PCB bonding pad structure

Abstract

The utility model relates to the technical field of PCB bonding pads, and discloses a PCB bonding pad structure, which comprises a PCB substrate, a bonding pad main body and a component body, the component body is welded on the bonding pad main body, the bonding pad main body comprises an outer layer bonding pad, a middle layer bonding pad and an inner layer bonding pad, the outer-layer bonding pad, the middle-layer bonding pad and the inner-layer bonding pad are connected to the PCB substrate in a nested or superposed manner, and solder resist ink structures are arranged at the joint of the outer-layer bonding pad and the middle-layer bonding pad and the joint of the middle-layer bonding pad and the inner-layer bonding pad. According to the PCB bonding pad structure, the solder resist ink structures are arranged at the joints of the outer-layer bonding pad, the middle-layer bonding pad and the inner-layer bonding pad, so that liquid tin is prevented from flowing through the solder resist ink structures, the liquid tin is prevented from flowing among the outer-layer bonding pad, the middle-layer bonding pad and the inner-layer bonding pad, meanwhile, the component body is limited through the solder resist ink structures, and the reliability of the component body is improved. The deviation of the component body is avoided, and the effect of improving the welding precision is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB pads, and specifically relates to a PCB pad structure. Background Technique

[0002] A PCB pad refers to the lead holes and the copper foils (copper skins) with various shapes around them on the PCB board. The shapes of the pads are different. Common ones include square pads, round pads, oval pads, etc. In addition, there are also some special pads that are not very common, such as teardrop pads, cross pads, etc., which are used to connect components to the PCB board.

[0003] Reflow soldering technology is not unfamiliar in the field of electronic manufacturing. The components on various boards used in our computers are all soldered to the circuit board through this process. There is a heating circuit inside this device that heats air or nitrogen to a high enough temperature and then blows it onto the circuit board with components already attached, so that the solder on both sides of the components melts and bonds with the main board.

[0004] Chinese Patent Publication No.: CN 118283923 A discloses an invention patent named "A Pad Structure of a PCB and Its Soldering Process", which includes components, component pads provided at both ends of the bottom of the components, and PCB pads corresponding to the two component pads; the PCB pad includes a first pad and a second pad connected to the first pad; the width of the first pad is the same as the width of the component pad;

[0005] During the soldering process of the above-mentioned prior art when passing through the reflow soldering furnace, the two ends of the component start to displace under the influence of the tin liquid tension on the surface of the molten tin liquid. Since the width of the first pad is the same as the width of the component pad, the component cannot move left and right, but can only move up and down. Due to the function of the second pad, the component needs to move up and down along the vertical direction to the geometric center of the first pad and the second pad. Therefore, tension is generated on the component. When the tensions received at both ends of the component are the same and the acting directions are opposite, the component is straightened on the surface of the liquid tin and cannot move.

[0006] However, in the prior art, due to the miniaturization of the product structure, there are compatible designs of multiple components with different specifications and sizes in the design. And to improve the integration degree of the components, the components are also placed overlappingly. The above-mentioned prior art cannot solve the problem of the offset phenomenon of multiple overlapping components passing through the reflow soldering.

[0007] Therefore, a PCB pad structure is proposed to solve the problem of multiple overlapping components and avoid the problem of passing through the reflow soldering. Content of the Utility Model

[0008] The purpose of the utility model is to provide a PCB pad structure to solve the problems proposed in the above background technique.

[0009] To solve the above technical problems, the present utility model provides the following technical solution: A PCB pad structure, comprising a PCB substrate, a pad body and a component body, wherein the component body is soldered on the pad body;

[0010] The pad body includes an outer layer pad, a middle layer pad and an inner layer pad, and the outer layer pad, the middle layer pad and the inner layer pad are connected to the PCB substrate in a nested or stacked manner;

[0011] Solder mask ink structures are provided at the joints between the outer layer pad and the middle layer pad and between the middle layer pad and the inner layer pad;

[0012] The top of the solder mask ink structure at the joint between the outer layer pad and the middle layer pad is higher than the top of the middle layer pad, and the top of the solder mask ink structure at the joint between the middle layer pad and the inner layer pad is higher than the top of the inner layer pad;

[0013] The solder mask ink structure limits the component body.

[0014] Preferably, both the outer layer pad and the middle layer pad are semi-open shapes, and the middle layer pad is nested inside the outer layer pad;

[0015] The inner layer pad is rectangular, and the inner layer pad is nested inside the middle layer pad.

[0016] Preferably, there is a gap between the outer layer pad and the middle layer pad, and there is a gap between the middle layer pad and the inner layer pad;

[0017] The solder mask ink structures are respectively filled in the gaps between the outer layer pad and the middle layer pad and between the middle layer pad and the inner layer pad.

