Vacuum cavity with turnover mechanism

Abstract

The utility model relates to a vacuum cavity with a turnover mechanism, which mainly comprises a vacuum cavity and a turnover mechanism, and the turnover mechanism is connected with the vacuum cavity and positioned in an accommodating space of the vacuum cavity. The turnover mechanism mainly comprises a clamping unit and a turnover unit, and the clamping unit is located in the containing space of the vacuum cavity and used for clamping at least one substrate in the containing space. The overturning unit is located in the containing space of the vacuum cavity and connected with the clamping unit, and the overturning unit is used for driving the clamping unit to overturn the substrate clamped by the clamping unit. According to the structure of the utility model, the substrate in the vacuum cavity can be overturned in a deposition or etching step without taking the substrate out of the vacuum cavity, so that the manufacturing efficiency and quality can be improved.

Description

Technical Field

[0001] The utility model relates to a vacuum chamber with a flipping mechanism, which can be used to flip a substrate located in the vacuum chamber. Background Art

[0002] Chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD) are all commonly used thin film deposition apparatuses and are widely used in the preparation of integrated circuits, light emitting diodes, displays, etc.

[0003] The deposition apparatus mainly includes a chamber and a carrier plate, where the carrier plate is located in the chamber and is used to carry at least one substrate. Taking physical vapor deposition as an example, a target needs to be arranged in the chamber, and the target faces the substrate on the carrier plate. During physical vapor deposition, an inert gas and / or a reaction gas can be transported into the chamber, and a bias voltage is applied to the target and the carrier plate respectively. The carrier plate also controls the temperature of the carried substrate. The inert gas in the chamber will be ionized due to the action of a high-voltage electric field. The ionized inert gas will be attracted by the bias voltage on the target and bombard the target. The target atoms or molecules sputtered from the target will be attracted by the bias voltage on the carrier plate and deposited on the surface of the heated substrate to form a thin film on the surface of the substrate.

[0004] In the advanced packaging or display industry, multiple through holes are often formed in the substrate, and a metal thin film is formed inside the through holes of the substrate through a deposition step. Generally, double-sided coating needs to be performed on the substrate and the through holes to form a complete metal thin film inside the through holes. During the double-sided coating process, a titanium film is first deposited on the upper surface of the substrate and the upper half of the through holes, then the substrate is taken out of the vacuum chamber and flipped, and a titanium film is deposited on the lower surface of the substrate and the lower half of the through holes. Then double-sided coating is performed again to form a copper film on the surface of the titanium film.

[0005] However, during the process of taking the substrate out of the vacuum chamber and flipping it, the substrate will come into contact with the external gas, causing the titanium film to oxidize, which may result in the subsequent copper film not growing evenly and firmly on the surface of the titanium film. In addition, repeatedly taking the substrate out of the vacuum chamber and flipping it will undoubtedly affect the preparation efficiency and increase the preparation cost.

[0006] Another possible preparation method is to first temporarily bond the lower surface of the substrate to an additional circuit board, and then perform a deposition step on the upper surface and the through holes of the substrate to sequentially deposit a titanium film and a copper film on the upper surface and / or inside the through holes of the substrate. After completing the deposition step, the substrate is debonded from the additional circuit board, and the substrate is cleaned. This preparation method does not require flipping the substrate during the deposition process, which is beneficial to improving the preparation efficiency. However, the manufacturing cost of this preparation method is relatively high, and it is not suitable for depositing metal thin films in through holes with a high aspect ratio.

[0007] As described in the prior art, when performing a deposition step or an etching step, it may be necessary to perform double-sided coating or double-sided etching on the substrate, and during the deposition or etching process, the substrate needs to be taken out of the vacuum chamber and flipped, and then the flipped substrate is put back into the vacuum chamber. The above steps will not only affect the preparation efficiency, but the substrate taken out of the vacuum chamber is more likely to come into contact with the external gas, resulting in oxidation of the metal thin film, thereby affecting the preparation quality. Summary of the Utility Model

[0008] Therefore, the present utility model provides a novel vacuum chamber with a flipping mechanism, in which the flipping mechanism can directly flip the substrate inside the vacuum chamber, and there is no need to take the substrate out of the vacuum chamber for flipping during the process, which is not only beneficial to improving the preparation efficiency, but also beneficial to improving the preparation quality.

