Test equipment

Abstract

The embodiment of the utility model relates to the technical field of semiconductor detection, in particular to test equipment, which comprises a box body, a mainboard, a test box and a semiconductor chilling plate, the box body is provided with an accommodating cavity, the mainboard and the test box are arranged in the accommodating cavity along a first direction, and the test box and the semiconductor chilling plate are arranged in the accommodating cavity along a second direction. The first direction is perpendicular to the second direction, the test box is provided with a test cavity, the test cavity is used for providing a test environment for a to-be-tested chip, a jack communicated with the test cavity is formed in one side, close to the mainboard, of the test box, the to-be-tested chip in the test cavity can be connected with the mainboard through the jack, and the semiconductor chilling plate is close to the outer wall of the test cavity. According to the test equipment, the temperature is increased and decreased through the semiconductor chilling plate with a small size, the mainboard and the test box are arranged along the first direction, the test box and the semiconductor chilling plate are arranged along the second direction, and the chip to be tested in the test cavity is connected to the mainboard through the jack, so that the overall structure is compact, and the size of the equipment is reduced.

Description

Technical Field

[0001] The embodiments of the present utility model relate to the technical field of semiconductor detection, and particularly to a testing device. Background Art

[0002] With the rapid development of technology, people have higher and higher requirements for the reliability of chips. Chip testing, as an important part of the chip manufacturing field, plays a good role in promoting the quality of chips. Currently, the device for aging testing of memory chips (generally called a furnace body) places the chips to be tested on a test board, then inserts the test board into the furnace body, and heats and cools the furnace body where the test board is located through a compressor and an evaporator in the furnace body to simulate the aging process of the memory chips.

[0003] However, since the compressor and the evaporator occupy a relatively large space, the volume of the aging testing device is relatively large. Summary of the Utility Model

[0004] In view of the above problems, the embodiments of the present utility model provide a testing device that overcomes or at least partially solves the above problems.

[0005] According to one aspect of the embodiments of the present utility model, a testing device is provided, including a box body, a main board, a test box, and a thermoelectric cooler. The box body is provided with a receiving cavity. The main board and the test box are arranged in the receiving cavity along a first direction. The test box and the thermoelectric cooler are arranged in the receiving cavity along a second direction. The first direction and the second direction are perpendicular. The main board is used for communicating and connecting with the chip to be tested. The test box is provided with a test cavity for providing a test environment for the chip to be tested. A jack communicating with the test cavity is opened on one side of the test box close to the main board. The chip to be tested in the test cavity can be connected to the main board through the jack. The thermoelectric cooler is adjacent to the outer wall of the test cavity to heat and cool the test cavity.

[0006] In some embodiments, the testing device includes a monitoring board arranged in the receiving cavity. The monitoring board is arranged along the first direction on the side of the main board close to the test box, and the monitoring board and the test box are respectively located at both ends of the receiving cavity. The monitoring board is electrically connected to the main board and the thermoelectric cooler respectively.

[0007] In some embodiments, the testing device includes a test board and a connector. The test board is arranged in the test cavity and is used for fixing the chip to be tested. One end of the connector is connected to the test board, and the other end of the connector passes through the jack and is connected to the main board.

[0008] In some embodiments, the test box includes a box body and a box cover. An insertion hole is provided on one side of the box body close to the main board. An opening is provided on one side of the box body facing away from the main board. A window corresponding to the opening is provided at the top of the box body, and the opening is adjacent to the window. The box cover is covered on the window. Wherein, when the box cover covers the window, the box cover can close the opening, and at this time, the box body and the box cover jointly enclose to form the test cavity.

[0009] In some embodiments, one end of the box cover is rotatably connected to the edge of the window through a hinge, and the other end of the box cover is connected to the box body through an electronic lock, and the electronic lock is used to control the opening and closing of the box cover.