[0018] Preferably, the outer layer pad, the middle layer pad and the inner layer pad are all rectangular, the outer layer pad is located at the bottommost, the middle layer pad is stacked on top of the outer layer pad, and the inner layer pad is stacked on top of the middle layer pad.

[0019] Preferably, the solder mask ink structures are respectively provided on the tops of the outer layer pad and the middle layer pad;

[0020] The solder mask ink structure provided on the top of the outer layer pad overlaps with the side surface of the middle layer pad, and the top of the solder mask ink structure is higher than the top of the middle layer pad;

[0021] The solder mask ink structure provided on the top of the middle layer pad overlaps with the side surface of the inner layer pad, and the top of the solder mask ink structure is higher than the top of the inner layer pad.

[0022] Preferably, the component body includes a bottom layer component, a middle layer component, and a top layer component. The bottom layer component is adapted to the solder joints of the outer layer pads, the middle layer component is adapted to the solder joints of the middle layer pads, and the top layer component is adapted to the solder joints of the inner layer pads;

[0023] The bottom layer component, the middle layer component, and the top layer component are welded separately or stacked and welded.

[0024] Preferably, the bottom layer component, the middle layer component, and the top layer component are stacked in sequence from bottom to top, and gaps are provided between the bottom layer component, the middle layer component, and the top layer component.

[0025] Compared with the prior art, the beneficial effects achieved by the present utility model are as follows:

[0026] First, by providing a solder mask ink structure at the connection of the outer layer pads, the middle layer pads, and the inner layer pads, the present utility model blocks the flow of liquid tin through the solder mask ink structure, thereby preventing the liquid tin from flowing between the outer layer pads, the middle layer pads, and the inner layer pads. At the same time, the component body is limited by the solder mask ink structure to prevent the component body from shifting, achieving the effect of improving the welding accuracy.

[0027] Second, by nesting or stacking the outer layer pads, the middle layer pads, and the inner layer pads together, when welding, the bottom layer component, the middle layer component, and the top layer component can be welded in a stacked manner, thereby increasing the degree of circuit integration and improving the utilization rate of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic diagram of the nested pad structure of the present utility model;

[0029] Figure 2 is an exploded view of the nested pad structure of the present utility model;

[0030] Figure 3 is a schematic diagram of the welding of unit devices of the nested pad structure of the present utility model;

[0031] Figure 4 is a schematic diagram of the welding of multiple devices of the nested pad structure of the present utility model;

[0032] Figure 5 is an exploded schematic diagram of the welding of multiple devices of the nested pad structure of the present utility model;

[0033] Figure 6 is a schematic diagram of the stacked pad structure of the present utility model;

[0034] Figure 7 is an exploded view of the stacked pad structure of the present utility model;

[0035] Figure 8 Schematic diagram of welding for the stacked pad structure unit device of the present utility model;

[0036] Figure 9 Schematic diagram of welding for the multi-component device with the stacked pad structure of the present utility model;

[0037] Figure 10 Exploded schematic diagram of welding for the multi-component device with the stacked pad structure of the present utility model.

[0038] Wherein: 1. PCB substrate; 2. Pad body; 201. Outer layer pad; 202. Middle layer pad; 203. Inner layer pad; 3. Solder mask ink structure; 4. Component body; 401. Bottom layer component; 402. Middle layer component; 403. Top layer component. Specific implementation manners

[0039] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0040] Please refer to Figures 1-10 a PCB pad structure, including a PCB substrate 1, a pad body 2, and a component body 4, and the component body 4 is welded on the pad body 2;

[0041] The pad body 2 includes an outer layer pad 201, a middle layer pad 202, and an inner layer pad 203, and the outer layer pad 201, the middle layer pad 202, and the inner layer pad 203 are connected to the PCB substrate 1 in a nested or stacked manner;

[0042] Solder mask ink structures 3 are provided at the joints between the outer layer pad 201 and the middle layer pad 202 and at the joints between the middle layer pad 202 and the inner layer pad 203;

[0043] The top of the solder mask ink structure 3 at the joint between the outer layer pad 201 and the middle layer pad 202 is higher than the top of the middle layer pad 202, and the top of the solder mask ink structure 3 at the joint between the middle layer pad 202 and the inner layer pad 203 is higher than the top of the inner layer pad 203;

[0044] The solder mask ink structure 3 positions the component body 4.

