Bonding tool for hybrid integrated circuit

Abstract

The utility model relates to the field of hybrid integrated circuits, in particular to a bonding tool for a hybrid integrated circuit, which comprises a substrate mounting device, a plurality of mounting grooves, a plurality of gas channels and vacuum holes, the mounting grooves are used for placing substrates and are arranged in an array, and the gas channels and the vacuum holes are communicated with one another. The plurality of gas channels comprise at least one first channel arranged along each column in the plurality of mounting grooves and at least one second channel arranged along each row, one end of the at least one gas channel penetrates through the main body and is used for being communicated with a negative pressure source, and the plurality of vacuum holes are used for being communicated with the bottoms of the plurality of mounting grooves and the gas channels; and negative pressure is formed between the mounting groove and the substrate to adsorb the substrate. According to the bonding tool provided by the invention, the damage to the substrate and the metal conduction band on the surface of the substrate can be reduced to the greatest extent while the substrate is ensured to be stably fixed in the mounting groove.

Description

Technical Field

[0001] The present disclosure relates to the field of hybrid integrated circuits, and particularly to a bonding tool for hybrid integrated circuits. Background Art

[0002] In the process of hybrid integrated circuit processing, the traditional processing method is to bond the substrate to the base of the package first and then perform bonding. Specifically: first, form metal conductive bands on the substrate, then bond this substrate into the cavity of the base, subsequently bond the required electronic components to the substrate, and then perform bonding to achieve the required circuit functions. Finally, seal the cover and the base through hermetic welding to complete the encapsulation.

[0003] However, for some hybrid integrated circuit products, the cavity of their base is designed to be relatively deep and contains long pins inside. If the above traditional processing method is used for bonding inside the cavity of the base, it will bump the base or the pins during the bonding process, with a relatively high operation difficulty and prone to product failure.

[0004] Therefore, the existing improvement strategy is: first fix the substrate on the bonding tool, then bond the electronic components on the substrate through bonding wires, and then bond the substrate after bonding to the inside of the package. However, this improvement still faces some challenges. For example, since the substrate is relatively thin and light and has metal conductive bands formed on its surface, using the existing bonding tool is likely to damage the metal conductive bands and the edges of the substrate, thereby affecting the product performance.

[0005] Therefore, it is necessary to develop a new type of bonding tool to reduce the damage to the substrate and improve the product performance. Summary of the Utility Model

[0006] To solve or improve the problems in the prior art, the present disclosure provides a new type of bonding tool for hybrid integrated circuits. This bonding tool can ensure the stable fixation of the substrate while reducing the damage to the substrate and the metal conductive bands on its surface; in addition, the bonding tool does not increase the processing difficulty.

[0007] Specifically, the present disclosure provides a bonding tool for hybrid integrated circuits, including a substrate mounting device. The substrate mounting device includes a main body, and the main body includes:

[0008] A plurality of mounting grooves, arranged in an array on one side surface of the main body for placing the substrate;

[0009] A plurality of gas channels communicating with each other, arranged inside the main body, including at least one first channel arranged along each column of the plurality of mounting grooves and at least one second channel arranged along each row of the plurality of mounting grooves. At least one gas channel has an exposed end, and this exposed end penetrates the main body and at least part of the exposed end is used to communicate with a negative pressure source;

[0010] Multiple vacuum holes are used to connect the bottoms of multiple mounting grooves to the gas channel, so as to form a negative pressure between the mounting groove and the substrate to adsorb the substrate.

[0011] Compared with the prior art, in the technical solution provided by the present disclosure, the substrate to be processed is arranged in the mounting groove, and the bottom of the mounting groove is connected to the gas channel through the vacuum hole and then connected to the negative pressure source, so as to form a negative pressure in the space between the bottom of the substrate and the mounting groove, thereby quickly and firmly adsorbing the substrate to the bottom of the mounting groove. Since the substrate is fixed to the bonding tooling by air pressure, the stress on the substrate is more dispersed, and the damage to the substrate and the conductive tape thereon is smaller, so that the bonding can be completed smoothly and safely. In addition, by adjusting the pressure of the negative pressure source, the adsorption force on the substrate can be flexibly adjusted, so that the bonding tooling can be applied to substrates of various different thicknesses and structures, and thus can meet the processing requirements of various substrates, especially relatively thin and light substrates.