[0009] An object of the present utility model is to provide a vacuum chamber with a flipping mechanism, which mainly includes a vacuum chamber and a flipping mechanism, wherein the flipping mechanism is located in the accommodating space of the vacuum chamber and is used to clamp and flip the substrate inside the vacuum chamber, which is beneficial to improving the preparation efficiency.

[0010] An object of the present utility model is to provide a vacuum chamber with a flipping mechanism. When performing double-sided coating on the upper and lower surfaces of the substrate, the flipping mechanism can directly flip the substrate inside the vacuum chamber without taking the substrate out of the vacuum chamber for turning over, which can avoid the metal thin film on the surface of the deposited substrate from coming into contact with the external air to form an oxide layer, and is beneficial to improving the preparation quality.

[0011] An object of the present utility model is to provide a vacuum chamber with a flipping mechanism. During the process of flipping the substrate, the clamping unit will firmly clamp the substrate to prevent the substrate from falling or loosening.

[0012] To achieve the above object, the present utility model provides a vacuum chamber with a flipping mechanism, comprising: a vacuum chamber including an accommodation space; and a flipping mechanism connected to the vacuum chamber, further comprising: a clamping unit located within the accommodation space of the vacuum chamber and configured to clamp at least one substrate; and a flipping unit connected to the clamping unit, wherein the flipping unit is configured to drive the clamping unit and flip the substrate clamped by the clamping unit within the accommodation space of the vacuum chamber.

[0013] In at least one embodiment of the vacuum chamber with a flipping mechanism and a thin film deposition apparatus as described above, the flipping unit includes: a plate body; a pushing portion disposed on the plate body; a driving unit connected to the pushing portion and configured to drive the pushing portion to displace relative to the plate body; and a guiding unit configured to guide the pushing portion.

[0014] In at least one embodiment of the vacuum chamber with a flipping mechanism and a thin film deposition apparatus as described above, the driving unit includes: a driving shaft connected to a driving motor located outside the vacuum chamber and driven by the driving motor to rotate; and a driving rod connecting the driving shaft and the pushing portion, wherein when the driving shaft rotates, it drives the pushing portion to displace through the driving rod.

[0015] In at least one embodiment of the vacuum chamber with a flipping mechanism and a thin film deposition apparatus as described above, the driving rod includes a groove, and a protruding portion is disposed on the pushing portion, and the protruding portion is located within the groove of the driving rod.

[0016] In at least one embodiment of the vacuum chamber with a flipping mechanism and a thin film deposition apparatus as described above, the guiding unit includes a guiding groove, and the protruding portion on the pushing portion is located within the guiding groove, and when the driving shaft rotates, it drives the protruding portion to displace along the guiding groove of the guiding unit through the driving rod.

[0017] In at least one embodiment of the vacuum chamber with a flipping mechanism and a thin film deposition apparatus as described above, the clamping unit includes: two clamping portions configured to clamp the substrate; and two linkage portions disposed on the plate body and respectively connected to the two clamping portions, wherein when the driving shaft rotates, it drives the pushing portion to displace through the driving rod, so as to drive the two linkage portions to displace relative to the plate body, such that the two clamping portions operate in an open state or a clamping state.

[0018] In at least one embodiment of the vacuum chamber with a flipping mechanism and a thin film deposition apparatus as described above, the clamping unit includes: a base disposed on the plate body; and two connecting rods, one ends of the two connecting rods are pivotally connected to the base, and the other ends are respectively pivotally connected to the two linkage portions, wherein the pushing portion is configured to push the base to displace relative to the plate body, such that the base drives the two linkage portions to displace relative to the plate body through the two connecting rods.

[0019] In at least one embodiment of the vacuum chamber and thin film deposition apparatus with a flipping mechanism described above, at least one position sensor is adjacent to the base and is used to sense the position of the base to determine whether the clamping unit is operating in the open state or the clamping state.

[0020] In at least one embodiment of the vacuum chamber and thin film deposition apparatus with a flipping mechanism described above, the guide groove of the guiding unit includes a semi-circular guide groove and two linear guide grooves. The two linear guide grooves are respectively connected to both ends of the semi-circular guide groove. When the two clamping parts are operating in the open state, the pushing part will be located in the linear guide groove. When the two clamping parts are operating in the clamping state, the pushing part will be located inside the semi-circular guide groove.

