Chip packaging and fixing device

Abstract

The utility model provides a chip packaging and fixing device. The chip packaging fixing device is used for fixing a substrate with a chip on the surface, and comprises a carrier used for carrying the substrate, the carrier is provided with a plurality of first magnetic parts, the surface of the carrier is provided with at least one substrate groove, and the substrate groove is used for placing the substrate; the carrier comprises a plurality of first magnetic parts, the cover plate is provided with a plurality of second magnetic parts, the second magnetic parts and the first magnetic parts can attract each other so that the carrier and the cover plate can be matched to fix the peripheral area of the substrate, and the surface of the cover plate is provided with at least one first opening used for exposing a chip on the surface of the substrate. According to the technical scheme, the second magnetic part is additionally arranged in the cover plate, so that the magnetic attraction force of the chip packaging fixing device is improved, the warping of the substrate is effectively controlled, the flip chip and pseudo soldering are avoided, and the yield of chip packaging is improved. Wherein the magnetic parts should be fully distributed on the cover plate as much as possible, so that the magnetic attraction force is improved to the maximum extent.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, and particularly relates to a chip packaging and fixing device. Background Art

[0002] In the prior art for 2.5D advanced packaging products, for products with high warpage, a strong magnetic carrier and a common metal cover plate are usually used in the mounting and reflow process to reduce the warpage effect. However, as the substrate size design becomes larger and the 2.5D chip size becomes larger, the conventional strong magnetic combination (strong magnetic carrier and metal cover plate) can no longer effectively control the substrate warpage, and often still leads to defects such as solder joint bridging and open circuits in flip chip (FC) soldering.

[0003] Therefore, how to improve the substrate warpage and reduce the solder joint bridging and open circuits in flip chip (FC) soldering is a problem that needs to be solved currently. Summary of the Invention

[0004] The technical problem to be solved by the utility model is how to improve the substrate warpage and reduce the solder joint bridging and open circuits in flip chip soldering, and provide a chip packaging and fixing device.

[0005] To solve the above problems, the utility model provides a chip packaging and fixing device for fixing a substrate with chips on its surface, including: a carrier for carrying the substrate, the carrier having a plurality of first magnetic members, the surface of the carrier having at least one substrate groove for placing the substrate; a cover plate having a plurality of second magnetic members, the second magnetic members being able to attract the first magnetic members to enable the carrier and the cover plate to cooperate to fix the peripheral area of the substrate, and the surface of the cover plate having at least one first opening for exposing the chips on the surface of the substrate.

[0006] In some embodiments, the surface of the cover plate further has a second opening.

[0007] In some embodiments, the second opening is adjacent to the first opening.

[0008] In some embodiments, in the direction of stacking the carrier and the cover plate, the first magnetic members and the second magnetic members are correspondingly arranged.

[0009] In some embodiments, the first magnetic members are embedded in the carrier, and the second magnetic members are embedded in the cover plate.

[0010] In some embodiments, the first opening corresponds to the substrate groove, and the size of the first opening is smaller than the size of the substrate groove.

[0011] In some embodiments, both the first magnetic members and the second magnetic members are magnetic beads.

[0012] In some embodiments, the first magnetic member and the second magnetic member are arranged with a dislocation, and the magnetic array formed by the first magnetic member and the magnetic array formed by the second magnetic member are arranged correspondingly.

[0013] In some embodiments, the cover plate is a metal cover plate, and the first magnetic member can also attract the metal cover plate to enable the carrier and the cover plate to cooperate to fix the peripheral area of the substrate.

[0014] By adding a second magnetic member in the cover plate, the magnetic suction force of the chip packaging fixing device is increased, the warping of the substrate is effectively controlled, the virtual soldering of the flip-chip is avoided, and the yield of the chip packaging is improved. Among them, the second magnetic member should cover the cover plate as much as possible to maximize the magnetic suction force.

[0015] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present invention. Technologies, methods, and devices known to those of ordinary skill in the relevant field may not be discussed in detail, but in appropriate cases, the technologies, methods, and devices should be regarded as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the following briefly introduces the drawings required to be used in the description of the specific embodiments. Obviously, the following drawings are only some specific embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1 Schematic structural diagram of using an existing chip packaging fixing device to fix a substrate.

[0018] Figure 2 Top view of a strong magnetic carrier in an existing chip packaging fixing device.

[0019] Figure 3 Top view of a metal cover plate in an existing chip packaging fixing device.