[0012] Moreover, the first channel and the second channel are arranged vertically and horizontally and communicate with each other, so as to form a cavity with a relatively large volume, that is, a negative pressure cavity, between the mounting groove and the negative pressure source. The negative pressure cavity can play a certain buffering effect on the pressure fluctuation of the negative pressure source, so that the acting force between the mounting groove and the substrate is relatively stable, which not only facilitates the bonding operation, but also further avoids damage to the substrate during the bonding process.

[0013] One end (i.e., the exposed end) of part of the gas channels is exposed from the main body, and at least part of the exposed ends are used to communicate with the negative pressure source. The other ends of this part of the gas channels and both ends of other gas channels can be buried in the main body, which is more convenient for the processing of the bonding tooling. The aforementioned exposed ends can be respectively connected to multiple negative pressure sources or connected to the same negative pressure source. By providing multiple gas channels for connecting to the negative pressure source, when the number and size of the substrates adsorbed by the bonding tooling remain unchanged, the desired negative pressure can be reached faster, and the adsorption force is also more uniform.

[0014] Preferably, the vacuum holes are arranged at the center of the bottom of the mounting groove and correspond to the mounting grooves one by one, which can make the stress-bearing part of the substrate located at a relatively central position and evenly transfer to the edge of the substrate, avoiding damage to the edge of the substrate.

[0015] Preferably, multiple vacuum holes are arranged at the bottom of the mounting groove, and the multiple vacuum holes are arranged in a single-layer ring or a multi-layer concentric ring with the center of the bottom of the mounting groove as the center of the circle. Arranging multiple vacuum holes under one mounting groove increases the adsorption area and further disperses the stress acting on the substrate, and can further avoid damage to the substrate while firmly adsorbing the substrate to the substrate mounting groove.

[0016] Preferably, the mounting groove includes a first groove and a second groove provided at the bottom of the first groove, and the cross-sectional area of the second groove is smaller than that of the first groove; the bottom of the second groove communicates with the vacuum hole.

[0017] The second groove connects the first groove to the vacuum hole, enabling the substrate to be more firmly adsorbed to the bottom of the mounting groove and avoiding abnormalities during the ultrasonic bonding process.

[0018] Optionally, the second groove is provided at the center of the bottom of the first groove, and the longitudinal section of the second groove is rectangular or trapezoidal.

[0019] Optionally, the second groove is a plurality of annular grooves concentric with the first groove and a connecting groove connecting the plurality of annular grooves; further, the bottom of the annular groove and / or the connecting groove communicates with the vacuum hole so that the first groove communicates with the gas channel through the second groove.

[0020] The second groove is structurally designed as a plurality of annular grooves arranged concentrically around the center of the bottom of the first groove, and the plurality of annular grooves are connected by connecting grooves distributed radially. The connecting grooves between the plurality of annular grooves can be in different radial directions, optimizing the gas flow path. At the same time, this design allows the vacuum hole (single or multiple) to be set below any annular groove or connecting groove, and can be flexibly configured below any annular groove or directly connected to the connecting groove to connect the first groove to the gas channel.

[0021] Preferably, a positioning edge is provided at the top edge of the mounting groove to facilitate bonding.

[0022] Preferably, a pick-and-place groove is provided at the top edge of the mounting groove, and the depth of the pick-and-place groove is greater than that of the mounting groove to facilitate picking up or placing the substrate with tweezers.

[0023] Preferably, the substrate mounting device further includes an airtight screw, which is provided in the part of the exposed end of the gas channel that is not used for communicating with the negative pressure source to seal the gas channel.

[0024] Preferably, the substrate mounting device further includes a nozzle joint, one end of the nozzle joint is connected to at least a part of the exposed end of the gas channel; the other end of the nozzle joint is a gas path connection end for communicating with the negative pressure source.

