Chip frame straightening detection mechanism
By setting up limit baffles and jamming slots on the mold, combining detection components and detection cameras, the precise positioning of the chip frame is achieved, which solves the damage caused by inadequate placement of the chip frame and improves the pass rate of stamping and cutting.
Patent Information
- Application Number
- CN202422132247.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-08-30
AI Technical Summary
In the prior art, multiple sets of chip frames are prone to be placed inadequately when placed on the mold, resulting in chip damage after stamping, reducing the pass rate of stamping and cutting.
A chip frame alignment detection mechanism is designed. By setting a limit baffle and a jagging slot on the mold, combining the detection components and the detection camera, the chip frame is accurately positioned and automatically recognized, and the indicator light is used to prompt whether it is installed in place.
It improves the positioning accuracy of the chip frame, reduces chip damage, and improves the pass rate of stamping and cutting.
Smart Images
Figure CN223167446U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip packaging, and relates to a detection mechanism, in particular to a chip frame alignment detection mechanism. Background Technique
[0002] The stamping and separation of chips from the chip frame is an important step in the semiconductor packaging process, which involves precisely cutting or stamping the chips from their carriers for subsequent packaging and testing.
[0003] During conventional stamping and separation, the chip frame is placed above the mold, and cutting is performed by the blades on the mold. Multiple chip frames are placed in order, and multiple groups of chip frames can be processed in one stamping, increasing work efficiency.
[0004] However, when multiple groups of chip frames are placed simultaneously, there may be situations such as improper placement, resulting in chip damage after stamping and rendering them unusable. Summary of the Invention
[0005] The purpose of the utility model is to provide a chip frame alignment detection mechanism with accurate positioning and individual alarm for the problems existing in the prior art.
[0006] The purpose of the utility model can be achieved by the following technical solutions: A chip frame alignment detection mechanism, characterized in that it includes a mold body composed of an upper mold and a lower mold. A number of frame installation positions are evenly distributed on the lower mold. A limiting baffle is provided on the frame installation position, and a clamping groove symmetric to the center of the limiting baffle is provided on the frame installation position. A detection component is provided on one side of the mold body. A clamping plate is provided on the detection component. A number of installation cavities are provided on the clamping plate. Detection components are provided on the installation cavities. A detection camera is provided at the bottom of the detection component. A number of indicator lights are provided at the top of the detection component. A driving unit is provided on the detection component. Positioning cavities and positioning posts are provided on both the upper mold and the lower mold. An extended positioning post is provided on the clamping plate.
[0007] In the above chip frame alignment detection mechanism, a telescopic cylinder is provided on the driving unit, and a support column is provided on the telescopic cylinder. A rotary bearing is provided on the support column, and the clamping plate is fixed to the rotary bearing.
[0008] In the above chip frame alignment detection mechanism, a limiting post is provided on the clamping plate, and a limiting plate is provided on the support column.
[0009] In the above chip frame alignment detection mechanism, a handle is provided on the clamping plate, and a start button is provided on the handle.
[0010] Compared with the prior art, the chip frame alignment detection mechanism of the present invention realizes positioning by engaging the positioning on the clamping plate with the positioning cavity on the lower die, aligns the detection camera with the edge of the chip frame, identifies whether the chip frame is installed in place by shooting and comparison, and prompts whether it is qualified through an indicator light, reducing the problem of low qualification rate caused by conventional operations. Brief Description of the Drawings
[0011] Figure 1 is a schematic structural diagram of the chip frame alignment detection mechanism of the present invention.
[0012] Figure 2 is a schematic structural diagram of the chip frame alignment detection mechanism of the present invention.
[0013] In the figure, 1, positioning column; 2, limit plate; 3, installation cavity; 4, limit column; 5, upper die; 6, die body; 7, indicator light; 8, detection component; 9, clamping groove; 10, lower die; 11, frame installation position; 12, limit baffle; 13, lengthened positioning column; 14, clamping plate; 15, telescopic cylinder; 16, support column; 17, rotary bearing; 18, handle; 19, start button; 20, drive unit; 21, detection camera; 22, positioning cavity. Detailed Embodiment
[0014] The following are specific embodiments of the present invention and in combination with the drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.
