Heat dissipation structure of circuit board

Abstract

The utility model discloses a circuit board heat dissipation structure, which comprises a circuit board body, a first heat conduction part, a heat dissipation bottom plate and a second heat conduction part, the heat dissipation bottom plate is arranged below the circuit board body at intervals, the first heat conduction part is arranged between the circuit board body and the heat dissipation bottom plate and is in contact with the circuit board body and the heat dissipation bottom plate, and the second heat conduction part is in contact with the heat dissipation bottom plate. A plurality of radiating fins are arranged at the bottom of the radiating bottom plate, a radiating side plate is arranged on the left side, the second heat conducting part is arranged on the right side of the radiating side plate, the left side of the second heat conducting part is in contact with the radiating side plate, and the bottom of the second heat conducting part is in contact with the top of the circuit board body. According to the technical scheme, heat energy on the circuit board body can be conducted to the heat dissipation bottom plate and the heat dissipation fins through the first heat conduction part, the heat energy can be rapidly dissipated out through the heat dissipation bottom plate and the heat dissipation fins, and heat energy on the top of the circuit board body can be conducted to the heat dissipation side plate for heat dissipation through the second heat conduction part. Rapid heat dissipation of the circuit board is achieved, the heat dissipation effect is improved, and therefore the service life of the circuit board can be prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and particularly relates to a circuit board heat dissipation structure. Background Art

[0002] Generally, circuit boards are installed inside existing electrical components (such as step-down voltage regulators, chargers, etc.). Generally, some electronic components with large heat generation are arranged on the circuit board to meet the functional requirements of the circuit board. When the electrical components are in a working state for a long time, a large amount of heat will be generated on the internal circuit board. If the heat on the circuit board is not discharged in time, the circuit board and the electronic components thereon will be in a high-temperature state, causing damage to the circuit board and the electronic components, and shortening the service life of the circuit board. Summary of the Utility Model

[0003] In order to overcome the existing technical defects, the purpose of the utility model is to provide a circuit board heat dissipation structure to solve the above technical problems.

[0004] The technical solution adopted by the utility model to solve the technical problems is as follows:

[0005] According to one aspect of the utility model, a circuit board heat dissipation structure is designed, including: a circuit board body, a first heat conduction part, a heat dissipation bottom plate and a second heat conduction part. The heat dissipation bottom plate is arranged at an interval below the circuit board body. The first heat conduction part is arranged between the circuit board body and the heat dissipation bottom plate and is in contact with both. A plurality of heat dissipation fins are arranged at the bottom of the heat dissipation bottom plate, and a heat dissipation side plate is arranged on the left side. The second heat conduction part is arranged on the right side of the heat dissipation side plate, and its left side is in contact with the heat dissipation side plate and the bottom is in contact with the top of the circuit board body.

[0006] By adopting the above technical solution, the heat energy on the circuit board body can be conducted to the heat dissipation bottom plate and the heat dissipation fins through the first heat conduction part, and the heat energy can be quickly dissipated through the heat dissipation bottom plate and the heat dissipation fins. By arranging the second heat conduction part, the heat energy on the top of the circuit board body can be conducted to the heat dissipation side plate for heat dissipation, realizing rapid heat dissipation of the circuit board, improving the heat dissipation effect, and thus the service life of the circuit board can be improved.

[0007] In order to better solve the above technical defects, the utility model also has a better technical solution:

[0008] In some embodiments, a heat-conducting insulating sheet is arranged between the circuit board body and the heat dissipation bottom plate. Thus, the insulation performance between the circuit board body and the heat dissipation bottom plate can be improved.

[0009] In some embodiments, connection feet are respectively arranged at the four corners of the heat dissipation bottom plate, and mounting waist holes are arranged on the connection feet.

[0010] In some embodiments, the first heat conducting part is in a block structure or a sheet structure, and one or more of them are provided.

[0011] In some embodiments, the second heat conducting part is in a block structure or a long strip board structure, and one or more of them are provided.

[0012] In some embodiments, a pressing plate is arranged on the right side of the second heat conducting part, and the heat dissipation side plate is fixedly connected with the pressing plate by screws.

[0013] In some embodiments, the circuit board body is fixedly connected with the heat dissipation bottom plate by screws.

[0014] In some embodiments, a plurality of heat dissipation strips are distributed on the left side of the heat dissipation side plate, and the heat dissipation side plate and the heat dissipation bottom plate are of an integral structure. Thus, the heat dissipation performance of the circuit board can be further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. is a schematic diagram of a circuit board heat dissipation structure according to an embodiment provided by the present utility model;

[0016] Figure 2 FIG. is a schematic diagram of another perspective of the circuit board heat dissipation structure;

[0017] Figure 3 FIG. is a front view schematic diagram of the circuit board heat dissipation structure;

[0018] Figure 4 FIG. is an exploded schematic diagram of the circuit board heat dissipation structure;

[0019] REFERENCE NUMERALS:

[0020] 1. Circuit board body; 2. First heat conducting part; 3. Heat dissipation bottom plate; 31. Connection foot; 32. Mounting waist hole; 33. Heat sink; 34. Heat dissipation side plate; 4. Second heat conducting part; 5. Pressing plate; 6. Screw. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] To make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with the specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present utility model. In addition, in the following description, the descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present utility model.

[0022] In the description of the present utility model, it should be understood that when it comes to orientation descriptions, such as the upper, lower, front, rear, left, right, etc., the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0023] In the description of the present utility model, unless otherwise clearly defined, terms such as setting, installation, connection, and fixed connection should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.