[0020] Figure 4 Cross-sectional schematic diagram of an embodiment of the chip packaging fixing device of the present invention.

[0021] Figure 5 Top view of an embodiment of the carrier of the chip packaging fixing device of the present invention.

[0022] Figure 6 Top view of an embodiment of the cover plate of the chip packaging fixing device of the present invention.

[0023] Figure 7 Schematic cross-sectional view of a fixed substrate using an embodiment of the chip packaging and fixing device of the present invention. Detailed implementation manners

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0025] Please refer to Figures 1 to 3 , wherein Figure 1 is a schematic structural view of a fixed substrate using an existing chip packaging and fixing device, Figure 2 is a top view of a strong magnetic carrier in the existing chip packaging and fixing device, Figure 3 is a top view of a metal cover plate in the existing chip packaging and fixing device, wherein Figure 1 the side view of the strong magnetic carrier shown in Figure 2 is a cross-sectional view along the AA' direction in Figures 1 to 3 . As shown in Figures 1 to 3 , the existing chip packaging and fixing device includes: a strong magnetic carrier 11 and a metal cover plate 12. During the mounting and reflow process, the substrate 10 is located between the strong magnetic carrier 11 and the metal cover plate 12. The surface of the strong magnetic carrier 11 has a plurality of small magnetic beads 110, and the small magnetic beads 110 can magnetically attract the metal cover plate 12, so that the metal cover plate 12 can press down the edge of the substrate 10, thereby preventing the substrate 10 from warping during the packaging process. However, as the size design of the substrate 10 becomes larger and larger, the existing chip packaging and fixing device can no longer control the warping of the substrate 10.

[0026] To solve the above problems, the present invention provides a chip packaging and fixing device. Please refer to Figures 4 to 6 , wherein Figure 4 is a schematic cross-sectional view of an embodiment of the chip packaging and fixing device of the present invention, Figure 5 is a top view of an embodiment of the carrier of the chip packaging and fixing device of the present invention, Figure 6 is a top view of an embodiment of the cover plate of the chip packaging and fixing device of the present invention, Figure 7 is a schematic cross-sectional view of a fixed substrate using an embodiment of the chip packaging and fixing device of the present invention. Among them, in Figure 4 and Figure 7 , a chip packaging and fixing device is schematically shown. Among them, Figure 4 and Figure 7 the side view of the carrier shown in Figure 5Cross-sectional view along the direction of BB' Figure 4 and Figure 7 The side view of the cover plate shown in Figure 6 is a cross-sectional view along the direction of CC'. The chip packaging fixing device is used to fix a substrate with a chip on its surface, as Figures 4 to 7 shown. The chip packaging fixing device includes: a carrier 41 and a cover plate 42. The carrier 41 is used to carry the substrate. The carrier 41 has a plurality of first magnetic members 410. The surface of the carrier 41 has at least one substrate groove 411 for placing the substrate. The cover plate 42 has a plurality of second magnetic members 420. The second magnetic members 420 can attract the first magnetic members 410 to cooperate with each other so that the carrier 41 and the cover plate 42 can cooperate to fix the peripheral area of the substrate. The surface of the cover plate 42 has at least one first opening 421 for exposing the chip on the surface of the substrate.

[0027] When it is necessary to use the chip packaging fixing device to fix the substrate with the chip, first place the substrate on the substrate groove 411 of the carrier 41, and then press the cover plate 42 on the substrate. The first magnetic members 410 and the second magnetic members 420 attract each other, so that the cover plate 42 can press down on the substrate, thereby realizing the fixation of the substrate. Among them, the cover plate 42 only presses the edge of the substrate, and the area of the substrate with the chip is exposed to the first opening 421. The above technical solution enhances the fixing ability of the chip packaging fixing device by adding the second magnetic members 420 in the cover plate 42 and using the strong magnetic attraction between the first magnetic members 410 and the second magnetic members 420, and can effectively control the warping of the substrate, avoid the virtual soldering of the flip-chip, and improve the yield of chip packaging. Among them, the second magnetic members 420 should cover the cover plate as much as possible to maximize the magnetic attraction.

[0028] Since the cover plate 42 is relatively thin and affected by the embedding of a plurality of the second magnetic members 420 in the cover plate 42, the cover plate 42 will be deformed during high-temperature welding, resulting in poor pressing and a decrease in the actual suction effect. To solve the above problems, in some embodiments, the surface of the cover plate 42 also has a second opening 422. Adding the second opening 422 to the cover plate 42 releases the stress of the cover plate 42, and can ensure that the cover plate 42 still remains flat at high temperatures, maximizing the suction effect brought by the second magnetic members 420, thereby improving the welding effect.

