Three-dimensional steam cavity embedded liquid cooling radiator

Abstract

A three-dimensional vapor chamber embedded liquid cooling radiator comprises a three-dimensional vapor chamber element with a plurality of fins and a semi-open shell, the three-dimensional vapor chamber element comprises an upper cover and a lower plate, the upper cover comprises a raised tube body arranged on the upper surface of the upper cover and provided with a tube body cavity and a tube body outer surface, and the lower plate is opposite to the upper cover and provided with a plurality of fins. When the upper cover is coupled to the lower plate, a closed air cavity is formed, the fins form the upper surface of the upper cover at intervals to form a plurality of micro-channels, meanwhile, the fins surround the protruding pipe body, the semi-open shell is coupled to the three-dimensional steam cavity element to form a heat exchange cavity, the semi-open shell is provided with an input port and an output port, the input port is used for inputting cooling liquid, and the output port is used for outputting cooling liquid. After the cooling liquid flows through the plurality of micro-channels and the outer surface of the pipe body of the convex pipe body, the cooling liquid is output through the output port.

Description

Technical Field

[0001] The utility model relates to a cold plate type liquid cooling radiator, in particular to a three-dimensional vapor cavity embedded liquid cooling radiator in which a three-micro vapor cavity element with a plurality of fins is embedded in a liquid cooling heat exchange cavity. Background Art

[0002] As the thermal design power (TDP) and power density of high-computing chips and communication chips in servers and communication switches gradually increase, the temperature of the chips also gradually increases. The 3D stacked IC packaging also makes it more difficult to dissipate the heat generated by the bottom chip.

[0003] The conventional air cooling technology has faced a bottleneck, and liquid cooling technology has emerged. Among them, cold plate liquid cooling technology has gradually become the mainstream. The conventional cold plate cooling technology can be roughly divided into shovel-tooth microchannel cold plates, jet-flow cold plates and two-phase flow cold plates. However, as the power of integrated circuit components such as chips exceeds 1,000W, the power density exceeds 100W / cm2, and it is a 3D stacked packaging structure, the conventional cold plate cooling technology also faces the bottleneck of heat dissipation and heat dissipation. Although the general pure jet-type cold plate can effectively reduce the chip temperature in the coolant impact area, it will also cause the problem of excessive temperature difference of the entire chip; the shovel-tooth microchannel cold plate that generally relies on heat dissipation fins for heat dissipation also faces the difficulty of reducing thermal resistance and the problem of temperature uniformity; and the two-phase flow cold plate also faces the problem of complex and expensive two-phase coolant circulation system and insufficient heat dissipation area.

[0004] Therefore, in order to solve the heat dissipation and cooling challenges brought about by the current gradual increase in chip power and power density, it is necessary to provide a more efficient solution that can simultaneously solve the heat dissipation and temperature uniformity problems of high-power chips. Utility Model Content

[0005] In view of this, the purpose of the utility model is to provide a three-dimensional vapor chamber embedded liquid cooling radiator, which can effectively solve the heat dissipation and heat dissipation problems caused by the current gradual increase in chip power and power density, and solve the heat dissipation and temperature uniformity problems of high-power chips.

[0006] To achieve the above object, the utility model discloses a three-dimensional vapor chamber embedded liquid cooling radiator, which is characterized by comprising:

[0007] A three-dimensional vapor chamber element with multiple fins, comprising:

[0008] An upper cover having an upper cover upper surface and a protruding tube body, wherein the protruding tube body is disposed on the upper cover upper surface and has a tube body cavity and an outer tube body surface; and

[0009] A lower plate, relative to the upper cover, and when the upper cover is coupled to the lower plate, a sealed air cavity is formed;

[0010] A plurality of fins, spaced apart and formed on the upper surface of the upper cover to form a plurality of microchannels, and simultaneously surrounding the raised tube body; and

[0011] A semi-open housing, coupled to the three-dimensional vapor chamber element to form a heat exchange cavity, the semi-open housing having an input port for inputting coolant and an output port, so that the coolant flows through the microchannels and the outer surface of the tube body of the raised tube body and then is output through the output port.

[0012] Wherein, the semi-open housing includes a spray head connected to the input port, the input port is relative to the raised tube body, and the spray head sprays the coolant onto the outer surface of the tube body of the raised tube body first and then flows through the microchannels and is output through the output port.

