High-temperature thickness gauge
By using carbon steel pads, acoustic insulation and thermal insulation materials and inclined wafer design in high-temperature thickness gauge, the problem of damage to the probe in high-temperature environment is solved, and stable measurement and accurate detection at high temperature are achieved.
Patent Information
- Application Number
- CN202521090011.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-30
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2035-05-30
AI Technical Summary
The existing high-temperature thickness gauge cannot effectively cool down in high temperature environments, resulting in damage to the probe or shortened service life, affecting detection efficiency and cost.
A high-temperature thickness gauge is designed, using carbon steel pads to enhance the high-temperature resistance of the probe, filled with acoustic insulation and thermal insulation materials to reduce signal interference and prevent high-temperature transmission, transmitting and receiving wafers are tilted to improve signal accuracy, and the temperature sensing module provides real-time temperature compensation.
Working stably in high temperature environments improves measurement accuracy and reliability, protects the probe from damage, and reduces detection costs.
Smart Images

Figure CN223166115U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of thickness measurement equipment, in particular to a high-temperature thickness gauge. Background Technique
[0002] A thickness gauge is used to measure the thickness of various materials, objects, and various processed parts. It can also monitor various pipelines and pressure vessels in production equipment to monitor the degree of thinning after corrosion during their use. It is widely used in various fields such as petroleum, chemical industry, metallurgy, shipbuilding, aviation, and aerospace, and requires extremely high accuracy. According to different measurement methods, thickness gauges can be roughly divided into contact thickness gauges and non-contact thickness gauges.
[0003] A high-temperature thickness gauge introduces ultrasonic waves into the equipment body through a probe and requires a high-temperature coupling agent to support. However, during the thickness measurement process, pipelines with too high temperatures are often encountered. The too high temperature is likely to cause damage to the probe or reduce its service life. Currently, on-site high-temperature thickness measurement cannot effectively cool the probe of the thickness gauge, affecting the subsequent use of the high-temperature thickness gauge.
[0004] Currently, during on-site high-temperature thickness measurement, the probe of the thickness gauge cannot be effectively cooled. After detection, the probe needs to be cooled for a period of time to avoid affecting subsequent use, reducing the detection efficiency; during the thickness measurement process, when detecting pipelines with too high temperatures, the too high temperature is likely to cause damage to the probe or reduce its service life, increasing the detection cost. Content of the Utility Model
[0005] In view of the deficiencies of the prior art, the utility model provides a high-temperature thickness gauge, which solves the problems that during on-site high-temperature thickness measurement, the probe of the thickness gauge cannot be effectively cooled, and after detection, the probe needs to be cooled for a period of time to avoid affecting subsequent use, reducing the detection efficiency; during the thickness measurement process, when detecting pipelines with too high temperatures, the too high temperature is likely to cause damage to the probe or reduce its service life, increasing the detection cost.
[0006] To achieve the above objectives, the utility model is realized through the following technical solutions: A high-temperature thickness gauge includes a body, a signal line, and a high-temperature probe. The high-temperature probe is in contact with the material to be detected, and the high-temperature probe is connected to the body through a signal line. The high-temperature probe includes:
[0007] A housing;
[0008] Internal components, the internal components are arranged in the housing, the internal components are provided with a temperature sensing module, the inner side of the housing is filled with acoustic insulation material and heat insulation material, and the acoustic insulation material is located inside the heat insulation material;
[0009] A carbon steel pad, the carbon steel pad is connected to the outside of the housing and is in contact with the heat insulation material.
[0010] Preferably, a connecting tail pipe is connected to the outside of the housing, and the connecting tail pipe is sleeved outside the signal line.
[0011] Preferably, an electrical adapter is provided in the internal component, and the electrical adapter is located inside the acoustic insulation material.
[0012] Preferably, the internal component is provided with a transmitting wafer and a receiving wafer. The transmitting wafer and the receiving wafer are located at the junction of the acoustic insulation material and the heat insulation material. The transmitting wafer and the receiving wafer are inclined inward at a certain angle. There are two sets of electrical adapters. Both sets of electrical adapters are connected to the signal line. One set of the electrical adapters is connected to the transmitting wafer, and the other set of the electrical adapters is connected to the receiving wafer.
[0013] Preferably, the temperature sensing module is located inside the heat insulation material and is in contact with the carbon steel pad, and the temperature sensing module is connected to the signal line.