[0029] In some embodiments, the second opening 422 is disposed adjacent to the first opening 421. Specifically, in this embodiment, the cover plate 42 includes six rectangular first openings 421, and the first openings 421 are arranged in an array of three rows and two columns; there are two second openings 422, which are located between two adjacent columns of the first openings 421, and both ends of the strip-shaped second opening 422 extend to be flush with the edge of the array of the first openings 421 to buffer the deformation caused by high-temperature welding in the first openings 421.

[0030] In some embodiments, in the stacking direction of the carrier 41 and the cover plate 42, the first magnetic member 410 and the second magnetic member 420 are correspondingly arranged. The first magnetic member 410 and the second magnetic member 420 are arranged in one-to-one correspondence, which can minimize the distance between the first magnetic member 410 and the second magnetic member 420, so that the magnetic attraction force between the first magnetic member 410 and the second magnetic member 420 reaches the maximum, thereby avoiding warping of the substrate and improving the welding effect.

[0031] In some embodiments, the first magnetic member 410 is embedded in the carrier 41, and the second magnetic member 420 is embedded in the cover plate 42. In other embodiments, the first magnetic member 410 and the second magnetic member 420 may also be respectively disposed on the surfaces of the carrier 41 and the cover plate 42 close to each other.

[0032] In some embodiments, the number of the first magnetic member 410 and the second magnetic member 420 should be as many as possible to increase the magnetic attraction force between the carrier 41 and the cover plate 42.

[0033] In some embodiments, the substrate groove 411 is rectangular, and four first magnetic members 410 are disposed at each edge of the substrate groove 411.

[0034] In some embodiments, the first opening 421 and the substrate groove 411 are correspondingly arranged, and the size of the first opening 421 is smaller than the size of the substrate groove 411. The size of the first opening 421 should be smaller than the size of the substrate, so that the cover plate 42 at the edge of the first opening 421 presses on the edge of the substrate to cooperate with the carrier 41 to fix the substrate.

[0035] In some embodiments, a bump 423 is provided on the lower surface of the cover plate 42 at the edge of the first opening 421. When fixing the substrate, the bump 423 can be inserted into the substrate groove 411 to a certain depth to further increase the pressure of the cover plate 42 on the edge of the substrate. In some embodiments, both the first magnetic member 410 and the second magnetic member 420 are magnetic beads.

[0036] In some embodiments, the cover plate 42 is a metal cover plate, and the first magnetic member 410 can also attract the metal cover plate to enable the carrier 41 and the cover plate 42 to cooperate to fix the peripheral area of the substrate. The material of the cover plate 42 is preferably a magnetic material such as iron, cobalt, or nickel, so that the first magnetic member 410 can not only attract the second magnetic member 420 but also attract the cover plate 42, further enhancing the magnetic attraction force between the cover plate 42 and the carrier 41.

[0037] In some embodiments, the first magnetic member 410 and the second magnetic member 420 are arranged in a staggered manner, and the magnetic array formed by the first magnetic member 410 and the magnetic array formed by the second magnetic member 420 are arranged correspondingly.

[0038] As Figure 7 shown, when the chip packaging fixing device fixes the substrate, the substrate 70 is placed in the substrate groove 711 of the carrier 71. The cover plate 72 is covered on the upper surface of the carrier 71. A plurality of second magnetic members 720 are embedded in the cover plate 72. At least one first opening 721 is formed on the surface of the cover plate 72, and the first opening 721 exposes the upper surface of the substrate 70. The chip 73 is flip-chip mounted on the surface of the substrate 70 and is located within the first opening 721.

[0039] In some embodiments, the chip 73 is flip-chip mounted on the surface of the substrate 70 through solder balls 74.

[0040] In some embodiments, the first magnetic member 710 is arranged around the substrate groove 711; the second magnetic member 720 is arranged around the first opening 721 to achieve the maximum magnetic attraction force near the substrate 70, control the warping of the substrate 70, avoid virtual soldering in flip-chip mounting of the chip, and improve the yield of chip packaging. The number of the first magnetic member 710 and the second magnetic member 720 should be as large as possible to increase the magnetic attraction force between the carrier 71 and the cover plate 72.

[0041] In some embodiments, the substrate groove 711 is rectangular, and 4 of the first magnetic members 710 are arranged at each edge of the substrate groove 711.

