Positioning mechanism for chip packaging patch
Through the support plate structure driven by electric slide rails and electric push rods, combined with sponge wipe cleaning, the problem of difficult to remove the chip fixing mechanism and dust accumulation is solved, and the chip is easily fixed and cleaned, improving processing stability and quality.
Patent Information
- Application Number
- CN202422436039.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-10-09
AI Technical Summary
The existing chip fixing mechanism is difficult to remove the chip efficiently, and dust and debris are easily accumulated during the processing process, affecting the processing quality of the chip.
The support plate structure driven by electric slide rails and electric push rods is used to clean it with sponge wipes. The support plate adjusts the chip height when it rises or falls, and the lifting and lowering of the electric push rod is automatically adjusted through the pressure sensor to achieve convenient fixing and cleaning of the chip.
It realizes convenient removal and fixation of the chip, prevents dust and debris from entering the through-trough, and improves the stability and quality of chip processing.
Smart Images
Figure CN223156006U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip processing, in particular to a positioning mechanism for chip packaging and pasting. Background Art
[0002] A pick-and-place machine: also known as a "chip mounter" or "surface mount system" (Surface Mount System). In a production line, it is configured after a dispensing machine or a screen printer. It is a device that accurately places surface mount components on PCB pads by moving the pick-and-place head. It is divided into two types: manual and fully automatic. A fully automatic pick-and-place machine is a device used to achieve high-speed and high-precision fully automatic placement of components. It is the most critical and complex device in the entire SMT production. The pick-and-place machine is the main device in the SMT production line. The pick-and-place machine has evolved from an early low-speed mechanical pick-and-place machine to a high-speed optical centering pick-and-place machine, and is developing towards multi-function and flexible connection modularization.
[0003] When a chip is pasted, the chip needs to be fixed. The existing fixing mechanism is a fixing seat with a groove. The chip is placed in the groove. However, due to the small volume of the chip, it is not easy to take out the chip placed in the groove. At the same time, during processing, dust and debris are likely to accumulate in the groove.
[0004] Therefore, it is very necessary to propose a new positioning mechanism for chip packaging and pasting to solve the above problems. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a positioning mechanism for chip packaging and pasting, so as to solve the problem that when a chip is pasted, the chip needs to be fixed. The existing fixing mechanism is a fixing seat with a groove. The chip is placed in the groove. However, due to the small volume of the chip, it is not easy to take out the chip placed in the groove. At the same time, during processing, dust and debris are likely to accumulate in the groove.
[0006] To achieve the above purpose, the utility model provides the following technical solution: A positioning mechanism for chip packaging and pasting, including an electric slide rail. Two electric slide rails are arranged in parallel. Sliders are slidably matched on the opposite sides of the two electric slide rails. A chip placement block is fixed between two corresponding sliders. A U-shaped frame is fixed at the bottom end of the chip placement block. A through groove is opened at the top end of the chip placement block. There are multiple through grooves, and the multiple through grooves are equidistantly distributed along the length direction of the chip placement block. The U-shaped opening of the U-shaped frame faces upward. A support plate is arranged to be lifted and lowered inside the through groove. A sponge wipe is fixedly connected to the outside of the support plate. The outside of the sponge wipe is attached to the inner wall of the corresponding through groove.
[0007] Preferably, an electric push rod is fixed inside the U-shaped frame. The top of the electric push rod is provided with a lifting plate. The top of the lifting plate is fixed with support columns. There are multiple support columns, and the multiple support columns extend into the corresponding through grooves. The bottom end of the support plate is fixed on the corresponding support column.
[0008] Preferably, a pressure sensor is embedded in the top end of the support plate.
[0009] Preferably, sliding grooves are opened at both ends inside the U-shaped frame. The sliding grooves are distributed along the height direction of the U-shaped frame. The two ends of the lifting plate are respectively slidably matched in the corresponding sliding grooves.
[0010] Preferably, there are multiple electric push rods, and the multiple electric push rods are equidistantly distributed along the length direction of the U-shaped frame.
