Glass assembly and vehicle

By setting a buffer between the welding terminal and the conductor, stress is dispersed, the problem of stress concentration of the welding terminal on the glass is solved, the stability and durability of the glass assembly are improved, the production process is simplified and the cost is reduced.

CN223161610UActive Publication Date: 2025-07-29FUYAO GLASS IND GROUP CO LTD
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Patent Information

Application Number
CN202422350006.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-26
Publication Date
2025-07-29
Estimated Expiration
2034-09-26

AI Technical Summary

Technical Problem

The stress concentration of welding terminals on glass causes glass to be easily slit, especially on laminated glass, which affects the stability and reliability of glass.

Method used

A buffer member is provided between the welding terminal and the conductor, and the buffer member is in a tight contact with the conductor through the buffer member, the gap between the welding terminal and the glass is raised, stress is dispersed, and a solder layer is used as a buffer medium to avoid direct contact and stress concentration.

Benefits of technology

Reduces the risk of glass lobes, improves product stability and durability of glass assembly, simplifies production processes, reduces material costs, and does not affect existing production lines.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a glass assembly and a vehicle, the glass assembly comprises glass, an electric conductor, a welding terminal, a solder layer and a buffer part, the electric conductor is arranged on the glass, the welding terminal is arranged on the side, away from the glass, of the electric conductor, the welding terminal and the electric conductor are arranged at an interval, and the buffer part is arranged on the surface, facing the electric conductor, of the welding terminal and is in abutting contact with the electric conductor; the solder layer is electrically connected between the solder terminal and the conductor. According to the glass assembly provided by the invention, the stress of the welding terminal on the glass can be improved, the damage to the glass caused by excessively concentrated force is avoided, and the risk that the glass is cracked is reduced.
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Description

Technical Field

[0001] The present application relates to the field of vehicle technology, and in particular to a glass assembly and a vehicle. Background Art

[0002] With the continuous advancement of technology, the functions integrated into vehicle glass are increasing. This can be achieved by providing different conductors on the glass and configuring solder terminals to establish electrical connections with the conductors, thereby integrating different functions into the glass. For example, the conductors can be heating wires, which can be formed by printing conductive material on the surface of the glass. These heating wires can then be heated to achieve defog, defrost, or de-icing functions on the glass. Alternatively, the conductors can be metal antenna coatings, which can be used to print antennas on the glass using metallic coatings to integrate antennas into the glass and enhance communication capabilities. However, the configured solder terminals can exert stress on the glass, which can easily cause the glass to crack. Utility Model Content

[0003] The purpose of the present application is to provide a glass assembly and a vehicle, which can improve the stress of the welding terminal on the glass, avoid damage to the glass caused by excessive concentrated force, and reduce the risk of glass cracking.

[0004] The present application provides a glass assembly, including glass, a conductor, a welding terminal, a solder layer and a buffer. The conductor is arranged on the glass, the welding terminal is arranged on the side of the conductor facing away from the glass, and is spaced apart from the conductor. The buffer is arranged on the surface of the welding terminal facing the conductor, and is in contact with the conductor. The solder layer is electrically connected between the welding terminal and the conductor.

[0005] In the glass assembly provided in the embodiment of the present application, a buffer is provided on the surface of the welding terminal facing the conductor so that the buffer is in contact with the conductor provided on the glass. On the one hand, the buffer serves to physically isolate the welding terminal from the conductor, elevating the welding terminal so that a certain gap exists between the welding terminal and the glass, thereby avoiding direct contact between the welding terminal and the conductor and thus avoiding contact between the welding terminal and the glass. Since there is no direct contact point between the welding terminal and the glass, the stress generated by the welding terminal during welding will not be concentrated at a single point, but will be dispersed over a large area, reducing the stress concentration caused by the contact between the welding terminal and the glass, thereby avoiding damage to the glass caused by excessively concentrated force, helping to significantly reduce cracks in the glass caused by excessive stress, and thereby reducing the risk of glass cracking. In addition, there is no direct contact between the welding terminal and the glass, which reduces the mechanical pressure exerted by the welding terminal on the glass, helps to evenly distribute the stress of the welding terminal on the glass, and reduces the tension caused by thermal expansion during the cooling process of the welding terminal after welding, thereby reducing the risk of glass cracking.

[0006] On the one hand, the buffer also plays a buffering role, avoiding rigid contact between the welding terminal and the glass, thereby reducing the risk of glass cracking. On the other hand, by providing a buffer on the surface of the welding terminal facing the conductor, the effect of raising the welding terminal can be achieved, and there is no need to apply a holding force to the welding terminal, reducing the process complexity of manufacturing the glass assembly. At the same time, by raising the welding terminal, the space between the welding terminal and the glass can be increased, thereby increasing the storage capacity of the solder layer under the welding terminal, which is conducive to improving the welding strength between the solder layer, the welding terminal and the glass. The glass assembly provided by the embodiment of the present application improves the stress of the welding terminal by providing a buffer, avoiding damage to the glass caused by overly concentrated force, and improving the product stability, durability and reliability of the glass assembly.

[0007] In addition, the method of providing a buffer is easy to implement, and the material cost of the buffer is low, and it will not cause significant interference to the existing production line. The embodiment of the present application does not require large-scale modification of the production equipment by using the buffer, and can be quickly applied in the existing production process.

[0008] In a possible implementation manner, the buffer includes an adhesive layer and a flexible layer. The adhesive layer is bonded between the surface of the welding terminal facing the conductor and the flexible layer, and the flexible layer abuts against the conductor to achieve abutting contact between the buffer and the conductor, avoiding rigid contact between the welding terminal and the glass, thereby reducing the risk of glass cracking.