[0010] In some embodiments, the electronic lock includes a lock catch, a lock core, a lock body and a handle. The lock catch is fixed to the other end of the box cover, the lock body is fixed to the top of the box body, one end of the lock core is used to cooperate with the lock catch, the other end of the lock core passes through the lock body and is connected to one end of the handle, and the other end of the handle extends out of the guide hole of the box body. Wherein, when one end of the lock core cooperates with the lock catch and the electronic lock is powered on, the lock body will lock the other end of the lock core, so that one end of the lock core is locked with the lock catch, and at this time the box cover cannot be opened; when the electronic lock is powered off, the lock body will not lock the other end of the lock core, and by pulling the other end of the handle, one end of the lock core can be pulled out of the lock catch, so that one end of the lock core is unlocked from the lock catch, and at this time the box cover can be opened.

[0011] In some embodiments, the test device includes a heat dissipation component disposed in the receiving cavity. The heat dissipation component is disposed on the side of the semiconductor refrigeration sheet facing away from the test box along the second direction. Along the third direction, first ventilation holes and second ventilation holes are respectively provided on two side walls of the box body close to the heat dissipation component, and gas can form convection through the first ventilation holes and the second ventilation holes. The third direction is perpendicular to the first direction and the second direction respectively.

[0012] In some embodiments, the test device includes a heat sink. One side of the heat sink abuts against the outer wall of the test cavity, and the other side of the heat sink abuts against the semiconductor refrigeration sheet.

[0013] In some embodiments, the test device includes a plurality of heat preservation boards, and the plurality of heat preservation boards are disposed on the outer wall of the test box to wrap the test box.

[0014] In some embodiments, the test device includes a temperature sensor, and the temperature sensor is disposed in the test cavity, and the temperature sensor is used to detect the temperature in the test cavity.

[0015] The beneficial effects of the embodiments of the present utility model are as follows: Different from the prior art, a testing device provided by the embodiments of the present utility model includes a box body, a main board, a testing box, and a semiconductor refrigeration sheet. The box body is provided with a receiving cavity. The main board and the testing box are arranged in the receiving cavity along a first direction, and the testing box and the semiconductor refrigeration sheet are arranged in the receiving cavity along a second direction. The first direction and the second direction are perpendicular. The main board is used for communication connection with a chip to be tested. The testing box is provided with a testing cavity for providing a testing environment for the chip to be tested. A jack communicating with the testing cavity is opened on one side of the testing box close to the main board. The chip to be tested in the testing cavity can be connected to the main board through the jack. The semiconductor refrigeration sheet is adjacent to the outer wall of the testing cavity to cool the testing cavity. The testing device of the present utility model uses a semiconductor refrigeration sheet with a small volume to cool, arranges the main board and the testing box along the first direction, arranges the testing box and the semiconductor refrigeration sheet along the second direction, and the chip to be tested in the testing cavity is connected to the main board through the jack, making the overall structure compact to reduce the volume of the device. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments of the present utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained according to the drawings without creative efforts.

[0017] Figure 1 is a perspective view of the testing device provided by the embodiments of the present utility model;

[0018] Figure 2 is an exploded view of the testing device provided by the embodiments of the present utility model;

[0019] Figure 3 is a structural view of the box body of the testing device provided by the embodiments of the present utility model after the cover plate is opened;

[0020] Figure 4 is a structural view of the testing device provided by the embodiments of the present utility model after the cover plate, the box cover, and one side plate are removed;

[0021] Figure 5 is a cross-sectional view of the testing device provided by the embodiments of the present utility model in the testing box area;

[0022] Figure 6 is a structural view of the testing box provided by the embodiments of the present utility model after the box cover is opened;

[0023] Figure 7It is a cross-sectional view of the test equipment provided by the embodiment of the present utility model in the electronic lock area;

[0024] Figure 8 It is a schematic structural diagram of the electronic lock provided by the embodiment of the present utility model;

[0025] Figure 9 It is a schematic structural diagram of the assembled heat preservation board and the box body provided by the embodiment of the present utility model;

[0026] Figure 10 is Figure 5 the enlarged view of part A in

[0027] Figure 11 It is a schematic structural diagram of the heat sink provided by the embodiment of the present utility model.