[0013] Wherein, the raised tube body further has a tube body top end, which is accommodated in the input port.

[0014] Wherein, the input port has an opening and a flow channel opening communicating with the opening, so that the coolant is first sprayed onto the outer surface of the tube body of the raised tube body through the opening and then flows through the microchannels and is output through the output port.

[0015] Wherein, the semi-open housing has a housing lower surface, and the microchannel fins abut against the housing lower surface.

[0016] Wherein, the semi-open housing further has a top plate and a side plate, the input port is arranged on the top plate, and the output port is arranged on the top plate or the side plate.

[0017] Wherein, the spray head has a spray port to spray the coolant onto the outer surface of the raised tube body nearby.

[0018] Wherein, the semi-open housing further has a top plate and a side plate, a top plate flow channel is provided in the top plate and has a top plate side end, the input port is arranged at the top plate side end, the top plate flow channel connects the input port and the spray head, and the output port is arranged on the side plate.

[0019] Wherein, the upper cover further has an upper cover cavity, and when the upper cover is coupled to the lower plate, the tube body cavity and the upper cover cavity form the sealed air cavity.

[0020] Wherein, the lower plate has a lower plate cavity, and when the upper cover is coupled to the lower plate, the tube body cavity and the lower plate cavity form the sealed air cavity.

[0021] In summary, the present utility model provides a three-dimensional vapor chamber embedded liquid cooling radiator. First, after the lower plate of the three-dimensional vapor chamber element in close contact with the heat source absorbs heat energy, the working fluid inside the three-dimensional vapor chamber element undergoes phase change and two-phase flow circulation in the sealed gas chamber. Further, since a plurality of fins are arranged on the upper surface of the upper cover, when the three-dimensional vapor chamber embedded liquid cooling radiator of the present utility model actually operates, the coolant can directly splash and impact the raised pipe body after flowing in from the input port, and then flow through the microchannels formed by each fin and perform forced heat exchange.

[0022] Therefore, in the three-dimensional vapor chamber embedded liquid cooling radiator of the present utility model, since the position where the raised pipe body is arranged is perpendicular to the heat source (i.e., the wafer), when the coolant flows in from the input port, it can directly dissipate heat from the place with the highest temperature, allowing the coolant to take away the heat energy from the radiator. Moreover, the three-dimensional vapor chamber embedded liquid cooling radiator of the present utility model further provides different forms to meet the heat dissipation requirements of electronic products with space limitations or multi-wafer electronic products, so as to satisfy the efficient wafer heat dissipation and heat spreading solutions required for the development of high-power wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Shows a cross-sectional view of a three-dimensional vapor chamber embedded liquid cooling radiator according to a specific embodiment of the present utility model.

[0024] Figure 2 Shows Figure 1 an exploded view of a three-dimensional vapor chamber embedded liquid cooling radiator.

[0025] Figure 3 Shows a cross-sectional view of a three-dimensional vapor chamber embedded liquid cooling radiator according to another specific embodiment of the present utility model.

[0026] Figure 4 Shows a cross-sectional view of a three-dimensional vapor chamber embedded liquid cooling radiator according to another specific embodiment of the present utility model.

[0027] Figure 5 Shows a cross-sectional view of a three-dimensional vapor chamber embedded liquid cooling radiator according to another specific embodiment of the present utility model.

[0028] Figure 6 Shows a cross-sectional view of a three-dimensional vapor chamber embedded liquid cooling radiator according to another specific embodiment of the present utility model.

[0029] Figure 7 Shows a schematic diagram of a three-dimensional vapor chamber element according to another specific embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] In order to make the advantages, spirit, and features of the present utility model easier and clearer to understand, the following will be described and discussed in detail with specific embodiments and with reference to the accompanying drawings. It should be noted that these specific embodiments are only representative specific embodiments of the present utility model, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present utility model or the corresponding specific embodiments. Also, the components in the drawings are only used to express their relative positions and are not drawn according to their actual proportions. The step numbers of the present utility model are only used to distinguish different steps and do not represent the order of the steps. This is stated first for clarification.

