Display device

Abstract

The utility model discloses a display device which comprises a supporting layer, an adhesive layer, a display panel, a flexible circuit board, an electronic component and a sealing layer which are stacked in sequence, the display panel comprises a display part, a bending part and a binding part, the flexible circuit board and the binding part are bound and connected to form a double-layer binding structure, a first opening is formed in the double-layer binding structure, and a second opening is formed in the adhesive layer. The first opening exposes the edge of the adhesive layer, the electronic component is arranged on the side, away from the supporting layer, of the double-layer binding structure, the sealing layer surrounds the outer side of the electronic component, and in the area of the first opening, a part of the sealing layer is arranged in the first opening and connected to the side face of the adhesive layer and the side, away from the supporting layer, of the adhesive layer. The packaging effect can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and particularly to a display device. Background Art

[0002] With the development of folding screen mobile phones, users' waterproof requirements for folding screen mobile phones are getting higher and higher. In traditional folding screen mobile phones, structures such as flexible printed circuits (FPCs) and display panels in the display module are attached to the support layer through double-sided tape. During the production process, in order to prevent dust from adhering to the surface of the double-sided tape, the edges of the double-sided tape usually retract inside the edges of the display module.

[0003] However, due to the edges of the double-sided tape retracting inside the edges of the display module, in the plan view of the display device, a retraction channel is formed between the part of the edge of the display module that does not overlap with the double-sided tape and the support layer. This retraction channel is located outside the edge of the double-sided tape. When setting the sealing layer subsequently, in order to prevent glue overflow, a glue with relatively weak fluidity is used as the material of the sealing layer, resulting in the cured sealing layer being unable to seal this retraction channel. Water and oxygen from the outside invade the inside of the display device through this retraction channel, causing the flexible printed circuit board and the electronic components arranged on the flexible printed circuit board to be affected by moisture, thus affecting the encapsulation effect.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above technical problems. Utility Model Content

[0005] The purpose of this application is to provide a display device to improve the encapsulation effect.

[0006] To solve the above problems, the technical solution of this application is as follows:

[0007] This application provides a display device, including:

[0008] A support layer;

[0009] An adhesive layer provided on one side of the support layer;

[0010] A display panel, including a display part, a bending part, and a bonding part connected in sequence. The display part is arranged on the side of the support layer away from the adhesive layer, the bonding part is arranged on the side of the adhesive layer away from the display part, and the bending part is located between the display part and the bonding part;

[0011] A flexible printed circuit board, which is arranged on the side of the adhesive layer away from the display part. The flexible printed circuit board is bonded to the bonding part to form a double-layer bonding structure. In the plan view of the display device, a first opening is formed on the double-layer bonding structure, and the edge of the adhesive layer is exposed through the first opening;

[0012] Electronic components, disposed on a side of the double-sided bonding structure away from the support layer;

[0013] A sealing layer, surrounding the outside of the electronic components. In the area of the first opening, a part of the sealing layer is disposed within the first opening and is connected to the side surface of the adhesive layer and the surface of the adhesive layer away from the support layer.

[0014] In an embodiment of the present application, the sealing layer includes:

[0015] A first sealing portion, disposed on a side of the support layer away from the display portion;

[0016] A second sealing portion, disposed on a side of the double-sided bonding structure away from the support layer; and

[0017] A third sealing portion, the third sealing portion being connected to the first sealing portion and the second sealing portion. In the area of the first opening, the third sealing portion is disposed within the first opening and is connected to the side surface of the adhesive layer and the surface of the adhesive layer away from the support layer.

[0018] In an embodiment of the present application, the double-sided bonding structure includes a connected first sub-portion and a second sub-portion. The first sub-portion is located on a side of the second sub-portion away from the bending portion. The first opening is disposed at an edge of the second sub-portion. The orthographic projection of the edge of the first sub-portion on the support layer is located outside the orthographic projection of the adhesive layer on the support layer.

[0019] In an embodiment of the present application, the first opening extends to a side surface of the second sub-portion.

[0020] In an embodiment of the present application, the distance from the side wall of the first opening to the side surface of the second sub-portion is in the range of 0 to 0.3 millimeters.