[0011] Preferably, the chip placement blocks are distributed along the length direction of the electric slide rail. The length of the U-shaped frame is the same as the length of the chip placement blocks, and the height of the chip placement blocks is flush with the height of the electric slide rail.
[0012] Preferably, the bottom of the through groove penetrates through the bottom end of the chip placement block.
[0013] The beneficial technical effect of the present utility model is that: when the chip placement block drives the chip to reach the specified processing area, by starting the electric push rod, the electric push rod can be driven to extend upward or retract downward, so that the support plate rises or falls, driving the chips in the corresponding through grooves to adjust the height, facilitating the chips to be taken out of the through grooves or fixed in the through grooves. And when the support plate rises or falls, the sponge wipes outside the support plate will rub the inner walls of the corresponding through grooves to carry out cleaning work, avoiding debris or dust from entering the inside of the through grooves and affecting the processing of the chips.
[0014] At the same time, a pressure sensor is embedded in the top end of each support plate. When the chip is being pasted or processed with pressure, the pressure sensor will detect the pressure signal. Through the different pressures received by the chip, the lifting height of the electric push rod can be automatically adjusted to make adaptive changes. And when the electric push rod rises or falls, it can synchronously drive all the chips in the through grooves to rise or fall, facilitating the processing of the same size chips in the same batch. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the positioning mechanism for chip encapsulation and pasting of the present utility model.
[0016] Figure 2 For the present utility model Figure 1 The enlarged schematic diagram at A in.
[0017] Figure 3This is a schematic structural diagram of the U-shaped frame and the electric push rod of the present utility model.
[0018] In the figure: 1, electric slide rail; 2, slider; 3, chip placement block; 4, through groove; 5, support plate; 6, sponge eraser; 7, pressure sensor; 8, U-shaped frame; 9, electric push rod; 10, lifting plate; 11, support column. Specific embodiments
[0019] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.
[0020] As Figure 1 - Figure 3 shown, the present utility model provides a positioning mechanism for chip packaging and pasting, including two electric slide rails 1 arranged in parallel. A slider 2 is slidably engaged with each of the opposite sides of the two electric slide rails 1. A chip placement block 3 is fixed between the two corresponding sliders 2. A through groove 4 is opened at the top of the chip placement block 3. The through groove 4 can place the chip to be pasted and fix the chip.
[0021] When the electric slide rail 1 is started, the chip placement block 3 can be driven by the slider 2 to move, facilitating the movement of the placed chip to the processing area for processing.
[0022] A U-shaped frame 8 is fixed to the bottom end of the chip placement block 3. A plurality of through grooves 4 are opened at the top of the chip placement block 3. The plurality of through grooves 4 are equidistantly distributed along the length direction of the chip placement block 3. The U-shaped opening of the U-shaped frame 8 faces upward. A support plate 5 is vertically arranged inside the through groove 4. A sponge eraser 6 is fixedly connected to the outside of the support plate 5. The outside of the sponge eraser 6 is attached to the inner wall of the corresponding through groove 4.
[0023] An electric push rod 9 is fixed inside the U-shaped frame 8. The top end of the electric push rod 9 is provided with a lifting plate 10. The top end of the lifting plate 10 is fixed with a plurality of support columns 11. The plurality of support columns 11 extend into the corresponding through grooves 4. The bottom end of the support plate 5 is fixed to the corresponding support column 11.
[0024] Chute grooves are opened at both ends inside the U-shaped frame 8. The chute grooves are distributed along the height direction of the U-shaped frame 8. The two ends of the lifting plate 10 are respectively slidably engaged inside the corresponding chute grooves. When the electric push rod 9 rises, the lifting plate 10 will be driven to rise. The support columns 11 and the support plate 5 at the top end of the lifting plate 10 will rise inside the corresponding through grooves 4.