[0028] The reference numerals in the specific embodiments are as follows:

[0029] 100, test equipment;

[0030] 1, box body; 1a, receiving cavity; 1b, first heat dissipation fan; 11, front panel; 12, rear panel; 13, side panel; 13a, first ventilation hole; 13b, second ventilation hole; 13c, guide hole; 14, bottom plate; 15, cover plate; 15a, window;

[0031] 2, test component; 21, test box; 21a, test cavity; 211, box body; 211a, open end; 2111, convex part; 211f, jack; 212, box cover; 212a, picking part; 22, main board; 23, test board; 24, connector; 25, monitoring board;

[0032] 3, temperature control component; 31, semiconductor refrigeration sheet; 31a, first surface; 31b, second surface; 32, heat sink; 321, positioning part;

[0033] 4, heat dissipation component; 44, fan; 7, hinge; 8, electronic lock; 81, lock catch; 82, lock core; 83, lock body; 84, handle; 9, heat preservation board; 9a, slot; 10, temperature sensor;

[0034] X, first direction; Y, second direction; Z, third direction. Specific embodiments

[0035] To facilitate the understanding of the present utility model, the present utility model will be described in more detail below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are only for the purpose of illustration.

[0036] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present utility model belongs. The terms used in this specification in the description of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0037] The current device for aging testing of memory chips (generally referred to as the furnace body) places the chips to be tested on the test board, then inserts the test board into the furnace body, and raises and lowers the temperature of the furnace body where the test board is located through the compressor and evaporator in the furnace body to simulate the aging process of the memory chips.

[0038] The compressor and evaporator in the existing chip aging test equipment occupy a relatively large space, making the volume of the aging test equipment relatively large.

[0039] The test equipment of the present utility model raises and lowers the temperature through a thermoelectric cooler with a relatively small volume, and arranges the main board and the test box along the first direction, arranges the test box and the thermoelectric cooler along the second direction, and the chips to be tested in the test cavity are connected to the main board through the jacks, so that the overall structure is compact to reduce the volume of the equipment.

[0040] To facilitate the reader's understanding of the inventive concept of the present utility model, the specific structure of the test equipment is described below:

[0041] Please refer to Figures 1 - 3 , the test equipment 100 of the present utility model includes a box body 1, a test component 2, a temperature control component 3 and a heat dissipation component 4. The box body 1 is provided with a receiving cavity 1a. The test component 2, the temperature control component 3 and the heat dissipation component 4 are all arranged in the receiving cavity 1a. The test component 2 is used to test the chips to be tested, the temperature control component 3 is used to raise and lower the temperature of the chips to be tested, and the heat dissipation component 4 is used to quickly dissipate heat from the chips to be tested and / or the temperature control component 3.

[0042] For the above-mentioned box body 1, the box body 1 includes a front panel 11, a rear panel 12, two side panels 13, a bottom panel 14 and a cover panel 15. Along the first direction X, the bottom panel 14 and the cover panel 15 are oppositely arranged; along the second direction Y, the front panel 11 and the rear panel 12 are oppositely arranged; along the third direction Z, the two side panels 13 are oppositely arranged; the front panel 11, the rear panel 12, the two side panels 13, the bottom panel 14 and the cover panel 15 jointly enclose a receiving cavity 1a, and any two of the first direction X, the second direction Y and the third direction Z are perpendicular to each other.

[0043] In some embodiments, first heat dissipation fans 1b are arranged on opposite side walls of the box body 1 to form convection, thereby accelerating the heat dissipation of the test component 2 inside the box body 1.