[0015] As Figure 1 , 2 shown, the chip frame alignment detection mechanism of the present invention includes a die body 6 composed of an upper die 5 and a lower die 10. A plurality of frame installation positions 11 are evenly distributed on the lower die 10. A limit baffle 12 is provided on the frame installation position 11, and a clamping groove 9 symmetric to the center of the limit baffle 12 is provided on the frame installation position 11. A detection component 8 is provided on one side of the die body 6. A clamping plate 14 is provided on the detection component 8. A plurality of installation cavities 3 are provided on the clamping plate 14. Detection components 8 are provided on the installation cavities 3. A detection camera 21 is provided at the bottom of the detection component 8. A plurality of indicator lights 7 are provided at the top of the detection component 8. A drive unit 20 is provided on the detection component 8. Positioning cavities 22 and positioning columns 1 are provided on both the upper die 5 and the lower die 10. A lengthened positioning column 13 is provided on the clamping plate 14. After the frame is set on the frame installation position 11, the clamping plate 14 is controlled to move above the lower die 10 and positioned through the positioning cavity 22 and the positioning column 1. The detection camera 21 scans the sharp corners of the frame and the sharp corners of the clamping groove 9, and automatically identifies whether the frame is installed in place. Different indicator lights 7 prompt whether it is installed in place.
[0016] Preferably, the driving unit 20 is provided with a telescopic cylinder 15 , and the telescopic cylinder 15 is provided with a support column 16 , the support column 16 is provided with a rotary bearing 17 , and the clamping plate 14 is fixed to the rotary bearing 17 .
[0017] Preferably, a limiting column 4 is provided on the clamping plate 14 , and a limiting plate 2 is provided on the supporting column 16 .
[0018] Preferably, a handle 18 is provided on the clamping plate 14, and a start button 19 is provided on the handle 18. The start button 19 is used to activate the cylinder to lift the clamping plate 14, which is manually rotated and positioned by the limit column 4 against the limit plate 2. The clamping plate 14 is lowered when it is released.
[0019] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present invention or exceeding the scope defined by the appended claims.
[0020] Although this document frequently uses terms such as positioning column 1, limiting plate 2, mounting cavity 3, limiting column 4, upper mold 5, mold body 6, indicator light 7, detection assembly 8, snap-in groove 9, lower mold 10, frame mounting position 11, limiting baffle 12, extended positioning column 13, snap-in plate 14, telescopic cylinder 15, support column 16, rotary bearing 17, handle 18, start button 19, drive unit 20, detection camera 21, and positioning cavity 22, the use of other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the present invention; interpreting them as any additional limitations is contrary to the spirit of the present invention.
Claims
1. Chip frame alignment detection mechanism, characterized in that It includes a mold body (6) composed of an upper mold (5) and a lower mold (10). There are several frame mounting positions (11) evenly distributed on the lower mold (10). A limit baffle (12) is provided on the frame mounting position (11), and a clamping groove (9) centrosymmetric with the limit baffle (12) is provided on the frame mounting position (11). A detection component (8) is provided on one side of the mold body (6). A clamping plate (14) is provided on the detection component (8). There are several installation cavities (3) opened on the clamping plate (14). Detection components (8) are provided on the installation cavities (3). A detection camera (21) is provided at the bottom of the detection component (8). Several indicator lights (7) are provided at the top of the detection component (8). A driving unit (20) is provided on the detection component (8). Positioning cavities (22) and positioning columns (1) are provided on both the upper mold (5) and the lower mold (10). An extended positioning column (13) is provided on the clamping plate (14).
2. The chip frame alignment detection mechanism according to claim 1, characterized in that, A telescopic cylinder (15) is provided on the driving unit (20), and a support column (16) is provided on the telescopic cylinder (15). A rotary bearing (17) is provided on the support column (16). The clamping plate (14) is fixed to the rotary bearing (17).
3. The chip frame alignment detection mechanism according to claim 2, characterized in that: A limit column (4) is provided on the clamping plate (14), and a limit plate (2) is provided on the support column (16).
4. The chip frame alignment detection mechanism according to claim 1, characterized in that A handle (18) is provided on the clamping plate (14), and a start button (19) is provided on the handle (18).