[0021] Through the vacuum chamber with a flipping mechanism of the present utility model, it is not only beneficial to improve the preparation efficiency, but also more beneficial to improve the preparation quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present utility model will be further described in detail below in conjunction with the drawings and specific embodiments.

[0023] Figure 1 It is a side view of an embodiment of the vacuum chamber with a flipping mechanism of the present utility model.

[0024] Figure 2 It is a three-dimensional schematic diagram of an embodiment of the flipping mechanism of the present utility model.

[0025] Figure 3 It is a partial structure side view of an embodiment of the flipping mechanism of the present utility model.

[0026] Figures 4 to 7 They are respectively the action side views of an embodiment of the flipping mechanism of the present utility model.

[0027] DESCRIPTION OF THE REFERENCE NUMERALS

[0028] 10: Flipping mechanism

[0029] 100: Vacuum chamber with a flipping mechanism

[0030] 101: Vacuum chamber

[0031] 102: Accommodation space

[0032] 11: Clamping unit

[0033] 111: Clamping part

[0034] 113: Connecting rod

[0035] 115: Linking part

[0036] 117: Base

[0037] 119: Elastic unit

[0038] 12: Substrate

[0039] 13: Flipping unit

[0040] 131: Plate body

[0041] 141: First guide rail

[0042] 143: Second guide rail

[0043] 145: Third guide rail

[0044] 15: Driving unit

[0045] 151: Driving shaft

[0046] 153: Driving rod

[0047] 155: Groove

[0048] 16: Position sensor

[0049] 171: Pushing part

[0050] 1711: Protruding part

[0051] 18: Driving motor

[0052] 19: Guiding unit

[0053] 191: Guide groove

[0054] 1911: Semi-circular guide groove

[0055] 1913: Linear guide groove

[0056] 192: Partition space

[0057] 193: Perforation. Detailed implementation manners

[0058] Please refer to Figure 1 、 Figure 2 and Figure 3 , which are respectively the side view of an embodiment of the vacuum chamber with a flipping mechanism of the present utility model, the three-dimensional schematic diagram of an embodiment of the flipping mechanism of the present utility model, and the side view of a partial structure. As shown in the figures, the vacuum chamber 100 with a flipping mechanism mainly includes a vacuum chamber 101 and a flipping mechanism 10, wherein the flipping mechanism 10 is connected to the vacuum chamber 101. Part or all of the flipping mechanism 10 is located in a receiving space 102 of the vacuum chamber 101, and can clamp and flip at least one substrate 12 in the receiving space 102 of the vacuum chamber 101.

[0059] In an embodiment of the present utility model, the vacuum chamber 100 with a flipping mechanism can be a chemical vapor deposition machine tool, a physical vapor deposition machine tool, an atomic layer deposition machine tool, an etching machine tool, etc. During the deposition or etching step, the accommodating space 102 of the vacuum chamber 101 will be in a low-pressure or vacuum state to perform the deposition or etching step.

[0060] The flipping mechanism 10 located inside the vacuum chamber 101 can flip the substrate 12 inside the vacuum chamber 101 under a low-pressure or vacuum state. Specifically, the flipping mechanism 10 further includes a clamping unit 11 and a flipping unit 13. The clamping unit 11 is used to clamp the substrate 12, and the flipping unit 13 is connected to the clamping unit 11 and is used to drive the clamping unit 11 located in the accommodating space 102 of the vacuum chamber 101 and the substrate 12 clamped by it to flip. For example, the substrate 12 can be a wafer provided with a plurality of through holes.

[0061] In an embodiment of the present utility model, the clamping unit 11 includes two clamping parts 111, and the two clamping parts 111 can approach or separate from each other. For example, the upper and lower clamping parts 111. When the two clamping parts 111 approach each other, they will clamp the substrate 12 located between the two clamping parts 111 and operate in a clamping state. When the two clamping parts 111 separate from each other, they will release the substrate 12 between the two clamping parts 111 and operate in an open state.

