High-precision multilayer PCB integrated circuit board

Abstract

The utility model relates to the field of integrated circuit boards with good antistatic and pressure-resistant performance, and discloses a mounting plate and an integrated circuit board mounting device box, the integrated circuit board mounting device box is fixed on the surface of the mounting plate, and the two ends of the integrated circuit board mounting device box are fixedly connected with self-tapping screws which are convenient to mount. The integrated circuit board mounting device box is rectangular, the high-precision multi-layer PCB integrated circuit board body sketch is connected and fixed in the integrated circuit board mounting device box, and the high-precision multi-layer PCB integrated circuit board body sketch and the integrated circuit board mounting device box are connected and fixed through a straight screw of the integrated circuit board mounting device buckle. The high-precision multi-layer PCB integrated circuit board body sketch is installed in the integrated circuit board installation device box through installation hole sites reserved in the high-precision multi-layer PCB integrated circuit board body sketch, and the high-precision multi-layer PCB integrated circuit board body sketch is fixed to the integrated circuit board installation device box through the integrated circuit board installation device buckle. The utility model relates to a face-to-face clamping installation mode.

Description

Technical Field

[0001] The utility model relates to the field of integrated circuit boards with good antistatic and high voltage resistance, specifically an installation board and an integrated circuit board installation device box. The surface of the installation board is fixed with an integrated circuit board installation device box. Both ends of the integrated circuit board installation device box are fixedly connected with self-tapping screws for convenient installation. The integrated circuit board installation device box is rectangular and internally connected and fixed with a simplified diagram of a high-precision multi-layer PCB integrated circuit board body. There are cross-recessed screws at the four corners of the simplified diagram of the high-precision multi-layer PCB integrated circuit board body for matching with the integrated circuit board installation device buckle. The cross-recessed screws for matching with the integrated circuit board installation device buckle connect and fix the simplified diagram of the high-precision multi-layer PCB integrated circuit board body and the integrated circuit board installation device box. Through the reserved installation holes on the simplified diagram of the high-precision multi-layer PCB integrated circuit board body, the simplified diagram of the high-precision multi-layer PCB integrated circuit board body is installed in the integrated circuit board installation device box, and the integrated circuit board installation device buckle is used to fix the simplified diagram of the high-precision multi-layer PCB integrated circuit board body on the integrated circuit board installation device box, adopting a face-to-face clamping installation method. Background Art

[0002] Under the trend of miniaturization and high performance of multi-layer PCB integrated circuit boards, their internal structures are becoming more and more complex and the conductive lines are becoming more and more dense. This high-density layout increases the risk of high-temperature short circuits between the lines. The installation method and the form of the metal heat sink fins seriously affect heat dissipation, greatly shortening the reliability and service life of the integrated circuit. As the line spacing decreases, the heat dissipation installation problem becomes increasingly prominent. The resulting short circuit and overheating can not only cause the circuit function to fail, but also may lead to safety accidents. For this reason, we have proposed a high-precision multi-layer PCB integrated circuit board. Summary of the Utility Model

[0003] (1) Technical Problems to be Solved

[0004] Aiming at the deficiencies of the prior art, the utility model provides a high-precision multi-layer PCB integrated circuit board, which solves the above problems.