[0009] In a possible implementation manner, the buffer is sleeved on the welding terminal. The buffer includes an abutting portion provided on the surface of the welding terminal facing the conductor and abutting against the conductor to achieve abutting contact between the buffer and the conductor, avoiding rigid contact between the welding terminal and the glass, thereby reducing the risk of glass cracking.

[0010] In a possible implementation manner, the welding terminal includes a welding surface facing the conductor. The solder layer is connected between the welding surface and the conductor. The welding surface is a flat surface, which can make the contact between the welding terminal and the conductor become a wide surface contact instead of a point contact, thereby avoiding concentrated pressure on the glass in a specific small area, and further reducing the risk of glass cracking.

[0011] In a possible implementation, the welding terminal includes a welding surface facing the conductor, and a solder layer is connected between the welding surface and the conductor. The welding surface includes a first surface and a second surface, and the second surface protrudes towards the conductor relative to the first surface. On the one hand, it is beneficial to increase the contact area between the welding surface and the solder layer, thereby facilitating an increase in the gripping force of the solder layer on the welding terminal, and further facilitating an increase in the welding force of the welding terminal on the glass, making the welding terminal more firmly welded on the glass. On the other hand, the second surface protrudes relative to the first surface to form a space, which has the function of storing the material of the solder layer. When the welding terminal is pressed downward in the direction towards the glass during the welding process, it can solve the problem of a reduction in the amount of solder between the contact surfaces of the welding terminal and the conductor caused by the overflow of the material of the solder layer towards the surroundings.

[0012] In a possible implementation, the welding terminal includes a connecting portion and a plurality of welding feet, the connecting portion is connected between the plurality of welding feet, and at least one buffer member is provided on the surface of each welding foot facing the conductor, and the solder layer is connected between the welding foot and the conductor.

[0013] In a possible implementation, the solder layer covers at least a part of the circumferential side surface of the buffer member, ensuring a good connection between the welding terminal and the conductor.

[0014] In a possible implementation, the glass assembly further includes a wire and a connector, and the wire is connected between the welding terminal and the connector.

[0015] In a possible implementation, the glass is tempered glass, and the conductor is provided on the surface of the tempered glass;

[0016] Alternatively, the glass includes an outer glass plate, an intermediate layer, and an inner glass plate. The intermediate layer is sandwiched between the outer glass plate and the inner glass plate, and the conductor is provided on the side of the inner glass plate facing away from the intermediate layer.

[0017] The embodiment of the present application further provides a vehicle, including a vehicle frame and the glass assembly as described above, and the glass is installed on the vehicle frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 It is a schematic structural diagram of the glass assembly provided by the embodiment of the present application applied to a vehicle;

[0020] Figure 2 For Figure 1Schematic top view structure diagram of the glass assembly shown;

[0021] Figure 3 is Figure 2 Schematic cross-sectional structure diagram of the glass assembly shown;

[0022] Figure 4 is Figure 2 Schematic structure diagram of the wire harness in the glass assembly shown;

[0023] Figure 5 is Figure 3 Schematic cross-sectional structure diagram of the welding terminal in the wire harness shown;

[0024] Figure 6 is Figure 4 Schematic assembly structure diagram of the welding terminal, solder layer, glass, and conductor in the wire harness shown in some embodiments;

[0025] Figure 7 Schematic cross-sectional structure diagram of a partial structure of the glass assembly in the first embodiment of the present application;

[0026] Figure 8 Schematic cross-sectional structure diagram of a partial structure of the glass assembly in the second embodiment of the present application;

[0027] Figure 9 Schematic cross-sectional structure diagram of a partial structure of the glass assembly in the third embodiment of the present application;

[0028] Figure 10 Schematic cross-sectional structure diagram of a partial structure of the glass assembly in the fourth embodiment of the present application;

[0029] Figure 11 Schematic cross-sectional structure diagram of a partial structure of the glass assembly in the fifth embodiment of the present application;

[0030] Figure 12 Schematic cross-sectional structure diagram of a partial structure of the glass assembly in the sixth embodiment of the present application;

[0031] Figure 13 Schematic cross-sectional structure diagram of a partial structure of the glass assembly in the seventh embodiment of the present application;

[0032] Figure 14 Schematic cross-sectional structure diagram of a partial structure of the glass assembly in the eighth embodiment of the present application. Detailed implementation manners

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0034] Please refer to Figure 1 、 Figure 2 and Figure 3 ,[[ID=##]] Figure 1 which is a schematic structural diagram of the glass assembly 300 provided by the embodiment of the present application applied to the vehicle 1. Figure 2 is Figure 1 a top view structural diagram of the glass assembly 300 shown in Figure 3 and is Figure 2 a cross-sectional structural diagram of the glass assembly shown in

[0035] The embodiment of the present application provides a glass assembly 300, and the glass assembly 300 can be applied to scenarios such as vehicles 1, doors and windows, and glass curtain walls. In this embodiment, the glass assembly 300 applied to the vehicle 1 is taken as an example for illustration.

[0036] The vehicle 1 includes a vehicle frame 100 and a glass assembly 300. The glass assembly 300 is installed on the vehicle frame 100. Among them, the glass assembly 300 includes a glass 310, a conductor 330, and a wire harness 350. The glass 310 is installed on the vehicle frame 100, and the conductor 330 is installed on the side of the glass 310 facing the inside of the vehicle 1. The wire harness 350 is electrically connected to the conductor 330.