[0021] In an embodiment of the present application, the first sealing portion includes:

[0022] Two first sub-segments, the first sub-segments extending along a first direction of the display device, and the two first sub-segments being spaced apart along a second direction of the display device; and

[0023] A second sub-segment, extending along the second direction of the display device and connecting the two first sub-segments;

[0024] Wherein, in a plan view of the display device, the first sub-portion is located between the two first sub-segments, and the first sub-portion is located between the second sub-segment and the second sealing portion, and the third sealing portion connects the first sub-segment and the second sealing portion.

[0025] In one embodiment of the present application, the third sealing portion includes:

[0026] A first sealing sub-portion, disposed on a side of the adhesive layer exposed to the first opening and filling the first opening, the first sealing sub-portion connecting the second sealing portion; and

[0027] A second sealing sub-portion, connecting the first sealing sub-portion and the first sub-segment, the second sealing sub-portion being disposed on a side surface of the adhesive layer.

[0028] In one embodiment of the present application, the display device further includes a protective layer, the protective layer being disposed on a side of the double-layer binding structure away from the support layer and covering the double-layer binding structure;

[0029] Wherein, the second sealing portion is disposed on a side of the protective layer away from the support layer.

[0030] In one embodiment of the present application, a second opening is formed in the protective layer, the second opening exposing a portion of the double-layer binding structure provided with the first opening, the second opening communicating with the first opening;

[0031] Wherein, a part of the third sealing portion is further disposed in the second opening and connects a side surface of the double-layer binding structure and a side of the double-layer binding structure away from the support layer.

[0032] In one embodiment of the present application, the second sub-portion is a part of the flexible circuit board, the electronic component is disposed on a side of the flexible circuit board away from the support layer, the first opening is provided on the flexible circuit board, and the second sealing portion is disposed on a surface of the flexible circuit board away from the support layer;

[0033] The adhesive layer includes a first adhesive portion, the first adhesive portion being located between the flexible circuit board and the support layer, and the first opening exposing an edge of the first adhesive portion.

[0034] In one embodiment of the present application, the second sub-portion is a part of the binding portion, the electronic component is disposed on a side of the binding portion away from the support layer, the first opening is provided on the binding portion, and the second sealing portion is disposed on a surface of the binding portion away from the support layer;

[0035] The adhesive layer includes a second adhesive portion, the second adhesive portion being located between the binding portion and the support layer, and the first opening exposing an edge of the second adhesive portion.

[0036] In the present application, a first opening is provided in the double-layer binding structure. The portion of the double-layer binding structure without the first opening covers the side of the adhesive layer away from the support layer to prevent the side of the adhesive layer away from the support layer from being contaminated with dust. Among them, a retracted channel is formed between the portion of the double-layer binding structure without the first opening and the support layer. The portion of the double-layer binding structure with the first opening exposes the edge of the adhesive layer. In the area of the first opening, the support layer, the adhesive layer, and the double-layer binding structure form a stepped structure, where the edge of the adhesive layer protrudes from the edge of the double-layer binding structure. During the formation of the sealing layer, the sealing layer covers the above stepped structure to seal the above retracted channel and prevent external water and oxygen from invading the electronic components through the above retracted channel, thereby improving the encapsulation effect of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a schematic diagram of an embodiment of a conventional display device;

[0038] Figure 2 is Figure 1 a schematic diagram of an embodiment of the A-A' cross-sectional line of the conventional display device shown;

[0039] Figure 3 is a schematic diagram of a first embodiment of the display device of the present application;

[0040] Figure 4 is Figure 3 a schematic diagram of an embodiment of the B-B' cross-sectional line of the display device of the present application shown;

[0041] Figure 5 is Figure 3 a schematic diagram of an embodiment of the C-C' cross-sectional line of the display device of the present application shown;

[0042] Figure 6 is Figure 3 an enlarged view of an embodiment at D in

[0043] Figure 7 is Figure 3 another enlarged view of an embodiment at D in

[0044] Figure 8 is a schematic diagram of a second embodiment of the display device of the present application;

[0045] Figure 9 is Figure 8 a schematic diagram of an embodiment of the E-E' cross-sectional line of the display device of the present application shown;

[0046] Figure 10 is Figure 8 a schematic diagram of an embodiment of the F-F' cross-sectional line of the display device of the present application shown. Detailed implementation manners

[0047] The meanings of the terms used in this specification and the claims correspond to those commonly understood by those of ordinary skill in the art to which this application pertains. The terms used in this specification and the claims are for the purpose of facilitating the description and understanding of this application only, and are not intended to limit this application to the narrow interpretation of the specific terms used in this specification and the claims.