[0005] (2) Technical Solutions

[0006] To achieve the above-mentioned purpose, the present utility model provides the following technical solutions: A high-precision multi-layer PCB integrated circuit board includes a mounting plate and an integrated circuit board mounting device box. It is characterized in that the integrated circuit board mounting device box is fixed on the surface of the mounting plate. Self-tapping screws are fixedly connected to both ends of the integrated circuit board mounting device box. The integrated circuit board mounting device box is rectangular and internally connected and fixed with a high-precision multi-layer PCB integrated circuit board body. There are cross-recessed head screws at the four corners of the high-precision multi-layer PCB integrated circuit board body. The cross-recessed head screws connect and fix the high-precision multi-layer PCB integrated circuit board body and the integrated circuit board mounting device box. An integrated circuit board mounting device buckle is provided on the surface of the high-precision multi-layer PCB integrated circuit board body. Holes are provided at the four corners of the surface of the integrated circuit board mounting device box and the surface of the high-precision multi-layer PCB integrated circuit board body. A metal radiator is fixedly installed at the right end of the high-precision multi-layer PCB integrated circuit board body. The integrated circuit board mounting device box is threadedly connected through a module mounting part and self-tapping screws. The self-tapping screws pass through the mounting plate. An integrated circuit board mounting device buckle is provided on the surface of the high-precision multi-layer PCB integrated circuit board body. The opening of the integrated circuit board mounting device buckle facilitates the cross-recessed head screws, and can conveniently fix the high-precision multi-layer PCB integrated circuit board body in the integrated circuit board mounting device box. Holes are provided at the four corners of the surface of the integrated circuit board mounting device box and the surface of the high-precision multi-layer PCB integrated circuit board body, which facilitates the disassembly of the high-precision multi-layer PCB integrated circuit board body. A metal radiator is fixedly installed at the right end of the high-precision multi-layer PCB integrated circuit board body. The self-tapping screws can fix the integrated circuit board mounting device box on the mounting plate, which is convenient and fast.

[0007] Preferably, holes are provided at the four corners of the surface of the high-precision multi-layer PCB integrated circuit board body. An integrated circuit board working module 1 and an integrated circuit board working module 2 are fixedly installed in sequence at the left end of the surface. A metal radiator mounting part 1 is fixedly installed on the lower surface of the high-precision multi-layer PCB integrated circuit board body. A metal radiator mounting part 1 is fixedly installed on the upper surface of the integrated circuit board working module 1 and the integrated circuit board working module 2 installed in sequence at the right end of the high-precision multi-layer PCB integrated circuit board body.

[0008] Preferably, the integrated circuit board mounting device box includes an insulating heat dissipation box housing, a mounting limiting part, and a module mounting part. Module mounting parts are fixedly installed on both sides of the insulating heat dissipation box housing. Mounting limiting parts are fixedly installed at the four corners of the inner wall of the insulating heat dissipation box housing. Reserved mounting holes are provided on the mounting limiting parts. Two groups of reserved mounting positions are provided on both sides of the insulating heat dissipation box housing.

[0009] Preferably, an arc transition is fixedly installed at the top end of the metal radiator mounting part at the bottom. A fin support part is installed on the surface of the arc transition. A ring-shaped sequence curved fin is fixedly installed on the surface of the fin support part.

[0010] Preferably, a limiting portion is provided on the upper surface of the limiting mounting surface. The right end of the limiting mounting surface is connected to a fixed support rear plate. The left end of the support rear plate is connected to the lower part of the limiting mounting surface. A threaded limiting portion is provided on the lower surface of the limiting mounting surface, and an extended threaded limiting portion is inserted into the threaded limiting portion.

[0011] (III) Beneficial Effects

[0012] Compared with the prior art, the present utility model provides a high-precision multi-layer PCB integrated circuit board, which has the following beneficial effects:

[0013] 1. The reserved mounting hole positions on the high-precision multi-layer PCB integrated circuit board body are used to mount the high-precision multi-layer PCB integrated circuit board body in the integrated circuit board mounting device box. The high-precision multi-layer PCB integrated circuit board body is fixed to the integrated circuit board mounting device box by the integrated circuit board mounting device buckle. The face-to-face clamping mounting method can better protect the high-precision multi-layer PCB integrated circuit board body from being damaged during installation; the metal radiator is installed on the metal radiator mounting part I in a special fixing method; the reserved mounting position can transmit heat while serving as the reserved mounting position for the integrated circuit board mounting device buckle.

[0014] 2. Two metal radiators are installed on both the front and back sides of the high-precision multi-layer PCB integrated circuit board body, which can simultaneously cool the two working modules of the high-precision multi-layer PCB integrated circuit board body, namely, integrated circuit board working module I and integrated circuit board working module II; the limit design of the reserved mounting hole positions and mounting limit portions can make the high-precision multi-layer PCB integrated circuit board body hang in the air entirely, increasing the heat dissipation area.

