Detection medium of automatic optical detection equipment
By designing a detection medium with multi-layer pattern layers, the problem of single function of standard sheets in the prior art is solved, and comprehensive defect type verification of automatic optical detection equipment is realized, which improves verification accuracy and reduces costs.
Patent Information
- Application Number
- CN202421666905.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-07-15
AI Technical Summary
The existing automatic optical defect detection equipment has a single standard sheet function or limited pattern texture features, making it difficult to fully verify the defect type detection capability of various features.
A detection medium of an automatic optical detection device is designed, including several pattern layers arranged up and down along the thickness direction of the medium body. Each pattern layer has a pattern unit distributed in an array, including an array pattern, resolution pattern, random pattern, line width pattern and inscribed pattern, simulate mass production detection conditions, and covers multiple capabilities verification.
Improve verification accuracy, reduce production costs, simplify verification process, enable most of the functions related to optical and detection on a standard medium, and fully verify defect types.
Smart Images
Figure CN223155978U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of optical system detection, and particularly relates to a detection medium for an automatic optical detection device. Background Art
[0002] The wafer automatic optical defect detection device is one of the core devices in semiconductor process manufacturing. It uses optical imaging technology to obtain the surface image of the process wafer, performs algorithm analysis on the image, and reports the yield information such as various defects existing in the wafer during the manufacturing process.
[0003] Due to the complexity of the process, materials, and patterns in wafer manufacturing, the automatic optical defect detection device needs to be repeatedly and extensively used for yield monitoring. For different processes, materials, and patterns, the wafer detection device needs to be able to effectively detect defects and flaws and perform stable detection. Therefore, the evaluation and judgment of the detection ability of the automatic optical defect detection device is an important topic for determining the device's own performance.
[0004] The evaluation and judgment of the detection ability of the automatic optical defect detection device mainly include optical resolution ability, minimum defect detection ability, defect detection ability under different process processes, detection repeatability, false detection rate, device migration rate, etc.
[0005] There are currently two main methods for verifying the detection ability of the automatic optical defect detection device: mass production wafer verification and standard wafer verification. Due to the inconsistent standards in mass production wafer verification, there are often many additional influencing factors, and it is impossible to accurately judge the detection ability of the device. It is impossible to accurately and comprehensively judge the superiority and inferiority of the device's ability among multiple non-fully identical models of devices. Especially before and after the device migration process, it is very difficult to find a sufficient number and suitable mass production wafers for verification; due to the single function or pattern texture characteristics limitation of the existing standard wafers, it is often difficult to ensure that the detection ability of various characteristic defect types can be verified. Summary of the Invention
[0006] The embodiments of this application provide a detection medium for an automatic optical detection device to solve the problem that it is often difficult to ensure the verification of the detection ability of various characteristic defect types due to the single function or pattern texture characteristics limitation of the standard wafer in the related technology.
[0007] The embodiments of this application provide a detection medium for an automatic optical detection device, which includes a medium body and a plurality of pattern layers arranged up and down along the thickness direction of the medium body. The pattern layers are provided with pattern units arranged in an array.
[0008] Each pattern layer's pattern unit is provided with at least one standard pattern, and the standard pattern includes one of an array pattern, a resolution pattern, a random pattern, a line width pattern, and an overlay pattern.
[0009] As a whole, all the said pattern layers are provided with at least two standard patterns.
[0010] In some embodiments, the array pattern includes one or more of a stripe array pattern, a rotation array pattern, and a pattern array pattern.
[0011] In some embodiments, the stripe array pattern includes horizontal and vertical stripe patterns;
[0012] And / or, the stripe array pattern includes a plurality of stripe units, and there are different line width dimensions between the horizontal and vertical stripe patterns in each of the stripe units;
[0013] And / or, the rotation array pattern includes an oblique line pattern;
[0014] And / or, the rotation array pattern includes a plurality of rotation units, and there are different line width dimensions between the oblique line patterns in each of the rotation units;
[0015] And / or, the pattern array pattern includes horizontal, vertical, oblique, dot, and line patterns, and the widths of some of the lines gradually change;
[0016] And / or, the pattern array pattern includes a plurality of pattern units, and there are different line width dimensions between the horizontal, vertical, oblique, dot, and line patterns in each of the pattern units.
[0017] In some embodiments, the resolution pattern includes a line pair scale covering 60 to 3500 line pairs.
