Silicon wafer positioning device and contact type exposure machine

Abstract

The utility model provides a silicon wafer positioning device and a contact type exposure machine, and relates to the technical field of photoetching. The silicon wafer positioning device comprises a wafer bearing table and a plurality of positioning pin assemblies, the plurality of positioning pin assemblies are installed on the wafer bearing table, the plurality of positioning pin assemblies are arranged on a preset path at intervals, and a to-be-positioned channel for a silicon wafer body to enter and exit is formed between the two positioning pin assemblies located on the outermost side in the plurality of positioning pin assemblies; the preset path coincides with the outer edge of the silicon wafer body. According to the structural design of the positioning device, positioning of the silicon wafer body is achieved through cooperation of the multiple positioning pin assemblies, the positioning positions of the silicon wafer body each time are kept consistent, the positioning operation is simple, the efficiency is high, and the photoetching cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of lithography, and more specifically, to a silicon wafer positioning device and a contact exposure machine. Background Art

[0002] In the prior art, in a contact exposure machine, a photomask is fixed on a mask holder, and the mask holder is fixed on a machine table by a mechanical clamping method, so that when exposing on a lithography top plate, it can be ensured that the silicon wafer is in close contact with the photomask, thereby ensuring that the pattern on the photomask can be copied onto the silicon wafer one-to-one. However, in the actual use process, since the silicon wafer needs to be manually placed on the top surface of a wafer stage during loading, the top surface of the wafer stage in the prior art is a flat surface, and only the reference line provided on the top surface of the wafer stage is used as the positioning for placing the silicon wafer. There are great differences in the initial positions of the silicon wafers each time they are placed, resulting in a long alignment time and affecting the working efficiency. Summary of the Utility Model

[0003] An object of the utility model is to provide a silicon wafer positioning device and a contact exposure machine, which can shorten the silicon wafer positioning time and improve the lithography working efficiency.

[0004] The embodiments of the utility model are implemented as follows:

[0005] In a first aspect, the utility model provides a silicon wafer positioning device, including:

[0006] A wafer stage and a plurality of positioning pin assemblies, the plurality of positioning pin assemblies are all installed on the wafer stage, the plurality of positioning pin assemblies are arranged at intervals on a preset path, and a channel for the silicon wafer body to enter and exit to be positioned is formed between the two positioning pin assemblies located on the outermost sides among the plurality of positioning pin assemblies; the preset path coincides with the outer edge of the silicon wafer body.

[0007] In an optional embodiment, a first positioning line segment for positioning the side plane of the silicon wafer body is provided on the wafer stage, and two of the plurality of positioning pin assemblies fall on the first positioning line segment.

[0008] Based on the above solution, under the guidance of the first positioning line segment, the position of the silicon wafer body can be adjusted by referring to the position of the first positioning line segment before placing the silicon wafer body, so that the silicon wafer body can be placed on the wafer stage in a correct posture, saving the steps of repeatedly adjusting the position of the silicon wafer body relative to the wafer stage and improving the operation efficiency.

[0009] In an optional embodiment, a second positioning line segment perpendicular to the first positioning line segment is provided on the wafer stage, and two of the plurality of positioning pin assemblies are arranged at intervals in the extending direction of the second positioning line segment.

[0010] Based on the above solution, through the cooperation of the first positioning line segment and the second positioning line segment, the attitude adjustment of the silicon wafer body can be quickly achieved. Moreover, combined with multiple positioning pin assemblies distributed at intervals, while ensuring the quick positioning of the silicon wafer body, it can be positioned at the same position each time, improving the positioning efficiency.

[0011] In an alternative embodiment, the positioning pin assembly is arranged as a telescopic structure to adapt to the positioning of silicon wafer bodies with different thicknesses.

[0012] Based on the above solution, due to the different thicknesses of the silicon wafer bodies, when the height of the positioning pin assembly is relatively low, it cannot effectively position the silicon wafer body. When the height of the positioning pin assembly is relatively high, when the photomask is attached to the silicon wafer body, the positioning pin assembly is likely to interfere with the photomask, scratching the photomask and causing equipment failures. Therefore, the positioning pin assembly is arranged as a telescopic structure. During the positioning stage, the height of the positioning pin assembly is relatively high, and it can achieve the positioning of silicon wafer bodies with different thicknesses. During the photolithography stage, when the photomask approaches the silicon wafer body, the positioning pin assembly shortens and the height decreases, which can adapt to the thickness of the silicon wafer body, thus avoiding interference with the photomask and being less likely to scratch the photomask.

