PCB preheating device

Abstract

The utility model discloses a PCB preheating device which comprises a first heat conduction plate and a second heat conduction plate, the first heat conduction plate is located below the second heat conduction plate, a heating vent groove and a cooling vent groove are arranged in the first heat conduction plate, each vent groove is provided with an air inlet hole, and the second heat conduction plate is provided with a plurality of air outlet channels for each vent groove. The air outlet channel penetrates through the upper and lower surfaces of the second heat-conducting plate, a heating rod is arranged in the second heat-conducting plate corresponding to the heating vent groove, and a plurality of temperature sensors are mounted on the second heat-conducting plate. The air blowing function is added on the basis of a traditional heating module, the heat conduction efficiency is improved, the PCB is heated more evenly, the temperature difference of all positions of the PCB is reduced, and the dispensing effect is better guaranteed.

Description

Technical Field

[0001] The utility model relates to a field, in particular to a PCB board preheating device. Background Art

[0002] When some PCB boards are produced, dispensing is required. To ensure the dispensing effect, some glues require the PCB board to be preheated to a certain temperature range before dispensing. The existing treatment method is that the PCB board is transported to the preheating station through a conveying track, and there is a heating module below the PCB board to heat the PCB board. The heating module does not contact the PCB board, and the heat is conducted through the air. Restricted by the conveying track, the width of the existing heating module is smaller than the width of the PCB board. Therefore, it mainly focuses on heating the middle part of the PCB board and cannot evenly conduct the heat to all positions of the PCB board. After the PCB board is heated, the temperature in the middle is high, and the temperature at both sides is the lowest, with a temperature difference exceeding 20°C, which cannot meet the requirements for the preheating temperature of the PCB board before some glues are dispensed. Content of the Utility Model

[0003] Aiming at the deficiencies of the prior art, the utility model provides a PCB board preheating device, which mainly solves the problems of uneven preheating and large temperature difference of the PCB board.

[0004] To achieve the above object, the utility model is realized through the following technical solutions:

[0005] A PCB board preheating device includes a first heat conducting plate and a second heat conducting plate. The first heat conducting plate is located below the second heat conducting plate. The first heat conducting plate is provided with a heating air vent groove and a cooling air vent groove, and each air vent groove is configured with an air inlet hole. The second heat conducting plate is configured with a plurality of air outlet channels for each air vent groove. The air outlet channels penetrate the upper and lower surfaces of the second heat conducting plate. A heating rod is arranged inside the second heat conducting plate corresponding to the position of the heating air vent groove, and several temperature sensors are installed on the second heat conducting plate.

[0006] Further, the heating air vent grooves and the cooling air vent grooves are arranged alternately.

[0007] Further, the upper surface of the first heat conducting plate is recessed to form two heating air vent grooves and a cooling air vent groove, and the cooling air vent groove is located between the two heating air vent grooves.

[0008] Further, the air inlets of the two heating air vent grooves and the air inlet of the cooling air vent groove are respectively located at opposite ends of the first heat conducting plate.

[0009] Further, the capacity of the cooling air vent groove is smaller than that of the heating air vent groove.

[0010] Further, the second heat conducting plate is provided with two rows of air outlet channels corresponding to each heating air vent groove, each heating rod is located between the two rows of air outlet channels, and the second heat conducting plate is provided with one row of air outlet channels corresponding to the position of the cooling air vent groove.

[0011] Furthermore, the air outlet channel is a stepped channel with a smaller upper part and a larger lower part.

[0012] Furthermore, the first heat conducting plate and the second heat conducting plate are made of metal materials.

[0013] Furthermore, the metal is aluminum.

[0014] The utility model has the following beneficial effects:

[0015] The first heat conducting plate is provided with a heating air vent groove and a cooling air vent groove. The second heat conducting plate is provided with multiple air outlet channels for each air vent groove. The second heat conducting plate is heated by a heating rod, and air is blown upward to the PCB board, so as to achieve the purpose of heating the PCB board. Based on the traditional heating module, the blowing function is added to improve the heat conduction efficiency, make the PCB board heated more evenly, reduce the temperature difference at each position of the PCB board, and better ensure the dispensing effect. Description of the Drawings

[0016] Figure 1 is a schematic diagram of the PCB board preheating device of the embodiment of the utility model heating the PCB board;

[0017] Figure 2 is an exploded view of the PCB board preheating device;

[0018] Figure 3 is a cross-sectional view of the PCB board preheating device. Detailed Embodiments

[0019] The following further describes the utility model with reference to the drawings and embodiments.

[0020] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0021] Such as Figures 1 to 3As shown in the figure, this embodiment provides a PCB board preheating device, which includes a first heat conducting plate 2 and a second heat conducting plate 1. The first heat conducting plate 2 is located below the second heat conducting plate 1. The first heat conducting plate 2 is provided with a heating air vent groove 3 and a cooling air vent groove 4, and each air vent groove is configured with an air inlet hole 5. The second heat conducting plate 1 is configured with a plurality of air outlet channels 6 for each air vent groove. The air outlet channels 6 penetrate through the upper and lower surfaces of the second heat conducting plate 1. A heating rod 8 is provided inside the second heat conducting plate 1 corresponding to the position of the heating air vent groove 3, and a plurality of temperature sensors 7 are installed on the second heat conducting plate 1.

[0022] The width of the preheating device is smaller than the width of the PCB board. During use, both sides of the PCB board are placed on two transmission tracks, and the preheating device is located between the two transmission tracks and below the middle of the PCB board. The heating rod 8 conducts electricity to heat the second heat conducting plate 1 to raise its temperature. The temperature sensor 7 detects the temperature of the second heat conducting plate 1. After the second heat conducting plate 1 reaches a certain temperature, it is heated at a constant temperature to keep the temperature of the second heat conducting plate 1 within a certain range to preheat the PCB board 9.