[0018] In some embodiments, the random pattern includes a fret pattern composed of back-and-forth broken lines and protrusions.
[0019] In some embodiments, the line width pattern includes one or more of a rectangular line width pattern, a rotated rectangular line width pattern obtained by rotating the rectangular line width pattern by 90°, and a circular line width pattern.
[0020] In some embodiments, the rectangular line width pattern includes a plurality of concentrically arranged square frames, and the line widths of each square frame gradually decrease in a set direction;
[0021] And / or, the circular line width pattern includes a plurality of concentrically arranged circular rings, and the line widths of each circular ring gradually decrease in a set direction.
[0022] In some embodiments, the set direction is from the inside to the outside or from the outside to the inside.
[0023] In some embodiments, the overlay pattern includes a number of sub-overlay patterns, and the sub-overlay patterns include a plurality of alignment marks, and there is a preset offset between the centers of two adjacent alignment marks.
[0024] In some embodiments, the alignment marks of at least one of the sub - overlay patterns are rectangular;
[0025] The alignment marks of at least one of the sub - overlay patterns are cross - shaped.
[0026] The beneficial effects brought by the technical solutions provided in this application include:
[0027] The detection medium proposed in this application fully considers the usage scenarios of automatic optical wafer inspection equipment. Basically, most of the optical and inspection - related functions can be completed on a standard medium, improving the verification accuracy, reducing the production cost, simplifying the verification process, and solving the problem that in the related art, due to the single function of the standard wafer or the limitation of pattern texture features, it is often difficult to ensure the defect type detection ability for verifying various features. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0029] Figure 1 Schematic diagram of the detection medium of the automatic optical detection equipment provided for the embodiments of this application;
[0030] Figure 2 Schematic diagram of the pattern unit provided for the embodiments of this application;
[0031] Figure 3 Schematic diagram of the horizontal and vertical stripe pattern provided for the embodiments of this application;
[0032] Figure 4 Schematic diagram of the oblique line pattern provided for the embodiments of this application;
[0033] Figure 5 Schematic diagram of the horizontal, vertical, oblique dot - line pattern provided for the embodiments of this application;
[0034] Figure 6 Schematic diagram of the random pattern provided for the embodiments of this application;
[0035] Figure 7 Schematic diagram of the resolution pattern provided for the embodiments of this application;
[0036] Figure 8 Schematic diagram of the line - width pattern provided for the embodiments of this application, (a) is a rectangular line - width pattern, (b) is a rotated rectangular line - width pattern, and (c) is a circular line - width pattern.
[0037] In the figure: 1. Medium body; 2. Pattern layer; 3. Pattern unit; 31. Array pattern; 311. Strip array pattern; 3111. Strip unit; 312. Rotating array pattern; 3121. Rotating unit; 313. Patterned array pattern; 3131. Patterned unit; 32. Resolution pattern; 33. Random pattern; 34. Line width pattern; 341. Rectangular line width pattern; 342. Rotating rectangular line width pattern; 343. Circular line width pattern; 35. Overlay pattern. Detailed implementation mode
[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.
[0039] Refer to Figure 1 and Figure 2 As shown, the embodiments of the present application provide a detection medium for an automatic optical detection device, which includes a medium body 1 and a plurality of pattern layers 2 arranged up and down in the thickness direction of the medium body 1. The material of the medium body 1 can be a silicon wafer, a silicon carbide wafer, a glass substrate, or other materials. The outer shape of the detection medium can be circular or square, and the size can be 12 inches, 8 inches, or other sizes. The pattern layer 2 is provided with pattern units 3 arranged in an array. The pattern units 3 basically cover the medium body 1, and each pattern unit 3 has the same pattern texture. The same pattern units 3 can conveniently quantify the repeatability and reproducibility of the detection performance of the automatic optical detection device. Since the pattern units 3 are repeatedly arranged on the entire medium, specific abnormal defects of different sizes are designed at specific positions of each pattern unit. The curve detection ability of the automatic optical detection device can be verified through the abnormal defects; at least one standard pattern is provided for the pattern units 3 of each pattern layer 2. The standard pattern includes one of the array pattern 31, the resolution pattern 32, the random pattern 33, the line width pattern 34, and the overlay pattern 35. It can be understood that the pattern textures of the pattern units 3 of the same pattern layer 2 are the same, and the pattern textures of the pattern units 3 of different pattern layers 2 can be the same or different. There can be only one standard pattern in the pattern units 3 of the pattern layer 2, or two, three, or four standard patterns; all the pattern layers 2, as a whole, are provided with at least two standard patterns.
