Triode lead frame and triode

By adopting arc-shaped and oblique pre-cut designs in the transistor lead frame, the problem of post-cut burrs is solved, the production efficiency and packaging firmness are improved, and the service life of the transistor lead frame is extended.

CN223156033UActive Publication Date: 2025-07-25DONGGUAN TONGKE ELECTRONICS CO LTD
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Patent Information

Application Number
CN202422406380.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-08
Publication Date
2025-07-25
Estimated Expiration
2034-10-08

AI Technical Summary

Technical Problem

The pre-cut grooves of the existing transistor lead frame are V-shaped, with sharp or burrs at the rear cutting end, which requires post-sanding, increasing workload and slowing down production efficiency.

Method used

Design arc-shaped and oblique pre-cut grooves to avoid burrs after cutting, and form chip placement grooves at the center of the chip section to increase the contact area.

Benefits of technology

No post-sanding is required, which improves production efficiency, enhances the firmness after packaging and the service life of the transistor lead frame.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of semiconductor components, and particularly relates to a triode lead frame and a triode, which comprises a heat dissipation part, an end part of the heat dissipation part is connected with a chip part, the chip part is connected with a middle rib through a bending part, a pin part is arranged between the middle rib and a bottom rib, and the joint of the pin part and the bottom rib is provided with an arc-shaped pre-cutting groove I; the side, on the pin part, of the first pre-cutting groove is in an arc shape, and the side, on the bottom rib, of the first pre-cutting groove is in an oblique line shape, after the part between the pin part and the bottom rib is cut off, the edge of the end of the pin part is in an arc shape, smooth, free of burrs and free of later polishing, the workload is reduced, the working efficiency is improved, the center of the chip part is punched by a punching machine to sink downwards, and a chip containing groove is formed. And the chip is welded in the chip placing groove, so that the contact area of the chip part and the chip is increased, the firmness of the chip part and the chip after packaging is improved, and the service life of the triode lead frame is prolonged.
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Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor components, and particularly relates to a triode lead frame and a triode. Background Art

[0002] In the existing triode lead frame, V-shaped pre-cut grooves are provided at all the places that need to be cut. After cutting, the end parts are relatively sharp or have many burrs, which need to be polished later, increasing the workload, slowing down the production efficiency, and wasting more time and labor costs.

[0003] For example, in a lead frame row for a reinforced photovoltaic diode with the patent application number CN201821034838.2, which includes a plurality of lead frames connected in series; it is characterized in that: the lead frame includes a positioning plate and a carrier sheet connected to the positioning plate; positioning holes are provided on the positioning plate, and two symmetrically arranged cutting process holes are provided on the positioning plate; both of the two cutting process holes communicate with the positioning holes; the cutting process holes divide the positioning plate into an upper connecting part and a lower heat dissipation part; protrusions are provided on both sides of the connecting part, and the protrusions of adjacent connecting parts are integrally connected; the heat dissipation part is integrally connected to the carrier sheet; two pre-cut grooves are provided between the connecting part and the heat dissipation part. However, the disadvantage of this technical solution is that the pre-cut grooves are V-shaped pre-cut grooves, and the end parts after cutting are relatively sharp or have many burrs, which need to be polished later, increasing the workload and slowing down the production efficiency. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a triode lead frame and a triode to solve the problems in the prior art. The specific technical solutions are as follows:

[0005] A triode lead frame includes a heat dissipation part, the end of the heat dissipation part is connected to a chip part, the chip part is connected to a middle rib through a bending part, a pin part is provided between the middle rib and a bottom rib, and an arc-shaped pre-cut groove one is provided at the connection between the pin part and the bottom rib.

[0006] Further, a heat dissipation hole is provided at the center position of the heat dissipation part.

[0007] Further, a chip placement groove is provided at the center position of the chip part.

[0008] Further, the pin part includes two side pins and a middle rib. The two side pins and the middle rib are all arranged between the middle rib and the bottom rib. Pre-cut groove ones are provided at the connections between the two side pins and the bottom rib, and a pre-cut groove one is also provided at the connection between the middle pin and the bottom rib.