[0044] For the above-mentioned test component 2, please refer to Figures 4 - 5 , the test component 2 includes a test box 21, a main board 22 and a test board 23. The test box 21 is provided with a test cavity 21a, and the test cavity 21a is used to provide a test environment for the chip to be tested; the test board 23 is arranged in the test cavity 21a, and the test board 23 is used to fix and connect the chip to be tested; the main board 22 is electrically connected to the test board 23, and the main board 22 is used to communicate with the chip to be tested to detect the working quality of the chip to be tested under different test environments. The main board 22 is equivalent to the brain of the whole device, and operations such as program reading and writing, signal transmission and reception need to be carried out through the main board 22. Preferably, the size of the test cavity 21a of the present application is designed to be 260*58*53.5 mm to meet miniaturization requirements. Specifically, the main board 22 and the test box 21 are arranged in the receiving cavity 1a along the first direction X to reduce the space occupied by the main board 22 and the test box 21 in the second direction Y and the third direction Z.

[0045] In some embodiments, please refer to Figure 6 , a jack 211f communicating with the test cavity 21a is opened on one side of the test box 21 close to the main board 22. The chip to be tested in the test cavity 21a can be connected to the main board 22 through the jack 211f. In this way, the side of the test box 21 with the jack 211f can be directly abutted against the surface of the main board 22, thereby reducing the gap between the test box 21 and the main board 22 to further reduce the space occupied by the test box 21 and the main board 22. Further, the test device 100 includes a connector 24. One end of the connector 24 is connected to the test board 23, and the other end of the connector 24 passes through the jack 211f and is then connected to the main board 22 to make the connection between the chip to be tested and the main board 22 more stable.

[0046] In some embodiments, the test box 21 includes a box body 211 and a box cover 212. The box body 211 is provided with an opening 211a. The box cover 212 covers the opening 211a. The box body 211 and the box cover 212 together enclose the test cavity 21a. The box cover 212 is used to open and close the box body 211 to facilitate the placement of the chip to be tested. The jack 211f is provided on the side of the box body 211 close to the main board 22, and an opening 211a is provided on the side of the box body 211 away from the main board 22. A window 15a corresponding to the opening 211a is provided on the top of the box body 1, that is, the cover plate 15 of the box body 1 is provided with the window 15a, and the opening 211a is adjacent to the window 15a, and the box cover 212 is covered on the window 15a; wherein, when the box cover 212 covers the window 15a, the box cover 212 can close the opening 211a, and at this time, the box body 211 and the box cover 212 are jointly enclosed to form the test cavity 21a, so that the chip to be tested can be put in and taken out by opening the box cover 212 without opening the cover plate 15 of the box body 1, which makes the operation more convenient. Preferably, the test box 21 is made of metal 6061 aluminum alloy, which is a high-quality aluminum alloy product produced through heat treatment and pre-stretching processes and is a heat-treatment-strengthened alloy, so that the test box 21 has a better thermal insulation effect.

[0047] In some embodiments, one end of the box cover 212 is rotatably connected to the edge of the window 15a via a hinge 7, so that the box cover 212 can be rotated and opened relative to the window 15a; further, a picking portion 212a is provided at the other end of the box cover 212. When the box cover 212 needs to be opened, the user can grab the picking portion 212a and pull it outward to lift up the other end of the box cover 212, so that one end of the box cover 212 can be rotated via the hinge 7, thereby quickly opening the box cover 212.

[0048] In some embodiments, please refer to Figures 7 - 8, the other end of the box cover 212 is connected to the box body 1 through an electronic lock 8, and the electronic lock 8 is used to control the opening and closing of the box cover 212. The electronic lock 8 includes a lock catch 81, a lock core 82, a lock body 83 and a handle 84. The lock catch 81 is fixed to the other end of the box cover 212, the lock body 83 is fixed to the top of the box body 1, one end of the lock core 82 is used to cooperate with the lock catch 81, the other end of the lock core 82 passes through the lock body 83 and is connected to one end of the handle 84, and the other end of the handle 84 extends out of the guide hole 13c of the box body 1; wherein, when one end of the lock core 82 cooperates with the lock catch 81 and the electronic lock 8 is powered on, the lock body 83 will lock the other end of the lock core 82, so that one end of the lock core 82 is locked with the lock catch 81, and at this time the box cover 212 cannot be opened; when the electronic lock 8 is powered off, the lock body 83 will not lock the other end of the lock core 82, and by pulling the other end of the handle 84, one end of the lock core 82 can be pulled out of the lock catch 81, so that one end of the lock core 82 is unlocked from the lock catch 81, and at this time the box cover 212 can be opened.