[0048] Please refer to Figure 1 , in the conventional display device 100a, in order to prevent the adhesive layer 20a from being contaminated with dust, a double-layer bonding structure formed by the bonding portion 31a and the flexible circuit board 40a covers the adhesive layer 20a, and the edge of the adhesive layer 20a is retracted inside the edge of the double-layer bonding structure, so as to achieve the purpose of preventing the surface of the adhesive layer 20a on the side away from the support layer 10a from being contaminated with dust.

[0049] In the conventional display device 100a, the sealing layer 50a includes a first sealing portion 51a, a second sealing portion 52a, and a third sealing portion 53a. Among them, the first sealing portion 51a is disposed on one side of the support layer, the second sealing portion 52a is disposed on the double-layer bonding structure, and the third sealing portion 53a connects the first sealing portion 51a and the second sealing portion 52a.

[0050] Please refer to Figure 2 , in the cross-sectional view of the conventional display device 100a, since the edge of the adhesive layer 20a is retracted inside the edge of the double-layer bonding structure (the double-layer bonding structure is taken as the flexible circuit board 40a here), an inward retraction channel 83 is formed on the side of the flexible circuit board 40a facing the support layer 10a, the side surface of the adhesive layer 20a, and the side of the support layer 10a facing the flexible circuit board 40a. Among them, the display portion 33a of the display panel 100a and the adhesive layer 20a are disposed on opposite sides of the support layer 10a.

[0051] In order to prevent glue overflow, the material of the sealing layer 50a is usually selected as a glue with relatively weak fluidity, and the glue with relatively weak fluidity cannot completely fill the inward retraction channel 83, resulting in the inability to completely seal the inward retraction channel. External water and oxygen will invade the inside of the display device 100a through the inward retraction channel 83, causing the electronic components 41a disposed on the flexible circuit board 40a to be affected by moisture and affecting the encapsulation effect.

[0052] Please refer to Figure 3 , in an embodiment of the present application, the display device 100 includes a support layer 10, an adhesive layer 20, a display panel, a flexible circuit board 40, a sealing layer 50, and a middle frame.

[0053] Please refer to Figure 4, an adhesive layer 20 is provided on one side of the support layer 10. The display panel includes a display portion 33, a bending portion 32, and a bonding portion 31 that are sequentially connected. The display portion 33 is disposed on the side of the support layer 10 away from the adhesive layer 20. The bonding portion 31 is disposed on the side of the adhesive layer 20 away from the display portion 33. The bending portion 32 is located between the display portion 33 and the bonding portion 31. A flexible circuit board 40 is disposed on the side of the support layer 10 away from the adhesive layer 20. The flexible circuit board 40 is bonded to the bonding portion 31 to form a double-layer bonding structure 60. In a plan view of the display device 100, a first opening 81 is formed in the double-layer bonding structure 60. The first opening 81 exposes the edge of the adhesive layer 20. Electronic components 41 are disposed on the side of the double-layer bonding structure 60 away from the support layer 10. A sealing layer 50 is disposed around the outside of the electronic components 41. In the area of the first opening 81, a part of the sealing layer 50 is disposed in the first opening 81 and is connected to the side surface of the adhesive layer 20 and the surface of the adhesive layer 20 away from the support layer 10.

[0054] Optionally, the sealing layer 50 includes a first sealing portion 51, a second sealing portion 52, and a third sealing portion 53. The first sealing portion 51 is disposed on the side of the support layer 10 away from the display portion 33. The second sealing portion 52 is disposed on the side of the double-layer bonding structure 60 away from the support layer 10. The third sealing portion 53 is connected to the first sealing portion 51 and the second sealing portion 52. In the area of the first opening 81, the third sealing portion 53 is disposed in the first opening 81 and is connected to the side surface of the adhesive layer 20 and the surface of the adhesive layer 20 away from the support layer 10.