[0025] Preferably, the aforementioned bonding tooling further includes a negative pressure source, the negative pressure source includes a first port and a second port, wherein: the first port is used to communicate with the gas supply device through a first gas pipe to supply gas to the negative pressure source and drive the negative pressure source; the second port is connected to the substrate mounting device through a second gas pipe to form a negative pressure between the mounting groove and the substrate.

[0026] Preferably, an air path switch is provided on the aforementioned first gas pipe to control the flow rate of the gas flowing into the negative pressure source.

[0027] Preferably, a digital pressure gauge is provided on the aforementioned second gas pipe to monitor the pressure of the installation groove.

[0028] In summary, the bonding tooling provided by the present disclosure can firmly fix the substrate and reduce the damage to the substrate and its surface metal conductive strip during the bonding process. In addition, it can also reduce the operation difficulty, thereby improving the product performance. Description of the Drawings

[0029] Figure 1 is an assembly drawing of the substrate mounting device provided by an embodiment of the present disclosure;

[0030] Figure 2 is a three-dimensional structural schematic diagram of the substrate mounting device provided by an embodiment of the present disclosure;

[0031] Figure 3 is a horizontal cross-sectional schematic diagram of the substrate mounting device provided by an embodiment of the present disclosure;

[0032] Figure 4 is a row cross-sectional schematic diagram of the substrate mounting device provided by an embodiment of the present disclosure;

[0033] Figure 5 is a column cross-sectional schematic diagram of the substrate mounting device provided by an embodiment of the present disclosure;

[0034] Figure 6 is a partial enlarged schematic diagram of the substrate mounting device provided by an embodiment of the present disclosure;

[0035] Figure 7 is a three-dimensional structural schematic diagram of the airtight screw provided by an embodiment of the present disclosure;

[0036] Figure 8 is a three-dimensional structural schematic diagram of the air nozzle joint provided by an embodiment of the present disclosure;

[0037] Figure 9 is a schematic diagram of the gas path connection between the substrate mounting device and components such as a vacuum generator serving as a negative pressure source in the embodiment.

[0038] Description of the Labels in the Drawings:

[0039] 1000: Substrate mounting device, 1100: Main body;

[0040] 1110: Installation groove, 1111: First groove, 1112: Second groove, 1113: Positioning edge, 1114: Pick-and-place groove;

[0041] 1120: Gas channel, 1121: First channel, 1122: Second channel;

[0042] 1130: Vacuum hole;

[0043] 1200: Hermetic screw;

[0044] 1300: Air nozzle joint, 1310: Gas path connection end. Detailed implementation manners

[0045] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0046] The following embodiments are exemplary, and the implementation manners described therein do not represent all implementation manners consistent with the present disclosure. The "connection" involved in the embodiments of the present disclosure mainly refers to the structural connection, including fixed connection or detachable connection, and the airtight connection between pipelines and chambers.

[0047] It should be understood that although the present disclosure uses ordinal numbers such as "first" and "second", these ordinal numbers are only used to distinguish the same type of things from each other, and do not represent their sequence, importance or quantity. Without conflict, the features in the following embodiments and implementation manners can be combined with each other.

[0048] Since the substrate is thin and metal conductive bands are formed on the surface of the substrate, in the process of hybrid integrated circuit processing, if the existing bonding tooling is used to fix the substrate, for example, pressing against the upper and lower surfaces of the substrate or pressing against the opposite edges of the substrate to fix the substrate, it is easy to damage the metal conductive bands on the substrate or damage the edges of the substrate, thereby affecting the performance of the product.

[0049] To reduce the damage to the substrate and without increasing the processing difficulty, the embodiments of the present disclosure provide a new type of bonding tooling, which can not only ensure that the substrate is firmly fixed, but also reduce the damage to the edges of the substrate and the metal conductive bands on its top surface; in addition, the usage method of this bonding work is relatively simple. In the following, the exemplary implementation manners of the above-mentioned bonding tooling will be described with reference to the drawings.