[0040] It can be understood that the number of layers of the pattern layer 2 can be one or more. If there is only one layer of the pattern layer 2, at least two standard patterns are provided in the pattern units 3 of the pattern layer 2, so that at least two standard patterns are provided in all of the pattern layer 2 as a whole. If there are multiple layers of the pattern layer 2, at least one standard pattern is provided in the pattern units 3 of at least one layer of the pattern layer 2, and at least one standard pattern is provided in the pattern units 3 of at least another layer of the pattern layer 2, so that at least two standard patterns are provided in all of the pattern layer 2 as a whole.
[0041] At least two standard patterns among the array pattern 31, the resolution pattern 32, the random pattern 33, the line width pattern 34, and the overlay pattern 35 are designed in the detection medium provided by the present application, so as to simulate the detection conditions of mass production as much as possible, so that a detection medium can cover various ability tests in optical performance verification, detection ability verification, measurement ability verification, etc. of an optical detection device.
[0042] Therefore, the detection medium proposed by the present application fully considers the usage scenarios of automatic optical wafer detection equipment, and can basically complete most of the functions related to optics and detection on a standard medium, improving the verification accuracy, reducing the production cost, simplifying the verification process, and solving the problem that in the related art, due to the single function of the standard wafer or the limitation of the pattern texture characteristics, it is often difficult to ensure the defect type detection ability of verifying various characteristics.
[0043] It can be understood that a first pattern area, a second pattern area, a third pattern area, a fourth pattern area, and a fifth pattern area are provided on the pattern unit 3.
[0044] The array pattern 31 is provided on the first pattern area, the resolution pattern 32 is provided on the second pattern area, the random pattern 33 is provided on the third pattern area, the line width pattern 34 is provided on the fourth pattern area, and the overlay pattern 35 is provided on the fifth pattern area.
[0045] See Figure 2 As shown, the array pattern 31 includes one or several of a stripe array pattern 311, a rotation array pattern 312, and a pattern array pattern 313. The stripe array pattern 311, the rotation array pattern 312, and the pattern array pattern 313 can be used to simulate various line types in the actual wafer manufacturing process, so as to fully simulate and verify the detection ability of the automatic optical detection device under various process designs.
[0046] It can be understood that the first pattern area is further divided into a first sub-area of the first pattern, a second sub-area of the first pattern, and a third sub-area of the first pattern. A stripe array pattern 311 is provided on the first sub-area of the first pattern, a rotating array pattern 312 is provided on the second sub-area of the first pattern, and a decorative pattern array pattern 313 is provided on the third sub-area of the first pattern.
[0047] See Figure 3 As shown, the stripe array pattern 311 includes horizontal and vertical stripe patterns. By using the horizontal and vertical stripe patterns, the straight line process in wafer manufacturing can be simulated. The horizontal and vertical stripe patterns can be in the form of a square as Figure 3 shown. The line width of the square is 10 um and the side length is 60 um. It can also be a rectangle or a straight pattern with other parameters.
[0048] See Figure 2 As shown, the stripe array pattern 311 includes a plurality of stripe units 3111. For example, Figure 2 there are four stripe units 3111. The horizontal and vertical stripe patterns in each of the stripe units 3111 have different line width dimensions. That is to say, the line widths and lengths of the horizontal and vertical stripe patterns in each of the stripe units 3111 are different and change in order from large to small, so as to simulate different wafer manufacturing line width processes.
[0049] See Figure 4 As shown, the rotating array pattern 312 includes oblique line patterns. By using the oblique line patterns, the oblique line process in wafer manufacturing can be simulated. The oblique line patterns can be in the form of a rotated square as Figure 4 shown. The line width of the square is 10 um and the side length is 60 um. It can also be a rotated rectangle or a straight pattern with other parameters.
[0050] See Figure 2 As shown, the rotating array pattern 312 includes a plurality of rotating units 3121. For example, Figure 2 there are three rotating units 3121. The oblique line patterns in each of the rotating units 3121 have different line width dimensions. That is to say, the line widths and lengths of the oblique line patterns in each of the rotating units 3121 are different and change in order from large to small, so as to simulate different wafer manufacturing line width processes.