[0055] In the present application, a first opening 81 is formed in the double-layer bonding structure 60. The portion of the double-layer bonding structure 60 where the first opening 81 is not provided covers the side of the adhesive layer 20 away from the support layer 10 to prevent the side of the adhesive layer 20 away from the support layer 10 from being contaminated with dust. Among them, a retracted channel 83 is formed between the portion of the double-layer bonding structure 60 where the first opening 81 is not provided and the support layer 10. The portion of the double-layer bonding structure 60 where the first opening 81 is provided exposes the edge of the adhesive layer 20.

[0056] Please refer to Figure 5 , in the area of the first opening 81, the support layer 10, the adhesive layer 20, and the double-layer bonding structure 60 form a stepped structure, where the edge of the adhesive layer 20 protrudes beyond the edge of the double-layer bonding structure 60. During the formation of the sealing layer 50, the third sealing portion 53 covers the above stepped structure to close the above retracted channel 83 and prevent external water and oxygen from invading the electronic components 41 through the above retracted channel 83, improving the encapsulation effect of the display device 100.

[0057] Optionally, the display device 100 of the present application further includes a middle frame. The middle frame covers the side of the sealing layer 50 away from the support layer 10.

[0058] Optionally, in one embodiment, the electronic component 41 further includes a chip, which is disposed on the side of the bonding portion 31 away from the support layer 10. The chip is bonded to the bonding portion 31, and the sealing layer 50 is located at the periphery of the flexible circuit board and the bonding portion.

[0059] Optionally, in one embodiment, the electronic component 41 further includes a capacitor / resistor, which is disposed on the side of the flexible circuit board away from the support layer. The capacitor / resistor is electrically connected to the flexible circuit board, and the sealing layer is located at the periphery of the flexible circuit board.

[0060] Optionally, the adhesive layer 20 includes a first adhesive portion 21 and a second adhesive portion 22. The first adhesive portion 21 is located between the flexible circuit board 40 and the support layer 10, and the first adhesive portion 21 is used to connect the flexible circuit board 40 and the support layer 10. The second adhesive portion 22 is located between the bonding portion 31 and the support layer 10, and the second adhesive portion 22 is used to connect the bonding portion 31 and the support layer 10.

[0061] Optionally, the material of the support layer 10 is one of materials such as stainless steel, carbon fiber, and titanium alloy.

[0062] Optionally, the material of the adhesive layer 20 is double-sided tape.

[0063] Optionally, the material of the sealing layer 50 is waterproof glue.

[0064] Optionally, a patterned structure is provided on the side of the middle frame facing the support layer 10. The patterned structure is adapted to the first sealing portion 51, the second sealing portion 52, and the third sealing portion 53 with different heights, so as to achieve the effect that the sealing layer 50 is closely attached to the middle frame.

[0065] Optionally, during the production process, a flexible circuit board support film can be attached to the first opening 81 to reduce dust from adhering to the adhesive layer 20 exposed by the first opening 81.

[0066] Please refer to Figure 3 , optionally, the display device 100 further includes a protective layer 70. The protective layer 70 is disposed on the side of the double-layer bonding structure 60 away from the support layer 10 and covers the electronic component 41. The second sealing portion 52 is disposed on the side of the protective layer 70 away from the support layer 10.

[0067] The protective layer 70 (IC Tape) is used to wrap the electronic component 41. The protective layer 70 can reduce parasitic capacitance, protect the electronic component from being damaged by external force extrusion, and reduce the influence of static electricity on the electronic component. Optionally, optionally, the protective layer 70 is the double-layer bonding structure 60. The material of the protective layer 70 of the double-layer bonding structure 60 includes insulating glue and conductive glue.

[0068] Please refer to Figure 5, Optionally, a second opening 82 is formed in the protective layer 70. Please refer to Figure 6 , A part of the double-layer bonding structure 60 provided with the first opening 81 is exposed through the second opening 82. The second opening 82 communicates with the first opening 81. A part of the third sealing portion 53 is also disposed within the second opening 82 and connects the side surface of the double-layer bonding structure 60 and the surface of the double-layer bonding structure 60 away from the support layer 10.

