Multi-piece cleaning device

Abstract

The utility model discloses a multi-chip cleaning device, and relates to the technical field of semiconductor substrate material manufacturing, and the multi-chip cleaning device comprises a device main body and a spraying assembly; the spraying assembly comprises at least three spraying pieces; the at least three spraying pieces are sequentially arranged on the device main body and are distributed in a stepped manner; the device main body is provided with fixing stations for fixing the substrate slices at the positions between the two adjacent spraying pieces; the fixing stations are distributed in a stepped mode, the stepped distribution direction is the same as the stepped distribution direction of the spraying pieces, the substrate slices located on the fixing stations and the spraying assemblies are distributed in a staggered mode in height, and by means of the design, the arrangement density of the substrate slices is increased, occupied cleaning space is reduced, and slice taking and placing / loading and unloading are convenient. The spraying holes are formed in the opposite faces of the adjacent spraying pieces and used for spraying and cleaning the substrate slices, double-face cleaning operation is achieved, and the cleaning efficiency and the cleaning effect are effectively improved.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor substrate material manufacturing, and particularly relates to a multi-wafer cleaning device. Background Art

[0002] Radio frequency devices manufactured using indium phosphide substrates have shown excellent performance in application scenarios such as satellites and radars, and have gradually become the mainstream substrate materials for radio frequency devices.

[0003] In the manufacturing of indium phosphide substrate materials, the polished indium phosphide substrate wafers need to be cleaned. Spray cleaning is one of the main cleaning methods for indium phosphide substrate wafers. Traditional spray cleaning is mostly single-wafer spray cleaning, which has low efficiency. To improve efficiency, multiple wafers can be set for one-time cleaning. However, multi-wafer cleaning requires a large cleaning space, is prone to incomplete cleaning, and also increases the complexity of loading and unloading. Therefore, there is an urgent need to propose a design solution to ensure multi-wafer cleaning efficiency, reduce the occupied cleaning space, and optimize the cumbersome problem of loading and unloading. Summary of the Utility Model

[0004] In view of this, the purpose of this application is to provide a multi-wafer cleaning device to ensure multi-wafer cleaning efficiency, reduce the occupied cleaning space, and optimize the cumbersome problem of loading and unloading.

[0005] To achieve the above technical purpose, this application provides a multi-wafer cleaning device, including a device main body and a spray assembly;

[0006] The spray assembly includes at least three spray members;

[0007] At least three of the spray members are sequentially arranged on the device main body and are arranged in a stepped manner;

[0008] At the positions of the device main body between two adjacent spray members, fixing stations for fixing substrate wafers are respectively provided;

[0009] Each of the fixing stations is arranged in a stepped manner, and the stepped distribution direction is the same as that of the spray members, so that the substrate wafers located on the fixing stations are staggeredly distributed in height with the spray assembly;

[0010] Spray holes are provided on the opposite sides of adjacent spray members for spray cleaning of substrate wafers.

[0011] Furthermore, an installation surface is provided at the top of the device main body;

[0012] At least three of the spray members are arranged on the installation surface;

[0013] Limiting edge strips are respectively provided on both sides of the installation surface;

[0014] The two limiting edges enclose a diversion groove with the mounting surface.

[0015] Furthermore, a clamping groove is provided on the mounting surface for forming the fixing station.

[0016] Furthermore, both ends of the clamping groove respectively extend into the limiting edges.

[0017] Furthermore, both ends of the clamping groove respectively extend out of the limiting edges.

[0018] Furthermore, connecting ear parts are respectively fixed on both sides of each spraying part;

[0019] The connecting ear parts located on the same side are connected to a fixing strip;

[0020] The fixing strip is detachably installed with the limiting edge.

[0021] Furthermore, a spraying cavity is provided inside the spraying part;

[0022] Spraying holes are provided on both side surfaces of the spraying part.

[0023] Furthermore, the spraying holes located on the same surface are divided into multiple columns;

[0024] The multiple columns of spraying holes are evenly distributed around the circumference of the spraying part.

[0025] Furthermore, pipe connectors communicating with the spraying cavity are provided on both sides of the spraying part.

[0026] Furthermore, at least three spraying parts are distributed in a symmetric stepped manner.

