. These disturbances not only affect the uniform deposition of the copper layer on the circuit board but also cause friction between the circuit board and the holding plate body, resulting in damage to the surface of the circuit board.

[0029] The present application will be described below with reference to the accompanying drawings and specific embodiments:

[0030] The utility model provides a circuit board copper deposition device that uses a suspendable placement component 200, which improves the convenience and flexibility of operation. The circuit board 206 is sleeved on the positioning rod 205, and adjacent circuit boards 206 are separated by spacer sleeves 207. Multiple circuit boards 206 can be subjected to copper deposition treatment at one time, ensuring the stability of the circuit board 206 during the copper deposition process, avoiding shaking and falling off of the circuit board 206 during the copper deposition process, and improving reliability and safety.

[0031] Specifically:

[0032] Please refer to Figures 1-4 , a circuit board copper deposition device, including a copper deposition tank 100, and a suspendable placement component 200 is arranged inside the copper deposition tank 100;

[0033] A heating device and a stirring device are also arranged inside the copper deposition tank 100; the heating device can adjust the temperature of the solution inside the copper deposition tank 100 to ensure that the solution remains within the optimal reaction temperature range. The stirring device can continuously stir the solution inside the copper deposition tank 100 to keep it evenly distributed, avoid sedimentation or stratification of the components in the solution, and ensure that the circuit board 206 can contact the solution with a uniform concentration during the copper deposition process.

[0034] The placement component 200 includes a bottom frame 201. A plurality of vertical rods 202 are fixedly connected to the outside of the bottom frame 201. Hanging parts 203 are fixed on the vertical rods 202, and the hanging parts 203 are hung on the edge of the top of the copper deposition tank 100. The hanging parts 203 are hung on the edge of the top of the copper deposition tank 100, so that the entire placement component 200 can be conveniently suspended inside the copper deposition tank 100, facilitating the immersion and removal of the circuit board 206.

[0035] Positioning rods 205 are installed at the four corners of the top of the bottom frame 201. A plurality of circuit boards 206 and spacer sleeves 207 are sequentially sleeved on the positioning rods 205. The spacer sleeves 207 are used to separate adjacent circuit boards 206 to ensure that the circuit boards 206 do not contact or interfere with each other, while improving space utilization and allowing multiple circuit boards 206 to be processed simultaneously.

[0036] A first locking bolt 204 is threadedly connected to the hanging member 203. After hanging the hanging member 203 on the edge of the top of the copper deposition tank 100, the first locking bolt 204 is tightened, and the end of the first locking bolt 204 abuts against the copper deposition tank 100, which can ensure that the placing component 200 will not shake or fall off during the copper deposition process.

[0037] The chassis 201 includes a frame 2011. A plurality of partition bars 2012 are linearly and equidistantly fixedly connected to the inner side of the frame 2011, enhancing the structural strength of the chassis 201. A plurality of fixing holes 2013 are linearly and equidistantly arranged on the frame 2011 and the partition bars 2012, providing a plurality of fixing points for the vertical rod 202. The position of the vertical rod 202 can be adjusted according to the hole positions on the circuit board 206, improving the adaptability.

[0038] The fixing holes 2013 are threaded holes, and the bottom of the vertical rod 202 is provided with an external thread portion. The external thread portion is threadedly inserted into the interior of the threaded hole, and the position of the vertical rod 202 can be easily adjusted as needed to adapt to circuit boards 206 of different sizes.

[0039] A locking member 208 is sleeved on the outer surface of the positioning rod 205. The bottom of the locking member 208 abuts against the top of the uppermost circuit board 206, ensuring the stability of the circuit board 206 during the copper deposition process and preventing the circuit board 206 from shaking and falling off.

[0040] The locking member 208 includes a pressure sleeve 2081 and a locking sleeve 2082. The locking sleeve 2082 is fixedly connected to the top of the pressure sleeve 2081. The pressure sleeve 2081 and the locking sleeve 2082 are sleeved on the positioning rod 205. A second locking bolt 2083 is threadedly connected to the outside of the locking sleeve 2082. The end of the second locking bolt 2083 abuts against the outer surface of the positioning rod 205. A plurality of circuit boards 206 and spacer sleeves 207 are sequentially sleeved on the positioning rod 205, and the spacer sleeves 207 separate adjacent circuit boards 206. After the circuit boards 206 are placed, the locking member 208 is sleeved on the positioning rod 205, the bottom of the pressure sleeve 2081 abuts against the top of the uppermost circuit board 206, and then the second locking bolt 2083 is tightened. The end of the second locking bolt 2083 abuts against the outer surface of the positioning rod 205, thereby ensuring the stability of the fixation of the circuit board 206.