[0049] In some embodiments, please also refer to Figure 9 , the testing device 100 includes a plurality of heat preservation plates 9, and the plurality of heat preservation plates 9 are arranged on the outer wall of the testing box 21 to wrap the testing box 21 for heat preservation of the testing box 21. Specifically, the outer sides of the peripheral side walls and the bottom wall of the box body 211 of the testing box 21 are all wrapped with heat preservation plates 9, and the heat preservation plates 9 are preferably XPS foam boards to improve the heat preservation effect. It can be understood that the heat preservation plates 9 may also include at least one of polystyrene, extruded polystyrene, polyurethane or glass wool. Preferably, the heat preservation plate 9 arranged on a side wall of the box body 211 is provided with a slot 9a, and at least part of the temperature control component 3 is arranged in the slot 9a to position the temperature control component 3 and make the temperature control component 3 close to the side wall of the box body 211, so as to facilitate the temperature rise and fall of the testing cavity 21a.

[0050] For the above temperature control component 3, please also refer to Figures 10 - 11, the temperature control component 3 includes a thermoelectric cooler 31 and a heat sink 32. The test box 21, the thermoelectric cooler 31, and the heat sink 32 are arranged in the receiving cavity 1a along the second direction Y to reduce the space occupied by the test box 21, the thermoelectric cooler 31, and the heat sink 32 in other directions. The thermoelectric cooler 31 has opposite first and second surfaces 31a and 31b. The first surface 31a is adjacent to the outer wall of the test cavity 21a. The thermoelectric cooler 31 is used to raise and lower the temperature of the test cavity 21a. One side of the heat sink 32 abuts against the outer wall of the test cavity 21a, and the other side of the heat sink 32 abuts against the first surface 31a of the thermoelectric cooler 31. The heat sink 32 is used to better assist the thermoelectric cooler 31 in raising and lowering the temperature of the test cavity 21a. Specifically, the heat sink 32 is arranged between the heat insulation board 9 and the side wall of the box body 211 so that the heat insulation board 9 can insulate the heat sink 32. The side wall of the box body 211 is provided with a plurality of protruding portions 2111, and the heat sink 32 is provided with a plurality of through holes. At least part of the protruding portions 2111 is inserted into the through holes so that the heat sink 32 is positioned on the side wall of the box body 211. Further, the temperature control component 3 includes a fixing member. One end of the fixing member abuts against the heat sink 32, and the other end of the fixing member passes through the through hole and is fixed to the protruding portion 2111 so that the heat sink 32 is fixed to the side wall of the box body 211. The fixing member can be a screw, a buckle, a rivet, a welding part, or an adhesive part. The fixing member can be fixed to the protruding portion 2111 by screwing, clamping, bonding, or welding, etc. A positioning portion 321 is provided on the surface of the heat sink 32 facing the thermoelectric cooler 31. At least part of the positioning portion 321 is arranged in the slot 9a of the heat insulation board 9 so that one side of the heat sink 32 facing the thermoelectric cooler 31 is positioned on the heat insulation board 9. The thermoelectric cooler 31 is arranged in the slot 9a of the heat insulation board 9 so that the thermoelectric cooler 31 is positioned on the heat insulation board 9. The first surface 31a of the thermoelectric cooler 31 abuts against the positioning portion 321. The thermoelectric cooler 31 is a prior art. In this application, thermoelectric coolers 31 of models such as TEC1-12706, TEC1-12708, or TEC1-12710 can be used. Through the thermoelectric cooler 31, the temperature of the test cavity 21a can be adjusted from room temperature to high temperature, so that the chip to be tested can be tested in a high-temperature environment. For example, the temperature of the test cavity 21a can be adjusted between 25°C and 90°C. The heat sink 32 includes copper to have a good heat dissipation effect.

