Substrate film thickness measuring device

Abstract

The utility model relates to the technical field of semiconductor material processing, in particular to a substrate film thickness measuring device which comprises a device body provided with a table top used for bearing a substrate; the detection hole is formed in the table top and is communicated with the inner cavity of the device body; the calibration sheet is arranged in the inner cavity of the device body and can be selectively presented below the detection hole; the signal transceiving component is used for transmitting and receiving optical signals; and the positioning assembly is used for limiting the relative position of the substrate and the table top. According to the substrate film thickness measuring device provided by the invention, the same device can be used for detecting the film thickness and film thickness uniformity of substrates with different sizes and different materials, and the compatibility is good.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor material processing, and particularly to a substrate film thickness measuring device. Background Art

[0002] In semiconductor manufacturing, the substrate provides a stable physical foundation for chip manufacturing, and various complex integrated circuit structures are carried on the substrate.

[0003] Before the substrate is processed into a chip or device, various functional film layers are often formed on the surface of the substrate, and the film thickness and uniformity of these functional film layers will affect the quality of the subsequent processed products.

[0004] Spectral measurement technology can be used to quickly detect the uniformity of the substrate film thickness. Therefore, a device for measuring the substrate film thickness by spectral measurement technology is required. Utility Model Content

[0005] The purpose of this utility model is to provide a substrate film thickness measuring device for measuring the film thickness of a substrate.

[0006] To achieve this purpose, the following technical solutions are adopted in this utility model:

[0007] A substrate film thickness measuring device, comprising: a device body, the device body has a tabletop for carrying a substrate;

[0008] A detection hole is provided on the tabletop and communicates with the inner cavity of the device body;

[0009] A calibration sheet is provided in the inner cavity of the device body and can be selectively presented below the detection hole;

[0010] A signal transceiver component for transmitting and receiving optical signals;

[0011] A positioning component for defining the relative position between the substrate and the tabletop.

[0012] Preferably, a slideway is provided in the inner cavity of the device body;

[0013] A calibration sheet carrier is arranged on the slideway and slides along the slideway.

[0014] Preferably, the calibration sheet carrier is provided with at least two calibration sheet carrying positions;

[0015] Each calibration sheet carrying position is used to place different calibration sheets.

[0016] Preferably, there are at least two slideways;

[0017] The slideways converge below the detection hole.

[0018] Preferably, it further includes a suction disc;

[0019] The suction disc is penetrated through the device body and can be telescopic relative to the tabletop;

[0020] The suction disc is used to adsorb the substrate and drive the substrate to rotate.

[0021] Preferably, it further includes a lifting and centering assembly;

[0022] The lifting and centering assembly includes three lifting rods penetrated through the tabletop.

[0023] Preferably, it further includes three support arms, and the three support arms are respectively connected to the lifting rods;

[0024] The support arms are parallel to the tabletop.

[0025] Preferably, each support arm is provided with a slider capable of sliding along the support arm;

[0026] The sliders on each support arm slide synchronously.

[0027] Preferably, the positioning assembly includes a positioning pin supported by an elastic unit;

[0028] The positioning pin is configured to protrude from the tabletop in the initial state.

[0029] Preferably, there are at least three positioning pins;

[0030] The three positioning pins are arranged radially along the device body.

[0031] Advantages of the present utility model:

[0032] The substrate film thickness measuring device provided by this application can detect the film thickness and film thickness uniformity of substrates with different sizes and different materials by the same device, and has good compatibility. Description of the drawings

[0033] Figure 1 is the overall structural schematic diagram of the substrate film thickness measuring device of the present utility model;

[0034] Figure 2 is the internal structural schematic diagram of the substrate film thickness measuring device of the present utility model;

[0035] In the figure: 1, tabletop; 2, support arm; 3, positioning pin; 4, detection hole; 5, calibration chip stage; 6, slideway; 7, calibration chip; 8, lifting rod; 9, slider; 10, suction disc. Detailed implementation manners

[0036] The present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the sake of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0037] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under", and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0039] In the description of this embodiment, the orientation or positional relationships such as "up", "down", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0040] Embodiment 1

[0041] Refer to Figure 1 Figure 2 , the embodiment of the present application provides a substrate film thickness measuring device for measuring the thickness of the film formed on the surface of the substrate and the film thickness uniformity. The film thickness measuring device includes a device body. In this embodiment, the device body is circular. In some feasible embodiments, the device body may also be in conventional shapes such as square, rectangular, etc.

