Glue pouring jig capable of effectively reducing bubbles and used for preparing PCB (Printed Circuit Board)

Abstract

The utility model relates to a glue pouring jig for preparing a PCB (Printed Circuit Board) capable of effectively reducing bubbles, which belongs to the technical field of PCB preparation and comprises a glue pouring jig main body, the glue pouring jig main body comprises an upper die, a lower die, a connecting pipe, a glue bin and an exhaust pipe, a PCB main body is placed in the lower die, and a bubble removing assembly is arranged in the glue pouring jig main body; the bubble removing assembly comprises an exhaust outlet formed in the lower end of the PCB body and further comprises a blocking block connected with the top end of the connecting pipe in an inserted mode, a pull rod is fixed to the top end of the blocking block, and a cover plate is slidably connected to the outer surface of the pull rod. According to the glue pouring jig capable of effectively reducing the bubbles and used for preparing the PCB, the bubble removing assembly is arranged, so that the jig is under vacuum pressure when glue enters the jig, a small amount of bubbles in the glue enter the exhaust outlet due to the pressure in the jig, the bubbles generated during glue pouring of the PCB can be effectively reduced, and the production efficiency of the PCB is improved. And a jig consisting of the upper die and the lower die can be stably combined together.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board preparation, and particularly relates to a glue filling fixture for PCB board preparation that can effectively reduce bubbles. Background Art

[0002] A circuit board is also known as a printed circuit board, PCB board, aluminum substrate, high-frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin printed circuit board, printed (copper etching technology) circuit board, etc. The circuit board miniaturizes and visualizes the circuit, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances.

[0003] When the PCB board is installed in the fan, it is necessary to fill the PCB with glue to ensure waterproofing during the normal operation of the fan. However, due to the obstruction of the PCB board and components, the fluidity of the liquid glue is often discounted, resulting in bubbles during glue filling, which affects its waterproof and dustproof performance and causes the fan to fail to be waterproof. Therefore, a glue filling fixture for PCB board preparation that can effectively reduce bubbles is proposed to solve the above problems. Summary of the Utility Model

[0004] In view of the deficiencies of the prior art, the utility model provides a glue filling fixture for PCB board preparation that can effectively reduce bubbles, which has the advantages of being able to reduce bubbles and solves the problem of inconvenience in reducing bubbles.

[0005] To achieve the above object, the utility model provides the following technical solution: A glue filling fixture for PCB board preparation that can effectively reduce bubbles, including a glue filling fixture main body, the glue filling fixture main body includes an upper mold, a lower mold, a connecting pipe, a glue storage tank and an air extraction pipe. The PCB board main body is placed inside the lower mold, and an anti-bubble component is arranged inside the glue filling fixture main body;

[0006] The anti-bubble component includes an exhaust outlet opened at the lower end of the PCB board main body. The anti-bubble component further includes a plug block inserted into the top end of the connecting pipe. A pull rod is fixed to the top end of the plug block. A cover plate is slidably connected to the outer surface of the pull rod. The anti-bubble component further includes a baffle fixed inside the air extraction pipe. A plug is slidably connected inside the baffle. The top end of the plug is rotatably connected to a bolt through a bearing. The anti-bubble component further includes a connecting structure arranged on the left and right sides of the upper mold.

[0007] Further, a round hole for the cover plate to slide on the outer surface of the pull rod is opened at the top end of the cover plate, and a rubber ring is fixed inside the round hole.

[0008] Further, a slot is opened at the top end of the baffle, and the plug is inserted into the slot.

[0009] Further, a screw hole for allowing a bolt to penetrate into its interior is provided at the top end of the air extraction pipe, and a stopper is fixed to the top end of the bolt.

[0010] Further, the connection structure includes support blocks fixed to the front and rear ends of the upper mold. A movable block is slidably connected to the outer surface of the support block. A connecting block is fixed to the lower end of the movable block. Clamping blocks are fixed to one side of the two connecting blocks facing each other. A screw rod is threadedly connected to the interior of the support block. Circular plates are fixed to one end of the two screw rods facing each other, and I-shaped blocks are fixed to one end of the two screw rods facing away from each other.