[0037] Specifically, the glass 310 can be the front windshield, rear windshield, sunroof glass, side window glass, etc. of the vehicle 1. In this embodiment, the glass 310 is taken as an example of the front windshield for illustration. The glass 310 can be tempered glass or laminated glass. Among them, the laminated glass can provide structural and protective functions for the vehicle 1. Exemplarily, the laminated glass includes two or more layers of glass plates, and an intermediate layer formed by sandwiching polyvinyl butyral (PVB) or other types of laminating materials is provided between the glass plates. Exemplarily, the laminated glass includes an outer glass plate 10, an intermediate layer 20, and an inner glass plate 30. The intermediate layer 20 is sandwiched between the outer glass plate 10 and the inner glass plate 30. The outer glass plate 10 has a first surface 11 and a second surface 12, and the first surface 11 and the second surface 12 are arranged opposite to each other along the thickness direction of the outer glass plate 10. Among them, the first surface 11 faces the outside of the vehicle 1, and the second surface 12 faces the intermediate layer 20. The inner glass plate 30 has a third surface 31 and a fourth surface 32, and the third surface 31 and the fourth surface 32 are arranged opposite to each other along the thickness direction of the inner glass plate 30. Among them, the third surface 31 faces the intermediate layer 20, and the fourth surface 32 faces the inside of the vehicle 1. Exemplarily, the material of the intermediate layer 20 can be polyvinyl butyral (PVB).

[0038] In this embodiment, the conductor 330 is provided on the fourth surface 32 of the inner glass plate 30 to realize the installation of the conductor 330 on the glass 310. Exemplarily, the conductor 330 can be a metal body, a pad, a heating wire, a metal antenna coating, etc.

[0039] The wire harness 350 is installed on the side of the conductor 330 away from the glass 310 and is electrically connected to the conductor 330. The wire harness 350 can play roles such as transmitting signals or conducting heat to the conductor 330 to ensure the normal operation of the vehicle 1 in different environments, thus playing an indispensable role as a bridge and link in the entire automotive system. Exemplarily, the wire harness 350 can be a heating wire harness or an antenna wire harness. Exemplarily, when the wire harness 350 is a heating wire harness, the heating wire harness drives the conductor 330 provided on the glass 310 to heat through an electric current, thereby heating the entire glass 310, and further realizing the effects of defogging, defrosting, and deicing, ensuring that the line of sight of the personnel inside the vehicle 1 remains clear under harsh weather conditions such as fog, rain, and snow, and improving driving safety.

[0040] Exemplarily, when the wire harness 350 is an antenna wire harness, the conductor 330 is a metal antenna coating. The antenna wire harness is connected to the metal antenna coating printed on the surface of the glass 310 and is connected to the low-noise amplifier and signal amplifier inside the vehicle 1 and the multimedia host integrated with the radio, thereby realizing the antenna function, effectively replacing the traditional telescopic antenna, optimizing the appearance design of the vehicle 1 and reducing the air resistance, while improving the stability and clarity of antenna signal reception. Among them, the metal antenna coating is printed on the glass 310, which can also solve the problems of easy damage and poor aesthetics of the traditional exposed antenna.

[0041] Referring to Figure 3 、 Figure 4 and Figure 5 , Figure 4 is Figure 2 the schematic structural diagram of the wire harness 350 in the glass assembly 300 shown in Figure 5 is Figure 3 the schematic cross-sectional structural diagram of the welding terminal 60 in the wire harness 350 shown in Figure 5 In which, (a) in

[0042] shows that the welding terminal 60 is the first welding terminal, and (b) shows that the welding terminal 60 is the second welding terminal. The wire harness 350 includes a connector 40, a wire 50, and a welding terminal 60. The wire 50 is electrically connected between the connector 40 and the welding terminal 60. The connector 40, the wire 50, and the welding terminal 60 work together to ensure the functionality and durability of the wire harness 350.

[0043] Specifically, the connector 40 is used to electrically connect to the functional module to realize signal transmission between the wire harness 350 and the functional module, so as to realize signal transmission or conductive heating of the conductor 330 by the functional module through the wire harness 350. Among them, the connector 40 is responsible for providing a stable and reliable electrical connection point, and can be engaged or separated from the connector in the functional module to realize quick and safe engagement or separation between the wire harness 350 and the functional module. Exemplarily, the functional module includes but is not limited to the radio, the central control system, or the controller of the vehicle 1.

[0044] The wire 50 belongs to the main body of the wire harness 350 and is responsible for the effective transmission of electrical signals. The wire 50 is usually made of a highly conductive material to ensure the efficiency and stability of electrical signal transmission. The welding terminal 60 is used to transmit electrical signals or power from one part to another. Among them, there can be multiple wires 50 and multiple welding terminals 60, and each wire 50 is connected between the connector 40 and a welding terminal 60. Exemplarily, the welding terminal 60 is usually made of conductive materials such as tin, silver, and copper, and has good electrical conductivity and mechanical strength. The welding terminal 60 includes a welding surface 61, and the welding surface 61 faces the conductor 330 and is used for electrical connection with the conductor 330. In this embodiment, the welding surface 61 includes a first surface 611 and a second surface 613, and the second surface 613 protrudes towards the conductor 330 relative to the first surface 611.

[0045] The welding terminal 60 includes at least one solder leg 63, and each solder leg 63 includes a welding surface 61. According to the number of solder legs 63, the welding terminal 60 includes a first welding terminal and a second welding terminal. Among them, as Figure 4 shown in (a) below, the first welding terminal has one solder leg 63, and the first welding terminal is a single-solder-leg terminal. The single-solder-leg terminal is welded to the conductor 330 provided on the glass 310 through a single welding surface 61. As Figure 4 shown in (b) below, the second welding terminal includes a plurality of solder legs 63 and a connecting portion 6�. The connecting portion 65 is connected between the plurality of solder legs 63. The plurality of solder legs 63 have a plurality of welding surfaces 61, and the welding terminal 60 is welded to the conductor 330 provided on the glass 310 through the plurality of welding surfaces 61. Among them, "a plurality" includes two or more. Exemplarily, the number of solder legs 63 in the second welding terminal is two, and the connecting portion 65 is connected between the two solder legs 63. At this time, the second welding terminal is a double-solder-leg terminal, and the double-solder-leg terminal connects the two solder legs 63 through a bridge structure to provide a more stable connection. It can be understood that the number of solder legs 63 of the second welding terminal can also be three, four, etc., and the present application does not limit this.

