Jacking mechanism for reducing chip damage during die bonding
By designing the lifting mechanism of the lifting plate and threaded rod system, the chip damage problem during crystal solidification process is solved, and higher yield and production efficiency are achieved.
Patent Information
- Application Number
- CN202422087457.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-08-27
AI Technical Summary
During the crystal solidification process, the high-speed operation of the solidification swing arm leads to chip damage, and the prior art is difficult to take into account both the production rate and the yield rate.
A lifting mechanism including a support block and a mounting block is designed to reduce the jitter range of the solid crystal swing arm through a liftable storage plate and threaded rod system, and improve chip recognition accuracy and operation stability.
It reduces the jitter range of the solid crystal swing arm, reduces chip damage, improves yield and production efficiency, and increases the practicality of the device.
Smart Images
Figure CN223167470U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip processing, and specifically relates to a jacking mechanism for reducing chip damage during die bonding. Background Technique
[0002] With the continuous development of semiconductor technology, the size of chips is decreasing day by day while the integration degree is constantly increasing. In the process of chip manufacturing, die bonding is a crucial link, which is directly related to the electrical performance and reliability of the chips. However, in the process of die bonding, in order to pursue efficiency, the transfer rate of chips is often increased by increasing the speed of the die bonding swing arm. However, the die bonding swing arm under high-speed operation is prone to jitter, and when transferring chips, the chips are extremely vulnerable to various factors and damaged, resulting in a decrease in the yield rate and an increase in cost.
[0003] In order to increase the yield rate, relevant staff can only slow down the speed of the die bonding swing arm. However, the slowed-down speed will also reduce the production efficiency within a certain period of time. Therefore, relevant staff use flexible materials such as rubber as the chip base, and then continue to transfer the chips with a die bonding swing arm at a relatively high speed. However, this method cannot significantly improve the yield rate, so that the die bonding device still cannot balance the production speed and the yield rate during use.
[0004] In view of this, a jacking mechanism for reducing chip damage during die bonding is provided to overcome the above defects. Content of the Utility Model
[0005] The purpose of the utility model is to provide a jacking mechanism for reducing chip damage during die bonding to solve the problems raised in the above background technique.
[0006] To solve the above technical problems, a jacking mechanism for reducing chip damage during die bonding provided by the utility model includes a support block and a mounting block. A placing plate is arranged above the mounting block. A driving plate and a guiding insertion rod are arranged on the bottom surface of the placing plate. An installation plate is fixedly installed on the top surface of the support block. A rotatable threaded rod is installed on the inner wall of the installation plate. A threaded moving block is threadedly connected to the outer wall of the threaded rod. A pushing column is fixedly installed on the outer wall of the threaded moving block. A driving groove is formed on the outer wall of the driving plate.
[0007] Furthermore, the pushing column is adapted to the driving groove. The pushing column is in the driving groove in the initial state. The driving plate is fixedly connected to the bottom surface of the placing plate.
[0008] Furthermore, the number of both the driving plate and the pushing column is two, and the two pushing columns are simultaneously in the two driving grooves.
[0009] Further, a docking plate is fixedly installed on the top surface of the support block, the other end of the threaded rod is rotatably connected to the inner wall of the docking plate, and a turning handle is connected to one side of the threaded rod.
[0010] Further, a guiding barrel is fixedly installed on the top surface of the mounting block, and the guiding insertion rod is fixedly installed on the bottom surface of the placing plate.
[0011] Further, the number of the guiding insertion rods and the guiding barrels is four each, the guiding insertion rods are adapted to the guiding barrels, and the four guiding insertion rods are all inside the guiding barrels in the initial state.
[0012] Further, through holes and docking slots are penetrated and opened on the inner walls of the support block and the mounting block.
[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0014] By providing a liftable placing plate, the height of the chip can be raised by the device, so that the chip can be more accurately identified, the moving distance of the die bonding swing arm can be reduced, thereby reducing the jitter amplitude of the die bonding swing arm, reducing the damage of the chip, ensuring the operation rate, and increasing the practicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 is a schematic structural view of the whole of the present utility model;
[0016] Figure 2 is a three-dimensional structural view of the side of the present utility model;
[0017] Figure 3 is a three-dimensional structural view of the front side of the present utility model;
[0018] Figure 4 is a three-dimensional structural view of the bottom of the present utility model.