[0027] It can be seen from the above technical solutions that the multi-piece cleaning device designed in this application steps the spraying parts constituting the spraying assembly and the fixing stations located between adjacent spraying parts in the same direction, and makes the lining wafers located on the fixing stations stagger in height with the spraying assembly. This design increases the layout density of the lining wafers, reduces the occupied cleaning space, and also facilitates wafer picking / placing / loading and unloading. Moreover, each lining wafer located on the fixing station can be spray-cleaned by the adjacent spraying parts, realizing double-sided cleaning operation, effectively improving the cleaning efficiency and cleaning effect. Description of the Drawings

[0028] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0029] Figure 1 It is a schematic structural diagram of a multi-piece cleaning device provided in the present application;

[0030] Figure 2 It is a schematic structural diagram of a spray component of a multi-piece cleaning device provided in the present application;

[0031] Figure 3 It is a schematic structural diagram of a device main body of a multi-piece cleaning device provided in the present application;

[0032] In the figure: 1, device main body; 11, mounting surface; 12, card slot; 13, limit edge; 2, spray part; 21, spray hole; 22, connecting ear; 23, pipe joint; 3, lining film; 4, fixing strip. Detailed implementation manners

[0033] The following will clearly and completely describe the technical solutions of the embodiments of the present application with reference to the drawings. Obviously, the described embodiments are some, rather than all, of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope protected by the embodiments of the present application.

[0034] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the embodiments of the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0035] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a replaceable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0036] An embodiment of the present application discloses a multi-chip cleaning device.

[0037] Please refer to Figure 1 , an embodiment of a multi-chip cleaning device provided in the embodiments of the present application includes:

[0038] A device main body 1 and a spraying assembly.

[0039] The spraying assembly includes at least three spraying members 2.

[0040] At least three spraying members 2 are sequentially arranged on the device main body 1 and are arranged in a stepped manner.

[0041] At the positions between adjacent two spraying members 2 on the device main body 1, fixing stations for fixing the substrate wafers 3 are respectively provided. Each fixing station is arranged in a stepped manner, and the stepped distribution direction is the same as that of the spraying members 2, and the substrate wafers 3 located at the fixing stations are vertically staggered with the spraying assembly (staggered vertically).

[0042] Spraying holes 21 are provided on the opposite surfaces of adjacent spraying members 2 for spraying and cleaning the substrate wafers 3.

[0043] For the multi-chip cleaning device designed in the present application, the spraying members 2 constituting the spraying assembly and the fixing stations between adjacent spraying members 2 are arranged in the same-direction steps, and the substrate wafers 3 located at the fixing stations are vertically staggered with the spraying assembly. This design increases the arrangement density of the substrate wafers 3, reduces the occupied cleaning space, and also facilitates the picking and placing of wafers / loading and unloading. Moreover, each substrate wafer 3 located at the fixing station can be sprayed and cleaned by the adjacent spraying member 2, realizing double-sided cleaning operation, effectively improving the cleaning efficiency and cleaning effect.

[0044] The above is Embodiment 1 of a multi-chip cleaning device provided in the embodiments of the present application. The following is Embodiment 2 of a multi-chip cleaning device provided in the embodiments of the present application. For details, please refer to Figures 1 to 3 .

[0045] Based on the solution of the above Embodiment 1:

[0046] Further, asFigure 3 As shown in the figure, a mounting surface 11 is provided at the top of the device body 1, and at least three spraying members 2 are arranged on the mounting surface 11.

[0047] Limit retaining edges 13 are respectively provided on both sides of the mounting surface 11, and a diversion groove is formed between the two limit retaining edges 13 and the mounting surface 11, so as to facilitate the diversion of the cleaning liquid and avoid accumulation, which may affect the cleaning effect.

[0048] Furthermore, as Figure 3 shown in the figure, a card slot 12 is provided on the mounting surface 11 to form a fixing station. By inserting the substrate sheet 3 into the card slot 12, the fixing of the substrate sheet 3 can be completed.

[0049] Furthermore, as Figure 3 shown in the figure, in order to meet the installation and fixing requirements of substrate sheets 3 of more sizes, both ends of the card slot 12 respectively extend into the limit retaining edges 13; or, both ends of the card slot 12 respectively extend out of the limit retaining edges 13.

[0050] Furthermore, as Figure 2 shown in the figure, connection ear parts 22 are respectively fixed on both sides of each spraying member 2. The connection ear parts 22 on the same side are connected to a fixing strip 4, and the fixing strip 4 is detachably installed with the limit retaining edge 13. By using the cooperation of the fixing strip 4 and the connection ear parts 22, each spraying member 2 is fixed together, which is convenient for unified installation and disassembly and more convenient for maintenance. The detachable connection method can be a plug-in fit. For example, a protrusion is provided at the bottom of the fixing strip 4, and a concave hole for the protrusion to insert is provided on the limit retaining edge 13. Those skilled in the art can make appropriate variation designs based on this, which is not limited.