[0046] Refer to Figure 6 , Figure 6 is Figure 4 a schematic assembly structure diagram of the welding terminal 60, the solder layer 70, the glass 310, and the conductor 330 in the wire harness 350 in some embodiments. Among them, Figure 6 the welding terminal 60 in (a) is the first welding terminal, and the welding terminal 60 in (b) is the second welding terminal.

[0047] In the welding surface 61 of the welding terminal 60, the second surface 613 abuts against and contacts the conductor 330 provided on the glass 310, so as to realize the abutting contact between the welding terminal 60 and the conductor 330, thereby realizing that the welding terminal 60 abuts against the glass 310. The first surface 611 is disposed at an interval from the conductor 330. The wire harness 350 further includes a solder layer 70, and the solder layer 70 is electrically connected between the first surface 611 in the welding surface 61 and the conductor 330, so as to realize that the solder layer 70 is electrically connected between the welding surface 61 and the conductor 330, thereby realizing that the solder layer 70 is electrically connected between the welding terminal 60 and the conductor 330, and further realizing the fixing of the wire harness 350 to the glass 310 and the electrical signal transmission between the wire harness 350 and the conductor 330.

[0048] During the cooling process after the wire harness 350 is welded to the conductor 330, there are differences in the expansion coefficients among the welding terminal 60 (the first welding terminal or the second welding terminal), the solder layer 70, and the glass 310, which are likely to cause the glass 310 to crack. For example, most of the welding terminal 60 is made of copper, and its expansion coefficient is about 16.6×10 -6 °C. When the material of the solder layer 70 is solder, its expansion coefficient is 15×10 -6 °C. While the expansion coefficient of the glass 310 in the vehicle 1 is relatively low, about 9×10 -6 °C. Due to the significant differences in the expansion coefficients between copper and solder and the glass 310, during the cooling process after the welding terminal 60 is welded, the shrinkage rates of copper and solder will be greater than that of the glass 310. When the welding terminal 60 is the first welding terminal, as shown in Figure 6 (a) below, stress in the F1 direction (the direction indicated by the solid arrow in Figure 6 (a) below) will be generated at the solder feet 63 of the welding terminal 60, thus easily causing the glass 310 to crack. When the welding terminal 60 is the second welding terminal, as shown in Figure 5 (b) below, not only will stress in the F1 direction (the direction indicated by the solid arrow in Figure 6 (b) below) be generated at each solder foot 63 of the welding terminal 60, but also stress in the F2 direction (the direction indicated by the dashed arrow in Figure 6 (b) below) generated by the shrinkage between multiple solder feet 63 exists, which intensifies the stress on the glass 310, thereby making it easier to cause the glass 310 to crack.

[0049] When glass 310 is tempered glass, the risk of glass 310 cracking caused by welding terminal 60 is less likely due to its high strength and good stress tolerance. However, with the advancement of the automotive industry and the strengthening of safety regulations, modern car designs are increasingly adopting laminated glass instead of tempered glass. Laminated glass offers better safety, superior optical properties, and sound insulation, optimizing the driving experience. However, laminated glass is relatively weak in mechanical strength and thermal stability, especially at the same thickness. Because it is composed of two thinner glass sheets and a PVB interlayer, it performs worse than tempered glass when subjected to external stress. Therefore, when welding terminal 60, originally suitable for tempered glass, is used on laminated glass, it will lead to more frequent glass cracking problems, which will affect user satisfaction.

[0050] Laminated glass has become the mainstream trend in automotive glass applications. Laminated glass is increasingly favored by customers due to its excellent optical performance and sound insulation effect. In order to solve the problem of glass cracking caused by the welding terminal 60 being applied to laminated glass, the first and second embodiments of the present application provide a glass assembly 300. Figure 7 and Figure 8 Provide a detailed description.

[0051] See also Figure 7 , Figure 7 1 is a schematic cross-sectional view of a partial structure of the glass assembly 300 in the first embodiment of the present application.

[0052] In the glass assembly 300 of the first embodiment, the welding terminal 60 is a first welding terminal. The welding terminal 60 is located on the side of the conductor 330 facing away from the glass 310. The first surface 611 and the second surface 613 of the welding surface 61 of the welding terminal 60 are spaced apart from the conductor 330, thereby ensuring that the welding terminal 60 and the conductor 330 are spaced apart. A gap 67 is formed between the welding surface 61 of the welding terminal 60 and the conductor 330. A solder layer 70 fills the gap 67 and electrically connects the first surface 611 and the second surface 613 of the welding surface 61 to the conductor 330, thereby ensuring that the solder layer 70 is electrically connected between the welding surface 61 and the conductor 330.

[0053] See also Figure 8 , Figure 8 1 is a schematic cross-sectional view of a partial structure of a glass assembly 300 in the second embodiment of the present application.

[0054] The difference between the glass assembly 300 of the second embodiment and the glass assembly 300 of the first embodiment is that the welding terminal 60 in the wiring harness 350 of the glass assembly 300 of the second embodiment is a second welding terminal.