[0019] In the figure: 1, support block; 2, mounting block; 3, mounting plate; 4, docking plate; 5, guiding barrel; 6, guiding insertion rod; 7, threaded rod; 8, turning handle; 9, placing plate; 10, driving plate; 11, driving groove; 12, pushing column; 13, docking slot; 14, threaded moving block; 15, through hole. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0021] Embodiment 1
[0022] Refer to Figures 1-4 , a lifting mechanism for reducing chip damage during die bonding, including a support block 1 and a mounting block 2. Above the mounting block 2, there is a placement plate 9. On the bottom surface of the placement plate 9, there are a driving plate 10 and a guiding insertion rod 6. On the top surface of the support block 1, there is a fixedly mounted mounting plate 3. Inside the inner wall of the mounting plate 3, there is a rotatable threaded rod 7. Threaded on the outer wall of the threaded rod 7 is a threaded moving block 14. Fixedly mounted on the outer wall of the threaded moving block 14 is a pushing column 12. On the outer wall of the driving plate 10, there is a driving groove 11.
[0023] Furthermore, the pushing column 12 is adapted to the driving groove 11. In the initial state, the pushing column 12 is inside the driving groove 11. The driving plate 10 is fixedly connected to the bottom surface of the placement plate 9. The number of both the driving plate 10 and the pushing column 12 is two. The two pushing columns 12 are simultaneously inside the two driving grooves 11. By setting the two pushing columns 12 to be simultaneously inside the two driving grooves 11, when the threaded rod 7 rotates, the threaded moving block 14 cannot follow the rotation and can only move along the horizontal direction of the threaded rod 7.
[0024] Even further, on the top surface of the support block 1, there is a fixedly mounted docking plate 4. The other end of the threaded rod 7 is rotatably connected to the inner wall of the docking plate 4. On one side of the threaded rod 7, there is a turning handle 8. By setting the threaded rod 7 to be rotatably connected between the mounting plate 3 and the docking plate 4, the rotation process of the threaded rod 7 is made more stable. By setting the turning handle 8, it enables the user to rotate the threaded rod 7 more easily. It should be noted that the turning handle 8 is rotationally connected to the inside of the mounting plate 3 in a damped manner. Therefore, the threaded rod 7 and the turning handle 8 will not easily rotate under non - human force.
[0025] During specific implementation, the main reason for the die bonding swing arm to cause damage to the chip is the jitter of the die bonding swing arm. Therefore, in this utility model, the user can place the chip on the top surface of the placement plate 9. When the die bonding swing arm generates jitter, the user can rotate the turning handle 8. After the turning handle 8 is rotated, it will drive the threaded rod 7 to rotate. After the threaded rod 7 rotates, the threaded moving block 14 threaded on the outer wall of the threaded rod 7 will be driven to move. After the threaded moving block 14 moves, the pushing columns 12 fixedly mounted on both sides of the threaded moving block 14 will also move. The pushing columns 12 are inside the driving groove 11. Therefore, after the pushing columns 12 move horizontally, due to the existence of the driving groove 11, the driving plate 10 and the placement plate 9 will be pushed upward, thus completing the lifting work of the chip.
[0026] After the chip is lifted, its position is easier to be detected, which helps the die bonding swing arm to find the position of the chip more accurately when picking up the chip, reduces the mechanical stress caused by position deviation. At the same time, raising the height of the chip can also improve the operating environment, making the die bonding swing arm move more smoothly when picking up the chip, reducing the jitter caused by the narrow operating space or interference of obstacles. In addition, the device also reduces the distance that the die bonding swing arm needs to move, thereby reducing the amplitude of the jitter of the die bonding swing arm and making the chip not easily damaged.
[0027] By setting the liftable storage board 9, the device can raise the height where the chip is located, so that the chip can be more accurately identified, and can also reduce the distance that the die bonding swing arm needs to move, thereby reducing the amplitude of the jitter of the die bonding swing arm, reducing the damage of the chip, ensuring the operation rate, and increasing the practicability of the device.
[0028] Embodiment 2
[0029] On the basis of Embodiment 1, please refer to Figures 1-4 , a jacking mechanism for reducing chip damage during die bonding. A guide barrel 5 is fixedly installed on the top surface of the mounting block 2. A guide insertion rod 6 is fixedly installed on the bottom surface of the storage board 9. The number of the guide insertion rods 6 and the guide barrels 5 is four. The guide insertion rod 6 is adapted to the guide barrel 5. The four guide insertion rods 6 are all inside the guide barrel 5 in the initial state.