[0013] In an alternative embodiment, the positioning pin assembly includes a positioning pin and an elastic member. The positioning pin is slidably mounted on the wafer stage, and the elastic member is clamped between the positioning pin and the wafer stage, and is used to make the positioning pin have a tendency to move away from the wafer stage.

[0014] Based on the above solution, in the initial state, the height of the protruding positioning pin is relatively high, and it can better position the silicon wafer body. When the photomask is attached to the silicon wafer body, the photomask can press the positioning pin to make it automatically descend, and the positioning pin can automatically descend to a position flush with the silicon wafer body, which is convenient for operation.

[0015] In an alternative embodiment, the positioning pin assembly further includes a fixing sleeve, and the fixing sleeve is mounted on the wafer stage; the positioning pin is slidably matched with the fixing sleeve, and the elastic member is clamped between the positioning pin and the fixing sleeve.

[0016] Based on the above solution, the positioning pin assembly is set as an independent module, and by connecting the fixing sleeve to the wafer stage, the installation and cooperation of the positioning pin relative to the wafer stage can be achieved, which is convenient for disassembly and assembly, inspection and replacement.

[0017] In an alternative embodiment, the fixed sleeve is provided with a guiding hole, which includes a first hole section and a second hole section that are connected. The aperture of the first hole section is smaller than that of the second hole section. The positioning pin includes a connected positioning cylinder and an anti - detachment foot. The positioning cylinder is slidably installed in the first hole section, and the anti - detachment foot is located in the second hole section. The elastic member is connected to both the positioning cylinder and the fixed sleeve, and the elastic member is used to make the anti - detachment foot have a tendency to fit against the top wall of the second hole section.

[0018] Based on the above - mentioned solution, in the initial state, the elastic member presses the anti - detachment foot tightly against the top wall of the second hole section. At this time, the length of the positioning cylinder extending out of the fixed sleeve is the longest, and it can play a positioning role for silicon wafer bodies of different thicknesses. Moreover, due to the cooperation structure between the anti - detachment foot and the fixed sleeve, the positioning pin will not come out of the fixed sleeve, ensuring safe use.

[0019] In an alternative embodiment, the anti - detachment foot is arranged in an annular structure.

[0020] Based on the above - mentioned solution, the contact area between the anti - detachment foot and the fixed sleeve is large, and the limiting effect is good.

[0021] In an alternative embodiment, the elastic member is arranged as a spring.

[0022] Based on the above - mentioned solution, the elastic member has a simple structure, low cost, and a long service life.

[0023] In a second aspect, the present utility model provides a contact exposure machine, which includes:

[0024] The silicon wafer positioning device according to any one of the foregoing embodiments.

[0025] The beneficial effects of the embodiments of the present utility model are:

[0026] To sum up, for the silicon wafer positioning device provided in this embodiment, by surrounding a positioning area with multiple positioning pin assemblies, after placing the silicon wafer body on the wafer supporting table and applying force to the silicon wafer body, the silicon wafer body can be pushed from the outside of the channel towards the position where the multiple positioning pin assemblies are located. When the silicon wafer body is in contact with all the multiple positioning pin assemblies, the position of the silicon wafer body is located by relying on the cooperation of the multiple positioning pin assemblies. The position of the silicon wafer body for each positioning remains consistent, and the positioning operation is simple, with high efficiency, reducing the lithography cost. Description of the Drawings

[0027] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the accompanying drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following accompanying drawings only show some embodiments of the present utility model and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant accompanying drawings can be obtained based on these drawings.

[0028] Figure 1 Schematic diagram of the silicon wafer positioning device according to the embodiment of the present utility model;

[0029] Figure 2 Side view of the silicon wafer positioning device according to the embodiment of the present utility model;

[0030] Figure 3 Schematic diagram of the first positioning pin assembly according to the embodiment of the present utility model.

