Quick switching jig for silicon wafer stage of die bonder

Abstract

The utility model relates to the technical field of silicon wafer stage jigs, in particular to a die bonder silicon wafer stage rapid switching jig which comprises a sliding base, a moving assembly is installed in the sliding base, a connecting block is installed on the moving assembly, a silicon wafer stage is fixedly installed on the connecting block, a film pasting jig is installed in the middle of the silicon wafer stage, and the film pasting jig is installed on the sliding base. A large-size inch disc is installed on the film pasting jig, a small-size inch disc is installed in the large-size inch disc, and the small-size inch disc and the large-size inch disc are connected through a limiting assembly. The left-right position adjustment of the silicon wafer table can be realized by the film pasting jig through the driving motor, the film pasting jig is attached to the large-size inch disc, the position is limited through the hook and the hanging ring, the stability of the large-size inch disc is ensured, the small-size inch disc is arranged in the large-size inch disc, and the small-size inch disc is connected through the spring, the ejector pin and the ball, so that the stability of the large-size inch disc is ensured. And switching of small-size cun plates is facilitated, eight-cun and six-storage films can be prepared, and the use efficiency of the silicon wafer stage of the die bonder is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer stage fixtures, and specifically, to a rapid switching fixture for a wafer stage of a die bonder. Background Art

[0002] During the processing operation of a die bonder, it is necessary to replace the fixtures for workpieces. Therefore, a large number of auxiliary fixtures are involved. These auxiliary fixtures need to be designed differently according to the product structure to meet the stable positioning of product machining, improve the forming accuracy. Fixtures are a large category of tools for carpenters, ironworkers, fitters, machinery, electronic control, and other handicrafts. The film pasting is an auxiliary mold during product processing, mainly as a tool to assist in controlling the position or movement.

[0003] The existing film pasting fixtures are usually fixedly installed on the processing equipment through bolts. When it is extremely inconvenient to replace the film pasting fixture during the processing, and the replacement process is rather cumbersome and has low efficiency. Moreover, when installing the film pasting fixture, it is necessary to adjust the position of the film pasting fixture back and forth for installation, and accurate positioning cannot be performed, resulting in too high an error rate and an increase in the defective rate of the products processed by the film pasting fixture. There is a need for a rapid switching fixture for a wafer stage of a die bonder to solve this problem. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a rapid switching fixture for a wafer stage of a die bonder to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A rapid switching fixture for a wafer stage of a die bonder, including a sliding base, the sliding base is located at the bottom of the whole device, a moving component is installed in the sliding base, a connecting block is installed on the moving component, a wafer stage is fixedly installed on the connecting block, a film pasting fixture is installed in the middle of the wafer stage, a large-size inch plate is installed on the film pasting fixture, a small-size inch plate is installed in the large-size inch plate, and the small-size inch plate and the large-size inch plate are connected by a limiting component.

[0006] As a preferred technical solution of the utility model, a motor is installed on the moving component, a threaded rod is installed at the output end of the motor, a threaded sleeve is threadedly connected to the threaded rod, and the connecting block is fixedly installed on the threaded sleeve.

[0007] As a preferred technical solution of the utility model, a slot is opened on the sliding base, the diameter of the slot is larger than the size of the connecting block, side-end protrusions are fixedly installed at both ends of the sliding base, and the side-end protrusions are slidably connected with the side-end sliding sleeves at the bottom end of the wafer stage.

[0008] As a preferred technical solution of the present invention, a bearing is rotatably mounted on one end of the threaded rod away from the motor, and the bearing is fixedly mounted on the inner wall of the sliding base.

[0009] As the preferred technical solution of the present invention, the large-sized inch plate is equipped with hooks, and there are three hooks distributed in a circle, and the film sticking jig is equipped with three hanging rings distributed in a circle, and the hanging rings are connected to the hooks on the large-sized inch plate.