[0051] Regarding the principle of temperature rise and fall of semiconductors, after the semiconductor refrigeration chip 31 is powered on, one side cools and the other side heats up, and the temperature difference between the two sides is stable at 60 °C. Therefore, theoretically, the faster the heat on the heating surface is dissipated, the lower the temperature of the cooling surface will be. Based on this, the cold of the cooling surface is then transferred to the small insulation cavity through the heat sink 32 to achieve a low-temperature environment. In this application, when the power supply is connected to the positive terminal of the semiconductor refrigeration chip 31, the first surface 31a of the semiconductor refrigeration chip 31 cools, and the second surface 31b of the semiconductor refrigeration chip 31 heats up to cool the test cavity 21a; when the power supply is connected to the negative terminal of the semiconductor refrigeration chip 31, the first surface 31a of the semiconductor refrigeration chip 31 heats up, and the second surface 31b of the semiconductor refrigeration chip 31 cools to heat the test cavity 21a. Since the semiconductor refrigeration chip 31 has the characteristic that the higher the temperature, the lower the working current, through multiple experiments, it is obtained that when using a semiconductor refrigeration chip 31 with a rated current of 15A under a voltage of 12.8V, the cooling speed is the fastest and the effect is the best.

[0052] For the above heat dissipation component 4, the heat dissipation component 4 is arranged on the side of the temperature control component 3 away from the test box 21, and the heat dissipation component 4 is used to dissipate heat from the temperature control component 3. Specifically, the heat dissipation component 4 is arranged along the second direction Y on the side of the semiconductor refrigeration chip 31 away from the test box 21 to reduce the occupied space of the heat dissipation component 4 and the semiconductor refrigeration chip 31 in other directions. Along the third direction Z, on both side walls of the box body 1 close to the heat dissipation component 4, opposite first ventilation holes 13a and second ventilation holes 13b are respectively opened, that is, on one end of the two side plates 13 of the box body 1 close to the heat dissipation component 4, opposite first ventilation holes 13a and second ventilation holes 13b are respectively opened, and gas can form convection through the first ventilation holes 13a and the second ventilation holes 13b to further improve the heat dissipation effect of the temperature control component 3. The heat dissipation component 4 includes a fan 44, and the fan 44 is arranged on the second surface 31b of the semiconductor refrigeration chip 31, and the fan 44 is used to dissipate the heat generated by the semiconductor refrigeration chip 31 into the environment through air flow. Further, the heat dissipation component 4 includes an external heat sink, and the external heat sink is arranged between the semiconductor refrigeration chip 31 and the fan 44, thereby accelerating the heat dissipation efficiency of the second surface 31b of the semiconductor refrigeration chip 31.

[0053] In this application, by connecting the power supply to the positive terminal of the semiconductor refrigeration chip 31, the semiconductor refrigeration chip 31 cools the test cavity 21a, and then through the fan 44, the second surface 31b of the semiconductor refrigeration chip 31 can be cooled, and correspondingly, the first surface 31a of the semiconductor refrigeration chip 31 will also be cooled, thereby reducing the temperature of the test cavity 21a. For example, the temperature of the test cavity 21a can be reduced to about 25 °C. Preferably, in this application, by selecting 2 semiconductor refrigeration chips 31, it is possible to achieve temperature rise and fall to the required temperature while taking into account the advantage of small volume.

[0054] In some embodiments, the above-mentioned test component 2 includes a monitoring board 25, the monitoring board 25 is disposed in the receiving cavity 1a of the box body 1, and the monitoring board 25 is electrically connected to the semiconductor refrigeration chip 31, the main board 22, the first cooling fan 1b and the heat dissipation component 4 respectively. The monitoring board 25 is used to monitor and control the semiconductor refrigeration chip 31, the main board 22, the first cooling fan 1b and the heat dissipation component 4. Specifically, the monitoring board 25 is disposed on one side of the main board 22 close to the test box 21 along the first direction X to reduce the space occupied by the monitoring board 25, the main board 22 and the test box 21 in the first direction X; the monitoring board 25 and the test box 21 are respectively located at two ends of the receiving cavity 1a to reduce the possibility of mutual influence between the monitoring board 25 and the test box 21, and the mutual influence may include communication influence and temperature influence.

