Air cooling device for reaction cavity of semiconductor processing equipment

Abstract

The utility model discloses an air cooling device for a reaction cavity of semiconductor processing equipment. The air cooling device comprises four groups of wind shields positioned outside the reaction cavity, supporting plates vertically arranged between two adjacent groups of wind shields, locking assemblies for connecting the wind shields and the supporting plates, an air inlet pipe fixedly mounted on one group of supporting plates in a penetrating manner, and a fan communicated with the air inlet pipe. The at least four groups of wind shields are connected end to end through the supporting plates and the locking assemblies and are arranged around the reaction cavity, and the sides, close to each other, of every two adjacent groups of wind shields are detachably mounted on the corresponding supporting plates through the locking assemblies. The locking assembly comprises a fixed end and an elastic lock catch, and the fixed end is installed on the supporting plate. When the wind shield is heated to deform, the deformation of the wind shield is still blocked by the edge of the supporting plate to prevent air leakage, so that the problem of insufficient air cooling of the reaction cavity caused by air leakage is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of air cooling of semiconductor processing reaction chambers, and particularly to an air cooling device for a reaction chamber of a semiconductor processing device. Background Art

[0002] Semiconductor processing devices, such as thin film deposition devices, epitaxial devices, oxidation devices, and heat treatment devices, etc., usually have a reaction chamber. The substrate is arranged in the reaction chamber through a pedestal, and corresponding processes are carried out under certain temperature and air pressure. In order to control the temperature or protect the device components, the above-mentioned semiconductor processing devices are equipped with water cooling and air cooling devices. Among them, the air cooling device usually adopts a fan and a ventilation duct. The ventilation duct is a pipe formed by arranging stainless steel plates around the components to be cooled. Cold air is sent in through air analysis, and after absorbing heat, it is output to achieve the cooling effect.

[0003] However, the baffle plate forming the ventilation duct of the existing air cooling device is usually set as a whole (that is, multiple plates are welded together to form the ventilation duct). Due to the overly large design of this structure, under high temperature conditions, the baffle plate is continuously roasted by high temperature and blown by cooling air, and it is easy to deform and leak air, resulting in insufficient air cooling of the reaction chamber, affecting the process (for example, in the epitaxial process, an epitaxial layer will be deposited on the inner wall of the reaction chamber, affecting the light transmittance of the reaction chamber, and causing unstable process temperature and unstable growth rate of the product epitaxial layer). At the same time, problems such as shortening the equipment maintenance cycle will occur. At the same time, the existing baffle plate forming the ventilation duct is set as an integral structure, and there are problems that it is very inconvenient to disassemble and the process is too complicated. Summary of the Utility Model

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present utility model is to provide an air cooling device for a reaction chamber of a semiconductor processing device to overcome the problems of air leakage caused by the deformation of the wind baffle and the difficulty in installing the wind baffle.

[0005] An air cooling device for a reaction chamber of a semiconductor processing device includes:

[0006] At least four groups of wind baffle plates located outside the reaction chamber;

[0007] Support plates erected between adjacent two groups of the wind baffle plates;

[0008] Locking components for connecting the wind baffle plates and the support plates;

[0009] An air inlet pipe fixedly installed through one of the support plates; and

[0010] A fan connected to the air inlet pipe.

[0011] In one embodiment, at least four groups of the windshields are connected end to end through a support plate and a locking assembly, and are arranged around the reaction chamber.

[0012] Further, the windshields are arranged vertically, and one side of adjacent two groups of the windshields close to each other is detachably installed on the corresponding support plate through the locking assembly, and the windshields are in contact with the support plate.

[0013] Still further, the locking assembly includes a fixed end and an elastic lock; wherein, the fixed end is installed on the support plate.

[0014] Even further, for the elastic lock, one corresponding end is fixedly installed on the windshield, and the other corresponding end is buckled on the fixed end.

[0015] In one embodiment, the fan is located at a position on the side of the windshield facing away from the reaction chamber, and the air inlet pipe is fixedly connected to the air outlet of the fan.

[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows: Four groups of windshields and four groups of support plates form a ventilation duct, which can be partially disassembled. When the windshields are deformed by heat, the deformation generated by the windshields is still blocked by the edges of the support plates to prevent air leakage, effectively solving the problem of insufficient air cooling in the reaction chamber caused by air leakage. At the same time, due to the use of a four-group windshield structure, the corresponding windshield can be removed according to the position to be repaired, so that the disassembly and installation processes can be simplified. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only exemplary, and for those of ordinary skill in the art, without creative efforts, other implementation drawings can be obtained according to the provided drawings.

[0018] The structures, ratios, sizes, etc. shown in this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions under which the present utility model can be implemented. Therefore, they do not have technical substance significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present utility model can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present utility model.

[0019] Figure 1 The figure shows the front view of an air cooling device for a reaction chamber of a semiconductor processing equipment provided by the present utility model.

[0020] Figure 2 The figure shows Figure 1 the top view of

[0021] Description of Main Component Symbols

[0022] 1. Windshield; 2. Support Plate; 3. Locking Assembly; 4. Air Inlet Duct; 5. Fan.

[0023] The above description of main component symbols further elaborates on the present utility model in conjunction with the accompanying drawings and specific embodiments. Specific Embodiments

[0024] The following specific embodiments illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of them. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present utility model.