[0051] See Figure 5 As shown, the decorative pattern array pattern 313 includes horizontal, vertical, oblique dot and line patterns, and the line widths of some parts are gradually changing. By using the horizontal, vertical, oblique dot and line patterns, the non-straight line process in wafer manufacturing can be simulated. The horizontal, vertical, oblique dot and line patterns include oblique gradient widths and longitudinal gradient widths. For example, Figure 5The vertical, horizontal, diagonal, dot and line patterns therein present as three-petal petal-like textures wrapping an "i"-shaped pattern. The vertical, horizontal, diagonal, dot and line patterns can also be other patterns including obliquely and longitudinally gradually varying widths.
[0052] See Figure 2 As shown, the pattern array pattern 313 includes a plurality of pattern units 3131, such as Figure 2 Six pattern units 3131 are provided therein. The vertical, horizontal, diagonal, dot and line patterns in each of the pattern units 3131 have different line width dimensions. That is to say, the line widths and lengths of the vertical, horizontal, diagonal, dot and line patterns in each of the pattern units 3131 are different and change sequentially from large to small, so as to simulate different wafer manufacturing line width processes.
[0053] See Figure 6 As shown, the random pattern 33 includes a fret pattern composed of back-and-forth broken lines and protrusions, which can simulate the wiring rules of the peripheral random area in wafer manufacturing. The above random area can be used to verify the defect detection ability of the optical detection device on the random pattern. See Figure 6 As shown, the basic width of the lines of the fret pattern is 2um, forming an approximate "3i" contour. The fret pattern can be a pattern similar to Figure 6 pattern.
[0054] See Figure 7 As shown, the resolution pattern 32 includes a line pair scale covering 60 to 3500 line pairs. The above line pairs can be used to verify the resolution ability of optical lenses from 8 microns to about 0.14 microns, basically covering the main lens resolution ability range of the optical detection device. When arranging, it can be partitioned by taking six line pair sizes as one area, and there are a total of six partitions: 6, 7, 8, 9, 10, and 11.
[0055] The fourth pattern area can be divided into a fourth pattern first sub-area, a fourth pattern second sub-area, and a fourth pattern third sub-area. See Figure 8 As shown, the line width pattern 34 includes one or more of a rectangular line width pattern 341, a rotated rectangular line width pattern 342 obtained by rotating the rectangular line width pattern 341 by 90°, and a circular line width pattern 343. The rectangular line width pattern 341 is arranged in the fourth pattern first sub-area, the rotated rectangular line width pattern 342 is arranged in the fourth pattern second sub-area, and the circular line width pattern 343 is arranged in the fourth pattern third sub-area. By designing different line width patterns, including different shapes and widths, the measurement ability of the optical detection device for line width can be verified.
[0056] Continue to see Figure 8 As shown, the rectangular line width pattern 341 includes a plurality of concentrically arranged square frames, and the line width of each square frame gradually decreases in a set direction, such asFigure 8 In (a), the side lengths of three concentrically arranged square frames are 110 μm, 82 μm, and 55 μm respectively; refer to Figure 8 (b), the rotated rectangular line width pattern 342 is obtained by rotating the rectangular line width pattern 341 by 90°. The number and side lengths of its square frames are the same as those of the square frames of the rectangular line width pattern 341. The circular line width pattern 343 includes a plurality of concentrically arranged rings, and the line widths of the respective rings gradually decrease in a set direction. For example Figure 8 (c), the radii of three concentrically arranged rings are 60 μm, 44 μm, 33 μm, and 27.5 μm respectively. Among them, the set direction is from the inside to the outside or from the outside to the inside. It can be understood that the set directions of the rectangular line width pattern 341, the rotated rectangular line width pattern 342, and the circular line width pattern 343 can be the same or different. The specific selection of the set direction can be determined according to actual needs.
[0057] Refer to Figure 2 As shown, the overlay pattern 35 includes a plurality of sub - overlay patterns. The sub - overlay patterns include a plurality of alignment marks, and there is a preset offset between the centers of two adjacent alignment marks. It can be understood that the above - mentioned preset offset can be determined according to actual needs, and the preset offsets of different sub - overlay patterns can be the same or different. At least one of the alignment marks of the sub - overlay patterns is rectangular, and at least one of the alignment marks of the sub - overlay patterns is cross - shaped.
[0058] By designing different sub - overlay patterns, including different alignment marks and alignment mark offsets, it is used to verify the accuracy of the overlay measurement of the optical detection device.