[0015] 3. The installation design of the module mounting part can more conveniently mount the high-precision multi-layer PCB integrated circuit board body hanging in the air to its working position; the arc connection design with an arc transition can increase the overall heat dissipation efficiency of the metal radiator; the fin support part is the main support part of the heat dissipation fins, which can greatly reduce the processing difficulty of the metal radiator; the curved fin design of the curved fins greatly improves the heat dissipation area of the metal radiator and significantly improves the heat dissipation efficiency of the metal radiator; the design of the integrated circuit board mounting device buckle is a surface clamping type. By tightening the screws, the pressure between the surfaces is increased, and the high-precision multi-layer PCB integrated circuit board body is fixed by increasing the surface friction force, which greatly ensures the low damage rate of the high-precision multi-layer PCB integrated circuit board body during the installation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic structural diagram of the high-precision multi-layer PCB integrated circuit board of the present utility model;

[0017] Figure 2This is a schematic cross-sectional view of the body of a high-precision multi-layer PCB integrated circuit board;

[0018] Figure 3 This is a schematic structural diagram of the working module of the integrated circuit board of the present utility model;

[0019] Figure 4 This is a schematic structural diagram of the housing of the insulating heat dissipation box of the present utility model;

[0020] Figure 5 This is a schematic structural diagram of the optimized metal heat sink of the present utility model;

[0021] Figure 6 This is a schematic structural diagram of the circuit board mounting device of the present utility model.

[0022] In the figure: 1 - body of the high-precision multi-layer PCB integrated circuit board; 2 - mounting plate; 3 - integrated circuit board mounting device box; 4 - metal heat sink; 5 - integrated circuit board mounting device buckle; 6 - self-tapping screw; 7 - flat-head screw; 8 - first metal heat sink mounting part; 9 - first integrated circuit board working module; 10 - second integrated circuit board working module; 11 - second metal heat sink mounting part; 12 - housing of the insulating heat dissipation box; 13 - reserved mounting hole positions; 14 - reserved mounting positions; 15 - mounting limiting part; 16 - module mounting part; 17 - arc transition; 18 - metal heat sink mounting part; 19 - fin support part; 20 - curved fins; 21 - guiding and limiting part; 22 - upper limiting mounting surface; 23 - lower limiting mounting surface; 24 - lengthened thread limiting part; 25 - thread limiting part; 26 - supporting rear plate; 27 - oblong hole. Specific embodiments

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0024] Please refer to Figures 1-6, A high-precision multi-layer PCB integrated circuit board includes a mounting plate 2 and an integrated circuit board mounting device box 3. It is characterized in that the integrated circuit board mounting device box 3 is fixed on the surface of the mounting plate 2. Self-tapping screws 6 are fixedly connected to both ends of the integrated circuit board mounting device box 3. The integrated circuit board mounting device box 3 is rectangular and internally connected and fixed with the high-precision multi-layer PCB integrated circuit board body 1. There are cross-recessed screws 7 at the four corners of the high-precision multi-layer PCB integrated circuit board body 1. The cross-recessed screws 7 connect and fix the high-precision multi-layer PCB integrated circuit board body 1 and the integrated circuit board mounting device box 3. An integrated circuit board mounting device buckle 5 is provided on the surface of the high-precision multi-layer PCB integrated circuit board body 1. Holes are provided at the four corners of the surface of the integrated circuit board mounting device box 3 and the surface of the high-precision multi-layer PCB integrated circuit board body 1. A metal radiator 4 is fixedly installed at the right end of the high-precision multi-layer PCB integrated circuit board body 1. The integrated circuit board mounting device box 3 is threadedly connected through the module mounting part 16 and the self-tapping screw 6. The self-tapping screw 6 passes through the mounting plate 2. An integrated circuit board mounting device buckle 5 is provided on the surface of the high-precision multi-layer PCB integrated circuit board body 1. The opening of the integrated circuit board mounting device buckle 5 facilitates the cross-recessed screw 7, and can conveniently fix the high-precision multi-layer PCB integrated circuit board body 1 in the integrated circuit board mounting device box 3. Holes are provided at the four corners of the surface of the integrated circuit board mounting device box 3 and the surface of the high-precision multi-layer PCB integrated circuit board body 1, which facilitates the disassembly of the high-precision multi-layer PCB integrated circuit board body 1. A metal radiator 4 is fixedly installed at the right end of the high-precision multi-layer PCB integrated circuit board body 1. The self-tapping screw 6 can fix the integrated circuit board mounting device box 3 on the mounting plate 2 conveniently and quickly.