[0024] Reference Figures 1 to 4 As shown, a circuit board heat dissipation structure provided by the present utility model includes: a circuit board body 1, a first heat conducting part 2, a heat dissipation bottom plate 3, and a second heat conducting part 4.

[0025] The heat dissipation bottom plate 3 is made of a metal material. Specifically, the material of the heat dissipation bottom plate 3 is aluminum or aluminum alloy or copper or silver, etc. In this embodiment, the material of the heat dissipation bottom plate 3 is preferably aluminum. Connection feet 31 are respectively arranged at the four corners of the heat dissipation bottom plate 3, and mounting waist holes 32 are arranged on the connection feet 31. The mounting waist holes 32 are strip-shaped through holes with a length greater than the width.

[0026] The heat dissipation bottom plate 3 is arranged below the circuit board body 1 and keeps a gap with the circuit board body 1. The first heat conducting part 2 is arranged between the circuit board body 1 and the heat dissipation bottom plate 3. The top of the first heat conducting part 2 contacts the circuit board body 1, and the bottom contacts the top of the heat dissipation bottom plate 3. The circuit board body 1 and the heat dissipation bottom plate 3 are fixedly connected by screws. Among them, the first heat conducting part 2 is in a block structure or a sheet structure. One or more first heat conducting parts 2 are provided. When one first heat conducting part 2 is provided, the first heat conducting part 2 is a large sheet structure. When multiple first heat conducting parts 2 are provided, the first heat conducting parts 2 are in a block structure, and the first heat conducting part 2 is located below the electronic components with a large heat generation amount on the circuit board body 1. The first heat conducting part 2 is a heat conducting silica gel sheet.

[0027] A heat conducting insulating sheet is arranged between the circuit board body 1 and the heat dissipation bottom plate 3. Among them, the heat conducting insulating sheet is located between the circuit board body 1 and the first heat conducting part 2 or between the first heat conducting part 2 and the heat dissipation bottom plate 3.

[0028] A plurality of heat dissipation fins 33 are arranged at the bottom of the heat dissipation bottom plate 3, and the heat dissipation fins 33 are an integral structure with the heat dissipation bottom plate 3.

[0029] A heat dissipation side plate 34 is provided on the left side of the heat dissipation bottom plate 3. The heat dissipation side plate 34 and the heat dissipation bottom plate 3 are of an integral structure. The second heat conduction part 4 is arranged on the right side of the heat dissipation side plate 34. The left side of the second heat conduction part 4 is in contact with the heat dissipation side plate 34, and the bottom is in contact with the top of the circuit board body 1. The second heat conduction part 4 is in a block structure or a long strip plate structure, and one or more are provided. In this embodiment, it is preferred that the second heat conduction part 4 is in a block shape and a plurality are arranged longitudinally. A pressing plate 5 is arranged on the right side of the second heat conduction part 4. The heat dissipation side plate 34 and the pressing plate 5 are fixedly connected by screws 6. Specifically, one end of the screw 6 passes through the through hole on the heat dissipation side plate 34 and is threadedly connected to the threaded hole on the pressing plate 5 to fix the second heat conduction part 4. The second heat conduction part 4 is a block-shaped heat conductive silica gel sheet.

[0030] In some embodiments, a plurality of heat dissipation strips are spaced apart and distributed on the left side of the heat dissipation side plate. The heat dissipation strips and the heat dissipation side plate are of an integral structure.

[0031] The above are only some embodiments of the present invention. For those of ordinary skill in the art, without departing from the inventive concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention.

Claims

1. A circuit board heat dissipation structure, characterized in that, Including: A circuit board body, a first heat conducting part, a heat dissipation bottom plate and a second heat conducting part. The heat dissipation bottom plate is spaced below the circuit board body. The first heat conducting part is arranged between the circuit board body and the heat dissipation bottom plate and is in contact with both of them. A plurality of heat dissipation fins are arranged at the bottom of the heat dissipation bottom plate, and a heat dissipation side plate is arranged on the left side. The second heat conducting part is arranged on the right side of the heat dissipation side plate, and its left side is in contact with the heat dissipation side plate and the bottom is in contact with the top of the circuit board body.

2. The heat dissipation structure of a circuit board according to claim 1, characterized in that, A heat conducting insulating sheet is arranged between the circuit board body and the heat dissipation bottom plate.

3. A circuit board heat dissipation structure according to claim 1 or 2, characterized in that Connecting feet are respectively arranged at the four corners of the heat dissipation bottom plate, and mounting waist holes are arranged on the connecting feet.

4. A circuit board heat dissipation structure according to claim 1, characterized in that, The first heat conducting part is in a block structure or a sheet structure, and one or more are provided.

5. The heat dissipation structure of a circuit board according to claim 1, wherein The second heat conducting part is in a block structure or a long strip board structure, and one or more are provided.

6. A circuit board heat dissipation structure according to claim 1 or 5, characterized in that, A pressing plate is arranged on the right side of the second heat conducting part, and the heat dissipation side plate and the pressing plate are fixedly connected by screws.

7. The heat dissipation structure of a circuit board according to claim 1, characterized in that, The circuit board body and the heat dissipation bottom plate are fixedly connected by screws.

8. A circuit board heat dissipation structure according to claim 1, characterized in that, A plurality of heat dissipation strips are distributed on the left side of the heat dissipation side plate, and the heat dissipation side plate and the heat dissipation bottom plate are of an integral structure.

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