[0025] In the actual operation of the present utility model, when the chip placement block 3 drives the chip to reach the designated processing area, by starting the electric push rod 9, the electric push rod 9 can be driven to extend upward or retract downward, so that the support plate 5 rises or falls, driving the chip in the corresponding through groove 4 to adjust the height, facilitating the taking out of the chip from the through groove 4 or fixing the chip in the through groove 4. Moreover, while the support plate 5 rises or falls, the sponge wipe 6 outside the support plate 5 will rub the inner wall of the corresponding through groove 4 to carry out the cleaning work, preventing debris or dust from entering the inside of the through groove 4 and affecting the processing of the chip.
[0026] At the same time, a pressure sensor 7 is embedded at the top of each support plate 5. When the chip is being pasted or processed under pressure, the pressure sensor 7 will detect the pressure signal. By the different pressures received by the chip, the lifting height of the electric push rod 9 is adjusted, so as to make an adaptive change. Moreover, when the electric push rod 9 rises or falls, it can synchronously drive all the chips in the through grooves 4 to rise or fall, facilitating the processing of the same-size chips in the same batch.
[0027] A plurality of electric push rods 9 are provided, and the plurality of electric push rods 9 are equidistantly distributed along the length direction of the U-shaped frame 8. The setting of the plurality of electric push rods 9 can make the rising or falling of the lifting plate 10 more stable.
[0028] The chip placement blocks 3 are distributed along the length direction of the electric slide rail 1. The length of the U-shaped frame 8 is the same as the length of the chip placement blocks 3, and the height of the chip placement blocks 3 is flush with the height of the electric slide rail 1.
[0029] The bottom of the through groove 4 penetrates through the bottom end of the chip placement block 3.
Claims
1. A positioning mechanism for chip packaging and pasting, comprising an electric slide rail (1), characterized in that: There are two electric slide rails (1) arranged in parallel. On the opposite sides of the two electric slide rails (1), there are sliders (2) in sliding fit. A chip placement block (3) is fixed between the two corresponding sliders (2). A U-shaped frame (8) is fixed to the bottom end of the chip placement block (3). A through groove (4) is formed at the top end of the chip placement block (3). There are multiple through grooves (4), and the multiple through grooves (4) are equidistantly distributed along the length direction of the chip placement block (3). The U-shaped opening of the U-shaped frame (8) faces upward. A support plate (5) is arranged to be lifted and lowered inside the through groove (4). A sponge eraser (6) is fixedly connected to the outer side of the support plate (5), and the outer side of the sponge eraser (6) is attached to the inner wall of the corresponding through groove (4).
2. The positioning mechanism of the chip package patch according to claim 1, characterized in that: An electric push rod (9) is fixed inside the U-shaped frame (8). A lifting plate (10) is arranged at the top end of the electric push rod (9). A support column (11) is fixed to the top end of the lifting plate (10). There are multiple support columns (11), and the multiple support columns (11) extend into the corresponding through grooves (4). The bottom end of the support plate (5) is fixed to the corresponding support column (11).
3. The positioning mechanism of the chip packaging and pasting according to claim 1, characterized in that: A pressure sensor (7) is embedded at the top end of the support plate (5).
4. The positioning mechanism of the chip packaging and pasting according to claim 2, characterized in that: Chute grooves are formed at both ends inside the U-shaped frame (8), and the chute grooves are distributed along the height direction of the U-shaped frame (8). The two ends of the lifting plate (10) are respectively in sliding fit with the corresponding chute grooves.
5. The positioning mechanism of the chip packaging patch according to claim 2, characterized in that: There are multiple electric push rods (9), and the multiple electric push rods (9) are equidistantly distributed along the length direction of the U-shaped frame (8).
6. The positioning mechanism of the chip packaging patch according to claim 1, wherein: The chip placement block (3) is distributed along the length direction of the electric slide rail (1). The length of the U-shaped frame (8) is the same as the length of the chip placement block (3), and the height of the chip placement block (3) is flush with the height of the electric slide rail (1).
7. The positioning mechanism of the chip package patch according to claim 1, wherein: The bottom of the through groove (4) penetrates through the bottom end of the chip placement block (3).