Sheet separating and combining device, feeding and discharging equipment and production line
By designing a split-combination device suitable for half-film silicon wafers, using fixed-distance adsorption components and driving mechanisms, the efficient split-combination and splitting of half-film silicon wafers is achieved, solving the problem of insufficient production capacity of existing devices and improving production efficiency.
Patent Information
- Application Number
- CN202421686471.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-07-16
AI Technical Summary
The existing split-combination device cannot be effectively applied to half-film silicon wafers, resulting in insufficient production capacity and cannot meet the production needs of half-film silicon wafers.
A split-piece device is designed, including a base, an adsorption mechanism and a driving mechanism. Through the cooperation of a fixed distance adsorption assembly and a driving mechanism, the plate-piece and slice operation of a half-piece silicon wafer is realized, and the transport efficiency is improved.
The transportation efficiency and production capacity of half-film silicon wafers are significantly improved, the equipment structure is simplified, the weight is reduced, and the production efficiency of the production line is improved.
Smart Images
Figure CN223157535U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of photovoltaic technology, and in particular to a sheet splitting and combining device, loading and unloading equipment and a production line. Background Art
[0002] In the production process of photovoltaic cells, it is necessary to load and unload silicon wafers many times, that is, to conduct the silicon wafers in the flower basket and the aluminum boat to each other. Specifically, the silicon wafers in the aluminum boat that have been processed are exported to the flower basket, or the silicon wafers that have not been processed are imported from the flower basket into the aluminum boat. Among them, before the silicon wafers are introduced into the aluminum boat, the two silicon wafers need to be pasted back to back to prevent the occurrence of plating bypass. However, before the silicon wafers are introduced into the flower basket, the two silicon wafers pasted back to back need to be separated. At present, the main method used is to combine or separate the two silicon wafers by using a splitting and combining device.
[0003] Due to technological development, more and more companies are using half-wafers as the mainstream size. The existing wafer splitting and combining devices are only suitable for whole wafers, not half-wafers, and cannot meet the production capacity of half-wafers. Therefore, a new wafer splitting and combining device is needed. Utility Model Content
[0004] In view of this, the present application provides a sheet splitting and combining device, loading and unloading equipment and a production line, which can improve the production capacity of the sheet splitting and combining device, loading and unloading equipment and the production line.
[0005] In the first aspect, an embodiment of the present application provides a split-and-combine sheet device, comprising a base, an adsorption mechanism and a driving mechanism, wherein the adsorption mechanism comprises a first adsorption component, a second adsorption component, a third adsorption component and a fourth adsorption component which are sequentially arranged along a first direction and disposed on the base. The driving mechanism is transmission-connected to the adsorption mechanism. The distance between the second adsorption component and the third adsorption component along the first direction is fixed, the driving mechanism is transmission-connected to the first adsorption component and the fourth adsorption component, and drives the first adsorption component to approach or move away from the second adsorption component, and drives the fourth adsorption component to approach or move away from the third adsorption component. Alternatively, the distance between the first adsorption component and the fourth adsorption component along the first direction is fixed, the driving mechanism is transmission-connected to the second adsorption component and the third adsorption component, and drives the second adsorption component to approach or move away from the first adsorption component, and drives the third adsorption component to approach or move away from the fourth adsorption component.
[0006] In the above-mentioned wafer separation and combination device, after the first adsorption component, the second adsorption component, the third adsorption component and the fourth adsorption component simultaneously adsorb half a silicon wafer, since the distance between the second adsorption component and the third adsorption component along the first direction is fixed, the driving mechanism drives the first adsorption component to approach the second adsorption component, and drives the fourth adsorption component to approach the third adsorption component to complete the wafer combination, and the driving mechanism drives the first adsorption component away from the second adsorption component, and drives the fourth adsorption component away from the third adsorption component to complete the wafer separation; or the distance between the first adsorption component and the fourth adsorption component along the first direction is fixed, the driving mechanism drives the second adsorption component to approach the first adsorption component, and drives the third adsorption component to approach the fourth adsorption component to complete the wafer combination, and the driving mechanism drives the second adsorption component away from the first adsorption component, and drives the third adsorption component away from the fourth adsorption component to complete the wafer separation, thereby doubling the transportation efficiency of the half silicon wafer and improving the production capacity of the wafer separation and combination device.