[0042] In this embodiment, the device body has an internal chamber and a table 1 for carrying a substrate. A detection hole 4 is provided on the table 1. In this embodiment, the detection hole 4 is opened at the center of the device body, so that the table 1 communicates with the internal chamber of the device body.

[0043] In the internal chamber of the device body, a plurality of slideways 6 are arranged. Each slideway has a same intersection point, and this intersection point is located below the detection hole 4. A calibration chip stage 5 is provided on the slideway 6 for placing a calibration chip 7. In this embodiment, two calibration chip placement positions are provided on a single calibration chip stage 5, and calibration chips of different materials are placed on each calibration chip placement position.

[0044] In this embodiment, the calibration chip stage 5 can slide along the slideway 6, and its sliding power comes from an external drive. The external drive can be a manual drive or an electric drive. The calibration chip stage 5 reciprocally slides along the slideway 6, and can convey different calibration chips 7 to below the detection hole 4. These different calibration chips have different materials or measurement accuracies.

[0045] Through the above settings, the device body can switch multiple calibration chips of different materials or accuracies, has better compatibility, and there is no need to manually replace the calibration chip when detecting the film thickness of substrates of different materials.

[0046] In this embodiment, a positioning component for defining the relative position between the substrate and the table is further included. In this embodiment, the positioning component uses a positioning pin 3 supported by an elastic member to position the positioning edge of the substrate. The positioning edge of the substrate mentioned here generally refers to the flat edge or notch edge formed by processing a commercially available substrate. The positioning pin 3 has an initial state protruding from the table 1. When the substrate is placed on the table 1, if the positioning edge of the substrate is not aligned with the positioning pin 3 (usually the positioning edge of the substrate is tangent to the side wall of the positioning pin 3), then the substrate will cover the positioning pin 3 and press the positioning pin 3 down until it retracts below the table 1.

[0047] In this embodiment, the positioning pin 3 can be a plurality of positioning pins arranged in the radial direction of the table 1. Such a setting can adapt to substrates of different sizes and provide accurate positioning for substrates of various specifications. When facing substrates of different sizes, these multiple positioning pins distributed in the radial direction can be adjusted accordingly according to the size of the substrate to ensure that the positioning edge of the substrate can accurately contact the positioning pin, so as to effectively define the position of the substrate.

[0048] In this embodiment, a suction chuck 10 is provided that can move up and down relative to the tabletop 1. Preferably, the detection hole 4 is used as the lifting channel for the suction chuck 10. The suction surface of the suction chuck 10 adsorbs the substrate at a height position higher than the positioning pin 3, continuously maintaining the adsorption force, and adsorbing the substrate to fit with the tabletop 1. The substrate is adsorbed and rotated by the suction chuck 10. When the positioning edge of the substrate rotates to the position where the positioning pin 3 is located, the positioning pin 3 bounces up due to the loss of the downward pressure of the substrate, and then the side wall of the positioning pin 3 catches the side wall of the substrate to limit the position of the substrate.

[0049] After the substrate is positioned by the suction chuck 10, the suction function is turned off, and it further descends to another position. This is to avoid interference with the calibration wafer stage 5 when the calibration wafer stage 5 slides below the detection hole 4.