[0010] As an optimal technical solution of the present invention, a limiting assembly is installed between the large inch disk and the small inch disk, a limiting block is installed on the limiting assembly, a spring is installed in the limiting block, a thimble is provided on one side of the spring, a round ball is installed on the end of the thimble away from the spring, and the small inch disk is supported by the round ball.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] (1) The utility model is a fast switching jig for the silicon wafer stage of a wafer bonding machine. The film sticking jig provided in the device can realize the left and right position adjustment of the silicon wafer stage through the driving motor. The film sticking jig is stuck to the large inch plate and the position is limited by the hook and the hanging ring, which ensures the stability of the large inch plate. A small inch plate is provided in the large inch plate and is connected by a spring, a pin and a round ball, which facilitates the switching of the small inch plate, thereby realizing the preparation of eight-inch and six-inch films, and improving the use efficiency of the silicon wafer stage of the wafer bonding machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 This is a structural schematic diagram of a wafer stage quick switching jig for a wafer bonding machine according to an embodiment of the present utility model;

[0015] Figure 2 This is a schematic diagram of the internal structure of a wafer stage quick switching jig moving component of a wafer bonding machine according to an embodiment of the present invention;

[0016] Figure 3 The utility model is a top view of a film-mounting jig of a wafer stage quick switching jig of a wafer bonding machine according to an embodiment of the present invention.

[0017] Reference numerals:

[0018] 1. Sliding base; 2. Side protrusion; 3. Wafer stage; 4. Side sliding sleeve; 5. Slot; 6. Film fixture; 7. Motor; 8. Threaded rod; 9. Threaded sleeve; 10. Connecting block; 11. Large inch plate; 12. Hook; 13. Hanging ring; 14. Small inch plate; 15. Limit block; 16. Spring; 17. Ejector pin; 18. Ball; 19. Hollow groove; 20. Bearing. DETAILED DESCRIPTION

[0019] Below, the utility model is further described with reference to the accompanying drawings and specific embodiments:

[0020] Example 1

[0021] refer to Figures 1 to 3 Example 1 is described, which includes a sliding base 1. The sliding base 1 is located at the bottom of the entire device. A moving component is installed in the sliding base 1. A connecting block 10 is installed on the moving component. A silicon wafer stage 3 is fixedly installed on the connecting block 10. A film fixture 6 is installed in the middle of the silicon wafer stage 3. A large inch plate 11 is installed on the film fixture 6. A small inch plate 14 is installed in the large inch plate 11. The small inch plate 14 is connected to the large inch plate 11 by a limit assembly. A hanging plate is installed on the large inch plate 11. Hook 12, and there are three hooks 12 distributed circumferentially, three hanging rings 13 are distributed circumferentially on the film jig 6, the hanging ring 13 is connected to the hook 12 on the large inch plate 11, a limit assembly is installed between the large inch plate 11 and the small inch plate 14, a limit block 15 is installed on the limit assembly, a spring 16 is installed in the limit block 15, a thimble 17 is provided on one side of the spring 16, a round ball 18 is installed on the end of the thimble 17 away from the spring 16, and the small inch plate 14 is supported by the round ball 18;

[0022] In this embodiment, the large inch plate 11 and the small inch plate 14 are connected by a spring 16, a thimble 17 and a ball 18, which facilitates the disassembly and assembly of the small inch plate 14 and facilitates switching. The small inch plate 14 can be directly manually pulled out during removal.

[0023] Example 2

[0024] refer to Figure 2 Example 2 is described. This embodiment further illustrates Example 1. A motor 7 is mounted on a moving assembly. A threaded rod 8 is mounted on the output end of the motor 7. A threaded sleeve 9 is threadedly connected to the threaded rod 8. A connecting block 10 is fixedly mounted on the threaded sleeve 9. A slot 5 is formed on the sliding base 1. The slot 5 has a diameter larger than the connecting block 10. Side protrusions 2 are fixedly mounted on both sides of the sliding base 1. The side protrusions 2 are slidably connected to the side sliding sleeve 4 at the bottom end of the wafer stage 3. A bearing 20 is rotatably mounted on the end of the threaded rod 8 away from the motor 7. The bearing 20 is fixedly mounted on the inner wall of the sliding base 1.

[0025] In this embodiment, the driving motor 7 is provided to drive the left and right position adjustment of the wafer stage 3.