[0069] In this embodiment, since the second opening 82 is formed in the protective layer 70, the adhesive layer 20, the double-layer bonding structure 60, and the protective layer 70 form a continuous stepped structure, enabling the third sealing portion 53 to cover the continuous stepped structure, thereby closing the retracted channel 83 and improving the encapsulation effect.

[0070] , Optionally, the double-layer bonding structure 60 includes a connected first sub-portion 61 and a second sub-portion 62. The first sub-portion 61 is located on the side of the second sub-portion 62 away from the bent portion 32. The first opening 81 is formed at the edge of the second sub-portion 62. The orthographic projection of the edge of the first sub-portion 61 on the support layer 10 is located outside the orthographic projection of the adhesive layer 20 on the support layer 10.

[0071] Please refer to Figure 3 , Optionally, in the first embodiment of the present application, the second sub-portion 62 is a part of the flexible circuit board 40. The first opening 81 is formed on the flexible circuit board 40, and the second sealing portion 52 is disposed on a surface of the flexible circuit board 40 away from the support layer 10.

[0072] Please refer to Figure 4 , Electronic components 41 are disposed on the side of the flexible circuit board 40 away from the support layer 10.

[0073] Please refer to Figure 4 , The adhesive layer 20 includes a first adhesive portion 21. The first adhesive portion is located between the flexible circuit board 40 and the support layer 10, and the first opening 81 exposes the edge of the first adhesive portion 21.

[0074] In this embodiment, please refer to the plan view of the display device 100 as shown in Figure 3 . The sealing layer 50 is disposed around the outside of the flexible circuit board 40. The electronic components 41 include capacitors, resistors, and touch chips, etc. The sealing layer 50 can also protect the electronic components such as capacitors, resistors, and touch chips from the intrusion of external water and oxygen, improving the encapsulation effect of the display device 100.

[0075] In this embodiment, the first opening 81 is disposed on the second sub - portion 62 of the flexible circuit board 40. Electronic components such as chips, capacitors, and resistors are disposed on the first sub - portion 61 of the flexible circuit board 40. The second sealing portion 52 is disposed on the second sub - portion 62 of the flexible circuit board 40 to improve the sealing effect of the electronic components on the first sub - portion 61 of the flexible circuit board 40.

[0076] In this embodiment, the orthographic projection of the edge of the first sub - portion 61 on the support layer 10 is located outside the orthographic projection of the adhesive layer 20 on the support layer 10. This can prevent dust from adhering to the side of the adhesive layer 20 away from the support layer 10. However, a retracted channel 83 is formed between the first sub - portion 61 and the support layer 10.

[0077] Please refer to Figure 5 , in this embodiment, the first opening 81 is disposed at the edge of the second sub - portion 62. The first opening 81 exposes a part of the adhesive layer 20. The first opening 81 communicates with the retracted channel 83. The adhesive layer 20 and the second sub - portion 62 form a stepped structure. The third encapsulation portion covers the stepped structure, thereby closing the retracted channel 83 and improving the sealing effect of the display device 100.

[0078] Optionally, please refer to Figure 7 , the first opening 81 extends to the side surface of the second sub - portion 62. In the region of the first opening 81, the edge of the adhesive layer 20 and the edge of the double - layer binding structure 60 form a stepped structure. The third sealing portion 53 covers the stepped structure, which can close the retracted channel 83 formed between the first sub - portion 61 and the support layer 10 and improve the encapsulation effect.

[0079] Optionally, the distance d from the side wall of the first opening 81 to the side surface of the second sub - portion 62 is in the range of 0 to 0.3 millimeters. Among them, the value of the distance d from the side wall of the first opening 81 to the side surface of the second sub - portion 62 is one of the values 0, 0.05 millimeters, 0.1 millimeters, 0.15 millimeters, 0.2 millimeters, 0.25 millimeters, and 0.3 millimeters. As the length of the distance d from the side wall of the first opening 81 to the side surface of the second sub - portion 62 increases, the sealing effect of the sealing layer 50 on the retracted channel 83 is better, but the risk of dust contaminating the adhesive layer 20 will also increase. Therefore, in this embodiment, the distance d from the side wall of the first opening 81 to the side surface of the second sub - portion 62 being in the range of 0 to 0.3 millimeters can balance the encapsulation effect and prevent dust from contaminating the adhesive layer 20.