[0009] Further, fixing holes are provided at the connections between the two side pins and the middle rib, and a fixing hole is also provided at the connection between the middle pin and the middle rib.

[0010] Further, upper ribs are provided between two adjacent heat dissipation parts, connecting parts are provided between two adjacent middle ribs, a first pre-cut groove is provided between the heat dissipation part and the upper rib, and a first pre-cut groove is provided between the middle rib and the connecting part.

[0011] Further, bending parts are provided on both sides of the chip part.

[0012] Further, a V-shaped second pre-cut groove is provided between the bottom rib and the connecting part, and the depth of the second pre-cut groove is one-half of the thickness of the bottom rib.

[0013] Further, a V-shaped third pre-cut groove is provided between the middle rib and the middle pin, and the depth of the third pre-cut groove is one-third of the thickness of the bottom rib.

[0014] A triode includes the triode lead frame described in any one of the above.

[0015] The advantages of the present utility model are as follows:

[0016] 1. The first pre-cut groove is arc-shaped on one side of the pin part and oblique-linear on one side of the bottom rib. After the pin part and the bottom rib are cut off, the edge of the end of the pin part is arc-shaped, smooth and without burrs, eliminating the need for later polishing, reducing the workload and improving the work efficiency.

[0017] 2. The center position of the chip part is punched and recessed downward by a punching machine to form a chip placement groove. The chip is welded in the chip placement groove, increasing the contact area between the chip part and the chip, thereby enhancing the firmness after the two are encapsulated and improving the working life of the triode lead frame. Description of the Drawings

[0018] Figure 1 is the overall structure schematic diagram of the present utility model Figure 1 ;

[0019] Figure 2 is the overall structure schematic diagram of the present utility model Figure 2 ;

[0020] Figure 3 is the overall structure schematic diagram of the present utility model Figure 3 ;

[0021] Figure 4 is the overall structure schematic diagram of the present utility model Figure 4 ;

[0022] Figure 5 is Figure 4 a cross-sectional view along the A-A section;

[0023] Figure 6 is Figure 5 a partial enlarged view of A in

[0024] Figure 7 isFigure 5 Partial enlarged view at B in [the figure];

[0025] Figure 8 is Figure 5 Partial enlarged view at C in [the figure];

[0026] Figure 9 is Figure 4 Cross-sectional view along the B-B section;

[0027] Figure 10 is Figure 9 Partial enlarged view at D in [the figure];

[0028] Description of the markings in the figure:

[0029] Heat dissipation part 1; heat dissipation holes 2; chip part 3; chip placement groove 4; upper rib 5; middle rib 6; side pins 7; middle pins 8; fixing holes 9; connecting part 10; bottom rib 11; bent part 12; pre-cut groove 1 13; pre-cut groove 2 14; pre-cut groove 3 15; bending part 16. Specific implementation mode

[0030] Next, the technical solution of the present utility model will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0031] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", and "third" are only used for the purpose of description and should not be construed as indicating or implying relative importance.

[0032] Embodiment 1

[0033] As Figures 1 - 10 shown, a triode lead frame includes a heat dissipation part 1. The end of the heat dissipation part 1 is connected to the chip part 3. The chip part 3 is connected to the middle rib 6 through a bending part 16. A pin part is provided between the middle rib 6 and the bottom rib 11, and an arc-shaped pre-cut groove 1 13 is provided at the connection of the pin part and the bottom rib 11;

[0034] Working principle of the above technical solution: The first pre-cut groove 13 is arc-shaped on one side of the pin part and oblique-linear on one side of the bottom rib 11. When the pin part and the bottom rib 11 are cut off, the edge of the end of the pin part is arc-shaped, smooth and burr-free, eliminating the need for later grinding, reducing the workload and improving work efficiency.