[0062] The flipping unit 13 includes a plate body 131, a driving unit 15, a pushing part 171, and a guiding unit 19. The pushing part 171 is arranged on the plate body 131, and the driving unit 15 is connected to the pushing part 171 and is used to drive the pushing part 171 to displace relative to the plate body 131.

[0063] In actual application, the driving unit 15 further includes a driving shaft 151 and a driving rod 153. The driving shaft 151 is connected to the pushing part 171 through the driving rod 153. When the driving shaft 151 rotates, it will drive the driving rod 153 to swing and / or rotate. The driving rod 153 will not rotate relative to the driving shaft 151 and can be used to drive the pushing part 171 to displace.

[0064] The driving rod 153 can be a long plate-like body, and further includes a long groove 155. The pushing part 171 is connected to a protruding part 1711, and the protruding part 1711 is located in the groove 155 of the driving rod 153. When the driving shaft 151 rotates, it drives the pushing part 171 to displace through the driving rod 153 and the protruding part 1711. During the displacement of the pushing part 171, it is connected to the protruding part 1711 of the pushing part 171 and can displace in the groove 155 of the driving rod 153. In practical applications, at least one first guide rail 141 is further provided on the plate body 131. The pushing part 171 is connected to the first guide rail 141 and displaces relative to the plate body 131 along the first guide rail 141.

[0065] The driving shaft 151 is not directly connected to the plate body 131 and does not displace with the plate body 131. Part or all of the driving shaft 151 can be located in the accommodation space 102 of the vacuum chamber 101 and is used to be connected to a driving motor 18 provided outside the vacuum chamber 101. The driving motor 18 is used to drive the driving shaft 151 and the driving rod 153 to rotate or swing. For example, the driving motor 18 located outside the vacuum chamber 101 can be connected and drive the driving shaft 151 to rotate through a shaft seal or a magnetic fluid shaft seal.

[0066] In an embodiment of the present invention, the clamping unit 11 further includes two connecting rods 113, two linkage parts 115 and a base 117. The linkage parts 115 and the base 117 are provided on the plate body 131 and can displace relative to the plate body 131. One end of the two connecting rods 113 is pivotally connected to the base 117, so that the two connecting rods 113 can swing relative to the base 117. The other ends of the two connecting rods 113 are respectively pivotally connected to one end of the two linkage parts 115 and can swing relative to the linkage parts 115, and the other end of the linkage part 115 is connected to the clamping part 111.

[0067] The base 117 provided on the plate body 131 can displace relative to the plate body 131. For example, a second guide rail 143 can be provided on the plate body 131. The base 117 is provided on the second guide rail 143 and can displace relative to the plate body 131 along the second guide rail 143. For example, the first guide rail 141 and the second guide rail 143 can be parallel to each other or arranged on the same straight line.

[0068] In an embodiment of the present invention, the plate body 131 can be disc-shaped, and the first guide rail 141 and the second guide rail 143 can be arranged along or parallel to the radial direction of the disc-shaped plate body 131. For example, the first guide rail 141 and the second guide rail 143 can be arranged on the same diameter of the disc-shaped plate body 131. In practical applications, the first guide rail 141 and the second guide rail 143 can be two independent guide rails. In different embodiments, the first guide rail 141 and the second guide rail 143 can be integrated into the same guide rail.

[0069] The linkage part 115 is arranged on the plate body 131, and two linkage parts 115 are respectively connected to two clamping parts 111. When the linkage part 115 displaces relative to the plate body 131, the connected clamping part 111 will be driven to displace. For example, two third guide rails 145 can be arranged on the plate body 131, and the two third guide rails 145 are arranged on the same straight line, while the two linkage parts 115 are respectively connected to the two third guide rails 145 and can displace relative to the plate body 131 along the third guide rails 145 to open or close the two clamping parts 111. In different embodiments, the two third guide rails 145 can be integrated into the same guide rail. In addition, the third guide rail 145 can be perpendicular to the first guide rail 141 and the second guide rail 143.

[0070] The pushing part 171 is adjacent to the base 117 and is located on one side edge of the base 117, while an elastic unit 119 is arranged on the other side edge of the base 117. The thrust provided by the driving shaft 151 to the pushing part 171 is greater than the elastic force of the elastic unit 119, and the elastic unit 119 can be compressed through the pushing part 171. For example, the elastic unit 119 can be a spring.