[0080] Optionally, please refer to Figure 3, the first sealing portion 51 includes two first sub - segments 511 and one second sub - segment 512. The first sub - segments 511 extend along the first direction Y of the display device 100. The two first sub - segments 511 are spaced apart along the second direction X of the display device 100. The second sub - segment 512 extends along the second direction X of the display device 100 and connects the two first sub - segments 511. In the plan view of the display device 100, the first sub - portion 61 is located between the two first sub - segments 511. The first sub - portion 61 is located between the second sub - segment 512 and the second sealing portion 52. The third sealing portion 53 connects the first sub - segment 511 and the second sealing portion 52.

[0081] In this embodiment, in the plan view of the display device 100, the sealing layer 50 composed of the first sealing portion 51, the second sealing portion 52 and the third sealing portion 53 surrounds the outside of the electronic components, thereby preventing the invasion of external water and oxygen and affecting the packaging effect of the display device 100.

[0082] Optionally, the first direction Y is perpendicular to the second direction X.

[0083] Optionally, please refer to Figure 5 , the third sealing portion 53 includes a first sealing sub - portion 531 and a second sealing sub - portion 532. The first sealing sub - portion 531 is disposed on the side of the adhesive layer 20 exposed to the first opening 81 and fills the first opening 81. The first sealing sub - portion 531 connects the second sealing portion 52. The second sealing sub - portion 532 connects the first sealing sub - portion 531 and the first sub - segment 511. The second sealing sub - portion 532 is disposed on the side surface of the adhesive layer 20.

[0084] In this embodiment, the second sealing sub - portion 532 disposed on the side surface of the adhesive layer 20 can seal the retracted channel 83 formed between the support layer 10 and the double - layer bonding structure 60, thereby preventing the invasion of external water and oxygen into the display device 100 and improving the sealing effect of the display device 100.

[0085] Optionally, please refer to Figure 8 , in the second embodiment of the present application, the second sub - portion 62 is a part of the bonding portion 31, the first opening 81 is provided on the bonding portion 31, and the second sealing portion 52 is disposed on a surface of the bonding portion 31 away from the support layer 10.

[0086] Optionally, please refer to Figure 9 , in the second embodiment of the present application, the electronic component 41 is disposed on a side of the bonding portion 31 away from the support layer 10.

[0087] Optionally, please refer to Figure 9 , the adhesive layer includes a second adhesive portion 22. The second adhesive portion is located between the bonding portion 31 and the support layer 10. A part of the second adhesive portion is exposed by the first opening.

[0088] In this embodiment, without reducing the encapsulation effect, the sealing space of the sealing layer 50 is increased, so that the entire flexible circuit board 40 and a part of the bonding portion 31 are also within the sealing space of the sealing layer 50, thereby further improving the encapsulation effect of the display device 100. It prevents the connection between the flexible circuit board 40 and the bonding portion 31 from being affected by moisture, and improves the device performance of the display device 100.

[0089] Please refer to Figure 8 , in this embodiment, the first opening 81 is provided on the second sub-portion 62 of the bonding portion 31. Electronic components 41 such as capacitors and resistors are provided on the flexible circuit board 40, and the flexible circuit board 40 is bonded to the first sub-portion 61 of the bonding portion 31. The second sealing portion 52 is provided on the second sub-portion 62 of the bonding portion 31.

[0090] In this embodiment, the orthographic projection of the edge of the first sub-portion 61 on the support layer 10 is located outside the orthographic projection of the adhesive layer 20 on the support layer 10. It can prevent dust from sticking to the side of the adhesive layer 20 away from the support layer 10. However, a retracted channel 83 is formed between the first sub-portion 61 and the support layer 10.

[0091] Please refer to Figure 9 , the electronic components 41 include a chip and a capacitor / resistor. Among them, the chip is provided on the side of the bonding portion 31 away from the support layer 10, and the capacitor / resistor is provided on the side of the flexible circuit board away from the support layer 10.