[0035] Embodiment 2

[0036] As Figures 1 - 10 shown, a heat dissipation hole 2 is provided at the center position of the heat dissipation part 1;

[0037] A chip placement groove 4 is provided at the center position of the chip part 3;

[0038] Working principle of the above technical solution: The center position of the chip part 3 is stamped downward by a stamping machine to form a chip placement groove 4, and the chip is welded in the chip placement groove 4, increasing the contact area between the chip part 3 and the chip, thereby enhancing the firmness after the two are encapsulated and improving the working life of the triode lead frame.

[0039] Embodiment 3

[0040] As Figures 1 - 10 shown, the pin part includes two side pins 7 and a middle rib 6. The two side pins 7 and the middle rib 6 are both arranged between the middle rib 6 and the bottom rib 11. Pre-cut grooves 13 are provided at the joints of the two side pins 7 and the bottom rib 11, and a pre-cut groove 13 is also provided at the joint of the middle pin 8 and the bottom rib 11;

[0041] Working principle of the above technical solution: The middle pin 8 is arranged at the center position of the bottom rib 11, and the two side pins 7 are respectively located on both sides of the middle pin 8. When the pin part and the bottom rib 11 are cut off, the edges of the ends of the two side pins 7 and the middle rib 6 are arc-shaped, smooth and burr-free, eliminating the need for later grinding, reducing the workload and improving work efficiency.

[0042] Embodiment 4

[0043] As Figures 1 - 10 shown, fixing holes 9 are provided at the joints of the two side pins 7 and the middle rib 6, and a fixing hole 9 is also provided at the joint of the middle pin 8 and the middle rib 6;

[0044] Working principle of the above technical solution: After the triode lead frame is plastic-sealed, the plastic-sealing body outside the triode lead frame will pass through the three fixing holes 9, further fixing the middle rib 6 in the plastic-sealing body, preventing the middle rib 6 from shaking randomly in the plastic-sealing body, thereby increasing the stability of the triode lead frame in the plastic-sealing body and improving the service life of the triode lead frame.

[0045] Embodiment 5

[0046] As Figures 1 - 10As shown, there is an upper rib 5 between two adjacent heat dissipation parts 1, a connecting part 10 between two adjacent middle ribs 6, a pre-cut groove 13 between the heat dissipation part 1 and the upper rib 5, and a pre-cut groove 13 between the middle rib 6 and the connecting part 10;

[0047] The working principle of the above technical solution: The heat dissipation part 1 and the upper rib 5 are cut open at the pre-cut groove 13. The pre-cut groove 13 is arc-shaped on the side of the heat dissipation part 1 and oblique-linear on the side of the upper rib 5. After cutting, the side edge of the heat dissipation part 1 is arc-shaped, smooth and without burrs, and no later polishing is required. The middle rib 6 and the connecting part 10 are cut open at the pre-cut groove 13. The pre-cut groove 13 is arc-shaped on the side of the middle rib 6 and oblique-linear on the side of the connecting part 10. After cutting, the side edge of the middle rib 6 is arc-shaped, smooth and without burrs, and no later polishing is required, reducing the workload and improving the work efficiency.

[0048] Embodiment Six

[0049] As Figures 1 - 10 shown, there is a V-shaped pre-cut groove 14 between the bottom rib 11 and the connecting part 10, and the depth of the pre-cut groove 14 is one-half of the thickness of the bottom rib 11;

[0050] There is a V-shaped pre-cut groove 15 between the middle rib 6 and the middle pin 8, and the depth of the pre-cut groove 15 is one-third of the thickness of the bottom rib 11;

[0051] The working principle of the above technical solution: The heat dissipation part 1 and the upper rib 5 are cut open at the pre-cut groove 13, and the bottom rib 11 and the connecting part 10 can be separated. The depth of the pre-cut groove 14 is one-half of the thickness of the bottom rib 11, and the pre-cut groove 14 is relatively deep to facilitate better cutting of the bottom rib 11 and the connecting part 10;

[0052] There is a V-shaped pre-cut groove 15 between the middle rib 6 and the middle pin 8, and the depth of the pre-cut groove 15 is one-third of the thickness of the bottom rib 11. The pre-cut groove 15 is relatively shallow. After the transistor lead frame is encapsulated by the plastic package, the plastic package will cover into the pre-cut groove 15, increasing the firmness between the transistor lead frame and the plastic package. In addition, when it is necessary to convert the transistor lead frame into a diode lead frame, only the middle pin 8 needs to be cut off at the cut groove 15, and it becomes a diode lead frame. Therefore, the transistor lead frame and the diode lead frame can use the same stamping equipment, saving equipment costs.