[0007] In the above embodiments, the adsorption mechanism also includes a separation and combination component, which includes a separation and combination seat, a separation and combination plate and a separation and combination driving member. The separation and combination seat is fixed to the base, and the separation and combination plate is slidably connected to the separation and combination seat parallel to the second direction. The separation and combination driving member is arranged on the separation and combination seat to drive the separation and combination plate to reciprocate parallel to the second direction. The second direction is perpendicular to the first direction. The second adsorption component and the third adsorption component are arranged on the separation and combination plate.
[0008] In one or more of the above embodiments, the adsorption mechanism also includes a first adsorption frame and a second adsorption frame, the first adsorption frame and the second adsorption frame are slidably connected to the base parallel to the first direction, the separation and combination seat is located between the first adsorption frame and the second adsorption frame, the first adsorption component is arranged on the first adsorption frame, and the fourth adsorption component is arranged on the second adsorption frame. The driving mechanism is transmission-connected to the first adsorption frame and the second adsorption frame, and drives the first adsorption frame to approach or move away from the separation and combination seat, and drives the second adsorption frame to approach or move away from the separation and combination seat.
[0009] In one or more of the above embodiments, the first adsorption assembly includes a fixed disk, a rotating disk, a rotating driving member and a first suction cup group. The fixed disk is fixed to the first adsorption frame, the rotating disk is fixed to the first suction cup group, the fixed disk has a first rotation axis, the rotating disk is rotatably arranged on the fixed disk around the first rotation axis, and the rotating driving member is fixed to the first adsorption frame for driving the rotating disk to rotate.
[0010] In one or more of the above embodiments, the adsorption mechanism also includes a first sliding assembly, the first sliding assembly includes a first guide rail, a first slider and a second slider, the first guide rail is fixed to the base and the length direction of the first guide rail is parallel to the first direction, the first slider is fixed to the first adsorption frame and the first slider is slidably arranged on the first guide rail parallel to the first direction, the second slider is fixed to the second adsorption frame and the second slider is slidably arranged on the first guide rail parallel to the first direction.
[0011] In one or more of the above embodiments, the adsorption mechanism further includes a second sliding assembly, which includes a second guide rail and a split and combined slider. The second guide rail is fixed to the split and combined seat, and the length direction of the second guide rail is parallel to the second direction. The split and combined slider is fixed to the split and combined plate and is slidably disposed on the second guide rail parallel to the second direction.
[0012] In a second aspect, an embodiment of the present application provides a loading and unloading device, including a robotic arm, a flower basket transverse movement device, a boat transverse movement device, and the split and combined wafer device in one or more of the above embodiments. The split and combined wafer device is connected to the robotic arm. The flower basket transverse movement device is used to move the flower basket, and the boat transverse movement device is used to move the boat. Both the flower basket and the boat are used to support silicon wafers. The split and combined wafer device is used to combine the silicon wafers on the flower basket and transfer them to the boat through the robotic arm, or the split and combined wafer device is used to split the silicon wafers on the boat and transfer them to the flower basket through the robotic arm.
[0013] In one or more of the above embodiments, the flower basket transverse movement device can carry two flower baskets. Each flower basket is provided with two first bearing parts arranged side by side. The first bearing part is used to support a row of half silicon wafers, and four first bearing parts are arranged side by side. Each boat is provided with at least eight second bearing parts arranged side by side. The second bearing part is used to support a row of half silicon wafers. The center distance between the second adsorption assembly and the third adsorption assembly is L1. Among the four first bearing parts, the center distance between the two middle first bearing parts is L2. Among the four second bearing parts, the center distance between the two second bearing parts on both sides of a second bearing part is L3, and L1 = L2 = L3 is satisfied.
[0014] In one or more of the above embodiments, there are two boat transverse movement devices and two flower basket transverse movement devices. The two flower basket transverse movement devices are arranged side by side and are located between the two boat transverse movement devices. The robotic arm is located on the same side of the two flower basket transverse movement devices and is located between the two boat transverse movement devices. The two flower basket transverse movement devices and the two boat transverse movement devices are arranged around the robotic arm.
[0015] In a third aspect, an embodiment of the present application provides a production line, including processing equipment and the loading and unloading device in one or more of the above embodiments. The loading and unloading device is used to transport silicon wafers to the processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a schematic diagram of the overall structure of the split and combined wafer device in an embodiment of the present application.
[0017] Figure 2 is a schematic diagram of the connection structure between the second adsorption assembly and the third adsorption assembly and the base in an embodiment of the present application.
[0018] Figure 3It is a schematic diagram of the connection structure between the first adsorption component and the base in an embodiment of the present application.
[0019] Figure 4 It is a top-down schematic diagram of the overall structure of the loading and unloading equipment in an embodiment of the present application.