[0051] Furthermore, a spraying cavity is provided inside the spraying member 2, and spraying holes 21 are provided on both side surfaces of the spraying member 2 to meet the requirement that the opposite sides can respectively spray and clean the substrate sheet 3. Of course, in actual use, the outer side surfaces of the first and the last spraying members 2 may not be provided with spraying holes 21.

[0052] Furthermore, as Figure 1 shown in FIGS. 1 and 2, the spraying holes 21 on the same surface are divided into multiple columns, and the multiple columns of spraying holes 21 are evenly distributed around the circumference of the spraying member 2, showing a radial array distribution; it can also be other distribution methods, which is not limited.

[0053] Furthermore, as Figure 2 shown in the figure, pipe connectors 23 communicating with the spraying cavity are provided on both sides of the spraying member 2. By adopting the design of double pipe connectors 23 on both sides, the spraying cavity can be filled faster, and the water outlet pressure consistency of each spraying hole 21 is better.

[0054] Furthermore, as Figure 1As shown, for a specific stepped distribution method, at least three spraying members 2 can be symmetrically stepped, that is, the spraying member 2 in the middle is at the highest position, and then the height gradually decreases towards both sides, forming a symmetric stepped arrangement, or a triangular stepped arrangement, and the corresponding device main body 1 has a triangular seat structure.

[0055] The spraying member 2 in this application can be a disc structure, and there is no specific limitation.

[0056] The spraying member 2, the pipe joint 23, the fixing strip 4, and the spraying member 2 in this application can all be prepared from PEEK materials, and there is no specific limitation.

[0057] A shaking device (such as a shaking motor) can be added to the bottom of the device main body 1, so that the device main body 1 can shake at a certain frequency to achieve dynamic cleaning and further improve the cleaning effect.

[0058] Working principle (taking nine spraying members 2 arranged in a symmetric step as an example):

[0059] 1. The operator installs eight lining wafers 3 on the corresponding fixed workstations respectively;

[0060] 2. The pipe joint 23 is conducted, and the spray holes 21 of the spraying member 2 spray out to clean the lining wafers 3 on the fixed workstations.

[0061] The above has introduced in detail a multi-wafer cleaning device provided by this application. For those of ordinary skill in the art, according to the idea of the embodiments of this application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to this application.

Claims

1. A multi-chip cleaning device, characterized in that, It includes a device main body (1) and a spraying component; The spraying component includes at least three spraying parts (2); At least three of the spraying parts (2) are sequentially arranged on the device main body (1) and are arranged in a stepped distribution; At the positions between two adjacent spraying parts (2) on the device main body (1), there are respectively fixed stations for fixing the lining sheets (3); Each of the fixed stations is arranged in a stepped distribution, and the stepped distribution direction is the same as that of the spraying parts (2), and the lining sheets (3) located on the fixed stations are staggeredly distributed in height with the spraying component; On the opposite sides of two adjacent spraying parts (2), there are spraying holes (21) for spraying and cleaning the lining sheets (3).

2. The multi-chip cleaning device according to claim 1, characterized in that, The top of the device main body (1) is provided with a mounting surface (11); At least three of the spraying parts (2) are arranged on the mounting surface (11); On both sides of the mounting surface (11), there are respectively limit retaining edges (13); A diversion groove is formed between the two limit retaining edges (13) and the mounting surface (11).

3. The multi-chip cleaning device according to claim 2, characterized in that, The mounting surface (11) is provided with a clamping groove (12) for forming the fixed station; 4. The multi-piece cleaning device according to claim 3, characterized in that, Both ends of the clamping groove (12) extend into the limit retaining edges (13) respectively; 5. A multi-chip cleaning device according to claim 3, characterized in that, Both ends of the clamping groove (12) extend out of the limit retaining edges (13) respectively; 6. The multi-chip cleaning device according to claim 2, wherein On both sides of each of the spraying parts (2), there are respectively fixed connecting ears (22); The connecting ears (22) located on the same side are connected to a fixing strip (4); The fixing strip (4) is detachably installed with the limit retaining edge (13).

7. The multi-piece cleaning device according to claim 1, wherein A spraying cavity is arranged inside the spraying part (2); On both side surfaces of the spraying part (2), there are the spraying holes (21); 8. The multi-chip cleaning device according to claim 7, wherein, The spraying holes (21) located on the same surface are divided into multiple columns; The multiple columns of spraying holes (21) are evenly distributed around the circumference of the spraying part (2); 9. The multi-chip cleaning device according to claim 7, wherein On both sides of the spraying part (2), there are respectively pipe joints (23) communicating with the spraying cavity; 10. A multi-chip cleaning device according to claim 9, characterized in that, At least three of the spraying parts (2) are arranged in a symmetric stepped distribution.

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