[0011] Further, circular holes for allowing the I-shaped blocks to rotate inside are provided on one side of the two movable blocks facing away from each other.

[0012] Further, the support blocks and the movable blocks are both rectangular with hollow interiors. Threaded holes for allowing the screw rods to move into or out of their interiors are provided on one side of the two support blocks facing away from each other.

[0013] Further, clamping grooves for allowing the clamping blocks to move into their interiors are provided at the front and rear ends of the lower mold.

[0014] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0015] The glue filling fixture for preparing a PCB board that can effectively reduce bubbles. By providing a bubble removal component, when the glue enters the fixture, the fixture is under vacuum pressure. Bubbles in a small amount of glue enter the exhaust outlet due to the pressure inside the fixture, which can effectively reduce the bubbles generated during the glue filling of the PCB board, and the fixture composed of the upper mold and the lower mold can be firmly combined together. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the present utility model;

[0017] Figure 2 is an external structural diagram of the upper mold and the lower mold of the present utility model;

[0018] Figure 3 is a schematic structural diagram of the I-shaped block and the screw rod of the present utility model;

[0019] Figure 4 is a schematic structural diagram of the baffle and the plug block of the present utility model.

[0020] In the figure: 1 upper mold, 2 lower mold, 3 connecting pipe, 4 glue storage tank, 5 cover plate, 6 pull rod, 7 plugging block, 8 air extraction pipe, 9 clamping block, 10 connecting block, 11 movable block, 12 support block, 13 I-shaped block, 14 screw rod, 15 circular plate, 16 baffle, 17 plug block, 18 bolt, 19 exhaust outlet, 20 PCB board main body. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figures 1 to 2 , a glue filling fixture for preparing a PCB board that can effectively reduce bubbles in this embodiment, includes a glue filling fixture main body. The glue filling fixture main body includes an upper mold 1, a lower mold 2, a connecting pipe 3, a glue storage tank 4 and an air extraction pipe 8. A PCB board main body 20 is placed inside the lower mold 2, and a bubble removing component is provided inside the glue filling fixture main body.

[0023] In addition, two insertion blocks are fixed at both the left and right ends of the lower end of the upper mold 1, and connection holes for inserting the insertion blocks are opened at both the left and right ends of the bottom end of the lower mold 2, so that the upper mold 1 and the lower mold 2 can be accurately closed.

[0024] And, the connecting pipe 3 is fixed to the top end of the upper mold 1, the air extraction pipe 8 is fixed to the right end of the connecting pipe 3, the glue storage tank 4 is fixed to the top end of the connecting pipe 3. The connecting pipe 3 is communicated with the upper mold 1, the air extraction pipe 8 is communicated with the connecting pipe 3, the connecting pipe 3 is communicated with the glue storage tank 4, and a vacuum extraction machine is provided at the other end of the air extraction pipe 8.

[0025] Moreover, the PCB board main body 20 is in a semi-circular arc shape, which can improve the fluidity of the glue when it is located inside the upper mold 1 and the lower mold 2, and can effectively increase the flow rate.

[0026] Please refer to Figures 1 to 4 , the bubble removing component in this embodiment includes an exhaust outlet 19 opened at the lower end of the PCB board main body 20. The bubble removing component further includes a blocking block 7 inserted into the top end of the connecting pipe 3. A pull rod 6 is fixed to the top end of the blocking block 7. A cover plate 5 is slidably connected to the outer surface of the pull rod 6. The bubble removing component further includes a baffle 16 fixed inside the air extraction pipe 8. A plug block 17 is slidably connected inside the baffle 16. The top end of the plug block 17 is rotatably connected to a bolt 18 through a bearing. The bubble removing component further includes a connection structure provided on both the left and right sides of the upper mold 1.

[0027] Wherein, a round hole for sliding on the outer surface of the pull rod 6 is opened at the top end of the cover plate 5, and a rubber ring is fixed inside the round hole, so that the cover plate 5 can slide on the surface of the pull rod 6 by sliding inside the rubber ring.