[0020] Figure 5 It is a schematic diagram of the positional relationship between the adsorption mechanism and the flower basket transverse movement device in an embodiment of the present application.
[0021] Figure 6 It is a schematic diagram of the positional relationship between the adsorption mechanism and the boat transverse movement device in an embodiment of the present application.
[0022] Description of main component symbols
[0023] 1. Loading and unloading equipment; 10. Robot arm; 20. Flower basket transverse movement device; 22. Flower basket sliding frame; 23. Flower basket positioning mechanism; 30. Boat transverse movement device; 32. Boat sliding frame; 33. Boat positioning mechanism; 40. Separation and combination piece device; 41. Base; 42. Adsorption mechanism; 421. First adsorption component; 4211. Fixed disk; 4212. Rotating disk; 4213. Rotating drive member; 4214. First suction cup group; 422. Second adsorption component; 423. Third adsorption component; 424. Fourth adsorption component; 425. Separation and combination component; 4251. Separation and combination seat; 4252. Separation and combination plate; 4253. Separation and combination drive member; 426. First adsorption frame; 427. Second adsorption frame; 428. First sliding component; 4281. First guide rail; 4282. First slider; 4283. Second slider; 429. Second sliding component; 4291. Second guide rail; 4292. Separation and combination slider; 43. Drive mechanism; 7. Flower basket; 71. First bearing part; 8. Boat; 81. Second bearing part; X. First direction; Y. Second direction; Z. Third direction; U. Fourth direction; V. Fifth direction. Detailed implementation manners
[0024] Next, the technical solutions in the embodiments of the present application will be described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.
[0025] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element present. When an element is considered to be "disposed on" another element, it can be directly disposed on the other element or there may be an intermediate element present. In this application, unless otherwise clearly specified and defined, terms such as "installed", "connected", "joined", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "comprising" and "provided with" and any variations thereof in the description of the specification, claims, and the above drawings of this application are intended to cover non-exclusive inclusion.
[0027] In the description of the embodiments of this application, technical terms such as "first", "second", etc. are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order, or primary-secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "a plurality" is more than two, unless otherwise clearly and specifically defined.
[0028] Referring to "embodiments" herein means that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of this application. The phrase appears in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Without conflict, the various embodiments in this application can be combined with each other.
[0029] It should be noted that the thickness, length, width, etc. of various components in the embodiments of this application shown in the drawings, as well as the overall thickness, length, width, etc. of the integrated device are only for illustrative purposes and should not constitute any limitation to this application.
[0030] One embodiment of the present application provides a split-and-combine sheet device, comprising a base, an adsorption mechanism and a driving mechanism, wherein the adsorption mechanism comprises a first adsorption component, a second adsorption component, a third adsorption component and a fourth adsorption component which are sequentially arranged along a first direction and disposed on the base. The driving mechanism is transmission-connected to the adsorption mechanism. The distance between the second adsorption component and the third adsorption component along the first direction is fixed, the driving mechanism is transmission-connected to the first adsorption component and the fourth adsorption component, and drives the first adsorption component to approach or move away from the second adsorption component, and drives the fourth adsorption component to approach or move away from the third adsorption component. Alternatively, the distance between the first adsorption component and the fourth adsorption component along the first direction is fixed, the driving mechanism is transmission-connected to the second adsorption component and the third adsorption component, and drives the second adsorption component to approach or move away from the first adsorption component, and drives the third adsorption component to approach or move away from the fourth adsorption component. After the first adsorption component, the second adsorption component, the third adsorption component and the fourth adsorption component simultaneously adsorb half a silicon wafer, since the distance between the second adsorption component and the third adsorption component along the first direction is fixed, the driving mechanism drives the first adsorption component to approach the second adsorption component, and drives the fourth adsorption component to approach the third adsorption component to complete the wafer merging, and the driving mechanism drives the first adsorption component away from the second adsorption component, and drives the fourth adsorption component away from the third adsorption component to complete the wafer separation; or the distance between the first adsorption component and the fourth adsorption component along the first direction is fixed, the driving mechanism drives the second adsorption component to approach the first adsorption component, and drives the third adsorption component to approach the fourth adsorption component to complete the wafer merging, and the driving mechanism drives the second adsorption component away from the first adsorption component, and drives the third adsorption component away from the fourth adsorption component to complete the wafer separation, thereby doubling the transportation efficiency of half a silicon wafer and improving the production capacity of the wafer separation and merging device, loading and unloading equipment and production line.