[0045] Through the above technical solution, a solder mask ink structure 3 is provided at the connection of the outer layer pad 201, the middle layer pad 202, and the inner layer pad 203, so as to block the flow of liquid tin through the solder mask ink structure 3, thereby preventing the liquid tin from flowing between the outer layer pad 201, the middle layer pad 202, and the inner layer pad 203. At the same time, the solder mask ink structure 3 positions the component body 4 to prevent the component body 4 from shifting, achieving the effect of improving the welding accuracy;

[0046] The pad body 2 described in the application document has three layers. In actual use, it can be prepared into less than three layers or more than three layers in the same manner as above, and the selection is based on actual needs.

[0047] Please refer to Figures 1-5 , the outer layer pad 201 and the middle layer pad 202 are both semi-open shapes, and the middle layer pad 202 is nested inside the outer layer pad 201;

[0048] The inner layer pad 203 is rectangular, and the inner layer pad 203 is nested inside the middle layer pad 202.

[0049] Through the above technical solution, the outer layer pad 201, the middle layer pad 202, and the inner layer pad 203 are installed in a nested manner, so that the outer layer pad 201, the middle layer pad 202, and the inner layer pad 203 are closer to each other, reducing the space occupied on the PCB substrate 1 and making the circuit board layout more convenient and compact;

[0050] Moreover, the tops of the outer layer pad 201, the middle layer pad 202, and the inner layer pad 203 are relatively flush, which can also improve the connection stability between the outer layer pad 201, the middle layer pad 202, and the inner layer pad 203.

[0051] Specifically, there is a gap between the outer layer pad 201 and the middle layer pad 202, and there is a gap between the middle layer pad 202 and the inner layer pad 203;

[0052] The solder mask ink structure 3 is respectively filled in the gaps between the outer layer pad 201 and the middle layer pad 202, and between the middle layer pad 202 and the inner layer pad 203.

[0053] Through the above technical solution, because the tops of the outer layer pad 201, the middle layer pad 202, and the inner layer pad 203 are relatively flush, when performing reflow soldering, the liquid tin is more likely to flow. Therefore, the solder mask ink structure 3 is provided to block the liquid tin;

[0054] The provided solder mask ink structure 3 can not only block the liquid tin, but also position the component body 4 to prevent the component body 4 from shifting during welding.

[0055] Please refer to Figures 6-10, the outer solder pad 201, the middle solder pad 202, and the inner solder pad 203 are all rectangular. The outer solder pad 201 is located at the bottommost layer. The middle solder pad 202 is stacked on top of the outer solder pad 201, and the inner solder pad 203 is stacked on top of the middle solder pad 202.

[0056] Through the above technical solution, the outer solder pad 201, the middle solder pad 202, and the inner solder pad 203 are connected in a stacked manner. Thus, when soldering the component body 4, there will be a gap between the bottom of the component body 4 and the top of the PCB substrate 1. These gaps can improve the heat dissipation of the component body 4;

[0057] When the component bodies 4 are stacked and installed, due to the height difference between the outer solder pad 201, the middle solder pad 202, and the inner solder pad 203, during the reflow soldering process, the high temperature is not likely to affect the already soldered component bodies 4. While improving the soldering accuracy, it avoids the occurrence of false soldering and loosening of the already soldered component bodies 4.

[0058] Specifically, the solder mask ink structure 3 is respectively arranged on the tops of the outer solder pad 201 and the middle solder pad 202;

[0059] The solder mask ink structure 3 arranged on the top of the outer solder pad 201 overlaps with the side surface of the middle solder pad 202, and the top of the solder mask ink structure 3 is higher than the top of the middle solder pad 202;

[0060] The solder mask ink structure 3 arranged on the top of the middle solder pad 202 overlaps with the side surface of the inner solder pad 203, and the top of the solder mask ink structure 3 is higher than the top of the inner solder pad 203.

[0061] Through the above technical solution, the outer solder pad 201, the middle solder pad 202, and the inner solder pad 203 are installed in a stacked manner. Thus, when soldering, the bottom solder pad will not affect the upper solder pad. However, the upper solder pad will affect the lower solder pad. Therefore, it is also necessary to set the solder mask ink structure 3 to block the liquid tin;

[0062] Moreover, in addition to blocking the liquid tin, the solder mask ink structure 3 is also used to position the component body 4 to improve the soldering accuracy.

[0063] Specifically, the component body 4 includes a bottom component 401, a middle component 402, and a top component 403. The bottom component 401 is adapted to the solder joints of the outer solder pad 201, the middle component 402 is adapted to the solder joints of the middle solder pad 202, and the top component 403 is adapted to the solder joints of the inner solder pad 203;

[0064] The bottom component 401, the middle component 402, and the top component 403 are soldered separately or stacked and soldered.

[0065] Through the above technical solutions, whether the bottom components 401, middle components 402, and top components 403 are welded separately or stacked is selected according to the functional requirements. The selected outer pads 201, middle pads 202, and inner pads 203 are used in combination with the bottom components 401, middle components 402, and top components 403, and are selected according to the specifications of the bottom components 401, middle components 402, and top components 403.