[0028] In addition, a slot is opened at the top end of the baffle 16, and the plug block 17 is inserted into the inside of the slot, so that the plug block 17 can be moved into or out of the baffle 16.

[0029] Moreover, the top end of the air extraction pipe 8 is provided with a screw hole for the bolt 18 to penetrate into its interior. A stop block is fixed to the top end of the bolt 18. The plug block 17 can be moved into the air extraction pipe 8 through the screw hole so that the plug block 17 can be moved into the baffle 16. And the bolt 18 is threadedly connected to the screw hole, and the plug block 17 can be fixed in the baffle 16. The plug block 17 is cylindrical.

[0030] Please refer to Figures 2 to 3 , the connection structure in this embodiment includes support blocks 12 fixed to the front and rear ends of the upper die 1. The outer surface of the support block 12 is slidably connected with a moving block 11. A connecting block 10 is fixed to the lower end of the moving block 11. Clamping blocks 9 are fixed to the opposite sides of the two front and rear connecting blocks 10. A screw rod 14 is threadedly connected inside the support block 12. Circular plates 15 are fixed to the opposite ends of the two screw rods 14. Shaped blocks 13 are fixed to the opposite ends of the two screw rods 14.

[0031] Secondly, circular holes for the shaped blocks 13 to rotate inside are formed on the opposite sides of the two moving blocks 11, so that the shaped blocks 13 can rotate on the moving blocks 11, so that the screw rods 14 can be stably rotated on the moving blocks 11 through the shaped blocks 13.

[0032] In addition, both the support block 12 and the moving block 11 are rectangular with hollow interiors. Threaded holes for the screw rods 14 to move into or out of their interiors are formed on the opposite sides of the two support blocks 12, so that the screw rods 14 can be threadedly connected to the support blocks 12 through the threaded holes. And square holes are formed on the opposite sides of the two moving blocks 11, so that the moving blocks 11 can move on the outer surface of the support blocks 12.

[0033] At the same time, clamping grooves for the clamping blocks 9 to move into are formed at the front and rear ends of the lower die 2. When the two clamping blocks 9 are moved into the clamping grooves of the lower die 2, the upper die 1 and the lower die 2 can be tightly fixed together.

[0034] It should be noted that the vacuum extraction machine is well-known to the public in the prior art, so its working principle will not be described in detail herein.

[0035] The working principle of the above embodiment is as follows:

[0036] During use, the PCB board main body 20 is placed in the jig composed of the upper die 1 and the lower die 2, and the upper die 1 and the lower die 2 are combined together. Then, the two shaped blocks 13 can be rotated to drive the screw rods 14 to rotate. Since the screw rods 14 are threadedly connected to the threaded holes of the support blocks 12, the screw rods 14 can be gradually moved into the interior of the support blocks 12. While the two screw rods 14 are moving, the two moving blocks 11 can be driven to move relatively through the two shaped blocks 13, so that the support blocks 12 are gradually moved into the moving blocks 11. The moving blocks 11 drive the clamping blocks 9 to move through the connecting blocks 10, so that the two clamping blocks 9 can be moved into the clamping grooves of the lower die 2, and thus the PCB board main body 20 can be enclosed in the jig;

[0037] By blocking the connecting pipe 3 with the blocking block 7, placing the cover plate 5 on the top of the glue storage bin 4, pulling the cover plate 5 to move on the outer surface of the pull rod 6, so that the cover plate 5 no longer abuts against the top of the glue storage bin 4, and the blocking block 7 still blocks the connecting pipe 3 when the cover plate 5 moves, thus glue can be added into the glue storage bin 4, while preventing the glue from flowing into the fixture through the connecting pipe 3. After the glue is added, the cover plate 5 resets, making the glue in a sealed environment. Then the vacuum extraction machine can evacuate the air in the connecting pipe 3 and the fixture through the suction pipe 8. When the preset pressure is reached, the vacuum extraction machine stops working. The blocking block 17 moves into the baffle 16 through the screw hole of the suction pipe 8, and the bolt 18 is threadedly connected with the screw hole, fixing the blocking block 17 in the baffle 16. When the fixture is separated from the vacuum extraction, it prevents external air from entering the connecting pipe 3 and the fixture;