[0031] One embodiment of the present application also provides a loading and unloading device, including a robotic arm, a flower basket transverse movement device, a boat transverse movement device and a separation and combination device in one or more of the above embodiments, the separation and combination device is connected to the robotic arm, the flower basket transverse movement device is used to move the flower basket, the boat transverse movement device is used to move the boat, the flower basket and the boat are both used to support silicon wafers, the separation and combination device is used to combine the silicon wafers on the flower basket and transfer them to the boat through the robotic arm, or the separation and combination device is used to separate the silicon wafers on the boat and transfer them to the flower basket through the robotic arm.
[0032] An embodiment of the present application provides a production line, including processing equipment and loading and unloading equipment in one or more of the above embodiments, wherein the loading and unloading equipment is used to transport silicon wafers to the processing equipment.
[0033] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the features in the following embodiments and examples can be combined with each other.
[0034] Figure 1The overall structural diagram of the split-and-combined sheet device 40 in one embodiment of the present application is shown.
[0035] See also Figure 1 An embodiment of the present application provides a sheet separation and combination device 40, including a base 41, an adsorption mechanism 42 and a driving mechanism 43. The adsorption mechanism 42 includes a first adsorption component 421, a second adsorption component 422, a third adsorption component 423 and a fourth adsorption component 424 arranged in sequence along a first direction X and disposed on the base 41. The driving mechanism 43 is transmission-connected to the adsorption mechanism 42.
[0036] The distance between the second adsorption component 422 and the third adsorption component 423 along the first direction X is fixed, and the driving mechanism 43 is connected to the first adsorption component 421 and the fourth adsorption component 424 in a transmission manner, and drives the first adsorption component 421 to approach or move away from the second adsorption component 422, and drives the fourth adsorption component 424 to approach or move away from the third adsorption component 423. After the first adsorption component 421, the second adsorption component 422, the third adsorption component 423 and the fourth adsorption component 424 simultaneously adsorb half of the silicon wafer, when the driving mechanism 43 drives the first adsorption component 421 to approach the second adsorption component 422, and the driving mechanism 43 drives the fourth adsorption component 424 to approach the third adsorption component 423, the half silicon wafer in the first adsorption component 421 and the half silicon wafer in the second adsorption component 422 are combined, and the half silicon wafer in the third adsorption component 423 and the half silicon wafer in the fourth adsorption component 424 are combined. When the driving mechanism 43 drives the first adsorption component 421 away from the second adsorption component 422, and the driving mechanism 43 drives the fourth adsorption component 424 away from the third adsorption component 423, the half silicon wafer in the first adsorption component 421 and the half silicon wafer in the second adsorption component 422 are separated, and the half silicon wafer in the third adsorption component 423 and the half silicon wafer in the fourth adsorption component 424 are separated.
[0037] In other embodiments, the distance between the first adsorption component 421 and the fourth adsorption component 424 along the first direction X is fixed, and the driving mechanism 43 is connected to the second adsorption component 422 and the third adsorption component 423 in a transmission manner, and drives the second adsorption component 422 to approach or move away from the first adsorption component 421, and drives the third adsorption component 423 to approach or move away from the fourth adsorption component 424. After the first adsorption component 421, the second adsorption component 422, the third adsorption component 423 and the fourth adsorption component 424 simultaneously adsorb half of the silicon wafer, when the driving mechanism 43 drives the second adsorption component 422 to approach the first adsorption component 421, and the driving mechanism 43 drives the third adsorption component 423 to approach the fourth adsorption component 424, the half silicon wafer in the first adsorption component 421 and the half silicon wafer in the second adsorption component 422 are combined, and the half silicon wafer in the third adsorption component 423 and the half silicon wafer in the fourth adsorption component 424 are combined. When the driving mechanism 43 drives the second adsorption component 422 away from the first adsorption component 421, and the driving mechanism 43 drives the third adsorption component 423 away from the fourth adsorption component 424, the half silicon wafer in the first adsorption component 421 and the half silicon wafer in the second adsorption component 422 are separated, and the half silicon wafer in the third adsorption component 423 and the half silicon wafer in the fourth adsorption component 424 are separated.
[0038] Figure 2 A schematic diagram of the connection structure between the second adsorption component 422 and the third adsorption component 423 and the base 41 in an embodiment of the present application is shown.
[0039] See also Figure 1 and Figure 2 In some embodiments, the adsorption mechanism 42 also includes a separation and combination component 425, which includes a separation and combination seat 4251, a separation and combination plate 4252 and a separation and combination driving member 4253. The separation and combination seat 4251 is fixed to the base 41, the separation and combination plate 4252 is slidably connected to the separation and combination seat 4251 parallel to the second direction Y, and the separation and combination driving member 4253 is arranged on the separation and combination seat 4251 to drive the separation and combination plate 4252 to reciprocate parallel to the second direction Y.