[0050] The bonding tooling provided by the embodiments of the present disclosure is applicable to the process of hybrid integrated circuit processing, especially applicable to the bonding process of the substrate. As Figure 1 and Figure 2 shown, the bonding tooling includes a substrate mounting device 1000, and the substrate mounting device 1000 includes a main body 1100. The main body 1100 has two opposite surfaces and side surfaces connected between the two surfaces. A plurality of mounting grooves 1110 are provided on one of the surfaces (hereinafter this surface will be referred to as the "upper surface", and the opposite surface will be referred to as the "lower surface").

[0051] The shape and size of the main body 1100 are subject to being adaptable to the bonding device. Optionally, the main body 1100 is an approximately rectangular plate-like structure. The shape and size of the installation grooves 1110 are adapted to the shape and size of the substrate to be processed; the sizes and shapes of the multiple installation grooves 1110 can be set to be the same or different, and can be specifically set according to actual processing requirements. In one embodiment, referring to Figure 1 and Figure 2 , the horizontal cross-section of the installation groove 1110 is approximately circular, and the multiple installation grooves 1110 are set to be the same. In a specific implementation manner, for example, in the structure shown in Figures 1 to 3 , the multiple installation grooves 1110 are arranged on the upper surface of the main body 1100 in an array, such as arranged in six rows and four columns, four rows and six columns, five rows and five columns, or can also be arranged in only one row or one column.

[0052] A plurality of gas channels 1120 are provided inside the main body 1100, and the plurality of gas channels 1120 communicate with each other, for example, communicate at the intersections of rows and columns; at least one end of at least one gas channel 1120 penetrates the main body 1100. In one embodiment, referring to Figure 1 and Figure 2 , the gas channels 1120 extend in a direction parallel to the upper surface of the main body 1100, and at least one end of at least one of them penetrates the main body 1100 and exposes from the side surface of the main body 1100, that is, the port of at least one gas channel 1120 is located on the side surface of the main body 1100. For the convenience of description below, this exposed end is called the exposure end. At least part of the exposure end is used to communicate with the negative pressure source, so that each gas channel 1120 is directly or indirectly communicated with the negative pressure source.

[0053] As shown in Figures 1 to 4 , the bottom of each installation groove 1110 communicates with the gas channel 1120 through a vacuum hole 1130, so that a negative pressure is formed in the space between the installation groove 1110 and the substrate, thereby adsorbing the substrate in the installation groove 1110 to facilitate bonding processing. Compared with the prior art, in the embodiments of the present disclosure, the substrate is adsorbed by negative pressure, the acting force applied to the substrate is more dispersed, the deformation of the substrate caused is smaller, and the damage to the thin and light substrate and the metal conductive band thereon is smaller. In addition, by adjusting the pressure of the negative pressure source, the adsorption force on the substrate can be flexibly adjusted, so that it can be applied to substrates of various different thicknesses and structures, further avoiding damage to the substrate and the metal conductive band during the bonding process.

[0054] In some embodiments, considering that the mounting grooves 1110 are arranged in an array, the plurality of gas channels 1120 communicating with each other may include at least one first channel 1121 disposed along each column among the plurality of mounting grooves 1110 and at least one second channel 1122 disposed along each row among the plurality of mounting grooves 1110. Among them, at least some of the first channels 1121 may have exposed ends, or at least some of the second channels 1122 may have exposed ends; or at least some of the first channels 1121 and at least some of the second channels 1122 may both have exposed ends. For example Figure 3 In the structure shown, all the first channels 1121 and all the second channels 1122 have exposed ends.

[0055] In the above embodiments, the first channels 1121 and the second channels 1122 that are staggered and communicate with each other form a cavity with a relatively large volume between the mounting grooves 1110 and the negative pressure source. This cavity can play a certain buffering effect on the pressure fluctuation of the negative pressure source. For example, when the negative pressure source is turned on or off, the negative pressure value may instantaneously exceed the preset value, and the aforementioned cavity can provide an expansion space for the gas therein, relieve the pressure fluctuation of the negative pressure source, and prevent the substrate, especially a thin and light substrate, from being damaged.