[0055] In some embodiments, the test device 100 includes a temperature sensor 10, the temperature sensor 10 is disposed in the test cavity 21a, the temperature sensor 10 is electrically connected to the main board 22 and the monitoring board 25 respectively, and the temperature sensor 10 is used to detect the temperature in the test cavity 21a.

[0056] In some embodiments, the test device 100 includes a whole-machine power on / off device, such as a switching power supply, a contactor, and a smoke detector, etc., to realize the control of the power switch of the test device 100.

[0057] For the convenience of readers to understand the inventive concept of the present invention, the working process of the test device 100 is described as follows:

[0058] When the test device 100 works, open the lid 212 of the test box 21, install the chip to be tested on the test board 23, then place the test board 23 with the chip to be tested into the test cavity 21a in the test box 21, and then electrically connect the test board 23 to the main board 22 through the connector 24. After closing the lid 212, start the semiconductor refrigeration chip 31, the heat dissipation component 4 and the first cooling fan 1b through the monitoring board 25, so that the temperature in the test cavity 21a rises and falls, thereby simulating the process of chip aging. After the main board 22 sends a signal to the test board 23, according to the return situation of the signal, judge the quality of the chip to be tested.

[0059] For existing devices, most of them are huge in size, one is equivalent to the size of a room, and they are difficult to install. They require dedicated lines, water supply and air conditioning, and need to be debugged for a long time before they can be used. The maintenance cost is high. Regularly, professional personnel need to be invited to check the operation status of the device and adjust the parameters. Moreover, the operation is inconvenient. It is necessary to work in a specific area (such as a clean room) wearing dust-proof clothes. Moreover, during the process of replacing the chip, it is necessary to shut down the machine, take out the test board first, and then replace them one by one, and the process is cumbersome. In addition, the existing devices are prone to vibration and noise when the temperature is raised and lowered by a compressor.

[0060] In the embodiment of the present utility model, the test device 100 raises and lowers the temperature of the test chamber 21a through the thermoelectric cooler 31. Compared with the prior art of refrigeration by a compressor, the volume of the test device 100 is greatly saved, enabling it to be placed on a desktop. By arranging the main board 22 and the test box 21 along the first direction X, arranging the test box 21 and the thermoelectric cooler 31 along the second direction Y, and connecting the chip under test in the test chamber 21a to the main board 22 through the jack 211f, the overall structure is compact, reducing the device volume and making the assembly process relatively simple, greatly reducing the noise. By abutting the fan 44 against the second surface 31b of the thermoelectric cooler 31, the temperature of the second surface 31b of the thermoelectric cooler 31 is reduced, causing the corresponding cooling of the first surface 31a of the thermoelectric cooler 31, and further enabling the test chamber 21a adjacent to the first surface 31a to achieve a low-temperature test environment. In addition, the test device 100 does not require a dedicated line and can be started with only 220V of daily electricity, without an additional water supply system.

[0061] The present utility model also provides an embodiment of a charging pile, which includes the above-mentioned test device. For the functions and structures of the test device, reference can be made to the above embodiments, and details will not be repeated here.

[0062] It should be noted that the description and drawings of the present utility model provide preferred embodiments of the present utility model. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments do not serve as additional limitations to the content of the present utility model. The purpose of providing these embodiments is to make the understanding of the disclosed content of the present utility model more thorough and comprehensive. Furthermore, the above technical features continue to be combined with each other to form various embodiments not listed above, all of which are regarded as within the scope described in the description of the present utility model. Further, for those of ordinary skill in the art, improvements or changes can be made according to the above description, and all such improvements and changes should fall within the protection scope of the appended claims of the present utility model.