[0040] In some embodiments, the second direction Y is perpendicular to the first direction X, and the second adsorption assembly 422 and the third adsorption assembly 423 are arranged along the first direction X and are disposed on the split plate 4252. The first direction X is the length direction of the base 41, the second direction Y is the width direction of the base 41, and the third direction Z is the thickness direction of the base 41.
[0041] In some embodiments, the adsorption mechanism 42 also includes a second sliding assembly 429, the second sliding assembly 429 includes a second guide rail 4291 and a splitting and combining slider 4292, the second guide rail 4291 is fixed to the splitting and combining seat 4251 and the length direction of the second guide rail 4291 is parallel to the second direction Y, the splitting and combining slider 4292 is fixed to the splitting and combining plate 4252 and the splitting and combining slider 4292 is parallel to the second direction Y and is slidably disposed on the second guide rail 4291.
[0042] In some embodiments, the separation and combination driving member 4253 is a stepper motor, which is connected to a nut in the separation and combination plate 4252 through a screw rod. By controlling the rotation of the screw rod, the separation and combination plate 4252 is driven to slide on the separation and combination seat 4251 parallel to the second direction Y.
[0043] Figure 3 A schematic diagram of the connection structure between the first adsorption component 421 and the base 41 in an embodiment of the present application is shown.
[0044] See also Figure 1 and Figure 3 In some embodiments, the adsorption mechanism 42 further includes a first adsorption frame 426 and a second adsorption frame 427, the first adsorption frame 426 and the second adsorption frame 427 are slidably connected to the base 41 parallel to the first direction X, the separation and combination seat 4251 is located between the first adsorption frame 426 and the second adsorption frame 427, the first adsorption component 421 is arranged on the first adsorption frame 426, the fourth adsorption component 424 is arranged on the second adsorption frame 427, the driving mechanism 43 is transmission-connected to the first adsorption frame 426 and the second adsorption frame 427, and drives the first adsorption frame 426 to approach or move away from the separation and combination seat 4251, and drives the second adsorption frame 427 to approach or move away from the separation and combination seat 4251.
[0045] In some embodiments, the adsorption mechanism 42 also includes a first sliding assembly 428, the first sliding assembly 428 includes a first guide rail 4281, a first slider 4282 and a second slider 4283, the first guide rail 4281 is fixed to the base 41 and the length direction of the first guide rail 4281 is parallel to the first direction X, the first slider 4282 is fixed to the first adsorption frame 426 and the first slider 4282 is slidably disposed on the first guide rail 4281 parallel to the first direction X, the second slider 4283 is fixed to the second adsorption frame 427 and the second slider 4283 is slidably disposed on the first guide rail 4281 parallel to the first direction X.
[0046] In some embodiments, the driving mechanism 43 includes a set of screw-nut mechanisms, the screw rotates synchronously with the synchronous wheel, the screw is connected to the nut in the first adsorption frame 426 and the second adsorption frame 427, and the screw is driven to rotate by the synchronous wheel, thereby driving the first adsorption frame 426 and the second adsorption frame 427 to slide closer to or away from each other on the base 41.
[0047] In some embodiments, the lead screw in the driving mechanism 43 is a bidirectional lead screw. A bidirectional lead screw is a left - right hand lead screw. Half of the thread part of the lead screw is left - handed and the other half is right - handed. When the lead screw rotates in one direction, the two nuts on the thread move apart or approach each other at both ends. When rotating in the opposite direction, the two nuts approach or move apart.
[0048] In some embodiments, the first adsorption assembly 421 includes a fixed disk 4211, a rotating disk 4212, a rotation driving member 4213, and a first suction cup group 4214. The fixed disk 4211 is fixed to the first adsorption frame 426, the rotating disk 4212 is fixed to the first suction cup group 4214. The fixed disk 4211 has a first rotation axis, and the rotating disk 4212 is rotatably arranged on the fixed disk 4211 around the first rotation axis. The rotation driving member 4213 is fixed to the first adsorption frame 426 and is used to drive the rotating disk 4212 to rotate. After the first adsorption assembly 421 sucks a set of half - wafers, by rotating 180°, it is then combined with the half - wafers in the second adsorption assembly 422, so as to stick the half - wafers in the first adsorption assembly 421 and the second adsorption assembly 422 back - to - back together to prevent the phenomenon of over - plating.