[0031] Please refer to Figure 1 and Figure 2 , Figure 1 which shows a sectional view of a three-dimensional vapor chamber embedded liquid-cooled radiator 1 of a specific embodiment of the present utility model, Figure 2 and Figure 1 shows an exploded view of the three-dimensional vapor chamber embedded liquid-cooled radiator 1 according to Figure 1 and Figure 2 As shown, the three-dimensional vapor chamber embedded liquid-cooled radiator 1 of this specific embodiment includes a three-dimensional vapor chamber element 10 with a plurality of fins 20 as a condensation area and a semi-open housing 30. The three-dimensional vapor chamber element 10 includes an upper cover 101 and a lower plate 102. The upper cover 101 has an upper cover upper surface 1011 and a protruding tube body 1012, where the protruding tube body 1012 is disposed on the upper cover upper surface 1011 and has a tube cavity 1013 and a tube outer surface. The lower plate 102 is opposite to the upper cover, and a sealed air cavity 103 is formed when the upper cover 101 is coupled to the lower plate 102. A plurality of fins 20 are spaced apart on the upper cover upper surface 1011 to form a plurality of microchannels 201, and at the same time, they surround the protruding tube body 1012. The semi-open housing 30 is coupled to the three-dimensional vapor chamber element 10 to form a heat exchange cavity 301. The semi-open housing has an input port 302 and an output port 303. The input port 302 is used to input coolant. After the coolant flows through the plurality of microchannels 201 and the tube outer surface of the protruding tube body 1012, it is then output through the output port 303.

[0032] In this specific embodiment, the three-dimensional vapor chamber element 10 with multiple fins 20 further includes a continuous porous capillary structure (not shown in the figure) and multiple support columns 104 with porous capillary structures. In practice, the porous capillary structure is disposed on the lower surface of the upper cover 101 and the upper surface of the lower plate 102, and the support columns 104 are disposed between the upper cover 101 and the lower plate 102. When the upper cover 101 is coupled to the lower plate 102, the multiple support columns 104 with porous capillary structures are located between the upper cover 101 and the lower plate 102, and further, the multiple support columns 104 with porous capillary structures form a continuous capillary structure with the porous capillary structure on the lower surface of the upper cover 101 and the upper surface of the lower plate 102 of the lower plate 102. Then, the working fluid is injected into the tube cavity of the upper cover 101 and the lower plate cavity of the lower cover and evacuated. After evacuation, the tube cavity and the lower plate cavity form a sealed air cavity 103. In practice, the working fluid can be water or a two-phase coolant, such as R134a. In another embodiment, the upper cover further has an upper cover cavity. When the upper cover is coupled to the lower plate, the tube cavity and the upper cover cavity form a sealed air cavity; in another embodiment, the upper cover has both a tube cavity and an upper cover cavity and the lower plate has a lower plate cavity. When the upper cover is coupled to the lower plate, the tube cavity, the upper cover cavity, and the lower plate cavity form a sealed air cavity.

[0033] In practical applications, the lower plate 102 of the three-dimensional vapor chamber element 10 with multiple fins 20 serves as the heat absorption area and preferentially absorbs the heat energy of the heat source 90. At this time, the working fluid in the sealed air cavity 103 of the three-dimensional vapor chamber element 10 absorbs heat energy and undergoes a phase change from the liquid working fluid to the gaseous working fluid. Then, the gaseous working fluid after the phase change in the heat absorption area can directly spray upward into the condensation area of the convex tube body 1012. Due to the temperature reduction, the cooled working fluid will undergo a phase change again and return to the liquid working fluid, and finally flow back to the heat absorption area along the porous capillary structure and the support columns 104, thereby repeating the two-phase flow cycle inside the three-dimensional vapor chamber element 10.

[0034] In practice, the fins of the three-dimensional vapor chamber embedded liquid cooling radiator 1 of this specific embodiment can be milled into shovel teeth fins 20 by the shovel tooth process, and the gap between the distances of each fin 20 forms a microchannel 201 so that the coolant can flow through more evenly. Then, the upper cover 101 with the shovel teeth fins 20 is coupled to the convex tube body 1012 into one body by welding. In another embodiment, the thickness of the upper cover and the height of the shovel teeth fins can also be reserved for the metal material, and then multiple fins are milled out by the CNC process, so that the shovel teeth fins are integrally formed on the upper cover. Due to the integral forming relationship, the thermal resistance between the flow channel fins and the upper cover can be reduced, thereby improving the heat dissipation efficiency.