Claims

1. A test device, characterized in that, include: Box body, main board, test box and semiconductor cooling chip; The box body is provided with a receiving cavity, the main board and the test box are arranged in the receiving cavity along a first direction, the test box and the semiconductor refrigeration sheet are arranged in the receiving cavity along a second direction, and the first direction is perpendicular to the second direction; The mainboard is used to communicate with the chip to be tested; The test box is provided with a test cavity, and the test cavity is used to provide a test environment for the chip to be tested. A jack connected to the test cavity is provided on a side of the test box close to the mainboard, and the chip to be tested in the test cavity can be connected to the mainboard through the jack; The semiconductor refrigeration plate is adjacent to the outer wall of the test cavity to increase or decrease the temperature of the test cavity.

2. The test device according to claim 1, characterized in that The testing device includes a monitoring board arranged in the receiving cavity, the monitoring board is arranged on a side of the main board close to the testing box along the first direction, and the monitoring board and the testing box are respectively located at two ends of the receiving cavity, and the monitoring board is electrically connected to the main board and the semiconductor cooling plate respectively.

3. The testing device according to claim 1, characterized in that The testing device comprises a testing board and a connector. The testing board is arranged in the testing cavity and is used to fix the chip to be tested. One end of the connector is connected to the testing board, and the other end of the connector is connected to the main board after passing through the jack.

4. The testing device according to claim 1, characterized in that The test box comprises a box body and a box cover, the box body is provided with the jack on one side close to the mainboard, the box body is provided with an opening on one side away from the mainboard, a window corresponding to the opening is provided on the top of the box body, and the opening is adjacent to the window, and the box cover is provided on the window; When the box cover covers the window, the box cover can close the opening, and at this time, the box body and the box cover together enclose the test cavity.

5. The testing device according to claim 4, characterized in that One end of the box cover is rotatably connected to the edge of the window through a hinge, and the other end of the box cover is connected to the box body through an electronic lock, and the electronic lock is used to control the opening and closing of the box cover.

6. The testing device according to claim 5, characterized in that The electronic lock comprises a lock catch, a lock core, a lock body and a handle, wherein the lock catch is fixed to the other end of the box cover, the lock body is fixed to the top of the box body, one end of the lock core is used to cooperate with the lock catch, the other end of the lock core passes through the lock body and is connected to one end of the handle, and the other end of the handle extends out of the guide hole of the box body; Among them, when one end of the lock core cooperates with the lock buckle and the electronic lock is powered on, the lock body will lock the other end of the lock core so that one end of the lock core is locked with the lock buckle, and the box cover cannot be opened at this time; when the electronic lock is powered off, the lock body will not lock the other end of the lock core, and one end of the lock core can be pulled out of the lock buckle by pulling the other end of the handle so that one end of the lock core is unlocked from the lock buckle, and the box cover can be opened at this time.

7. The testing device according to claim 1, characterized in that The testing device comprises a heat dissipation component arranged in the receiving cavity, and the heat dissipation component is arranged along the second direction on a side of the semiconductor cooling sheet away from the testing box; Along the third direction, the two side walls of the box body close to the heat dissipation component are respectively provided with first and second ventilation holes relative to each other, and the gas can form convection through the first and second ventilation holes. The third direction is perpendicular to the first and second directions respectively.

8. The testing device according to claim 1, characterized in that The testing device comprises a heat sink, one side of which abuts against the outer wall of the testing cavity, and the other side of which abuts against the semiconductor cooling sheet.

9. The testing device according to any one of claims 1 to 8, characterized in that: The testing device comprises a plurality of heat-insulating plates, and the plurality of heat-insulating plates are arranged on the outer wall of the testing box to wrap the testing box.

10. The testing device according to any one of claims 1 to 8, characterized in that: The testing device comprises a temperature sensor, which is arranged in the testing cavity and is used to detect the temperature in the testing cavity.

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