[0025] Please refer to Figure 1-2 , this embodiment provides an air-cooling device for a reaction chamber of a semiconductor processing equipment, which includes four groups of windshields 1 located outside the reaction chamber, support plates 2 erected between adjacent two groups of the windshields 1, a locking assembly 3 for connecting the windshields 1 and the support plates 2, an air inlet duct 4 fixedly installed through one of the support plates 2, and a fan 5 communicated with the air inlet duct 4. This embodiment takes four groups of windshields 1 as an example for illustration. In other embodiments, the number of windshields 1 can also be adaptively increased. Correspondingly, the number of support plates 2 is the same as that of the windshields 1, so as to enclose a larger-sized air-cooling space, which will not be elaborated here.

[0026] The four groups of windshields 1 are connected end to end through the support plates 2 and the locking assembly 3 and are arranged around the reaction chamber. The windshields 1 are vertically arranged. One side of adjacent two groups of windshields 1 close to each other is detachably installed on the corresponding support plate 2 through the locking assembly 3, and the windshields 1 are in contact with the support plates 2. The locking assembly 3 includes a fixed end and an elastic lock. Among them, the fixed end is installed on the support plate 2, and one corresponding end of the elastic lock is fixedly installed on the windshield 1, and the other corresponding end is buckled on the fixed end. In this embodiment, the four groups of windshields 1 are assembled end to end under the action of the support plates 2 and the locking assembly 3 to form an enclosing structure, forming a ventilation duct around the reaction chamber. At the same time, due to the combined connection, it is convenient for local disassembly, and the support plate 2 is used to allow a certain amount of movement of the windshield 1, that is, when the windshield 1 is thermally deformed, the deformation generated by the windshield 1 is still blocked by the edge of the support plate 2 to prevent air leakage, effectively solving the problem of insufficient air-cooling of the reaction chamber caused by air leakage. It should be noted that slots can also be provided at the upper and lower edges of the windshield 1 to prevent air leakage from above or below, which will not be elaborated here.

[0027] The air-cooling device of this embodiment uses multiple windshields 1. Each single windshield 1 has a low weight, making it easy for a single person to operate and install. Moreover, based on the combined and assembled installation structure, the local opening of the ventilation duct can be achieved, and it can be locally opened to facilitate the maintenance, disassembly, and assembly of the windshield 1 and the components (such as heating devices) inside the ventilation duct, without having to disassemble the whole, reducing the complexity of the operation.

[0028] The fan 5 is located on the side of the windshield 1 facing away from the reaction chamber, and the intake pipe 4 is fixedly connected to the air outlet of the fan 5. In this embodiment, based on the fan 5 sending cold air into the ventilation duct along the intake pipe 4, the purpose of air-cooling and temperature reduction of the reaction chamber is achieved.

[0029] In summary, the air-cooling device of this embodiment has the following advantages: Four groups of windshields 1 and four groups of support plates 2 form a ventilation duct, which can be locally disassembled. When the windshield 1 is deformed by heat, the deformation generated by the windshield 1 is still blocked by the edge of the support plate 2 to prevent air leakage, effectively solving the problem of insufficient air-cooling of the reaction chamber caused by air leakage. At the same time, due to the use of a four-group windshield structure, the corresponding windshield can be removed according to the position that needs to be repaired, thus simplifying the disassembly and installation process.

[0030] For the naming of each component involved, the function described in the specification is used as the naming standard, and it is not limited by the specific nouns used in this utility model. Those skilled in the art can also choose other nouns to describe the names of the various components of this utility model.

Claims

1. An air-cooling device for a reaction chamber of a semiconductor processing equipment, characterized in that, Comprising: At least four groups of windshields (1) located outside the reaction chamber; Support plates (2) erected between adjacent two groups of the windshields (1); A locking assembly (3) for connecting the windshields (1) and the support plates (2); An air inlet pipe (4) fixedly installed through one of the support plates (2); and A fan (5) communicated with the air inlet pipe (4).

2. The air cooling device for a reaction chamber of a semiconductor processing apparatus according to claim 1, wherein, At least four groups of the windshields (1) are connected end to end through the support plates (2) and the locking assembly (3), and are arranged around the reaction chamber.

3. The air-cooling device for a reaction chamber of a semiconductor processing apparatus according to claim 2, wherein, The windshields (1) are vertically arranged, and one side of adjacent two groups of the windshields (1) close to each other is detachably installed on the corresponding support plate (2) through the locking assembly (3), and the windshields (1) are in contact with the support plates (2).

4. The air-cooling device for a reaction chamber of a semiconductor processing apparatus according to claim 3, wherein The locking assembly (3) includes a fixed end and an elastic lock; wherein, the fixed end is installed on the support plate (2).

5. The air-cooling device for a reaction chamber of a semiconductor processing apparatus according to claim 4, wherein, For the elastic lock, one corresponding end is fixedly installed on the windshield (1), and the other corresponding end is buckled on the fixed end.

6. The air-cooling device for a reaction chamber of a semiconductor processing apparatus according to claim 1, wherein, The fan (5) is located at a position on the side of the windshield (1) facing away from the reaction chamber, and the air inlet pipe (4) is fixedly connected to the air outlet of the fan (5).

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