[0049] Among them, the working process of the fourth adsorption assembly 424 is the same as that of the first adsorption assembly 421, and will not be elaborated here.
[0050] Figure 4 Fig. shows a top - view schematic diagram of the overall structure of the loading and unloading device 1 in an embodiment of the present application.
[0051] Please refer to Figure 4 , an embodiment of the present application provides a loading and unloading device 1, including a robotic arm 10, a flower - basket transverse movement device 20, a boat transverse movement device 30, and a wafer combining and separating device 40. The wafer combining and separating device 40 is connected to the robotic arm 10. The flower - basket transverse movement device 20 is used to move the flower - basket 7, and the boat transverse movement device 30 is used to move the boat 8. Both the flower - basket 7 and the boat 8 are used to support wafers. The wafer combining and separating device 40 is used to combine the wafers on the flower - basket 7 and transfer them to the boat 8 through the robotic arm 10, or the wafer combining and separating device 40 is used to separate the wafers on the boat 8 and transfer them to the flower - basket 7 through the robotic arm 10.
[0052] Figure 5 Fig. shows a schematic diagram of the positional relationship between the adsorption mechanism 42 and the flower - basket transverse movement device 20 in an embodiment of the present application. Figure 6 Fig. shows a schematic diagram of the positional relationship between the adsorption mechanism 42 and the boat transverse movement device 30 in an embodiment of the present application.
[0053] Please refer to Figure 4 and in combination with Figure 5 and Figure 6, in some embodiments, the flower basket transverse movement device 20 can carry two flower baskets 7, and the two flower baskets 7 are arranged side by side along the fourth direction U. Each flower basket 7 is provided with two first carrying parts 71 arranged side by side, and the first carrying part 71 is used for supporting a row of half wafers. The four first carrying parts 71 are arranged side by side along the fourth direction U. Each first carrying part 71 can place a plurality of half wafers at equal intervals side by side along the fifth direction V, wherein the fourth direction U is perpendicular to the fifth direction V.
[0054] In some embodiments, the flower basket transverse movement device 20 further includes a flower basket sliding frame 22 and a flower basket positioning mechanism 23. The two flower baskets 7 are slidably arranged on the flower basket sliding frame 22 parallel to the fifth direction V, and the flower basket positioning mechanism 23 is used to drive and fix the flower basket 7 so that the flower basket 7 can provide unprocessed half wafers or carry processed half wafers at the feeding position. The feeding position refers to the position where the flower basket 7 is located when the robotic arm 10 can pick up materials from the flower basket 7.
[0055] The flower basket 7 also has a discharging position. When the flower basket 7 is in the discharging position, the flower basket 7 is far away from the robotic arm 10 to facilitate taking out the processed wafers from the flower basket 7.
[0056] In some embodiments, there are two boat transverse movement devices 30, and there are two flower basket transverse movement devices 20. The two flower basket transverse movement devices 20 are arranged side by side and are located between the two boat transverse movement devices 30. The robotic arm 10 is located on the same side of the two flower basket transverse movement devices 20 and is located between the two boat transverse movement devices 30. The two flower basket transverse movement devices 20 and the two boat transverse movement devices 30 are arranged around the robotic arm 10, shortening the movement time of the robotic arm 10 and improving the transfer efficiency of the half wafers.
[0057] In some embodiments, each boat 8 is provided with at least eight second carrying parts 81 arranged side by side, and the second carrying part 81 is used for supporting a row of half wafers.
[0058] In some embodiments, the boat transverse movement device 30 further includes a boat sliding frame 32 and a boat positioning mechanism 33. The boat 8 is slidably arranged on the boat sliding frame 32 parallel to the fifth direction V, and the boat positioning mechanism 33 is used to drive and fix the boat 8 so that the boat 8 can provide unprocessed half wafers after wafer bonding or carry processed half wafers after wafer bonding at the processing position. The processing position refers to the position where the boat 8 is located when the half wafers can be picked up from the boat 8 during processing.
[0059] The boat 8 also has a wafer bonding position. When the boat 8 is in the wafer bonding position, the boat 8 is close to the robotic arm 10 to facilitate the wafer bonding and splitting device 40 to put the half wafers on the flower basket transverse movement device 20 into the boat 8 after wafer bonding, or to facilitate the wafer bonding and splitting device 40 to put the processed half wafers on the boat 8 into the flower basket transverse movement device 20 after wafer splitting.