[0055] Specifically, in the wire harness 350 of the glass assembly 300 of the second embodiment, the welding terminal 60 includes a plurality of welding feet 63 and a connecting portion 65, and the connecting portion 65 is connected between the plurality of welding feet 63. In the welding surface 61 of each welding foot 63 of the welding terminal 60, the first surface 611 and the second surface 613 are both spaced from the conductor 330, so that each welding foot 63 is spaced from the conductor 330, and the connecting portion 65 is spaced from the conductor 330, so as to realize that the welding terminal 60 is spaced from the conductor 330. Wherein, a gap 67 is formed between the welding surface 61 of each welding foot 63 of the welding terminal 60 and the conductor 330. The solder layer 70 is filled in the gap 67 and is electrically connected between the first surface 611, the second surface 613 of the welding surface 61 of each welding foot 63 and the conductor 330, so as to realize that the solder layer 70 is electrically connected between the welding surface 61 of each welding foot 63 of the welding terminal 60 and the conductor 330.

[0056] In the glass assemblies 300 provided by the first embodiment and the second embodiment, by setting the welding terminal 60 to be spaced from the conductor 330, a certain gap 67 is formed between the welding terminal 60 and the conductor 330, thereby raising the welding terminal 60, so that the welding terminal 60 does not directly contact the conductor 330, so that the welding terminal 60 does not abut against the glass 310, reducing the mechanical pressure exerted by the welding terminal 60 on the glass 310. At the same time, the solder layer 70 is provided to fill the gap 67 formed by the spacing between the welding terminal 60 and the conductor 330. The solder layer 70 not only plays a role in electrical connection, but also acts as a buffer medium, which helps to more evenly distribute the stress of the welding terminal 60 at the welding surface 61, thereby reducing the tension caused by thermal expansion during the cooling process after the welding of the welding terminal 60, and further reducing the risk of glass 310 cracking.

[0057] However, in order to keep a gap 67 with a fixed height between the welding terminal 60 and the conductor 330, the height of the gap 67 is usually less than 1 mm, and a holding force needs to be applied to the welding terminal 60, which increases the process complexity of manufacturing the glass assembly 300. At the same time, it is also necessary to precisely control the size of the welding terminal 60 and the thickness of the solder layer 70 to ensure the consistency and repeatability during the production process of the glass assembly 300, thereby increasing the manufacturing complexity and cost, and posing a challenge to mass production. In addition, although this design can make the stress on the glass 310 at the position of the welding feet 63 more uniform, for the welding terminal 60 with a plurality of welding feet 63 used in the glass assembly 300 of the second embodiment, the stress in the F2 direction between the welding feet 63 still exists.

[0058] To solve the above problems, the present application further provides glass assemblies 300 of the third embodiment and the fourth embodiment, which will be specifically described below in conjunction with Figure 9 and Figure 10 for a specific description. Refer toFigure 9 , Figure 9 1 is a schematic cross-sectional view of a portion of the structure of the glass assembly 300 in the third embodiment of the present application.

[0059] The difference between the glass assembly 300 of the third embodiment and the glass assembly 300 of the first embodiment is that the glass assembly 300 of the third embodiment further includes a buffer member 80 .

[0060] Specifically, in the glass assembly 300 of the third embodiment, the welding terminal 60 is a first welding terminal, and the welding surface 61 of the welding leg 63 in the welding terminal 60 is separated from the conductor 330 to form a gap 67. The buffer member 80 is provided on the surface of the welding terminal 60 facing the conductor 330 and is in contact with the conductor 330. Among them, at least one buffer member 80 is provided on the surface of the welding leg 63 of the welding terminal 60 facing the conductor 330. In this embodiment, there are two buffer members 80. It is understandable that in other embodiments, there may also be one, three, etc. buffer members 80, and the embodiment of the present application does not limit the number of buffer members 80 provided on the welding leg 63.

[0061] Among them, the buffer 80 includes an adhesive layer 81 and a flexible layer 83. The adhesive layer 81 is bonded to the first surface 611 of the welding surface 61 in the welding terminal 60, so that the adhesive layer 81 is bonded to the surface of the welding terminal 60 facing the conductor 330. The flexible layer 83 is bonded to the side of the adhesive layer 81 away from the welding terminal 60, and is in abutting contact with the conductor 330, so that the buffer 80 is in abutting contact with the conductor 330, thereby avoiding rigid contact between the welding terminal 60 and the glass 310. Exemplarily, the material of the adhesive layer 81 can be glue or adhesive with adhesive properties. The material of the flexible layer 83 can be a non-metallic material, such as Teflon (also known as polytetrafluoroethylene). Exemplarily, the buffer 80 can withstand high temperatures of 300°C and above. In this embodiment, the buffer 80 is Teflon tape, which has good heat resistance and buffering properties.

[0062] The solder layer 70 fills the gap 67 and is electrically connected between the first surface 611, the second surface 613 of the welding surface 61 and the conductor 330, so as to realize the electrical connection between the solder layer 70 and the welding terminal 60 and the conductor 330. The solder layer 70 is arranged around the buffer 80, that is, the solder layer 70 is arranged around the circumference of the buffer 80. In this embodiment, Figure 9As shown, the solder layer 70 also wraps at least a part of the circumferential side surface of the buffer member 80 to achieve the edge connection between the solder layer 70 and the buffer member 80, thereby ensuring a good electrical connection between the welding terminal 60 and the conductor 330. It can be understood that in other embodiments, the solder layer 70 can also be arranged at an interval from the buffer member 80. For example, when the welding leg 63 is relatively long, the material of the solder layer 70 is connected between the welding terminal 60 and the conductor 330 and is spaced from the buffer member 80 by a certain distance. At this time, the circumferential side surface of the buffer member 80 is arranged at an interval from the solder layer 70.

[0063] Referring to Figure 10 , Figure 10 is a schematic cross-sectional structure diagram of a partial structure of the glass assembly 300 in the fourth embodiment of the present application.

[0064] The difference between the glass assembly 300 of the fourth embodiment and the glass assembly 300 of the second embodiment is that the glass assembly 300 of the fourth embodiment further includes a buffer member 80.