[0056] On the other hand, by arranging the plurality of gas channels 1120 to communicate with each other, a more uniform gas adsorption can be formed between the mounting grooves 1110 in each row and each column and the substrate, avoiding problems such as insufficient local adsorption force, and further realizing reliable fixation of the substrate.

[0057] Preferably, referring to Figure 2 and Figure 3 , the plurality of mounting grooves 1110 are arranged in six rows and four columns. The plurality of gas channels 1120 communicating with each other include four first channels 1121 disposed along the column direction in the mounting grooves 1110 and one second channel 1122 disposed along the row direction in the mounting grooves 1110. One end of all the first channels 1121 and the second channel 1122 penetrates through the main body 1100, that is, one end of all the first channels 1121 and the second channel 1122 is an exposed end, so as to facilitate the connection of some or all of the exposed ends with the negative pressure source. The other ends of all the first channels 1121 and the second channel 1122 are buried inside the main body 1100. This setting is more convenient for processing. For example, drilling holes inward on the side surface of a metal plate-shaped raw material to form the above-mentioned first channels 1121 and second channels 1122. Of course, the present disclosure is not limited to this. As long as it is ensured that at least one of the ports of the above-mentioned first channels 1121 and second channels 1122 is exposed through the side surface of the main body 1100. For example, grooves can also be respectively opened on the surfaces of two metal plate-shaped structures, and then the grooved surfaces are adhesively bonded or fixed in other ways so that the corresponding grooves are aligned to form the first channels 1121 and second channels 1122 that meet the above requirements.

[0058] In a typical embodiment, the substrate mounting device 1000 further includes a nozzle joint 1300, for example Figure 6 and Figure 8 in the structure shown, one end of the nozzle joint 1300 is embedded in the exposed end; the other end of the nozzle joint 1300 is a gas path connection end 1310 for communicating with a negative pressure source. In other words, at least part of the exposed end of the above gas channel 1120 can be connected to the negative pressure source through the nozzle joint 1300.

[0059] For the case where part of the exposed end is not used to communicate with the negative pressure source, in a typical embodiment, the substrate mounting device 1000 further includes an airtight screw 1200, for example Figure 6 and Figure 7 in the structure shown, the airtight screw 1200 is embedded in one of the exposed ends to seal the gas channel 1120.

[0060] A plurality of gas channels 1120 are set unsealed, and the plurality of unsealed gas channels 1120 are respectively connected to a plurality of negative pressure sources or connected to the same negative pressure source. With the above settings, when the number and size of the substrates adsorbed by the bonding tooling remain unchanged, the desired negative pressure can be achieved faster, and at the same time, the adsorption force is more uniform.

[0061] It can be understood that the number of gas channels 1120 and whether the gas channels 1120 penetrate the main body 1100 can be flexibly set. For example, both opposite ends of all the gas channels 1120 are buried inside the main body 1100, and additional gas pipes are provided to connect some of the gas channels 1120 to the negative pressure source.

[0062] In an alternative embodiment, for example Figure 4 and Figure 5 in the structure shown, a vacuum hole 1130 is provided below the center of the bottom of each mounting groove 1110. The vacuum hole 1130 communicates the mounting groove 1110 with the gas channel 1120. The substrate is fixed at the bottom of the mounting groove 1110 by forming a negative pressure through gas flow. The vacuum hole 1130 is provided at the center position of the bottom of the mounting groove 1110, so that the adsorption force on the substrate tends to the center of the substrate and can be evenly transmitted to the edge of the substrate, avoiding damage to the edge of the substrate.