[0066] Specifically, the bottom components 401, middle components 402, and top components 403 are stacked in sequence from bottom to top, and gaps are provided between the bottom components 401, middle components 402, and top components 403.

[0067] Through the above technical solutions, the stacking of the bottom components 401, middle components 402, and top components 403 in sequence from bottom to top is described according to the attached drawing description. During use, they are mainly arranged according to the size and power consumption;

[0068] Those with small volume and low power consumption are placed below, and those with large volume and high power consumption are placed above. The purpose is that the components with large volume and high power consumption generate a large amount of heat during use, and being placed above can be better affected by the radiator, so as to better dissipate heat.

[0069] During use, by providing a solder mask ink structure 3 at the connection of the outer pad 201, middle pad 202, and inner pad 203, the flow of liquid tin is blocked by the solder mask ink structure 3, so as to prevent the liquid tin from flowing between the outer pad 201, middle pad 202, and inner pad 203. At the same time, the solder mask ink structure 3 positions the component body 4 to prevent the component body 4 from shifting, achieving the effect of improving the welding accuracy;

[0070] By nesting or stacking the outer pad 201, middle pad 202, and inner pad 203 together, during welding, the bottom components 401, middle components 402, and top components 403 can be welded in a stacked manner, thereby increasing the degree of circuit integration and improving the utilization rate of the PCB board.

[0071] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB pad structure, comprising a PCB substrate (1), a pad body (2), and a component body (4), and the component body (4) is soldered on the pad body (2); It is characterized in that: The pad body (2) includes an outer layer pad (201), a middle layer pad (202), and an inner layer pad (203), and the outer layer pad (201), the middle layer pad (202), and the inner layer pad (203) are connected to the PCB substrate (1) in a nested or stacked manner; Solder mask ink structures (3) are provided at the connection between the outer layer pad (201) and the middle layer pad (202) and at the connection between the middle layer pad (202) and the inner layer pad (203); The top of the solder mask ink structure (3) at the connection between the outer layer pad (201) and the middle layer pad (202) is higher than the top of the middle layer pad (202), and the top of the solder mask ink structure (3) at the connection between the middle layer pad (202) and the inner layer pad (203) is higher than the top of the inner layer pad (203); The solder mask ink structure (3) positions the component body (4).

2. The PCB pad structure according to claim 1, wherein: The outer layer pad (201) and the middle layer pad (202) are both in a semi-open shape, and the middle layer pad (202) is nested inside the outer layer pad (201); The inner layer pad (203) is rectangular, and the inner layer pad (203) is nested inside the middle layer pad (202).

3. The PCB pad structure according to claim 2, characterized in that: A gap is left between the outer layer pad (201) and the middle layer pad (202), and a gap is left between the middle layer pad (202) and the inner layer pad (203); The solder mask ink structures (3) are respectively filled in the gaps between the outer layer pad (201) and the middle layer pad (202) and between the middle layer pad (202) and the inner layer pad (203).

4. A PCB pad structure according to claim 1, characterized in that: The outer layer pad (201), the middle layer pad (202), and the inner layer pad (203) are all rectangular, the outer layer pad (201) is at the bottommost, the middle layer pad (202) is stacked on top of the outer layer pad (201), and the inner layer pad (203) is stacked on top of the middle layer pad (202).

5. A PCB pad structure according to claim 4, characterized in that: The solder mask ink structures (3) are respectively provided on the tops of the outer layer pad (201) and the middle layer pad (202); The solder mask ink structure (3) provided on the top of the outer layer pad (201) overlaps with the side surface of the middle layer pad (202), and the top of the solder mask ink structure (3) is higher than the top of the middle layer pad (202); The solder mask ink structure (3) provided on the top of the middle layer pad (202) overlaps with the side surface of the inner layer pad (203), and the top of the solder mask ink structure (3) is higher than the top of the inner layer pad (203).

6. A PCB pad structure according to any one of claims 1-5, characterized in that: The component body (4) includes a bottom layer component (401), a middle layer component (402), and a top layer component (403), the bottom layer component (401) is adapted to the solder joints of the outer layer pad (201), the middle layer component (402) is adapted to the solder joints of the middle layer pad (202), and the top layer component (403) is adapted to the solder joints of the inner layer pad (203); The underlying component (401), the middle-layer component (402), and the top-layer component (403) are welded individually or by superposition welding.

7. The PCB pad structure according to claim 6, characterized in that: The underlying component (401), the middle-layer component (402), and the top-layer component (403) are stacked in sequence from bottom to top, and gaps are provided between the underlying component (401), the middle-layer component (402), and the top-layer component (403).

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