[0065] Specifically, in the wire harness 350 of the glass assembly 300 of the fourth embodiment, the welding terminal 60 is a second welding terminal, and a gap 67 is formed by spacing the welding surface 61 of the welding leg 63 in the welding terminal 60 from the conductor 330. The buffer member 80 is sleeved on the circumferential side of the welding leg 63 to achieve that the buffer member 80 is sleeved on the circumferential side of the welding terminal 60.

[0066] Among them, at least one buffer member 80 is provided on the surface of each welding leg 63 of the welding terminal 60 facing the conductor 330. In this embodiment, one buffer member 80 is provided on the surface of each welding leg 63 of the welding terminal 60 facing the conductor 330. It can be understood that in other embodiments, the number of buffer members 80 provided on the surface of each welding leg 63 facing the conductor 330 can also be two, three, etc. The embodiments of the present application do not limit the number of buffer members 80 provided on each welding leg 63. Specifically, each buffer member 80 includes a holding portion 85, and the holding portion 85 is arranged on the first surface 611 of the welding surface 61 of each welding leg 63 and is in abutting contact with the conductor 330 to achieve the abutting contact between the buffer member 80 and the conductor 330, thereby avoiding the rigid contact between the welding terminal 60 and the glass 310. Exemplarily, the material of the buffer member 80 is a non-metallic material, such as silica gel. Exemplarily, the buffer member 80 can withstand high temperatures of 300 °C or above. In this embodiment, the buffer member 80 is a sheath made of a flexible non-metallic material, such as a silica gel sleeve, and has good heat resistance and buffering performance.

[0067] The solder layer 70 fills the gap 67 and is electrically connected between the first surface 611, the second surface 613 of the welding surface 61 and the conductor 330, so as to realize the electrical connection of the solder layer 70 between the welding terminal 60 and the conductor 330. The solder layer 70 is disposed around the buffer member 80. In this embodiment, the solder layer 70 covers at least a part of the circumferential side surface of the buffer member 80, thereby ensuring a good connection between the welding terminal 60 and the circuit.

[0068] In the glass assemblies 300 provided by the third embodiment and the fourth embodiment, a buffer member 80 is disposed on the surface of the welding terminal 60 facing the conductor 330, so that the buffer member 80 abuts against the conductor 330 provided on the glass 310. Specifically, in the glass assembly 300 of the third embodiment, the buffer member 80 is adhered to the surface of the welding terminal 60 facing the conductor 330, and the flexible layer 83 in the buffer member 80 is used to abut against the conductor 330, so as to realize the abutting contact between the buffer member 80 and the conductor 330. In the glass assembly of the fourth embodiment, the buffer member 80 is sleeved on the circumferential side of the welding terminal 60, and the abutting portion 85 of the buffer member 80 is used to abut against the conductor 330, so as to realize the abutting contact between the buffer member 80 and the conductor 330.

[0069] On the one hand, the buffer member 80 plays a role in physically isolating the welding terminal 60 and the conductor 330, raising the welding terminal 60, so that there is a certain gap between the welding terminal 60 and the glass 310, avoiding direct contact between the welding terminal 60 and the conductor 330, and thus avoiding the abutment of the welding terminal 60 and the glass 310. Since there is no direct abutting contact point between the welding terminal 60 and the glass 310, the stress generated by the welding terminal 60 during welding will not concentrate at a single point, but will be dispersed over a large area, reducing the stress concentration caused by the abutment of the welding terminal 60 and the glass 310, thus avoiding damage to the glass 310 caused by overly concentrated force, helping to significantly reduce the cracks in the glass 310 caused by excessive stress, and further reducing the risk of the glass cracking. In addition, there is no direct abutment between the welding terminal 60 and the glass 310, reducing the mechanical pressure exerted by the welding terminal 60 on the glass 310, helping to evenly distribute the stress of the welding terminal 60 at the welding surface 61, and reducing the tension caused by thermal expansion during the cooling process after the welding terminal 60 is welded, thus reducing the risk of the glass 310 cracking.

[0070] On the one hand, the buffer member 80 also plays a buffering role, avoiding rigid contact between the welding terminal 60 and the glass 310, thereby reducing the risk of glass 310 cracking. On the other hand, by providing the buffer member 80 on the surface of the welding terminal 60 facing the conductor 330, the effect of raising the welding terminal 60 can be achieved, and there is no need to apply a holding force to the welding terminal 60, reducing the process complexity of manufacturing the glass assembly 300. At the same time, by raising the welding terminal 60, the space between the welding terminal 60 and the glass 310 can be increased, so that the storage capacity of the solder layer 70 under the welding terminal 60 can be increased, which is beneficial to improving the welding strength between the solder layer 70, the welding terminal 60 and the glass 310. In the glass assembly 300 provided by the embodiment of the present application, by providing the buffer member 80, the stress of the welding terminal 60 is improved, avoiding damage to the glass 310 caused by overly concentrated force, and improving the product stability, durability and reliability of the glass assembly 300.

[0071] In addition, the method of providing the buffer member 80 is easy to implement, and the material cost of the buffer member 80 is low, and it will not cause significant interference to the existing production line. The embodiment of the present application does not require large-scale modification of the production equipment by using the buffer member 80, and can be quickly applied to the existing production process.