[0014] The present utility model discloses a high-temperature thickness gauge, and the beneficial effects thereof are as follows:
[0015] By providing a carbon steel pad on the outside of the housing of the high-temperature probe, the present utility model can enhance the high-temperature resistance performance of the probe in a high-temperature environment and protect the internal components from the influence of high temperature;
[0016] The acoustic insulation material and the heat insulation material filled inside the housing. The acoustic insulation material can reduce signal interference and ensure the stable transmission of measurement signals; the heat insulation material further prevents high temperature from being transmitted to the internal components, improving the stability and measurement accuracy of the probe;
[0017] The design that the transmitting wafer and the receiving wafer are inclined inward at a certain angle helps to receive and transmit signals more accurately and optimize the measurement effect;
[0018] The setting of the temperature sensing module can monitor the temperature of the material to be detected in real time, provide a temperature compensation basis for the accuracy of measurement data, and improve the reliability of measurement. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0020] Figure 1 It is a schematic diagram of the overall structure of the present utility model;
[0021] Figure 2 This is a schematic diagram of the internal structure of the high-temperature probe of the present utility model.
[0022] In the figure: 1, the body; 2, the signal line; 3, the high-temperature probe; 31, the housing; 311, the connecting tail pipe; 312, the acoustic insulation material; 313, the heat insulation material; 32, the internal components; 321, the electrical adapter; 322, the transmitting wafer; 323, the receiving wafer; 324, the temperature sensing module; 33, the carbon steel pad; 4, the material to be detected. Specific embodiments
[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model are clearly and completely described below. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0024] By providing a high-temperature thickness gauge in the embodiments of the present application, the problems are solved that during on-site high-temperature thickness measurement, the probe of the thickness gauge cannot be effectively cooled, and after detection, the probe needs to be cooled for a period of time to avoid affecting subsequent use, reducing the detection efficiency; during the thickness measurement process, when detecting pipelines with too high temperatures, the too high temperature easily causes damage to the probe or reduces its service life, increasing the detection cost. By optimizing the design of the high-temperature probe structure, it can work stably in a high-temperature environment, improving the accuracy and reliability of measurement.
[0025] Embodiments of the present utility model disclose a high-temperature thickness gauge. Embodiment 1
[0026] As shown in the attached Figure 1-2 figure, it includes a body 1, a signal line 2, and a high-temperature probe 3. The high-temperature probe 3 is in contact with the material to be detected 4. The high-temperature probe 3 is connected to the body 1 through the signal line 2. The high-temperature probe 3 includes a housing 31, internal components 32, and a carbon steel pad 33. The internal components 32 are arranged inside the housing 31. The internal components 32 are provided with a temperature sensing module 324. The inner side of the housing 31 is filled with an acoustic insulation material 312 and a heat insulation material 313. The acoustic insulation material 312 is located inside the heat insulation material 313. The carbon steel pad 33 is connected to the outside of the housing 31 and is in contact with the heat insulation material 313.
[0027] The utility model can enhance the high-temperature resistance performance of the high-temperature probe 3 in a high-temperature environment and protect the internal components 32 from the influence of high temperature by arranging a carbon steel pad 33 on the outer side of the shell 31 of the high-temperature probe 3; the inner side of the shell 31 is filled with an acoustic insulation material 312 and a heat insulation material 313. The acoustic insulation material 312 can reduce signal interference and ensure the stable transmission of measurement signals; the heat insulation material 313 further prevents high temperature from being transmitted to the internal components 32, improving the stability and measurement accuracy of the high-temperature probe 3; the design that the transmitting wafer 322 and the receiving wafer 323 are inclined inward at a certain angle helps to receive and transmit signals more accurately and optimize the measurement effect; the setting of the temperature sensing module 324 can monitor the temperature of the material 4 to be detected in real time, provide a temperature compensation basis for the accuracy of measurement data, and improve the reliability of measurement.
[0028] Furthermore, a connecting tail pipe 311 is connected to the outer side of the shell 31, and the connecting tail pipe 311 is sleeved on the outer side of the signal line 2.
[0029] Specifically disclosed, the internal component 32 is provided with an electrical adapter 321, and the electrical adapter 321 is located inside the acoustic insulation material 312.