[0041] A vertical groove 2051 is provided in the middle of the positioning rod 205. Positioning strips 2084 are fixedly connected to the middle parts inside the pressure sleeve 2081 and the locking sleeve 2082. The positioning strips 2084 are slidably connected to the inside of the vertical groove 2051, which can prevent the pressure sleeve 2081 and the locking sleeve 2082 from rotating on the positioning rod 205, providing additional stability, and the locking member 208 can slide on the positioning rod 205 to adapt to the number of circuit boards 206.

[0042] Working principle: When in use, according to the hole positions on the circuit board 206, the vertical rod 202 is fixed in the corresponding fixing holes 2013, and then a plurality of circuit boards 206 and spacers 207 are successively sleeved on the positioning rod 205, so that the spacers 207 separate adjacent circuit boards 206. After the circuit boards 206 are placed, the locking member 208 is sleeved on the positioning rod 205, and the bottom of the pressing sleeve 2081 abuts against the top of the uppermost circuit board 206. Then, the second locking bolt 2083 is tightened, and the end of the second locking bolt 2083 abuts against the outer surface of the positioning rod 205;

[0043] Then, the entire placement assembly 200 is picked up and hung in the copper deposition tank 100. At this time, the hanging member 203 is hooked on the edge of the top of the copper deposition tank 100, and the first locking bolt 204 is tightened. The end of the first locking bolt 204 abuts against the copper deposition tank 100, which can ensure that the placement assembly 200 will not shake or fall off during the copper deposition process.

[0044] It should be noted that the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0045] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A copper deposition device for a circuit board, comprising a copper deposition tank (100), characterized in that: A suspendable placement component (200) is arranged inside the copper deposition tank (100); The placement component (200) includes a bottom frame (201), a plurality of vertical rods (202) are fixedly connected to the outside of the bottom frame (201), hanging members (203) are fixed on the vertical rods (202), and the hanging members (203) are hung on the edge of the top of the copper deposition tank (100); Positioning rods (205) are installed at the four corners of the top of the bottom frame (201), and a plurality of circuit boards (206) and spacer sleeves (207) are sequentially sleeved on the positioning rods (205), and the spacer sleeves (207) are used to separate adjacent circuit boards (206).

2. The copper deposition device for circuit boards according to claim 1, characterized in that, A first locking bolt (204) is threadedly connected to the hanging member (203), and the end of the first locking bolt (204) abuts against the copper deposition tank (100).

3. The copper deposition device for circuit boards according to claim 1, characterized in that, The bottom frame (201) includes a frame (2011), a plurality of partition strips (2012) are linearly and equidistantly fixedly connected to the inside of the frame (2011), and a plurality of fixing holes (2013) are linearly and equidistantly formed in the frame (2011) and the partition strips (2012).

4. The copper deposition device for circuit boards according to claim 3, wherein The fixing holes (2013) are threaded holes, and the bottom of the vertical rod (202) is provided with an external thread portion, and the external thread portion is threadedly inserted into the internal thread hole.

5. The copper deposition device for circuit boards according to claim 1, characterized in that, A locking member (208) is sleeved on the outer surface of the positioning rod (205), and the bottom of the locking member (208) abuts against the top of the uppermost circuit board (206).

6. The copper deposition device for circuit boards according to claim 5, wherein, The locking member (208) includes a pressing sleeve (2081) and a locking sleeve (2082), the locking sleeve (2082) is fixedly connected to the top of the pressing sleeve (2081), the pressing sleeve (2081) and the locking sleeve (2082) are sleeved on the positioning rod (205), a second locking bolt (2083) is threadedly connected to the outside of the locking sleeve (2082), and the end of the second locking bolt (2083) abuts against the outer surface of the positioning rod (205).

7. The copper deposition device for circuit boards according to claim 6, characterized in that, A vertical groove (2051) is provided in the middle of the positioning rod (205), and positioning strips (2084) are fixedly connected to the middle parts inside the pressing sleeve (2081) and the locking sleeve (2082), and the positioning strips (2084) are slidably connected to the inside of the vertical groove (2051).

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