[0023] Since only the heating rod 8 is provided inside the second heat conducting plate 1 corresponding to the position of the heating air vent groove 3, and no heating rod 8 is provided above the cooling air vent groove 4, the temperature of the gas output from the air outlet channel 6 communicated with the heating air vent groove 3 is higher than the temperature of the gas output from the air outlet channel 6 communicated with the cooling air vent groove 4. By adjusting the intake air flow of the heating air vent groove 3 and the cooling air vent groove 4, the temperature difference of the second heat conducting plate 1 can be adjusted. Air is supplied to each air vent groove, and the gas blows out from each air outlet channel 6 towards the PCB board 9, quickly conducting the temperature of the second heat conducting plate 1 to the PCB board 9. By reasonably designing the angle orientation and position of each air outlet channel 6, the entire PCB board 9 is within the range of direct hot air blowing, and the heating is more uniform.

[0024] In this embodiment, specifically, the upper surface of the first heat conducting plate 2 is recessed to form two heating air vent grooves 3 and one cooling air vent groove 4. The cooling air vent groove 4 is located between the two heating air vent grooves 3, and the capacity of the cooling air vent groove 4 is smaller than that of the heating air vent groove 3. The second heat conducting plate 1 is provided with two rows of air outlet channels 6 corresponding to each heating air vent groove, and each heating rod 8 is located between the two rows of air outlet channels 6. The second heat conducting plate 1 is provided with one row of air outlet channels 6 corresponding to the position of the cooling air vent groove 4. In other embodiments, the number of the heating air vent grooves 3 and the cooling air vent grooves 4 may be different from this embodiment. For example, multiple heating air vent grooves 3 and multiple cooling air vent grooves 4 are alternately arranged, which is beneficial to the uniform distribution of the heat of the second heat conducting plate.

[0025] The air inlets of the two heating air vent grooves and the air inlet of the cooling air vent groove are respectively located at opposite ends of the first heat conducting plate. The air inlets are installed with air inlet connectors 10, avoiding that the three air inlet connectors 10 are located at the same end of the first heat conducting plate, which is not conducive to reducing the size of the first heat conducting plate.

[0026] The temperature sensor can be one or more. Preferably, in this embodiment, only one temperature sensor 7 is provided in the middle of one end of the second heat conducting plate 1. Preferably, the air outlet channel 6 is a stepped channel with a smaller upper part and a larger lower part. When the air flow passes through the smaller-diameter part at the upper part of the air outlet channel 6 from bottom to top, the speed of the air flow increases, that is, the air flow blowing on the PCB board 9 speeds up, which is beneficial to quickly heating the PCB board 9.

[0027] Since the PCB board 9 is usually square, the first heat conducting plate 2 and the second heat conducting plate 1 in this embodiment are also set to be square, the heating rod 8 is linear, and the heating air vent groove 3 and the cooling air vent groove 4 are also set to be linear. Each air inlet is designed on the side surface of the first heat conducting plate 2. The air flow is independently controlled in three air paths, and the inlet air flow of the three air paths is adjusted, so that the temperature difference between the middle and both sides of the PCB board can be adjusted, and the temperature difference range after heating is within 5°C, which better ensures the dispensing effect.

[0028] Preferably, the first heat conducting plate 2 and the second heat conducting plate 1 are made of metal materials, such as aluminum, stainless steel, etc., preferably aluminum, which has good thermal conductivity and does not rust. The first heat conducting plate 2 and the second heat conducting plate 1 can also be made of other heat conducting materials.

[0029] As described above, the embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention. Therefore, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Claims

1. A PCB board preheating device, characterized in that, It includes a first heat conducting plate and a second heat conducting plate. The first heat conducting plate is located below the second heat conducting plate. The first heat conducting plate is provided with a heating air vent groove and a cooling air vent groove, and each air vent groove is configured with an air inlet hole. The second heat conducting plate is configured with a plurality of air outlet channels for each air vent groove, and the air outlet channels penetrate through the upper and lower surfaces of the second heat conducting plate. A heating rod is provided inside the second heat conducting plate corresponding to the position of the heating air vent groove, and a number of temperature sensors are installed on the second heat conducting plate.

2. The PCB board preheating device according to claim 1, wherein The heating air vent grooves and the cooling air vent grooves are arranged alternately.

3. The PCB board preheating device according to claim 1, characterized in that Two heating air vent grooves and one cooling air vent groove are formed by the upper surface of the first heat conducting plate being concave. The cooling air vent groove is located between the two heating air vent grooves.

4. The PCB board preheating device according to claim 3, wherein The air inlets of the two heating air vent grooves and the air inlet of the cooling air vent groove are respectively located at opposite ends of the first heat conducting plate.

5. The PCB board preheating device according to any one of claims 1 to 3, characterized in that, The capacity of the cooling air vent groove is smaller than that of the heating air vent groove.

6. The PCB board preheating device according to claim 4, wherein Two rows of air outlet channels are provided on the second heat conducting plate corresponding to each heating air vent groove, and each heating rod is located between the two rows of air outlet channels. One row of air outlet channels is provided on the second heat conducting plate corresponding to the position of the cooling air vent groove.

7. The PCB board preheating device according to claim 1, characterized in that, The air outlet channels are stepped channels with a smaller upper part and a larger lower part.

8. The PCB board preheating device according to claim 1, characterized in that, The first heat conducting plate and the second heat conducting plate are made of a metal material.

9. The PCB board preheating device according to claim 8, wherein The metal is aluminum.

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