[0025] Holes are provided at the four corners of the surface of the high-precision multi-layer PCB integrated circuit board body 1. An integrated circuit board working module one 9 and an integrated circuit board working module two 10 are fixedly installed in sequence at the left end of the surface. A metal radiator mounting part one 8 is fixedly installed on the lower surface of the high-precision multi-layer PCB integrated circuit board body 1. A metal radiator mounting part one 8 is fixedly installed on the upper surface of the integrated circuit board working module one 9 and the integrated circuit board working module two 10 arranged in sequence at the right end of the high-precision multi-layer PCB integrated circuit board body 1.

[0026] The integrated circuit board mounting device box 3 includes an insulating heat dissipation box housing 12, a mounting limiting part 15 and a module mounting part 16. Module mounting parts 16 are fixedly installed on both sides of the insulating heat dissipation box housing 12. Mounting limiting parts 15 are fixedly installed at the four inner wall corners of the insulating heat dissipation box housing 12. Reserved mounting holes 13 are provided on the mounting limiting parts 15. Two groups of reserved mounting positions 14 are provided on both sides of the insulating heat dissipation box housing 12.

[0027] At the top of the metal radiator mounting part 18 at the bottom, an arc transition 17 is fixedly installed. On the surface of the arc transition 17, a fin support part 19 is installed. On the surface of the fin support part 19, an annular sequence curved fins 20 are fixedly installed.

[0028] On the surface of the limiting mounting surface 26, a guiding and limiting part 21 is provided. The right end of the limiting mounting surface 22 is connected and fixed to the supporting rear plate 26. The left end of the supporting rear plate 26 is connected to the lower limiting mounting surface 23. On the surface of the lower limiting mounting surface 23, a threaded limiting part 25 is provided, and a lengthened threaded limiting part 24 is inserted into the threaded limiting part 25.

[0029] Working principle: Through the installation holes reserved on the high-precision multi-layer PCB integrated circuit board body 1, the high-precision multi-layer PCB integrated circuit board body 1 is installed in the integrated circuit board installation device box 3. The integrated circuit board installation device buckle 5 fixes the high-precision multi-layer PCB integrated circuit board body 1 on the integrated circuit board installation device box 3. The face-to-face clamping installation method can better protect the high-precision multi-layer PCB integrated circuit board body 1 from being damaged during installation; the metal radiator 4 is installed on the metal radiator mounting part 8 by a special fixing method; the reserved installation position 14 can transmit heat and at the same time serve as the reserved installation position for the integrated circuit board installation device buckle 5; two metal radiators 4 are installed on the front and back sides of the high-precision multi-layer PCB integrated circuit board body 1, which can simultaneously cool the two working module integrated circuit boards of the high-precision multi-layer PCB integrated circuit board body 1, namely, the integrated circuit board working module one 9 and the integrated circuit board working module two 10; the limiting design of the reserved installation holes 13 and the installation limiting parts 15 can make the high-precision multi-layer PCB integrated circuit board body 1 hang in the air entirely, increasing the heat dissipation area; the installation design of the module mounting part 16 can more conveniently install the high-precision multi-layer PCB integrated circuit board body 1 hanging in the air at its working position; the arc connection design of the arc transition 17 can increase the overall heat dissipation efficiency of the metal radiator 4; the fin support part 19 is the main supporting part of the heat dissipation fins, which can greatly reduce the processing difficulty of the metal radiator 4; the curved fin design of the curved fins 20 greatly improves the heat dissipation area of the metal radiator 4 and significantly improves the heat dissipation efficiency of the metal radiator 4; the design of the integrated circuit board installation device buckle 5 is a face-clamping type fixation. By tightening the screws, the pressure between the faces is increased, and the high-precision multi-layer PCB integrated circuit board body 1 is fixed by increasing the face friction, which greatly ensures the low damage rate of the high-precision multi-layer PCB integrated circuit board body 1 during the installation process.