[0030] It should be emphasized that the internal component 32 is provided with a transmitting wafer 322 and a receiving wafer 323. The transmitting wafer 322 and the receiving wafer 323 are located at the junction of the acoustic insulation material 312 and the heat insulation material 313. The transmitting wafer 322 and the receiving wafer 323 are inclined inward at a certain angle. There are two groups of electrical adapters 321, and both groups of electrical adapters 321 are connected to the signal line 2. One group of the electrical adapters 321 is connected to the transmitting wafer 322, and the other group of the electrical adapters 321 is connected to the receiving wafer 323. Embodiment 2
[0031] According to the attached Figure 1-2 As shown, it includes a machine body 1, a signal line 2 and a high-temperature probe 3. The high-temperature probe 3 is in contact with the material 4 to be detected. The high-temperature probe 3 is connected to the machine body 1 through the signal line 2. The high-temperature probe 3 includes a shell 31, internal components 32 and a carbon steel pad 33. The internal components 32 are arranged inside the shell 31. The inner side of the shell 31 is filled with an acoustic insulation material 312 and a heat insulation material 313. The acoustic insulation material 312 is located inside the heat insulation material 313; the carbon steel pad 33 is connected to the outer side of the shell 31 and is in contact with the heat insulation material 313.
[0032] It should be emphasized that the temperature sensing module 324 is located inside the heat insulation material 313 and is in contact with the carbon steel pad 33. The temperature sensing module 324 is connected to the signal line 2.
[0033] Working principle: When the high-temperature thickness gauge starts to work, the body 1 transmits an electrical signal to the electrical adapter 321 through the signal line 2. The two groups of electrical adapters 321 respectively transmit the signal to the transmitting wafer 322 and the receiving wafer 323.
[0034] After receiving the signal, the transmitting wafer 322 emits an ultrasonic signal. Since the transmitting wafer 322 and the receiving wafer 323 are inclined inward at a certain angle, the ultrasonic signal is more easily received by the receiving wafer 323 after being reflected by the material to be detected 4.
[0035] The receiving wafer 323 transmits the received reflected signal back to the body 1 through the electrical adapter 321 and the signal line 2. The body 1 calculates the thickness of the material to be detected 4 according to the signal transmission time and the propagation speed of ultrasonic waves in the material.
[0036] The temperature sensing module 324 monitors the temperature of the material to be detected 4 in real time and transmits the temperature signal to the body 1 through the signal line 2. The body 1 can perform temperature compensation on the measurement result according to the temperature data to improve the measurement accuracy.
[0037] The above shows and describes the basic principle, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.
Claims
1. A high-temperature thickness gauge, comprising a body (1), a signal line (2) and a high-temperature probe (3), wherein the high-temperature probe (3) is in contact with the material to be detected (4), and the high-temperature probe (3) is connected to the body (1) through the signal line (2), characterized in that, The high-temperature probe (3) includes: a housing (31); an internal component (32) disposed within the housing (31), the internal component (32) being provided with a temperature sensing module (324), the inner side of the housing (31) being filled with an acoustic insulation material (312) and a heat insulation material (313), the acoustic insulation material (312) being located inside the heat insulation material (313); a carbon steel pad (33) connected to the outside of the housing (31) and in contact with the heat insulation material (313).
2. The thickness gauge for high temperature according to claim 1, wherein A connection tail pipe (311) is connected to the outside of the housing (31), and the connection tail pipe (311) is sleeved outside the signal line (2).
3. The thickness gauge for high temperature according to claim 2, wherein, The internal component (32) is provided with an electrical adapter (321), and the electrical adapter (321) is located inside the acoustic insulation material (312).
4. The high-temperature thickness gauge according to claim 3, characterized in that, The internal component (32) is provided with a transmitting wafer (322) and a receiving wafer (323), the transmitting wafer (322) and the receiving wafer (323) being located at the junction of the acoustic insulation material (312) and the heat insulation material (313), the transmitting wafer (322) and the receiving wafer (323) being inclined inward at a certain angle, there are two sets of the electrical adapters (321), both sets of the electrical adapters (321) are connected to the signal line (2), one set of the electrical adapters (321) is connected to the transmitting wafer (322), and the other set of the electrical adapters (321) is connected to the receiving wafer (323).
5. The thickness gauge for high temperature according to claim 1, wherein The temperature sensing module (324) is located inside the heat insulation material (313) and in contact with the carbon steel pad (33), and the temperature sensing module (324) is connected to the signal line (2).