[0035] The semi-open housing 30 of the three-dimensional vapor chamber embedded liquid cooling radiator 1 of the present specific embodiment further includes a top plate 306 and a side plate 307. Among them, the input port 302 is arranged on the top plate 306; the output port 303 is arranged on the top plate 306 or the side plate 307. In practical applications, Figure 1 the arrow direction in is the coolant flow direction F. As Figure 1 shown, in addition to the heat dissipation by the two-phase flow cycle inside the three-dimensional vapor chamber element 10 described above, the coolant can be further directly sprayed from the input port 302 onto the outer surface of the protruding tube 1012 of the upper cover 101, and then flow through a plurality of microchannels 201 and be output through the output port. It should be noted that the input port 302 of the semi-open housing 30 is arranged at a position relative to the protruding tube 1012 so that the coolant can be directly vertically sprayed onto the outer surface of the tube for efficient heat exchange. In practice, the coolant can be one of water, acetone, ammonia, methanol, tetrachloroethane, and hydrofluorocarbon chemical refrigerants, but not limited thereto. The coolant can also be other fluids with heat absorption and heat removal capabilities. In another embodiment, the semi-open housing further includes a spray head connected to the input port, and the positions of the spray head and the input port are both relative to the protruding tube. The spray head further has a spray port for spraying the coolant onto the outer surface of the protruding tube first, and then flowing through a plurality of microchannels and being output through the output port. Please note that considering the heat exchange area of the microchannels and the flow rate of the coolant flowing through, the flow channel width d of the microchannels 201 of the three-dimensional vapor chamber embedded liquid cooling radiator of the present utility model is less than or equal to 1 mm. In practice, the flow channel width of the microchannels, the thickness of the fins, the size of the microchannels, and the number of output ports are not limited to this and can be adjusted according to the design. In practice, the lower plate of the three-dimensional vapor chamber element can also be designed according to requirements. For example, when there are other electronic components with a height higher than the heat source near the heat source, the lower cover can further include a boss structure to avoid the higher electronic components.

[0036] In practical applications, the three-dimensional vapor chamber embedded liquid cooling radiator of the present utility model can be installed in any high-power electronic product or server. However, when the installation space of the electronic device is limited, the present utility model further provides other embodiments. Please refer to Figure 3 , Figure 3 which shows a cross-sectional view of the three-dimensional vapor chamber embedded liquid cooling radiator 2 of another specific embodiment of the present utility model. As Figure 3As shown, the input port 302 and the output port 303 of the three-dimensional vapor chamber embedded liquid cooling radiator 2 of this specific embodiment are both provided on the top plate 306 of the semi-open housing 31. Let the coolant flow in from the input port 302 and exchange heat with the fins 20, and then sequentially flow along the microchannel to the protruding tube body 1012 on the upper cover to dissipate heat from the outer surface of the tube body of the protruding tube body, and finally flow out from the output port 303 along the microchannel 201. The other devices of this specific embodiment are substantially the same as the corresponding devices of the foregoing specific embodiment, so they will not be described in detail here. In practice, in addition to using the three-dimensional vapor chamber element of the present invention, a heat pipe can also be used.

[0037] Furthermore, the present invention provides embodiments of other aspects. Please refer to Figure 4 , Figure 4 which shows a cross-sectional view of a three-dimensional vapor chamber embedded liquid cooling radiator 3 of another specific embodiment of the present invention. As Figure 4 shown, the input port 302 of the semi-open housing 32 of the three-dimensional vapor chamber embedded liquid cooling radiator 3 of this specific embodiment further has an opening 305, and the protruding tube body 1012 has a tube top 1014, and the tube top 1014 will be received in the opening 305 of the input port 302. The other devices of this specific embodiment are substantially the same as the corresponding devices of the foregoing specific embodiment, so they will not be described in detail here.