[0092] Please refer to Figure 10 , in this embodiment, the first opening 81 is provided at the edge of the second sub-portion 62. The first opening 81 exposes a part of the adhesive layer 20. The first opening 81 communicates with the retracted channel 83. The adhesive layer 20 and the second sub-portion 62 form a stepped structure. The third encapsulation portion covers the stepped structure, thereby closing the retracted channel 83 and improving the sealing effect of the display device 100.

[0093] Optionally, the first opening 81 extends to the side surface of the second sub-portion 62. In the area of the first opening 81, a stepped structure is formed between the edge of the adhesive layer 20 and the edge of the double-layer bonding structure 60. The third sealing portion 53 covers the stepped structure, which can close the retracted channel 83 formed between the first sub-portion 61 and the support layer 10 and improve the encapsulation effect.

[0094] Optionally, the distance d from the sidewall of the first opening 81 to the side surface of the second sub - part 62 ranges from 0 to 0.3 millimeters. Among them, the value of the distance d from the sidewall of the first opening 81 to the side surface of the second sub - part 62 is one of the values 0, 0.05 millimeters, 0.1 millimeters, 0.15 millimeters, 0.2 millimeters, 0.25 millimeters, and 0.3 millimeters. As the length of the distance d from the sidewall of the first opening 81 to the side surface of the second sub - part 62 increases, the sealing effect of the sealing layer 50 on the retracted channel 83 becomes better, but it also increases the risk of dust contaminating the adhesive layer 20. Therefore, in this embodiment, the distance d from the sidewall of the first opening 81 to the side surface of the second sub - part 62 within the range of 0 to 0.3 millimeters can balance the encapsulation effect and prevent dust from contaminating the adhesive layer 20.

[0095] Optionally, please refer to Figure 8 , the first sealing portion 51 includes two first sub - segments 511 and one second sub - segment 512. The first sub - segment 511 extends along the first direction Y of the display device 100. The two first sub - segments 511 are arranged at intervals along the second direction X of the display device 100. The second sub - segment 512 extends along the second direction X of the display device 100 and connects the two first sub - segments 511. In the plan view of the display device 100, the first sub - part 61 is located between the two first sub - segments 511. The first sub - part 61 is located between the second sub - segment 512 and the second sealing portion 52. The third sealing portion 53 connects the first sub - segment 511 and the second sealing portion 52.

[0096] In this embodiment, in the plan view of the display device 100, the sealing layer 50 composed of the first sealing portion 51, the second sealing portion 52, and the third sealing portion 53 surrounds the outside of the flexible circuit board and the bonding portion, thereby preventing external water and oxygen from invading and affecting the encapsulation effect of the display device 100.

[0097] Optionally, the first direction Y is perpendicular to the second direction X.

[0098] Optionally, please refer to Figure 10 , the third sealing portion 53 includes a first sealing sub - portion 531 and a second sealing sub - portion 532. The first sealing sub - portion 531 is disposed on the side where the adhesive layer 20 is exposed to the first opening 81 and fills the first opening 81. The first sealing sub - portion 531 connects the second sealing portion 52. The second sealing sub - portion 532 connects the first sealing sub - portion 531 and the first sub - segment 511. The second sealing sub - portion 532 is disposed on the side surface of the adhesive layer 20.

[0099] In this embodiment, the second sealing sub - portion 532 disposed on the side surface of the adhesive layer 20 can seal the retracted channel 83 formed between the support layer 10 and the double - layer bonding structure 60, thereby preventing external water and oxygen from invading the display device 100 and improving the sealing effect of the display device 100.

[0100] The specific embodiments of the present application have been described in detail above. The above-described embodiments disclosed in the present application are only the preferred embodiments of the present application. For those of ordinary skill in the art, many variations and improvements can be made without departing from the concept of the present application. These variations and improvements all fall within the protection scope defined by the claims of the present application.