[0072] In addition, the embodiment of the present application adopts the method of providing the buffer member 80 on the welding terminal 60 to optimize the structure of the wire harness 350. This design for optimizing the structure of the wire harness 350 can be implemented relatively quickly. Without replacing the materials of the welding terminal 60 and the solder layer 70, the thermal stress is dispersed and reduced through structural design, thereby reducing the risk of glass 310 cracking. In addition, the structural optimization of the wire harness 350 can also utilize the existing materials and production line without large-scale additional investment, so that while ensuring the product quality of the glass assembly 300, it can quickly respond to market demands and regulatory changes, avoiding the need to spend a lot of time on the selection and verification of the materials of the welding terminal 60 and the solder layer 70 when optimizing the materials of the welding terminal 60 and the solder layer 70, as well as the need to conduct extensive tests to ensure that the new materials are compatible with the existing production process and do not affect the overall performance of the glass assembly 300 product, and the introduction of new materials requires adjustment of relevant manufacturing equipment and processes, resulting in increased costs and investment time.

[0073] In addition, by setting the second surface 613 of the welding surface 61 to protrude relative to the first surface 611 towards the conductor 330, on the one hand, it is beneficial to increase the contact area between the welding surface 61 and the solder layer 70, thereby facilitating an increase in the gripping force of the solder layer 70 on the welding terminal 60, and further facilitating an increase in the welding force of the welding terminal 60 on the glass 310, making the welding of the welding terminal 60 on the glass 310 more secure. On the other hand, the second surface 613 protrudes relative to the first surface 611 to form a space, which serves to store the material of the solder layer 70. When the welding terminal 60 is pressed downward in the direction towards the glass 310 during the welding process, it can solve the problem of a reduction in the solder amount between the contact surfaces of the welding terminal 60 and the conductor 330 caused by the overflow of the material of the solder layer 70 towards the surroundings.

[0074] Refer to Figure 11 , Figure 11 which is a schematic cross-sectional structure diagram of a partial structure of the glass assembly 300 in the fifth embodiment of the present application.

[0075] The difference between the glass assembly 300 of the fifth embodiment and the glass assembly 300 of the third embodiment is that, in the glass assembly 300 of the fifth embodiment, the welding surface 61 of the welding terminal 60 is a flat surface.

[0076] Specifically, in the glass assembly 300 of the fifth embodiment, the welding surfaces 61 of the solder legs 63 in the welding terminal 60 are all approximately flat surfaces, and a gap 67 is formed at an interval from the conductor 330. The solder layer 70 is filled in the gap 67 and is electrically connected between the welding surface 61 and the conductor 330 to achieve electrical connection of the solder layer 70 between the welding terminal 60 and the conductor 330.

[0077] Refer to Figure 12 , Figure 12 which is a schematic cross-sectional structure diagram of a partial structure of the glass assembly 300 in the sixth embodiment of the present application.

[0078] The difference between the glass assembly 300 of the sixth embodiment and the glass assembly 300 of the fourth embodiment is that, in the glass assembly 300 of the fifth embodiment, the welding surface 61 of the welding terminal 60 is a flat surface.

[0079] Specifically, in the glass assembly 300 of the sixth embodiment, the welding surfaces 61 of each solder leg 63 in the welding terminal 60 are all approximately flat surfaces, and each welding surface 61 forms a gap 67 at an interval from the conductor 330. The solder layer 70 is filled in the gap 67 and is electrically connected between each welding surface 61 and the conductor 330 to achieve electrical connection of the solder layer 70 between the welding terminal 60 and the conductor 330.

[0080] Compared to the design of the glass assembly 300 in the third and fourth embodiments in which the second surface 613 of the welding surface 61 is protruding relative to the first surface 611, in the glass assembly 300 in the fifth and sixth embodiments, by setting the welding surface 61 as a plane, the contact between the welding terminal 60 and the conductor 330 can be made into a wide surface contact rather than a point contact, thereby avoiding concentrated pressure on the glass 310 in a specific small area, thereby reducing the risk of the glass 310 breaking.

[0081] See also Figure 13 , Figure 13 1 is a schematic cross-sectional view of a partial structure of a glass assembly 300 in the seventh embodiment of the present application.

[0082] The difference between the glass assembly 300 of the seventh embodiment and the glass assembly 300 of the third embodiment lies in that the structure of the buffer member 80 in the glass assembly 300 of the seventh embodiment is different from that of the buffer member 80 of the third embodiment.

[0083] Specifically, in the glass assembly 300 of the seventh embodiment, the buffer member 80 is sleeved around the welding terminal 60. The buffer member 80 includes a supporting portion 85. The supporting portion 85 is provided on the first surface 611 of the welding surface 61 of the welding leg 63 and is in contact with the conductor 330 to achieve a supporting contact between the buffer member 80 and the conductor 330.

[0084] See also Figure 14 , Figure 14 1 is a schematic cross-sectional view of a partial structure of a glass assembly 300 in the eighth embodiment of the present application.

[0085] The difference between the glass assembly 300 of the eighth embodiment and the glass assembly 300 of the fourth embodiment lies in that the structure of the buffer member 80 in the glass assembly 300 of the eighth embodiment is different from that of the buffer member 80 of the fourth embodiment.

[0086] Specifically, in the glass assembly 300 of the eighth embodiment, the buffer member 80 includes an adhesive layer 81 and a flexible layer 83. The adhesive layer 81 is bonded to the first surface 611 of the welding surface 61 of each solder leg 63 of the solder terminal 60, thereby bonding the adhesive layer 81 to the surface of the solder terminal 60 facing the conductor 330. The flexible layer 83 is bonded to the side of the adhesive layer 81 facing away from the solder terminal 60 and abuts against the conductor 330, thereby achieving abutting contact between the buffer member 80 and the conductor 330.

[0087] It is understandable that in the glass assembly 300 of the seventh embodiment and the glass assembly 300 of the eighth embodiment, the welding surface 61 of the welding terminal 60 may also be a plane, and the present application does not impose any limitation thereto.

[0088] The embodiment of the present application also provides an assembling method for the glass assembly 300 of the third to eighth embodiments above. The assembling process of the glass assembly 300 of the third embodiment will be taken as an example for illustration below.