[0031] Icon:

[0032] 001 - Preset path; 100 - Wafer stage; 101 - First positioning line segment; 102 - Second positioning line segment; 200 - First positioning pin assembly; 210 - Fixed sleeve; 211 - Guide hole; 212 - First hole segment; 213 - Second hole segment; 220 - Positioning pin; 221 - Positioning cylinder; 222 - Anti - detachment foot; 230 - Elastic member; 300 - Second positioning pin assembly; 400 - Third positioning pin assembly; 500 - Fourth positioning pin assembly. Detailed implementation manners

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents the selected embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present utility model.

[0035] It should be noted that: Similar reference numerals and letters denote similar items in the following accompanying drawings. Therefore, once an item is defined in one accompanying drawing, it does not need to be further defined and explained in subsequent accompanying drawings.

[0036] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be construed as indicating or implying relative importance.

[0037] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0038] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0039] In the prior art, the silicon wafer is directly placed on the wafer stage 100, and the edge positioning is carried out by using the marking lines provided on the wafer stage 100. The manual operation efficiency is low, the error is large, and the positioning time is long.

[0040] In view of this, the designer provides a silicon wafer positioning device with low positioning operation difficulty, small positioning error and high positioning operation efficiency.

[0041] Please combine Figure 1 In this embodiment, the silicon wafer positioning device includes a wafer stage 100 and a plurality of positioning pin assemblies. The plurality of positioning pin assemblies are all installed on the wafer stage 100. The plurality of positioning pin assemblies are arranged at intervals on a preset path 001. A channel for the silicon wafer body to enter and exit to be positioned is formed between the two positioning pin assemblies located on the outermost sides among the plurality of positioning pin assemblies; the preset path 001 coincides with the outer edge of the silicon wafer body.

[0042] Continuing from the above, the usage method of the silicon wafer positioning device provided in this embodiment is as follows:

[0043] A positioning area is formed by multiple positioning pin assemblies. After the silicon wafer body is placed on the wafer stage 100, a force is applied to the silicon wafer body, which can push the silicon wafer body from the outside of the channel towards the position where the multiple positioning pin assemblies are located. When the silicon wafer body is in contact with all the multiple positioning pin assemblies, the position of the silicon wafer body is positioned by the cooperation of the multiple positioning pin assemblies at this time. The position of the silicon wafer body is kept consistent each time it is positioned, and the positioning operation is simple, with high efficiency, reducing the lithography cost.

[0044] The following embodiments illustrate the detailed structure of the silicon wafer positioning device by way of example.

[0045] It should be noted that the shape of the silicon wafer body is set as required, and the arrangement mode of the multiple positioning pin assemblies is adjusted according to the shape of the silicon wafer body as required. In this embodiment, an oval wafer is taken as an example for illustration, and a flat portion is provided on the edge of the silicon wafer body. In this way, the outer edge contour of the silicon wafer body is a combination of a straight line and an arc, and the two ends of the arc are respectively connected to the two ends of the straight line to form an annular edge.

[0046] Please refer to Figures 1 - 3 , in this embodiment, optionally, the silicon wafer positioning device includes a wafer stage 100, a first positioning pin assembly 200, a second positioning pin assembly 300, a third positioning pin assembly 400, and a fourth positioning pin assembly 500. The first positioning pin assembly 200, the second positioning pin assembly 300, the third positioning pin assembly 400, and the fourth positioning pin assembly 500 are all installed on the wafer stage 100 and are arranged at intervals in sequence along a preset path 001, and the preset path 001 coincides with the shape of the outer edge of the silicon wafer body. The first positioning pin assembly 200 and the fourth positioning pin assembly 500 are located on the outermost side, and a channel for the silicon wafer body to enter and exit is defined between the two. It should be understood that the number of positioning pin assemblies is selected as required and is not limited to four.

[0047] Please refer to Figure 1 , optionally, a first positioning line segment 101 and a second positioning line segment 102 are provided on the wafer stage 100, and the extension lines of the first positioning line segment 101 and the second positioning line segment 102 are perpendicular. The position where the first positioning line segment 101 is located corresponds to the line segment formed by the orthographic projection of the flat portion of the silicon wafer body on the wafer stage 100, and the length of the first positioning line segment 101 is greater than the length of the flat portion of the silicon wafer body. The first positioning pin assembly 200 and the second positioning pin assembly 300 are arranged in the extending direction of the first positioning line segment 101. The second positioning line segment 102 is tangent to the vertex corresponding to the long axis of the silicon wafer body. The third positioning pin assembly 400 and the fourth positioning pin assembly 500 are arranged in the extending direction of the second positioning line segment 102.