[0042] In some embodiments, the first opening 721 is correspondingly arranged with the substrate groove 711, and the size of the first opening 721 is smaller than that of the substrate groove 711. The size of the substrate groove 711 should be larger than that of the substrate 70 to accommodate the substrate 70, so that the substrate 70 can be stably placed in the substrate groove 711; the size of the first opening 721 should be smaller than that of the substrate 70, so that the cover plate 72 at the edge of the first opening 72 presses on the edge of the substrate 70 to cooperate with the carrier 71 to fix the substrate 70.

[0043] In some embodiments, both the first magnetic member 710 and the second magnetic member 720 are magnetic beads.

[0044] In some embodiments, the cover plate 72 is made of metal, and even can be a magnetic material such as iron, cobalt, nickel, etc., further enhancing the magnetic attraction between the cover plate 72 and the carrier 71.

[0045] It should be noted that the references to "an embodiment", "embodiments", "exemplary embodiments", "some embodiments", etc. in the specification indicate that the described embodiments may include specific features, structures or characteristics, but each embodiment may not necessarily include the specific feature, structure or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a specific feature, structure or characteristic is described in connection with an embodiment, implementing such a feature, structure or characteristic in connection with other embodiments is within the knowledge of those skilled in the relevant art, whether or not explicitly described.

[0046] Generally, the terms can be understood at least in part from their usage in the context. For example, as used herein, the term "one or more" depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense or can be used to describe a combination of features, structures or characteristics in a plural sense. Similarly, depending at least in part on the context, terms such as "a", "a certain" or "the" can also be understood to express singular usage or plural usage. Additionally, the term "based on" can be understood as not necessarily intended to express a set of exclusive factors, but rather can alternatively, also depending at least in part on the context, allow for the existence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected / coupled" not only refers to one component being directly coupled to another component, but also refers to one component being indirectly coupled to another component through an intermediate component.

[0047] It should be noted that the terms "including" and "having" and their variants involved in the documents of the present utility model are intended to cover non-exclusive inclusion. The terms "first", "second", etc. are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. Unless clearly indicated in the context, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other. Furthermore, in the above description, the description of well-known components and technologies is omitted to avoid unnecessarily confusing the concept of the present utility model. In each of the above embodiments, the focus of each embodiment is on the differences from other embodiments. For the same / similar parts between the embodiments, reference can be made to each other.

[0048] The above are only the preferred embodiments of the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and refinements can still be made, and these improvements and refinements should also be regarded as the protection scope of the present utility model.

Claims

1. A chip packaging and fixing device for fixing a substrate with a chip on its surface, characterized in that, Including: A carrier for carrying the substrate, the carrier having a plurality of first magnetic members, and at least one substrate groove on the surface of the carrier for placing the substrate; A cover plate having a plurality of second magnetic members, the second magnetic members being capable of attracting each other with the first magnetic members so that the carrier and the cover plate can cooperate to fix the peripheral area of the substrate, and at least one first opening on the surface of the cover plate for exposing the chips on the surface of the substrate.

2. The chip package fixing device according to claim 1, wherein The surface of the cover plate further has a second opening.

3. The chip package fixing device according to claim 2, wherein, The second opening is disposed adjacent to the first opening.

4. The chip package fixing device according to claim 1, wherein, In the stacking direction of the carrier and the cover plate, the first magnetic members and the second magnetic members are correspondingly arranged.

5. The chip package fixing device according to claim 1, characterized in that The first magnetic members are embedded in the carrier, and the second magnetic members are embedded in the cover plate.

6. The chip package fixing device according to claim 1, wherein The first opening is correspondingly arranged with the substrate groove, and the size of the first opening is smaller than the size of the substrate groove.

7. The chip package fixing device according to claim 6, wherein A bump is provided on the lower surface of the cover plate at the edge of the first opening. When fixing the substrate, the bump can be inserted into the substrate groove to a certain depth.

8. The chip package fixing device according to claim 1, characterized in that Both the first magnetic members and the second magnetic members are magnetic beads.

9. The chip package fixing device according to claim 1, wherein, The first magnetic members and the second magnetic members are arranged in a staggered manner, and the magnetic array formed by the first magnetic members and the magnetic array formed by the second magnetic members are correspondingly arranged.

10. The chip package fixing device according to claim 1, characterized in that, The cover plate is a metal cover plate, and the first magnetic members can also attract each other with the metal cover plate so that the carrier and the cover plate can cooperate to fix the peripheral area of the substrate.

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