[0053] Embodiment Seven

[0054] As Figures 1 - 10 shown, there are bending parts 12 on both sides of the chip part 3;

[0055] Working principle of the above technical solution: When stamping the lead frame of the triode, the edge of the chip part 3 can be stamped downward to form a bent part 12. After the triode lead frame is encapsulated, the bent part 12 can be stuck into the encapsulation body, thereby increasing the stability of the triode lead frame in the encapsulation body and improving the service life of the triode lead frame.

[0056] Embodiment VIII

[0057] As Figures 1 - 10 shown, a triode includes the triode lead frame described in any one of the above.

[0058] Working principle of the above technical solution: For the triode using this triode lead frame, the edge at the lower end of the lead is smooth, preventing scratching with other objects, and the structure is stable, improving the service life of the triode.

[0059] It can be understood that the present utility model is described through some embodiments. Those skilled in the art know that without departing from the spirit and scope of the present utility model, various changes or equivalent replacements can be made to these features and embodiments. Additionally, under the teaching of the present utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application belong to the scope protected by the present utility model.

Claims

1. A triode lead frame, characterized in that, It includes a heat dissipation part (1). The end of the heat dissipation part (1) is connected to the chip part (3). The chip part (3) is connected to the middle rib (6) through a bending part (16). There is a pin part between the middle rib (6) and the bottom rib (11), and there is an arc-shaped pre-cut groove one (13) at the connection of the pin part and the bottom rib (11).

2. The lead frame of a triode according to claim 1, characterized in that, There is a heat dissipation hole (2) at the central position of the heat dissipation part (1).

3. A triode lead frame according to claim 1, characterized in that, There is a chip placement groove (4) at the central position of the chip part (3).

4. A triode lead frame according to claim 1, characterized in that, The pin part includes two side pins (7) and the middle rib (6). The two side pins (7) and the middle rib (6) are both arranged between the middle rib (6) and the bottom rib (11). There is a pre-cut groove one (13) at the connection of each of the two side pins (7) and the bottom rib (11), and there is also a pre-cut groove one (13) at the connection of the middle pin (8) and the bottom rib (11).

5. A triode lead frame according to claim 4, characterized in that, There is a fixing hole (9) at the connection of each of the two side pins (7) and the middle rib (6), and there is also a fixing hole (9) at the connection of the middle pin (8) and the middle rib (6).

6. The lead frame of a triode according to claim 5, characterized in that, There is an upper rib (5) between two adjacent heat dissipation parts (1), and there is a connecting part (10) between two adjacent middle ribs (6). There is a pre-cut groove one (13) between the heat dissipation part (1) and the upper rib (5), and there is a pre-cut groove one (13) between the middle rib (6) and the connecting part (10).

7. A triode lead frame according to claim 1, wherein, There are bending parts (12) on both sides of the chip part (3).

8. A triode lead frame according to claim 6, characterized in that There is a V-shaped pre-cut groove two (14) between the bottom rib (11) and the connecting part (10), and the depth of the pre-cut groove two (14) is one-half of the thickness of the bottom rib (11).

9. The lead frame of a triode according to claim 8, characterized in that There is a V-shaped pre-cut groove three (15) between the middle rib (6) and the middle pin (8), and the depth of the pre-cut groove three (15) is one-third of the thickness of the bottom rib (11).

10. A triode, characterized in that, It includes the triode lead frame according to any one of claims 1-9.

Citation Information

Patent Citations

  • Strenghthened type photovoltaic is lead frame row for diode

    CN208352299U