[0060] It should be noted that during the production process of photovoltaic cells, the loading and unloading operations of half silicon wafers need to be carried out multiple times, that is, the half silicon wafers in the carrier horizontal transfer device 20 and the boat horizontal transfer device 30 are transferred to each other. Specifically, the half silicon wafers that have undergone process treatment in the boat horizontal transfer device 30 are exported to the carrier horizontal transfer device 20, and the half silicon wafers that have not undergone process treatment are imported from the carrier horizontal transfer device 20 into the boat horizontal transfer device 30. Moreover, during the process treatment of the half silicon wafers, the half silicon wafers need to be attached back to back to prevent the occurrence of the plating-around phenomenon. When the half silicon wafers in the boat horizontal transfer device 30 after process treatment are exported to the carrier horizontal transfer device 20, the half silicon wafers need to be placed in the same direction to facilitate the batch processing of the half silicon wafers after process treatment in subsequent process steps.
[0061] In some embodiments, the adsorption mechanism 42 includes a first adsorption component 421, a second adsorption component 422, a third adsorption component 423, and a fourth adsorption component 424 that are arranged in sequence along the first direction X and are disposed on the base 41. Four groups of silicon wafers can be taken from the carrier 7 at one time for wafer bonding, doubling the production capacity. The center distance between the second adsorption component 422 and the third adsorption component 423 is L1. Among the four first bearing parts 71, the center distance between the two middle first bearing parts 71 is L2. Among the four second bearing parts 81, the center distance between the two second bearing parts 81 on both sides of one second bearing part 81 is L3, satisfying L1 = L2 = L3. By setting the distance between the second adsorption component 422 and the third adsorption component 423 on the adsorption mechanism 42 to be the center distance between the two second bearing parts 81 on both sides of one second bearing part 81, and also setting the distance between the two first bearing parts 71 in the carrier 7 to be a matching distance, the middle second adsorption component 422 and the third adsorption component 423 can be fixed, and a set of micro-motion servo drive mechanisms can be shared by the second adsorption component 422 and the third adsorption component 423, realizing the simplification and light-weighting of the structure. The wafer bonding and splitting device 40 can simultaneously take four groups of half silicon wafers from the carrier horizontal transfer device 20 for wafer bonding, and can directly put them into the boat horizontal transfer device 30 after wafer bonding is completed, without performing two operations, improving the production capacity.
[0062] In the related art, the wafer bonding action of combining 4 groups of silicon wafers into 2 groups of silicon wafers is achieved through the X-axis, and then the two groups of silicon wafers are attached back to back tightly through the Y-axis movement.
[0063] In some embodiments, the spacing between each of the second bearing portions 81 of the boat 8 is 103 mm, and the spacing between the two middle first bearing portions 71 of the two flower baskets 7 is set to 206 mm. With this setting, the second adsorption assembly 422 and the third adsorption assembly 423 can cancel the movement in the X-axis direction, and the first adsorption assembly 421 and the fourth adsorption assembly 424 can share a set of Y-axis movement mechanisms, achieving the simplification of the mechanism and reducing the weight. After the four groups of silicon wafers on the wafer splitting and combining device 40 are combined, they become two groups of silicon wafers, which exactly correspond to the first and third second bearing portions 81 of the boat 8. By increasing the second bearing portions 81, the function of the boat 8 to pick up and place two groups of combined silicon wafers at one time is realized, and the overall machine cycle is accelerated.
[0064] An embodiment of the present application further provides a production line, including processing equipment and the loading and unloading equipment 1 in one or more of the above embodiments, and the loading and unloading equipment 1 is used to transport silicon wafers for the processing equipment.
[0065] In addition, for those of ordinary skill in the art, various other corresponding changes and deformations can be made according to the technical concept of the present application, and all these changes and deformations should fall within the protection scope of the claims of the present application.
Claims
1. A split and combined piece device, characterized in that, include: Base; An adsorption mechanism, the adsorption mechanism comprising a first adsorption component, a second adsorption component, a third adsorption component and a fourth adsorption component which are arranged in sequence along a first direction and are disposed on the base; A driving mechanism, drivingly connected to the adsorption mechanism; The distance between the second adsorption component and the third adsorption component along the first direction is fixed, and the driving mechanism is connected to the first adsorption component and the fourth adsorption component, and drives the first adsorption component to approach or move away from the second adsorption component, and drives the fourth adsorption component to approach or move away from the third adsorption component; Alternatively, the distance between the first adsorption component and the fourth adsorption component along the first direction is fixed, and the driving mechanism is transmission-connected to the second adsorption component and the third adsorption component, and drives the second adsorption component to approach or move away from the first adsorption component, and drives the third adsorption component to approach or move away from the fourth adsorption component.