[0026] In specific applications, the film sticking jig provided in this device is located on the wafer stage 3, and the bottom end of the wafer stage 3 is connected to the moving component through the connecting block 10. The driving motor 7 drives the rotation of the threaded sleeve 9 on the threaded rod 8. Since the threaded sleeve 9 is fixedly installed on the wafer stage 3 through the connecting block 10, and the connecting block 10 is slidably limited by the slot 5, the left and right position adjustment of the wafer stage 3 is realized. When using the film sticking jig, the large-size disk 11 is placed in the middle of the film sticking jig 6. The film sticking jig 6 is attached to the large-size disk 11 and the position is limited by the hook 12 and the hanging ring 13, ensuring the stability of the large-size disk 11. An eight-inch film can be made through the large-size disk 11, and a small-size disk 14 is provided in the large-size disk 11. The large-size disk 11 and the small-size disk 14 are connected by a spring 16, a thimble 17 and a ball 18, which is convenient for the disassembly and assembly of the small-size disk 14 and convenient for switching. During use, it can be sleeved on the large-size disk 11 for use. The small-size disk 14 can be directly manually removed during the removal process. Through the design of the large-size disk 11 and the small-size disk 14, there is no need to replace the film sticking jig 6. To make the corresponding film, the production of eight-inch and six-inch films can be realized through the large-size disk 11 and the small-size disk 14, thereby improving the use efficiency of the wafer stage 3 of the chip bonder.

[0027] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "top", "bottom", "one side", "the other side", "front", "rear", "middle part", "inside", "top end", "bottom end", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention; the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance; in addition, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

[0028] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A rapid switching fixture for the silicon wafer stage of a die bonder, characterized in that, The invention comprises a sliding base (1), wherein the sliding base (1) is located at the bottom end of the entire device, a moving component is installed in the sliding base (1), a connecting block (10) is installed on the moving component, a silicon wafer stage (3) is fixedly installed on the connecting block (10), a film sticking jig (6) is installed in the middle of the silicon wafer stage (3), a large inch plate (11) is installed on the film sticking jig (6), a small inch plate (14) is installed in the large inch plate (11), and the small inch plate (14) and the large inch plate (11) are connected by a limit assembly.

2. The quick-switching fixture for the silicon wafer stage of a die bonder according to claim 1, wherein A motor (7) is installed on the moving assembly, a threaded rod (8) is installed on the output end of the motor (7), a threaded sleeve (9) is threadedly connected to the threaded rod (8), and a connecting block (10) is fixedly installed on the threaded sleeve (9).

3. The quick-switching fixture for the silicon wafer stage of a die bonder according to claim 2, wherein The sliding base (1) is provided with a slot (5), the diameter of the slot (5) being larger than the size of the connecting block (10), and side end protrusions (2) being fixedly mounted on both sides of the sliding base (1), and the side end protrusions (2) being slidably connected to the side end sliding sleeves (4) at the bottom end of the silicon wafer stage (3).

4. A rapid switching fixture for a silicon wafer stage of a die bonder according to claim 2, characterized in that, A bearing (20) is rotatably mounted on one end of the threaded rod (8) away from the motor (7), and the bearing (20) is fixedly mounted on the inner wall of the sliding base (1).

5. A rapid switching fixture for a silicon wafer stage of a die bonder, as claimed in claim 1, wherein The large-sized inch plate (11) is provided with hooks (12), and three hooks (12) are distributed in a circumferential manner. The film sticking jig (6) is provided with three hanging rings (13) distributed in a circumferential manner. The hanging rings (13) are connected to the hooks (12) on the large-sized inch plate (11).

6. The quick-switching fixture for the silicon wafer stage of a die bonder according to claim 1, wherein A limit assembly is installed between the large inch plate (11) and the small inch plate (14), a limit block (15) is installed on the limit assembly, a spring (16) is installed in the limit block (15), a thimble (17) is provided on one side of the spring (16), a round ball (18) is installed at one end of the thimble (17) away from the spring (16), and the small inch plate (14) is supported by the round ball (18).

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