[0059] For example, as an example, refer to Figure 2 As shown, the overlay pattern 35 is designed with two sub - overlay patterns. One is a rectangular - based overlay mark, and the other is a cross - based overlay mark. The rectangular overlay marks form a complete set of rectangular overlay areas through the displacement change differences between several groups of rectangles. The cross - shaped overlay mark area forms a complete set of cross - shaped overlay areas through the displacement change differences between cross - shapes.
[0060] In summary, the present application proposes a new detection medium for an automatic optical inspection device. Different patterns and different defect types are designed in this detection medium to simulate the detection conditions of mass production as much as possible. At the same time, this detection medium is not only used for the sensitivity verification of an automatic optical defect detection device, but also can be used for the resolution verification, distortion verification, and uniformity verification of an optical imaging lens. Moreover, in this detection medium, patterns for critical dimension and overlay accuracy testing are designed. Therefore, the detection medium proposed in the present application fully considers the usage scenarios of an automatic optical wafer inspection device, and basically can complete most of the optical and inspection-related functions on a standard medium, improving the verification accuracy, reducing the production cost, and simplifying the verification process.
[0061] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. Unless otherwise clearly specified and defined, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0062] It should be noted that in the present application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.
[0063] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features claimed herein.
Claims
1. A detection medium for an automatic optical detection device, characterized in that: It includes a medium body (1), and a plurality of pattern layers (2) arranged up and down along the thickness direction of the medium body (1), and the pattern layers (2) are provided with pattern units (3) arranged in an array; Each pattern unit (3) of each pattern layer (2) is provided with at least one standard pattern, and the standard pattern includes one of an array pattern (31), a resolution pattern (32), a random pattern (33), a line width pattern (34), and a registration pattern (35); All the pattern layers (2) as a whole are provided with at least two standard patterns.
2. The detection medium of the automatic optical detection device according to claim 1, wherein: The array pattern (31) includes one or several of a stripe array pattern (311), a rotating array pattern (312), and a pattern array pattern (313).
3. The detection medium of the automatic optical detection device according to claim 2, wherein: The stripe array pattern (311) includes horizontal and vertical stripe patterns; And / or, the stripe array pattern (311) contains a plurality of stripe units (3111), and the horizontal and vertical stripe patterns in each stripe unit (3111) have different line width dimensions; And / or, the rotating array pattern (312) includes an oblique line pattern; And / or, the rotating array pattern (312) contains a plurality of rotating units (3121), and the oblique line patterns in each rotating unit (3121) have different line width dimensions; And / or, the pattern array pattern (313) includes horizontal, vertical, oblique dot and line patterns, and the widths of some lines gradually change; And / or, the pattern array pattern (313) contains a plurality of pattern units (3131), and the horizontal, vertical, oblique dot and line patterns in each pattern unit (3131) have different line width dimensions.
4. The detection medium of the automatic optical detection device according to claim 1, characterized in that: The resolution pattern (32) includes a line pair scale covering 60 to 3500 line pairs.
5. The detection medium of the automatic optical detection device according to claim 1, characterized in that: The random pattern (33) includes a fret pattern composed of back-and-forth broken lines and protrusions.
6. The detection medium of the automatic optical detection device according to claim 1, characterized in that: The line width pattern (34) includes one or several of a rectangular line width pattern (341), a rotated rectangular line width pattern (342) obtained by rotating the rectangular line width pattern (341) by 90°, and a circular line width pattern (343).
7. The detection medium of the automatic optical detection device according to claim 6, wherein: The rectangular line width pattern (341) includes a plurality of concentrically arranged square frames, and the line width of each square frame gradually decreases in a set direction; And / or, the circular line width pattern (343) includes a plurality of concentrically arranged circular rings, and the line width of each circular ring gradually decreases in a set direction.
8. The detection medium of the automatic optical detection device according to claim 7, characterized in that: The set direction is from the inside to the outside or from the outside to the inside.
9. The detection medium of the automatic optical detection device according to claim 1, wherein: The registration pattern (35) includes a plurality of sub-registration patterns, and each sub-registration pattern includes a plurality of alignment marks, and the centers of two adjacent alignment marks have a preset offset.
10. The detection medium of the automatic optical detection device according to claim 9, wherein: The alignment mark of at least one of the sub-nested pattern is rectangular; The alignment mark of at least one of the sub-nested pattern is cross-shaped.