[0071] When the driving shaft 151 rotates, it will drive the pushing part 171 to displace through the driving rod 153, and the elastic unit 119 can be compressed through the base 117. When the base 117 displaces towards the direction of the elastic unit 119, it will drive the two clamping parts 111 to move away from each other respectively through the two connecting rods 113 and the two linkage parts 115, so that the distance between the two clamping parts 111 increases and is operated in the open state.

[0072] On the contrary, when the pushing part 171 moves in the direction away from the elastic unit 119, the elastic unit 119 will push the base 117 towards the direction of the pushing part 171. When the base 117 displaces, it will drive the two clamping parts 111 to approach each other respectively through the two connecting rods 113 and the two linkage parts 115, so that the distance between the two clamping parts 111 decreases and is operated in the clamping state. The detailed operation mode will be described in the subsequent embodiments.

[0073] The guiding unit 19 is used to guide the pushing part 171 and limit the displacement paths of the pushing part 171 and the protruding part 1711 arranged on the pushing part 171, so that the pushing part 171 can displace on the plate body 131 or drive the plate body 131 to rotate. Specifically, the driving shaft 151 can drive the plate body 131 to rotate through the driving rod 153, the protruding part 1711, the pushing part 171 and / or the first guide rail 141, so that the linkage part 115, the clamping part 111, the connecting rod 113, the base 117 and / or the elastic unit 119 arranged on the plate body 131 also rotate accordingly, and the purpose of flipping the substrate 12 clamped by the clamping part 111 is achieved.

[0074] In an embodiment of the present utility model, the guiding unit 19 may be plate-shaped, and a guiding groove 191 is provided on the plate-shaped guiding unit 19. For example, the guiding groove 191 may be a groove or a perforation, and includes a semi-circular guiding groove 1911 and two linear guiding grooves 1913. The two linear guiding grooves 1913 are respectively connected to both ends of the semi-circular guiding groove 1911 and extend towards the radially inner side of the semi-circular guiding groove 1911. The protruding portion 1711 provided on the pushing portion 171 is located within the guiding groove 191 of the guiding unit 19, and the driving shaft 151 can drive the protruding portion 1711 and the pushing portion 171 to displace along the guiding groove 191 of the guiding unit 19 through the driving rod 153.

[0075] In practical applications, when the protruding portion 1711 of the pushing portion 171 displaces within the semi-circular guiding groove 1911, it will drive the plate body 131 to rotate, and when the protruding portion 1711 of the pushing portion 171 displaces within the linear guiding groove 1913, it will drive the clamping unit 11 to clamp or release the substrate 12.

[0076] As Figure 2 shown, the plate body 131 and the guiding unit 19 can be stacked, and a separation space 192 is formed between the plate body 131 and the guiding unit 19, and the driving unit 15, the connecting rod 113, the linkage portion 115, the base 117, the elastic unit 119 and / or the pushing portion 171 are located within the separation space 192.

[0077] Specifically, the protruding portion 1711 on the pushing portion 171 is located within the groove 155 of the driving rod 153 and the guiding groove 191 of the guiding unit 19. When the protruding portion 1711 displaces along the guiding groove 191 of the guiding unit 19, it may also displace along the groove 155 of the driving rod 153.

[0078] In addition, a perforation 193 can be provided on the guiding unit 19, and the cross-sectional area of the perforation 193 is larger than that of the driving shaft 151, so that the driving shaft 151 can pass through the perforation 193 and be connected to the driving motor 18 outside the vacuum cavity 101. The guiding unit 19 being plate-shaped is only an embodiment of the present utility model and is not limited by the protection scope of the present utility model.

[0079] Please refer to Figures 4 to 7 , which are respectively the action side views of an embodiment of the flipping mechanism of the present utility model. In the following description, Figure 4 is defined as the starting state of the flipping mechanism 10. In practical applications Figure 7 can also be the starting state of the flipping mechanism 10. In addition, for the convenience of representing the components of the flipping mechanism 10, in Figures 4 to 7 the guiding unit 19 located in front of the flipping mechanism 10 is represented in a dashed line and perspective manner, and is coordinated with Figure 2 as shown.