[0063] In a specific embodiment, a plurality of vacuum holes 1130 are provided at the bottom of each mounting groove 1110. The plurality of vacuum holes 1130 are evenly arranged and avoid through holes that may exist on the substrate. In this way, the substrate can be adsorbed through the plurality of vacuum holes 1130, increasing the adsorption area. In other words, the plurality of vacuum holes 1130 disperse the pressure exerted on the substrate, further firmly adsorbing the substrate in the mounting groove 1110 and being able to avoid damaging the thin and light substrate. In a preferred embodiment, the plurality of vacuum holes 1130 are arranged in a ring shape, and the ring is centered on the center of the bottom of the mounting groove 1110; or the plurality of vacuum holes 1130 can also be arranged in a plurality of concentric rings centered on the center of the bottom of the mounting groove 1110 and distributed radially, so that the adsorption force is more uniform.

[0064] In one embodiment, one end of the vacuum hole 1130 communicates with the intersection of gas channels 1120 in different directions. For example, one end of the vacuum hole 1130 is connected to the intersection of the first channel 1121 and the second channel 1122.

[0065] It is not difficult to understand that to achieve sufficient adsorption force, the larger the size of the radial cross-section (i.e., the transverse cross-section in the figure) of the vacuum hole 1130, the better. However, practice shows that during the bonding process, especially when using ultrasonic bonding, the problem of abnormal bonding points occasionally occurs. It is speculated that this may be because, due to the relatively large diameter of the vacuum hole 1130, there is a cavity between the vacuum hole 1130 and the substrate. Specifically, a cavity is formed at the port of the vacuum hole 1130. During the ultrasonic bonding process, due to ultrasonic vibration, resonance may occur at the position of the cavity, resulting in abnormal bonding points.

[0066] Therefore, in a preferred embodiment, the mounting groove 1110 includes a first groove 1111 and a second groove 1112 provided at the bottom of the first groove 1111. That is, along the thickness direction of the main body 1100, the first groove 1111 extends from the upper surface of the main body 1100 to the lower surface by a first distance, and the second groove 1112 continues to extend from the bottom of the first groove 1111 to the lower surface of the main body 1100 by a second distance; of course, the sum of the first distance and the second distance is less than the thickness of the main body 1100.

[0067] The setting of the second groove 1112 further increases the size of the chamber formed between the bottom of the substrate and the mounting groove 1110, that is, a negative pressure chamber with a contact area with the substrate far exceeding the diameter of the vacuum hole 1130 is formed at the bottom of the substrate. At the same time, without increasing the diameter of the vacuum hole 1130, the substrate can be more firmly adsorbed to the bottom surface of the first groove 1111, and the adsorption force on the substrate is more uniform. At the same time, similar to the above, it can also buffer the problem of pressure fluctuation. Therefore, by setting the mounting groove 1110 with the above structure, the problem of abnormal bonding points is effectively avoided.

[0068] Figure 4 and Figure 5 In the structure shown, the second groove 1112 is a cylindrical groove, and the bottom area of the second groove 1112 is smaller than the bottom area of the first groove 1111. The second groove 1112 communicates with the vacuum hole 1130 and indirectly connects the first groove 1111 to the vacuum hole 1130. Of course, the second groove 1112 can also be set as a frustum of a cone or other shapes. From another perspective, the longitudinal section of the second groove 1112 is rectangular, trapezoidal (such as an isosceles trapezoid) or other shapes.

[0069] Preferably, the above-mentioned second groove 1112 can also be set as a plurality of annular grooves concentric with the first groove 1111; the plurality of grooves are connected by a communication groove, and the communication groove can extend along the radial direction of the plurality of annular grooves. Optionally, the communication grooves between the plurality of annular grooves can be in different radial directions. In this case, a plurality of or a single vacuum hole 1130 can be arranged below any annular groove or communication groove to connect the first groove 1111 to the gas passage 1120, further improving the flexibility of the structural arrangement.

[0070] In a preferred embodiment, a positioning edge 1113 is provided at the top edge of the mounting groove 1110, and the positioning edge 1113 can include at least one straight edge. For example, in Figure 3 and Figure 6 the structure shown, it includes a long side, which is arranged on one side of the top edge of the mounting groove 1110; this long side is, for example, parallel to the extending direction of the first channel 1111; or, as Figure 3 shown, the positioning edge 1113 can further include two short sides, and the two short sides are respectively connected to both ends of the long side and are parallel to the extending direction of the second channel 1122.