Claims

1. A display device, characterized in that, Comprising: A support layer; An adhesive layer provided on one side of the support layer; A display panel including a display portion, a bending portion, and a bonding portion connected in sequence. The display portion is provided on the side of the support layer away from the adhesive layer, the bonding portion is provided on the side of the adhesive layer away from the display portion, and the bending portion is located between the display portion and the bonding portion; A flexible circuit board provided on the side of the adhesive layer away from the display portion. The flexible circuit board is bonded to the bonding portion to form a double-layer bonding structure. In a plan view of the display device, a first opening is formed in the double-layer bonding structure, and the first opening exposes an edge of the adhesive layer; Electronic components provided on the side of the double-layer bonding structure away from the support layer; A sealing layer surrounding the outside of the electronic components. In the area of the first opening, a part of the sealing layer is disposed in the first opening and is connected to a side surface of the adhesive layer and a surface of the adhesive layer away from the support layer.

2. The display device according to claim 1, wherein The sealing layer includes: A first sealing portion provided on the side of the support layer away from the display portion; A second sealing portion provided on the side of the double-layer bonding structure away from the support layer; and A third sealing portion. The third sealing portion is connected to the first sealing portion and the second sealing portion. In the area of the first opening, the third sealing portion is disposed in the first opening and is connected to a side surface of the adhesive layer and a surface of the adhesive layer away from the support layer.

3. The display device according to claim 2, characterized in that, The double-layer bonding structure includes a first sub-portion and a second sub-portion connected to each other. The first sub-portion is located on the side of the second sub-portion away from the bending portion. The first opening is provided at an edge of the second sub-portion. A positive projection of an edge of the first sub-portion on the support layer is located outside a positive projection of the adhesive layer on the support layer.

4. The display device according to claim 3, wherein, The first opening extends to a side surface of the second sub-portion.

5. The display device according to claim 4, characterized in that, A distance from a side wall of the first opening to a side surface of the second sub-portion is in a range of 0 to 0.3 millimeters.

6. The display device according to claim 3, characterized in that The first sealing portion includes: Two first sub-segments extending along a first direction of the display device. The two first sub-segments are spaced apart along a second direction of the display device; and A second sub-segment extending along the second direction of the display device and connecting the two first sub-segments; Wherein, in a plan view of the display device, the first sub-portion is located between the two first sub-segments, and the first sub-portion is located between the second sub-segment and the second sealing portion. The third sealing portion connects the first sub-segment and the second sealing portion.

7. The display device according to claim 6, characterized in that, The third sealing portion includes: A first sealing sub-portion disposed on a side of the adhesive layer exposed to the first opening and filling the first opening. The first sealing sub-portion is connected to the second sealing portion; and A second sealing sub-portion connecting the first sealing sub-portion and the first sub-segment. The second sealing sub-portion is disposed on a side surface of the adhesive layer.

8. The display device according to claim 2, wherein The display device further includes a protective layer provided on a surface of the double-layer bonding structure away from the support layer and covering the double-layer bonding structure; Wherein, the second sealing part is arranged on a surface of the protective layer away from the support layer.

9. The display device according to claim 8, wherein A second opening is formed in the protective layer, and the second opening exposes a portion of the double-layer bonding structure provided with the first opening, and the second opening communicates with the first opening; Wherein, a part of the third sealing part is further arranged in the second opening and connects the side surface of the double-layer bonding structure and a surface of the double-layer bonding structure away from the support layer.

10. The display device according to any one of claims 3-9, characterized in that, The second sub-part is a part of the flexible circuit board, the electronic component is arranged on a side of the flexible circuit board away from the support layer, the first opening is arranged on the flexible circuit board, and the second sealing part is arranged on a surface of the flexible circuit board away from the support layer; The adhesive layer includes a first adhesive part, the first adhesive part is located between the flexible circuit board and the support layer, and the first opening exposes an edge of the first adhesive part.

11. The display device according to any one of claims 3-9, characterized in that, The second sub-part is a part of the bonding part, the electronic component is arranged on a side of the bonding part away from the support layer, the first opening is arranged on the bonding part, and the second sealing part is arranged on a surface of the bonding part away from the support layer; The adhesive layer includes a second adhesive part, the second adhesive part is located between the bonding part and the support layer, and the first opening exposes an edge of the second adhesive part.

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