[0038] While pressing and fixing the cover plate 5 on the top of the glue storage bin 4, pull the pull rod 6 upward to move the blocking block 7 away from the top of the connecting pipe 3, so that the glue in the glue storage bin 4 flows into the fixture. The glue continuously enters the fixture, and the bubbles in a small amount of glue enter the exhaust outlet 19 of the PCB board main body 20 due to the pressure in the fixture, thereby effectively reducing the bubbles generated during the potting of the PCB board main body 20;

[0039] Wait until the glue fills the entire fixture, and let it stand for a few minutes to eliminate bubbles by pressure and take shape. Then the fixture can be smoothly transported to the preheating area. After preheating at 70 °C for 15 min, it is then smoothly transferred to a high-temperature oven and baked at 90 °C for 2 h to form. Take out the product, remove its fixture, and take out the PCB board main body 20 for water injection test.

[0040] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent in such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0041] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A glue filling fixture for preparing a PCB board that can effectively reduce bubbles, including a main body of the glue filling fixture, characterized in that: The glue filling fixture body includes an upper mold (1), a lower mold (2), a connecting pipe (3), a glue storage bin (4), and an air extraction pipe (8). A PCB board body (20) is placed inside the lower mold (2), and an air bubble removal component is provided inside the glue filling fixture body. The air bubble removal component includes an exhaust outlet (19) opened at the lower end of the PCB board body (20). The air bubble removal component further includes a plug block (7) inserted into the top end of the connecting pipe (3). A pull rod (6) is fixed to the top end of the plug block (7). A cover plate (5) is slidably connected to the outer surface of the pull rod (6). The air bubble removal component also includes a baffle (16) fixed inside the air extraction pipe (8). A plug (17) is slidably connected inside the baffle (16). The top end of the plug (17) is rotatably connected to a bolt (18) through a bearing. The air bubble removal component further includes a connection structure arranged on the left and right sides of the upper mold (1).

2. The glue filling fixture for preparing a PCB board that effectively reduces bubbles according to claim 1, wherein: A round hole for the cover plate (5) to slide on the outer surface of the pull rod (6) is opened at the top end of the cover plate (5), and a rubber ring is fixed inside the round hole.

3. The glue filling jig for preparing a PCB board capable of effectively reducing bubbles according to claim 1, characterized in that: A slot is opened at the top end of the baffle (16), and the plug (17) is inserted into the slot.

4. The potting fixture for PCB board preparation that can effectively reduce bubbles according to claim 1, wherein: A screw hole for the bolt (18) to penetrate into its interior is opened at the top end of the air extraction pipe (8), and a stop block is fixed to the top end of the bolt (18).

5. The glue filling fixture for PCB board preparation that can effectively reduce bubbles according to claim 1, characterized in that: The connection structure includes support blocks (12) fixed to the front and rear ends of the upper mold (1). A moving block (11) is slidably connected to the outer surface of the support block (12). A connecting block (10) is fixed to the lower end of the moving block (11). Clamping blocks (9) are fixed to the opposite sides of the front and rear two connecting blocks (10). A screw rod (14) is threadedly connected inside the support block (12). Circular plates (15) are fixed to the opposite ends of the two screw rods (14). Shaped blocks (13) are fixed to the opposite ends of the two screw rods (14).

6. The potting fixture for PCB board preparation according to claim 5, which is effective in reducing bubbles, is characterized in that: Round holes for the shaped blocks (13) to rotate inside are opened on the opposite sides of the two moving blocks (11).

7. The glue filling fixture for preparing a PCB board capable of effectively reducing bubbles according to claim 5, wherein: Both the support block (12) and the moving block (11) are rectangular with hollow interiors. Threaded holes for the screw rod (14) to move into or out of their interiors are opened on the opposite sides of the two support blocks (12).

8. The glue filling jig for preparing a PCB board capable of effectively reducing bubbles according to claim 5, wherein: Slots for the clamping blocks (9) to move into their interiors are opened at the front and rear ends of the lower mold (2).

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