2. The split and combined sheet device according to claim 1, characterized in that, The adsorption mechanism also includes a separation and combination component, which includes a separation and combination seat, a separation and combination plate and a separation and combination driving member. The separation and combination seat is fixed to the base, and the separation and combination plate is slidably connected to the separation and combination seat parallel to the second direction. The separation and combination driving member is arranged on the separation and combination seat to drive the separation and combination plate to reciprocate parallel to the second direction, and the second direction is perpendicular to the first direction. The second adsorption component and the third adsorption component are arranged on the separation and combination plate.
3. The split and combined sheet device according to claim 2, wherein, The adsorption mechanism also includes a first adsorption frame and a second adsorption frame, the first adsorption frame and the second adsorption frame are slidably connected to the base parallel to the first direction, the separation and combination seat is located between the first adsorption frame and the second adsorption frame, the first adsorption component is arranged on the first adsorption frame, and the fourth adsorption component is arranged on the second adsorption frame. The driving mechanism is transmission-connected to the first adsorption frame and the second adsorption frame, and drives the first adsorption frame to approach or move away from the separation and combination seat, and drives the second adsorption frame to approach or move away from the separation and combination seat.
4. The split and combined sheet device according to claim 3, wherein, The first adsorption assembly includes a fixed disk, a rotating disk, a rotating driving member and a first suction cup group, the fixed disk is fixed to the first adsorption frame, the rotating disk is fixed to the first suction cup group, the fixed disk has a first rotation axis, the rotating disk is rotatably arranged on the fixed disk around the first rotation axis, and the rotating driving member is fixed to the first adsorption frame for driving the rotating disk to rotate.
5. The split and combined sheet device according to claim 3, characterized in that, The adsorption mechanism also includes a first sliding assembly, which includes a first guide rail, a first slider and a second slider. The first guide rail is fixed to the base and the length direction of the first guide rail is parallel to the first direction. The first slider is fixed to the first adsorption frame and the first slider is slidably arranged on the first guide rail parallel to the first direction. The second slider is fixed to the second adsorption frame and the second slider is slidably arranged on the first guide rail parallel to the first direction.
6. The split and combined sheet device according to claim 2, characterized in that, The adsorption mechanism further includes a second sliding assembly, the second sliding assembly includes a second guide rail and a splitting and combining slider, the second guide rail is fixed to the splitting and combining seat and the length direction of the second guide rail is parallel to the second direction, the splitting and combining slider is fixed to the splitting and combining plate and the splitting and combining slider is slidably arranged on the second guide rail in parallel with the second direction.
7. A loading and unloading device, characterized in that, It includes a robotic arm, a flower basket transverse movement device, a boat transverse movement device, and a splitting and combining wafer device according to any one of claims 1 to 6. The splitting and combining wafer device is connected to the robotic arm. The flower basket transverse movement device is used to move the flower basket, the boat transverse movement device is used to move the boat. Both the flower basket and the boat are used to support silicon wafers. The splitting and combining wafer device is used to combine the silicon wafers on the flower basket and transfer them to the boat through the robotic arm, or the splitting and combining wafer device is used to split the silicon wafers on the boat and transfer them to the flower basket through the robotic arm.
8. The loading and unloading device according to claim 7, wherein The flower basket transverse movement device can carry two flower baskets. Each flower basket is provided with two first carrying parts arranged side by side. The first carrying part is used to support a row of half silicon wafers, and four first carrying parts are arranged side by side. Each boat is provided with at least eight second carrying parts arranged side by side. The second carrying part is used to support a row of half silicon wafers. The center distance between the second adsorption assembly and the third adsorption assembly is L1. Among the four first carrying parts, the center distance between the two middle first carrying parts is L2. Among the four second carrying parts, the center distance between the two second carrying parts on both sides of one second carrying part is L3, and L1 = L2 = L3 is satisfied.
9. The loading and unloading device according to claim 7, characterized in that, There are two boat transverse movement devices and two flower basket transverse movement devices. The two flower basket transverse movement devices are arranged side by side and are located between the two boat transverse movement devices. The robotic arm is located on the same side of the two flower basket transverse movement devices and is located between the two boat transverse movement devices. The two flower basket transverse movement devices and the two boat transverse movement devices are arranged around the robotic arm.
10. A production line, characterized in that, It includes a processing device and a loading and unloading device according to any one of claims 7 to 9. The loading and unloading device is used to carry silicon wafers for the processing device.