[0080] AsFigure 4 As shown, the pushing part 171 applies pressure to the elastic unit 119 through the base 117 and compresses the elastic unit 119. For example, the protruding part 1711 on the pushing part 171 is located in the linear guide groove 1913.

[0081] The two connecting rods 113 on the base 117 will be driven by the base 117 and swing in opposite directions. The two connecting rods 113 will respectively push the two linkage parts 115 towards the outside of the plate body 131, increasing the distance between the two linkage parts 115, and the distance between the clamping parts 111 connecting the two linkage parts 115 will also increase. At this time, the clamping unit 11 will operate in the open state, where the clamping parts 111 of the clamping unit 11 will not clamp the substrate 12, and related preparations can be performed on the upper surface of the substrate 12, such as a thin film deposition step or an etching step on the upper surface of the substrate 12.

[0082] As Figure 5 shown, after the preparation of the upper surface of the substrate 12 is completed, the driving rod 153 can be driven to swing by the driving shaft 151. The driving rod 153 will drive the linkage part 115 to gradually move away from the base 117 through the protruding part 1711. For example, the protruding part 1711 on the pushing part 171 leaves the linear guide groove 1913 and enters the semi-circular guide groove 1911.

[0083] The base 117 will be displaced in the direction of the pushing part 171 under the thrust of the elastic unit 119. In an embodiment of the present invention, a positioning convex part can be provided on the displacement path of the base 117 to limit the displacement of the base 117, where the thrust provided by the elastic unit 119 will push the base 117 towards the linkage part 115 until it reaches the positioning convex part. The two connecting rods 113 connected to the base 117 will be driven by the base 117 and swing in opposite directions. The two connecting rods 113 will respectively pull the two linkage parts 115 towards the inside of the plate body 131, reducing the distance between the two linkage parts 115, and the distance between the clamping parts 111 connecting the two linkage parts 115 will also decrease. At this time, the clamping unit 11 will operate in the clamping state and can clamp the substrate 12 through the two clamping parts 111 of the clamping unit 11.

[0084] In an embodiment of the present invention, at least one position sensor 16 can be provided on the plate body 131. The position sensor 16 is adjacent to the base 117 and is used to sense the position of the base 117, and the operating state of the clamping unit 11 (clamping state or open state) can be judged by the position of the base 117.

[0085] As Figure 6As shown, the drive shaft 151 drives the drive rod 153 to swing, causing the protruding portion 1711 and the pushing portion 171 connected to the drive rod 153 to displace along the guide groove 191 of the guiding unit 19. For example, the protruding portion 1711 and the pushing portion 171 move from one end of the semicircular guide groove 1911 to the other end.

[0086] In practical applications, the guiding unit 19 is a fixed component. For example, the guiding unit 19 can be fixed on the vacuum chamber 101 and will not displace or rotate relative to the vacuum chamber 101. When the protruding portion 1711 and the pushing portion 171 displace along the semicircular guide groove 1911 of the guiding unit 19, they will drive the plate body 131 connected to the pushing portion 171 and the clamping unit 11 provided on the plate body 131 to rotate, and flip the substrate 12 clamped by the clamping unit 11.

[0087] When the protruding portion 1711 and the pushing portion 171 displace along the semicircular guide groove 1911 of the guiding unit 19, the pushing portion 171 has left the linear guide groove 1913 and will not contact or push against the base 117 of the clamping unit 11. Therefore, during the process of flipping the substrate 12, the base 117 will not displace relative to the plate body 131, ensuring that the clamping portion 111 will stably maintain the clamping state and preventing the substrate 12 from loosening or falling off the clamping unit 11 during the flipping process.

[0088] In an embodiment of the present invention, at least one position sensor 16 can be provided near the clamping portion 111. The position sensor 16 is used to sense the position of the clamping portion 111 to determine whether the flipping mechanism 10 has completed the flipping of the substrate 12. In addition, the position sensor 16 can also be used to determine whether the clamping unit 11 is operating in the clamping state or the open state.