[0089] Referring to Figure 9 , the assembling method for the glass assembly 300 provided by the embodiment of the present application includes:

[0090] Step S1: Provide a welding terminal 60 and a buffer 80, and arrange the buffer 80 on the surface of the welding terminal 60.

[0091] In this embodiment, the buffer 80 (such as a Teflon tape) can be covered on the welding surface 61 of the welding terminal 60 facing the conductor 330, wherein the adhesive layer 81 is bonded between the welding surface 61 and the flexible layer 83, so as to arrange the buffer 80 on the welding terminal 60, ensuring that the buffer 80 is flat, without wrinkles, and completely covers the contact area between the welding terminal 60 and the conductor 330. It can be understood that in some other embodiments, the buffer 80 includes a holding portion 85, and the welding leg 63 of the welding terminal 60 can be sleeved into the buffer 80, so as to arrange the buffer 80 on the periphery of the welding terminal 60, thereby arranging the buffer 80 on the welding terminal 60.

[0092] Step S2: Provide a glass 310 provided with a conductor 330, and place the welding terminal 60 and the buffer 80 on the glass 310 provided with the conductor 330, wherein the buffer 80 is in abutting contact with the conductor 330, and a gap 67 is formed between the welding terminal 60 and the conductor 330 at an interval.

[0093] In this embodiment, the flexible layer 83 of the buffer 80 is in abutting contact with the conductor 330, so as to realize the abutting contact between the buffer 80 and the conductor 330, so that the welding terminal 60 does not directly abut against the surface of the glass 310, and the buffer 80 provides a supporting and buffering function. It can be understood that in some other embodiments, the holding portion 85 of the buffer 80 is in abutting contact with the conductor 330, so as to realize the abutting contact between the buffer 80 and the conductor 330. A gap 67 is formed between the welding surface 61 of the welding terminal 60 and the conductor 330 at an interval, so as to realize the spaced arrangement of the welding terminal 60 and the conductor 330.

[0094] Step S3: Fill the material of the solder layer 70 into the gap 67, and the material of the solder layer 70 cools to form the solder layer 70, and the solder layer 70 is connected between the welding terminal 60 and the conductor 330.

[0095] In this embodiment, the material of the solder layer 70 wraps at least part of the circumferential side surface of the buffer member 80, ensuring a good connection between the welding terminal 60 and the conductor 330. Specifically, using a welding technique, the material of the solder layer 70 is melted and filled into the gap 67. The material of the solder layer 70 flows to the circumferential side surface of the buffer member 80 and contacts the circumferential side surface of the buffer member 80. When the material of the solder layer 70 cools and solidifies, the connection between the formed solder layer 70 and at least part of the circumferential side surface of the buffer member 80 can be achieved.

[0096] After the glass assembly 300 is assembled, it further includes steps for detecting and testing the glass assembly 300. Specifically, after welding is completed, visual inspection and electrical testing are performed on the assembled glass assembly 300 to verify the fixing strength of the welding terminal 60 and the reliability of the electrical connection. The integrity of the glass assembly 300 is tested to ensure that no unacceptable stress is introduced during the welding process.

[0097] The above-disclosed are only the preferred embodiments of the present application. Of course, the scope of the rights of the present application cannot be limited thereby. Those of ordinary skill in the art can understand all or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.

Claims

1. A glass assembly, characterized in that, The invention comprises glass, a conductor, a welding terminal, a solder layer and a buffer. The conductor is arranged on the glass, the welding terminal is arranged on the side of the conductor away from the glass and is spaced apart from the conductor. The buffer is arranged on the surface of the welding terminal facing the conductor and is in contact with the conductor. The solder layer is electrically connected between the welding terminal and the conductor.

2. The glass assembly according to claim 1, characterized in that, The buffer member includes an adhesive layer and a flexible layer. The adhesive layer is bonded between a surface of the welding terminal facing the conductor and the flexible layer. The flexible layer is in abutting contact with the conductor.

3. The glass assembly according to claim 1, wherein, The buffer is sleeved on the welding terminal. The buffer comprises a supporting portion. The supporting portion is provided on a surface of the welding terminal facing the conductor and is in supporting contact with the conductor.

4. The glass assembly according to claim 1, characterized in that, The welding terminal includes a welding surface facing the conductor, the solder layer is connected between the welding surface and the conductor, and the welding surface is a plane.

5. The glass assembly according to claim 1, wherein The welding terminal includes a welding surface facing the conductor, the solder layer is connected between the welding surface and the conductor, and the welding surface includes a first surface and a second surface, wherein the second surface protrudes toward the conductor relative to the first surface.

6. The glass assembly according to any one of claims 1 to 5, characterized in that, The welding terminal includes a connecting portion and a plurality of welding feet, the connecting portion is connected between the plurality of welding feet, each welding foot is provided with at least one buffer member on a surface facing the conductor, and the solder layer is connected between the welding feet and the conductor.

7. The glass assembly according to any one of claims 1 to 5, characterized in that, The solder layer covers at least a portion of a peripheral side surface of the buffer component.

8. The glass assembly according to any one of claims 1 to 5, characterized in that The glass assembly further includes a wire and a connector, wherein the wire is connected between the welding terminal and the connector.

9. The glass assembly according to any one of claims 1 to 5, characterized in that, The glass is tempered glass, and the conductor is arranged on the surface of the tempered glass; Alternatively, the glass includes an outer glass plate, an intermediate layer and an inner glass plate, the intermediate layer is sandwiched between the outer glass plate and the inner glass plate, and the conductor is arranged on a side of the inner glass plate away from the intermediate layer.

10. A vehicle, characterized in that, The vehicle comprises a vehicle frame and the glass assembly according to any one of claims 1 to 9, wherein the glass is mounted on the vehicle frame.