[0038] The present invention provides embodiments of other aspects. Please refer to Figure 5 , Figure 5 which shows a cross-sectional view of a three-dimensional vapor chamber embedded liquid cooling radiator 4 of another specific embodiment of the present invention. As Figure 5 shown, the input port 302 of the semi-open housing 33 of the three-dimensional vapor chamber embedded liquid cooling radiator 4 of this specific embodiment further has an opening 305 and a flow channel opening 3051 communicating with the opening 305, and the tube top 1014 of the protruding tube body 1012 will be received in the opening 305. In practical applications, when the coolant flows in from the input port 302, it first flows through the opening 305 and then splashes on the outer surface of the tube body of the protruding tube body 1012. The coolant then flows into the area of the flow channel opening 3051 structure. At this time, since the flow channel opening 3051 structure of the three-dimensional vapor chamber embedded liquid cooling radiator 3 of this specific embodiment can control the water pressure when the coolant is input, the coolant then flows into the microchannels between each fin 20 from the flow channel opening 3051. It should be noted that the fins 20 of the three-dimensional vapor chamber embedded liquid cooling radiator 3 of this specific embodiment will abut against the lower surface of the housing of the semi-open housing 32. The other devices of this specific embodiment are substantially the same as the corresponding devices of the foregoing specific embodiment, so they will not be described in detail here. In practice, the size of the opening 305 and the size and shape of the flow channel opening 3051 can be designed according to requirements.

[0039] Please refer to Figure 6 , Figure 6 which shows a sectional view of the three-dimensional vapor chamber embedded liquid cooling radiator 5 of another specific embodiment of the present utility model. As Figure 6 shown, the semi-open housing 34 of the three-dimensional vapor chamber embedded liquid cooling radiator 5 of this specific embodiment further has a top plate 306 and a side plate 307. A top plate flow channel 3061 is provided in the top plate 306 and has a top plate side end 3062. The input port 302 is provided at the top plate side end 3062. The top plate flow channel 3061 is used to connect the input port 302, and the output port 303 is provided on the side plate 307. The coolant flows in from the input port 302 on the top plate side end 3062 and then flows along the top plate flow channel 3061 to the spray port. Then the coolant directly splashes on the outer surface of the tube body of the protruding tube body (not shown in the figure). The coolant further exchanges heat with each fin 20 along the micro-channel (not shown in the figure) structure, takes away the remaining heat energy again, and flows through the heat exchange cavity 301. Finally, it flows out from the output port 303 of the side plate 307 to complete a liquid cooling cycle of heat exchange. Please note that Figure 6 the illustrated input port is provided on the right side of the top plate. However, the setting position is not limited thereto, and the output port can also be provided in the top plate. In another embodiment, the semi-open housing further is provided with a spray head. The coolant is input from the input port and splashes the coolant onto the protruding tube body of the three-dimensional vapor chamber along the spray head. The other devices of this specific embodiment are substantially the same as the corresponding devices of the foregoing specific embodiment, so they will not be described in detail here.

[0040] Furthermore, for the wafer specifications with higher and higher power, in addition to the specifications with a single heat source, there will also be designs with multiple wafers of different powers at the same time. The present utility model further provides corresponding embodiments. Please refer to Figure 7 , Figure 7 which shows a schematic diagram of the three-dimensional vapor chamber element 11 of another specific embodiment of the present utility model. As Figure 7As shown in the figure, the three-dimensional vapor chamber element 11 of this specific embodiment includes three groups of protruding tube bodies 1012, 1015, and 1016. In practice, the height of the protruding tube body can correspond to the heat source (i.e., the power of the wafer). For example, the number of heat sources in this specific embodiment is 3, and the power magnitudes of the heat sources are in sequence: heat source 90 is greater than heat source 91 is greater than heat source 92. Among them, the protruding tube body 1012 is correspondingly arranged at a position relative to the heat source 90; the protruding tube body 1015 is correspondingly arranged at a position relative to the heat source 91; the protruding tube body 1016 is correspondingly arranged at a position relative to the heat source 92. Therefore, the height of the protruding tube body 1012 is greater than the height of the protruding tube body 1015 is greater than the height of the protruding tube body 1016 to dissipate heat for heat sources with different powers. Other devices of this specific embodiment are substantially the same as the corresponding devices in the foregoing specific embodiments, so they will not be elaborated here. In practice, the number and arrangement positions of the protruding tube bodies in the three-dimensional vapor chamber element are not limited to this, and can be designed according to the actual size, number, and specifications of the heat source.

[0041] To sum up, the present invention provides a three-dimensional vapor chamber embedded liquid-cooled radiator. First, after the three-dimensional vapor chamber element closely attached to the heat source absorbs heat energy, the working fluid inside the three-dimensional vapor chamber element undergoes phase change and two-phase flow circulation in the closed gas chamber. Further, since a plurality of fins are arranged on the upper surface of the upper cover, when the three-dimensional vapor chamber embedded liquid-cooled radiator of the present invention actually operates, the coolant can directly splash and impact at the protruding tube body after flowing in from the input port, and then flow through the microchannels formed by each fin and perform forced heat exchange.