[0071] In addition, the positioning edge 1113 can also adopt other ways, not limited to the way of one or more straight lines, as long as positioning can be achieved. For example, the positioning edge 1113 can also be an arc, and the arc has a different radian from other areas of the mounting groove 1110. The size of the positioning edge 1113 is adapted to the length of the positioning edge of the substrate to be adsorbed.

[0072] It should be noted that, of course, the above-mentioned positioning edge 1113 is described and defined from the perspective of the transverse section. Actually, the positioning edge 1113 is a three-dimensional structure and should actually be a positioning surface.

[0073] In a preferred embodiment, a pick-and-place groove 1114 is further provided at the top edge of the mounting groove 1110 to facilitate taking out or placing the substrate with tweezers or other clamping tools. Figure 1 and Figure 3In the structure shown, the pick-and-place groove 1114 is provided at the edge of the installation groove 1110. The depth of the pick-and-place groove 1114 is slightly greater than that of the installation groove 1110, so as to form a step at the junction of the bottom surfaces of the pick-and-place groove 1114 and the installation groove 1110, facilitating the picking and placing of the substrate in the installation groove 1110 with tweezers. Of course, the pick-and-place groove 1114 can also be arranged in other ways, as long as it can facilitate the picking and placing of the substrate with tweezers.

[0074] In a specific embodiment, as shown in Figure 9 the above bonding tooling further includes a negative pressure source. The negative pressure source can be connected to the gas supply device through a gas path switch, for example. The negative pressure source is, for example, a vacuum generator, and the gas supply device can be a compressed gas supply device, such as a plant-wide centralized gas supply system. When the gas path switch is opened, the compressed gas drives the vacuum generator to operate, so that the vacuum generator provides negative pressure as the negative pressure source required in the foregoing embodiment.

[0075] The specific structure and working principle of the foregoing vacuum generator are the same as those of the prior art, and will not be elaborated in this disclosure due to space limitations. Specifically, the first port of the vacuum generator is connected to the compressed gas supply device through a first gas pipe, and the second port of the vacuum generator can be connected to the nozzle joint 1300 of the substrate mounting device 1000 through a second gas pipe, so as to form a negative pressure between the installation groove 1110 and the substrate.

[0076] Using the plant-wide centralized gas supply system as the compressed gas supply device to drive the vacuum generator to operate is more compact and economical than an electrically driven vacuum machine or vacuum pump.

[0077] In some embodiments, the vacuum generator serving as the negative pressure source can also be an electrically driven device.

[0078] Preferably, a gas path switch is provided on the first gas pipe to control the flow rate of the gas flowing into the vacuum generator. In some embodiments, the negative pressure value provided by the vacuum generator can be controlled thereby, and the adsorption force of the substrate mounting device 1000 on the substrate can be adjusted thereby.

[0079] Preferably, a digital display pressure gauge can also be provided on the second gas pipe to monitor the pressure in the vacuum chamber, or rather, the adsorption force of the substrate mounting device 1000 on the substrate.

[0080] Preferably, a tee is provided on the second gas pipe. One end of the first part of the second gas pipe is connected to the negative pressure source, and the other end is connected to the first port of the tee. One end of the second part of the second gas pipe is connected to the second port of the tee, and the other end is connected to the nozzle joint 1300 of the substrate mounting device 1000. The third port of the tee is connected to the digital display pressure gauge to monitor the vacuum value in real time, and start bonding after ensuring that the product is adsorbed firmly and stably.

[0081] To provide a more complete description of the bonding tooling in the embodiments, the following is an exemplary operation process using the above bonding tooling:

[0082] Place the substrate into the substrate mounting groove 1110 of the substrate mounting device 1000. Open the air circuit switch. After the digital display pressure gauge reaches the value required by the process and remains stable, start operating the bonding equipment for bonding.

[0083] The above embodiments can avoid damaging the substrate during the process of placing the substrate on the bonding tooling and during the bonding process. By setting the size and shape of the mounting groove on the substrate mounting device according to different product types, the actual requirements of bonding multiple hybrid circuit single substrates can be met, and almost no modification to the existing bonding equipment is required, further reducing the processing cost.