[0048] By setting the first positioning line segment 101 and the second positioning line segment 102, it is possible to adjust the position of the silicon wafer body relative to the wafer stage 100 before placing the silicon wafer body, avoid placing the silicon wafer body on the wafer stage 100 in a wrong posture, reduce the steps of repeatedly adjusting the posture of the silicon wafer body, and improve the operation efficiency.

[0049] Moreover, by setting the first positioning line segment 101 and the second positioning line segment 102, it is possible to provide an accurate position for installing the positioning pin assembly on the wafer stage 100. The position of the positioning pin assembly is accurate, and the effect of positioning the silicon wafer body is good.

[0050] In this embodiment, optionally, the structures of the first positioning pin assembly 200, the second positioning pin assembly 300, the third positioning pin assembly 400, and the fourth positioning pin assembly 500 can be set to be the same. To avoid repetitive and cumbersome narration, in this embodiment, the first positioning pin assembly 200 is taken as an example for illustration.

[0051] Optionally, the first positioning pin assembly 200 is set to be a telescopic structure to adapt to the positioning of silicon wafer bodies with different thicknesses. Since the thicknesses of the silicon wafer bodies are different, when the height of the positioning pin assembly is relatively low, it cannot effectively position the silicon wafer body. When the height of the positioning pin assembly is relatively high, when the photomask is attached to the silicon wafer body, the positioning pin assembly is likely to interfere with the photomask and scratch the photomask, causing equipment failures. Therefore, the positioning pin assembly is set to be a telescopic structure. During the positioning stage, the height of the positioning pin assembly is relatively high, and it can realize the positioning of silicon wafer bodies with different thicknesses. During the photolithography stage, when the photomask approaches the silicon wafer body, the positioning pin assembly shortens and the height decreases, which can adapt to the thickness of the silicon wafer body, thereby avoiding interference with the photomask and being less likely to scratch the photomask.

[0052] Please combine Figure 3 Optionally, the positioning pin assembly includes a fixed sleeve 210, a positioning pin 220, and an elastic member 230. The fixed sleeve 210 is installed on the wafer stage 100. The positioning pin 220 is slidably engaged with the fixed sleeve 210. The elastic member 230 is clamped between the positioning pin 220 and the fixed sleeve 210 and is used to make the positioning pin 220 have a tendency to move away from the wafer stage 100. When the positioning pin 220 slides relative to the fixed sleeve 210, the length of the positioning pin 220 protruding from the wafer stage 100 can be adjusted. For example, when the positioning pin 220 slides upward, the length of the positioning pin 220 protruding from the wafer stage 100 increases. When the positioning pin 220 slides downward, the length of the positioning pin 220 protruding from the wafer stage 100 decreases. The fixed sleeve 210 can be connected to the wafer stage 100 by screwing. For example, threaded holes are provided on the wafer stage 100, external threads are provided on the outer peripheral surface of the fixed sleeve 210, and the fixed sleeve 210 is screwed and fixed to the threaded holes by using the external threads.

[0053] Further, the fixing sleeve 210 is provided with a guiding hole 211. The guiding hole 211 includes a first hole section 212 and a second hole section 213 that are connected. Both the first hole section 212 and the second hole section 213 can be circular holes, and the aperture of the first hole section 212 is smaller than that of the second hole section 213. The positioning pin 220 includes a connected positioning cylinder 221 and an anti - detachment foot 222. The positioning cylinder 221 is slidably installed in the first hole section 212, and the anti - detachment foot 222 is located in the second hole section 213; the elastic member 230 is connected to both the positioning cylinder 221 and the fixing sleeve 210, and the elastic member 230 is used to make the anti - detachment foot 222 have a tendency to fit against the top wall of the second hole section 213. In the initial state, the elastic member 230 presses the anti - detachment foot 222 against the top wall of the second hole section 213. At this time, the length of the positioning cylinder 221 extending out of the fixing sleeve 210 is the longest, and it can position silicon wafer bodies of different thicknesses. Moreover, due to the cooperation structure between the anti - detachment foot 222 and the fixing sleeve 210, the positioning pin 220 will not fall out of the fixing sleeve 210, ensuring safe use.