[0042] Therefore, in the three-dimensional vapor chamber embedded liquid-cooled radiator of the present invention, since the position where the protruding tube body is arranged is perpendicular to the heat source (i.e., the wafer), when the coolant flows in from the input port, it can directly dissipate heat from the place with the highest temperature, allowing the coolant to take the heat energy away from the radiator. And the three-dimensional vapor chamber embedded liquid-cooled radiator of the present invention further provides different forms to meet the heat dissipation requirements for electronic products with space limitations or multi-wafer electronic products, so as to meet the efficient wafer heat dissipation and heat spreading solutions required under the development of high-power wafers.

[0043] From the detailed description of the above preferred specific embodiments, it is hoped that the features and spirit of the present invention can be more clearly described, rather than limiting the scope of the present invention by the above-disclosed preferred specific embodiments. On the contrary, the purpose is to hope to cover various changes and equivalent arrangements within the scope of the patent scope to which the present invention is to be applied. Therefore, the scope of the patent scope applied for by the present invention should be interpreted as broadly as possible according to the above description, so as to cover all possible changes and equivalent arrangements.

Claims

1. A three-dimensional vapor chamber embedded liquid cooling radiator, characterized in that Comprising: A three-dimensional vapor chamber element with multiple fins, comprising: An upper cover having an upper cover upper surface and a raised tube body, the raised tube body being disposed on the upper cover upper surface and having a tube body cavity and a tube body outer surface; And A lower plate, relative to the upper cover and when the upper cover is coupled to the lower plate, forming a sealed air cavity; Multiple fins, spaced apart on the upper cover upper surface to form multiple microchannels and surrounding the raised tube body at the same time; And A semi-open housing, coupled to the three-dimensional vapor chamber element to form a heat exchange cavity, the semi-open housing having an input port for inputting coolant and an output port so that the coolant flows through the microchannels and the tube body outer surface of the raised tube body and then is output through the output port.

2. The three-dimensional vapor chamber embedded liquid cooling radiator according to claim 1, wherein, The semi-open housing includes a spray head connected to the input port, the input port being relative to the raised tube body, and the spray head first sprays the coolant onto the tube body outer surface of the raised tube body and then flows through the microchannels and is output through the output port.

3. The three-dimensional vapor chamber embedded liquid cooling radiator according to claim 2, wherein, The raised tube body further has a tube body top end, which is received in the input port.

4. The three-dimensional vapor chamber embedded liquid cooling radiator according to claim 2, wherein The input port has an opening and a flow channel opening communicating with the opening so that the coolant first sprays onto the tube body outer surface of the raised tube body through the opening and then flows through the microchannels and is output through the output port.

5. The three-dimensional vapor chamber embedded liquid cooling radiator according to claim 4, wherein, The semi-open housing has a housing lower surface, and the microchannel fins abut against the housing lower surface.

6. The three-dimensional vapor chamber embedded liquid cooling radiator according to claim 2, wherein The semi-open housing further has a top plate and a side plate, the input port is disposed on the top plate, and the output port is disposed on the top plate or the side plate.

7. The three-dimensional vapor chamber embedded liquid cooling radiator according to claim 2, characterized in that, The spray head has a spray port to spray the coolant onto the tube body outer surface of the raised tube body nearby.

8. The three-dimensional vapor chamber embedded liquid cooling radiator according to claim 2, wherein The semi-open housing further has a top plate and a side plate, a top plate flow channel is provided in the top plate and has a top plate side end, the input port is disposed at the top plate side end, the top plate flow channel connects the input port and the spray head, and the output port is disposed on the side plate.

9. The three-dimensional vapor chamber embedded liquid cooling radiator according to claim 1, wherein, The upper cover further has an upper cover cavity, and when the upper cover is coupled to the lower plate, the tube body cavity and the upper cover cavity form the sealed air cavity.

10. The three-dimensional vapor chamber embedded liquid cooling radiator according to claim 1, characterized in that, The lower plate has a lower plate cavity, and when the upper cover is coupled to the lower plate, the tube body cavity and the lower plate cavity form the sealed air cavity.

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