[0084] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the present disclosure.

Claims

1. A bonding tool for hybrid integrated circuits, characterized in that Comprising a substrate mounting device (1000), the substrate mounting device (1000) includes a main body (1100), and the main body (1100) includes: A plurality of mounting grooves (1110) for placing substrates, which are arranged in an array on one side surface of the main body (1100); A plurality of gas channels (1120) communicating with each other, which are arranged inside the main body (1100), including at least one first channel (1121) arranged along each column of the plurality of mounting grooves (1110), and at least one second channel (1122) arranged along each row of the plurality of mounting grooves (1110). At least one gas channel (1120) has an exposed end, and the exposed end penetrates the main body (1100) and at least part of the exposed end is used to communicate with a negative pressure source; A plurality of vacuum holes (1130) for communicating the bottoms of the plurality of mounting grooves (1110) with the gas channels (1120), so as to form a negative pressure between the mounting grooves (1110) and the substrate to adsorb the substrate.

2. The bonding tool according to claim 1, wherein The vacuum holes (1130) correspond to the mounting grooves (1110) one by one and are arranged at the centers of the bottoms of the mounting grooves (1110); Or The bottom of the mounting groove (1110) is provided with a plurality of vacuum holes (1130), and the plurality of vacuum holes (1130) are arranged in a single-layer ring or a multi-layer concentric ring with the center of the bottom of the mounting groove (1110) as the center of the circle.

3. The bonding tool according to claim 1 or 2, characterized in that, The mounting groove (1110) includes a first groove (1111) and a second groove (1112) provided at the bottom of the first groove (1111). The cross-sectional area of the second groove (1112) in the transverse direction is smaller than the cross-sectional area of the first groove (1111) in the transverse direction; the bottom of the second groove (1112) communicates with the vacuum hole (1130).

4. The bonding tool according to claim 3, wherein, The second groove (1112) is arranged at the center of the bottom of the first groove (1111), and the longitudinal cross-section of the second groove (1112) is rectangular or trapezoidal; Or, the second groove (1112) includes a plurality of annular grooves concentric with the first groove (1111) and a communication groove communicating the plurality of annular grooves; the bottoms of the annular grooves and / or the communication groove communicate with the vacuum hole (1130) to connect the first groove (1111) to the gas channel (1120).

5. The bonding tool according to claim 1, wherein, A positioning edge (1113) is provided at the top edge of the mounting groove (1110).

6. The bonding tool according to claim 1, wherein, A pick-and-place groove (1114) is provided at the edge of the mounting groove (1110), and the depth of the pick-and-place groove (1114) is greater than the depth of the mounting groove (1110).

7. The bonding tool according to claim 1, characterized in that The substrate mounting device (1000) further includes an airtight screw (1200), which is arranged at a part of the exposed end of the gas channel (1120) that is not used to communicate with the negative pressure source, so as to seal the gas channel (1120).

8. The bonding tool according to claim 1, characterized in that, The substrate mounting device (1000) further includes a nozzle joint (1300). One end of the nozzle joint (1300) is connected to at least a partially exposed end of the gas passage (1120), and the other end of the nozzle joint (1300) is a gas path connection end (1310) for communicating with a negative pressure source.

9. The bonding tool according to claim 1, wherein, It further includes a negative pressure source, and the negative pressure source includes a first port and a second port, where: The first port is used to communicate with a gas supply device through a first gas pipe so that gas is supplied to the negative pressure source and the negative pressure source is driven. The second port is communicated with the substrate mounting device (1000) through a second gas pipe so that a negative pressure is formed between the mounting groove (1110) and the substrate.

10. The bonding tooling according to claim 9, wherein, An air path switch is provided on the first gas pipe for controlling the flow rate of the gas flowing into the negative pressure source; a digital display pressure gauge is provided on the second gas pipe for monitoring the pressure of the mounting groove (1110).

Images