[0054] Further, the anti - detachment foot 222 is arranged in an annular structure. The contact area between the anti - detachment foot 222 and the fixing sleeve 210 is large, and the limiting effect is good.

[0055] It should be understood that the elastic member 230 can be set as a spring. The elastic member 230 has a simple structure, low cost, and a long service life.

[0056] Or, in other embodiments, the positioning pin 220 can be directly installed on the carrier table 100 through the elastic member 230.

[0057] Or, in other embodiments, the lower port of the second hole section 213 is set to be open. During assembly, first place the elastic member 230 in the threaded hole on the carrier table 100, and then fix the fixing sleeve 210 to the threaded hole, so that the elastic member 230 is in contact with both the carrier table 100 and the positioning pin 220.

[0058] For the silicon wafer positioning device provided in this embodiment, after the silicon wafer body is placed on the carrier table 100 in a set posture, when the silicon wafer body is pushed, the silicon wafer body contacts multiple positioning pin assemblies at the same time and is limited by the multiple positioning pin assemblies. The position of the silicon wafer body is accurate, the positioning time is short, and the operation efficiency is high.

[0059] This embodiment also provides a contact exposure machine. The contact exposure machine includes a silicon wafer positioning device and has advantages such as high operation efficiency.

[0060] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A silicon wafer positioning device, characterized in that, Comprising: A wafer support table (100) and a plurality of positioning pin assemblies, wherein the plurality of positioning pin assemblies are all installed on the wafer support table (100), the plurality of positioning pin assemblies are arranged at intervals on a preset path (001), and a channel for the wafer body to enter and exit to be positioned is formed between the two positioning pin assemblies located on the outermost sides among the plurality of positioning pin assemblies; the preset path (001) coincides with the outer edge of the wafer body.

2. The wafer positioning device according to claim 1, wherein: A first positioning line segment (101) for positioning the side plane of the wafer body is provided on the wafer support table (100), and two of the plurality of positioning pin assemblies fall on the first positioning line segment (101).

3. The wafer positioning device according to claim 2, wherein: A second positioning line segment (102) perpendicular to the first positioning line segment (101) is provided on the wafer support table (100), and two of the plurality of positioning pin assemblies are arranged at intervals in the extending direction of the second positioning line segment (102).

4. The wafer positioning device according to claim 1, wherein: The positioning pin assembly is arranged as a telescopic structure to adapt to the positioning of wafer bodies with different thicknesses.

5. The wafer positioning device according to claim 4, wherein: The positioning pin assembly includes a positioning pin (220) and an elastic member (230), the positioning pin (220) is slidably installed on the wafer support table (100), and the elastic member (230) is clamped between the positioning pin (220) and the wafer support table (100) for making the positioning pin (220) have a movement tendency away from the wafer support table (100).

6. The wafer positioning device according to claim 5, wherein: The positioning pin assembly further includes a fixing sleeve (210), the fixing sleeve (210) is installed on the wafer support table (100); the positioning pin (220) is slidably matched with the fixing sleeve (210), and the elastic member (230) is clamped between the positioning pin (220) and the fixing sleeve (210).

7. The wafer positioning device according to claim 6, wherein: The fixing sleeve (210) is provided with a guiding hole (211), the guiding hole (211) includes a connected first hole section (212) and a second hole section (213), the aperture of the first hole section (212) is smaller than that of the second hole section (213); the positioning pin (220) includes a connected positioning cylinder (221) and an anti - detachment foot (222), the positioning cylinder (221) is slidably installed in the first hole section (212), and the anti - detachment foot (222) is located in the second hole section (213); the elastic member (230) is connected to both the positioning cylinder (221) and the fixing sleeve (210), and the elastic member (230) is used for making the anti - detachment foot (222) have a movement tendency to fit against the top wall of the second hole section (213).

8. The wafer positioning device according to claim 7, wherein: The anti - detachment foot (222) is arranged in an annular structure.

9. The silicon wafer positioning device according to any one of claims 5 - 8, characterized in that: The elastic member (230) is arranged as a spring.

10. A contact exposure machine, characterized in that, The contact exposure machine includes: The silicon wafer positioning device according to any one of claims 1 - 9.

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