[0050] Taking a commercially available circular substrate as an example, before the suction chuck 10 adsorbs and rotates the substrate, it also includes the step of centering the substrate. The purpose of centering is to make the center of the substrate correspond to the center position of the detection hole 4, which can significantly improve the accuracy of detecting the film thickness and film thickness uniformity of the substrate. In this embodiment, the centering operation of the substrate is performed by a lifting and centering assembly. Specifically, the lifting and centering assembly includes three lifting rods 8 distributed on the device body and retractable relative to the tabletop 1. These three lifting rods 8 can be retracted and extended synchronously. In addition, there are three support arms 2. One end of the support arm 2 is installed on the lifting rod 8 and moves together with the lifting rod 8. The support arm 2 is parallel to the tabletop 1, and the other ends of the three support arms 2 point in the direction of the detection hole 4. A slider 9 is provided on the support arm 2, and the slider 9 can slide along the support arm 2. The sliders 9 located on different support arms 2 can slide synchronously. When the substrate is placed on the support arm 2, the three sliders 2 slide centripetally synchronously, pushing the substrate towards the center position, and finally completing the centering operation of the substrate.

[0051] In a preferred embodiment, in the initial state, the lifting rod 8 rises so that the support arm 2 is higher than the tabletop 1. After the substrate is placed on the support arm 2 and centered, the suction chuck 10 rises and adsorbs the substrate. After the substrate is adsorbed, the lifting rod 8 descends so that the support arm 2 descends below the tabletop 1.

[0052] After the substrate is positioned on the tabletop 1, the signal transceiver component is used to transmit and receive detection signals, so as to detect the film thickness and film thickness uniformity of the substrate. In this embodiment, the film thickness and film thickness uniformity of the substrate are measured by the way that the optical signal passes through the substrate, the detection hole, and the calibration sheet in sequence to generate a spectrum. When the incident light penetrates the interface of different substances, part of the light will be reflected. Due to the wave nature of light, the reflected lights from multiple interfaces interfere with each other, resulting in the oscillation phenomenon of the multi-wavelength spectrum of the reflected light. From the oscillation frequency of the spectrum, we can judge the distance between different interfaces, and then obtain the thickness of the material (more oscillations represent greater thickness). At the same time, other material properties, such as refractive index and roughness, can also be obtained.

[0053] When testing substrates of different materials, only the corresponding calibration sheet needs to be conveyed below the detection hole 4 through the calibration sheet stage 5.

[0054] Obviously, the above-mentioned embodiments of the present invention are only examples for clearly explaining the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A substrate film thickness measuring device, characterized in that, Comprising: A device body having a tabletop for carrying a substrate; A detection hole provided on the tabletop and communicating with the inner cavity of the device body; A calibration sheet provided in the inner cavity of the device body and capable of selectively presenting below the detection hole; A signal transceiver component for transmitting and receiving optical signals; A positioning component for defining the relative position between the substrate and the tabletop.

2. The substrate film thickness measuring device according to claim 1, wherein: A slideway is provided in the inner cavity of the device body; A calibration sheet carrier is provided on the slideway and slides along the slideway.

3. The substrate film thickness measuring device according to claim 2, characterized in that: The calibration sheet carrier is provided with at least two calibration sheet carrying positions; Each of the calibration sheet carrying positions is for placing different calibration sheets.

4. The substrate film thickness measuring device according to claim 2, wherein: There are at least two slideways; The slideways converge below the detection hole.

5. The substrate film thickness measuring device according to claim 1, characterized in that: Further comprising a suction cup; The suction cup penetrates through the device body and can stretch relative to the tabletop; The suction cup is used for sucking the substrate and driving the substrate to rotate.

6. The substrate film thickness measuring device according to claim 1, wherein: Further comprising a lifting and centering component; The lifting and centering component includes three lifting rods penetrating through the tabletop.

7. The substrate film thickness measuring device according to claim 6, characterized in that: Further comprising three support arms respectively connected to the lifting rods; The support arms are parallel to the tabletop.

8. The substrate film thickness measuring device according to claim 7, characterized in that: Each of the support arms is provided with a slider capable of sliding along the support arm; The sliders on each of the support arms slide synchronously.

9. The substrate film thickness measuring device according to claim 1, characterized in that: The positioning component includes a positioning pin supported by an elastic unit; The positioning pin is configured to protrude from the tabletop in the initial state.

10. The substrate film thickness measuring device according to claim 9, wherein: There are at least three positioning pins; The three positioning pins are arranged radially along the device body.

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