[0030] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision multi-layer PCB integrated circuit board, comprising a mounting plate (2) and an integrated circuit board mounting device box (3), characterized in that: The surface of the mounting plate (2) is fixed with an integrated circuit board mounting device box (3). The integrated circuit board mounting device box (3) is rectangular and internally connected and fixed with a high-precision multi-layer PCB integrated circuit board body (1). There are flat head screws (7) at the four corners of the high-precision multi-layer PCB integrated circuit board body (1). The flat head screws (7) connect and fix the high-precision multi-layer PCB integrated circuit board body (1) and the integrated circuit board mounting device box (3). An integrated circuit board mounting device buckle (5) is provided on the surface of the high-precision multi-layer PCB integrated circuit board body (1). A metal radiator (4) is fixedly installed at the right end of the high-precision multi-layer PCB integrated circuit board body (1).

2. The high-precision multi-layer PCB integrated circuit board according to claim 1, wherein: Module mounting parts (16) are arranged on both sides of the integrated circuit board mounting device box (3). Slots (27) are provided on the module mounting parts (16). The module mounting parts (16) are fixedly connected to the mounting plate (2) through self-tapping screws (6).

3. The high-precision multi-layer PCB integrated circuit board according to claim 1, characterized in that: Holes are provided at the four corners on the surface of the high-precision multi-layer PCB integrated circuit board body (1). An integrated circuit board working module one (9) and an integrated circuit board working module two (10) are fixedly installed in sequence at the left end on the surface of the high-precision multi-layer PCB integrated circuit board body (1). A metal radiator mounting part one (8) is fixedly installed on the surface of the high-precision multi-layer PCB integrated circuit board body (1).

4. The high-precision multi-layer PCB integrated circuit board according to claim 1, wherein: Mounting limit parts (15) are fixedly installed at the four inner wall corners of the insulating heat dissipation box housing (12). Reserved mounting holes (13) are provided on the mounting limit parts (15). The positions of the reserved mounting holes (13) correspond to the positions of the guiding limit parts (21). The flat head screws (7) pass through the reserved mounting holes (13) and the guiding limit parts (21) for fixation. Two groups of reserved mounting positions (14) are provided on both sides of the insulating heat dissipation box housing (12).

5. The high-precision multi-layer PCB integrated circuit board according to claim 1, characterized in that: 4) It includes an arc transition (17), a metal radiator mounting part (18), a fin support part (19) and a curved fin (20). An arc transition (17) is fixedly installed at the top of the metal radiator mounting part (18) at the bottom. A fin support part (19) is installed on the surface of the arc transition (17). A ring-shaped sequence of curved fins (20) is fixedly installed on the surface of the fin support part (19).

6. The high-precision multi-layer PCB integrated circuit board according to claim 1, wherein: The integrated circuit board mounting device buckle (5) includes a guiding limit part (21), an upper limiting mounting surface (22), a lower limiting mounting surface (23), a threaded limiting part (25) and a supporting rear plate (26). The guiding limit part (21) is provided on the surface of the upper limiting mounting surface (22). The right end of the upper limiting mounting surface (22) is connected and fixed to the supporting rear plate (26). The left end of the supporting rear plate (26) is connected. The threaded limiting part (25) is provided on the surface of the lower limiting mounting surface (23). An extended threaded limiting part (24) is inserted into the threaded limiting part (25). The integrated circuit board mounting device buckle (5) is fixedly installed inside the reserved mounting position (14).

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