[0089] After the flipping mechanism 10 completes the flipping of the substrate 12, as Figure 7 shown, the drive shaft 151 continuously drives the drive rod 153 to swing, and drives the linkage portion 115 to gradually approach the base 117 through the protruding portion 1711. For example, the protruding portion 1711 on the base 117 enters another linear guide groove 1913. The pushing portion 171 applies pressure to the elastic unit 119 through the base 117 and compresses the elastic unit 119. The two connecting rods 113 on the base 117 are driven by the base 117 to swing in opposite directions. The two connecting rods 113 respectively push the two linkage portions 115 toward the outside of the plate body 131, increasing the distance between the two linkage portions 115, and also increasing the distance between the clamping portions 111 connecting the two linkage portions 115. At this time, the clamping unit 11 operates in the open state, and the clamping portions 111 of the clamping unit 11 do not clamp the substrate 12.

[0090] After completing the above Figures 4 to 7 steps, the flipping of the substrate 12 is completed, making the originalFigure 4 The surface located below the substrate 12 faces upward, and after performing relevant preparations on the lower surface of the substrate 12, for example, performing a thin film deposition step or an etching step on the lower surface of the substrate 12.

[0091] The above content is only a preferred embodiment of the present utility model, and is not intended to limit the protection scope of the present utility model. That is, all equivalent changes and modifications made according to the shape, structure, features and spirit described in the application of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A vacuum chamber with a flipping mechanism, characterized in that, Comprising: A vacuum chamber including an accommodation space; And A flipping mechanism connected to the vacuum chamber, further including: A clamping unit located within the accommodation space of the vacuum chamber and configured to clamp at least one substrate; A flipping unit connected to the clamping unit, wherein the flipping unit is configured to drive the clamping unit and flip the substrate clamped by the clamping unit within the accommodation space of the vacuum chamber.

2. The vacuum chamber with a flipping mechanism as claimed in claim 1, wherein The flipping unit includes: A plate body; A pushing portion disposed on the plate body; A driving unit connected to the pushing portion and configured to drive the pushing portion to displace relative to the plate body; and A guiding unit configured to guide the pushing portion.

3. The vacuum chamber with a flipping mechanism according to claim 2, characterized in that, The driving unit includes: A driving shaft connected to a driving motor located outside the vacuum chamber and driven by the driving motor to rotate; and A driving rod connected to the driving shaft and the pushing portion, wherein when the driving shaft rotates, it drives the pushing portion to displace through the driving rod.

4. The vacuum chamber with a flipping mechanism according to claim 3, characterized in that, The driving rod includes a groove, and a protruding portion is disposed on the pushing portion, and the protruding portion is located within the groove of the driving rod.

5. The vacuum chamber with a flipping mechanism as claimed in claim 4, wherein, The guiding unit includes a guiding groove, and the protruding portion on the pushing portion is located within the guiding groove. When the driving shaft rotates, it drives the protruding portion to displace along the guiding groove of the guiding unit.

6. The vacuum chamber with a flipping mechanism as claimed in claim 5, wherein The clamping unit includes: Two clamping portions configured to clamp the substrate; Two linkage portions disposed on the plate body and respectively connected to the two clamping portions. When the driving shaft rotates, it drives the pushing portion to displace through the driving rod, so as to drive the two linkage portions to displace relative to the plate body, such that the two clamping portions operate in an open state or a clamping state.

7. The vacuum chamber with a flipping mechanism as claimed in claim 6, wherein The clamping unit includes: A base disposed on the plate body; and Two connecting rods, one ends of the two connecting rods are pivotally connected to the base, and the other ends are respectively pivotally connected to the two linkage portions. The pushing portion is configured to push the base to displace relative to the plate body, such that the base drives the two linkage portions to displace relative to the plate body through the two connecting rods.

8. The vacuum chamber with a flipping mechanism according to claim 7, wherein, Including at least one position sensor adjacent to the base and configured to sense the position of the base to determine whether the clamping unit operates in the open state or the clamping state.

9. The vacuum chamber with a flipping mechanism as described in claim 6, characterized in that, The guiding groove of the guiding unit includes a semi-circular guiding groove and two linear guiding grooves. The two linear guiding grooves are respectively connected to two ends of the semi-circular guiding groove. When the two clamping portions operate in the open state, the pushing portion is located in the linear guiding groove. When the two clamping portions operate in the clamping state, the pushing portion is located within the semi-circular guiding groove.

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