[0030] In addition, through holes 15 and docking slots 13 are penetrated through the inner walls of the support block 1 and the mounting block 2. By setting the docking slot 13, the driving plate 10 can be accommodated inside the docking slot 13. By setting the through hole 15, the guide insertion rod 6 can be accommodated by the through hole 15. The driving plate 10 is adapted to the docking slot 13.
[0031] During specific implementation, during the operation of the device, the guide insertion rod 6 is inside the guide barrel 5, and the guide insertion rod 6 is fixedly connected to the bottom of the storage board 9. During the lifting process of the storage board 9, the four guide insertion rods 6 cooperate with the guide barrel 5 to limit the lifting of the storage board 9 and prevent it from being skewed easily, increasing the stability of the device operation.
[0032] Working principle: The main reason for the damage to the chip by the die bonding swing arm is the jitter of the die bonding swing arm. Therefore, in this utility model, the user can place the chip on the top surface of the placement plate 9. When the die bonding swing arm jitters, the user can rotate the turning handle 8. After the turning handle 8 is rotated, it will drive the threaded rod 7 to rotate. After the threaded rod 7 rotates, the threaded moving block 14 threadedly connected to the outer wall of the threaded rod 7 will be driven to move. After the threaded moving block 14 moves, the push columns 12 fixedly installed on both sides of the threaded moving block 14 will also move. The push columns 12 are located inside the driving groove 11. Therefore, after the push columns 12 move horizontally, due to the existence of the driving groove 11, the driving plate 10 and the placement plate 9 will be pushed upward, thus completing the lifting work of the chip.
[0033] After the chip is lifted, the position of the chip is easier to be found. This helps the die bonding swing arm to more accurately find the position of the chip when picking up the chip, reducing the mechanical stress caused by position deviation. At the same time, raising the height of the chip can also improve the operating environment, making the die bonding swing arm more smooth when picking up the chip, reducing the jitter caused by the narrow operating space or obstacle interference. In addition, the device also reduces the distance that the die bonding swing arm needs to move, thereby reducing the jitter amplitude of the die bonding swing arm and making the chip not easily damaged.
[0034] By setting the liftable placement plate 9, the device can raise the height of the chip, so that the chip can be more accurately identified, and can also reduce the distance that the die bonding swing arm needs to move, thereby reducing the jitter amplitude of the die bonding swing arm, reducing the damage of the chip, ensuring the operation speed, and increasing the practicality of the device.
[0035] During the operation of the device, the guiding insertion rod 6 is inside the guiding barrel 5, and the guiding insertion rod 6 is fixedly connected to the bottom of the placement plate 9. During the lifting process of the placement plate 9, the four guiding insertion rods 6 cooperate with the guiding barrel 5 to limit the lifting of the placement plate 9 and prevent it from easily tilting, increasing the stability of the device operation.
Claims
1. A lifting mechanism for reducing chip damage during die bonding, comprising a support block (1) and a mounting block (2), characterized in that, Above the installation block (2), there is an object placing plate (9). On the bottom surface of the object placing plate (9), there are a driving plate (10) and a guiding insertion rod (6). On the top surface of the support block (1), there is a fixedly installed mounting plate (3). Inside the inner wall of the mounting plate (3), there is a rotatable threaded rod (7). On the outer wall of the threaded rod (7), there is a thread moving block (14) threadedly connected. On the outer wall of the thread moving block (14), there is a fixedly installed pushing column (12). On the outer wall of the driving plate (10), there is a driving groove (11).
2. The lifting mechanism for reducing chip damage during die bonding according to claim 1, characterized in that: The pushing column (12) is adapted to the driving groove (11). The pushing column (12) is in the driving groove (11) in the initial state. The driving plate (10) is fixedly connected to the bottom surface of the object placing plate (9).
3. The lifting mechanism for reducing chip damage during die bonding according to claim 2, wherein: The number of both the driving plate (10) and the pushing column (12) is two. The two pushing columns (12) are both in the two driving grooves (11) at the same time.
4. The lifting mechanism for reducing chip damage during die bonding according to claim 3, characterized in that: On the top surface of the support block (1), there is a fixedly installed docking plate (4). The other end of the threaded rod (7) is rotatably connected to the inner wall of the docking plate (4).
5. The lifting mechanism for reducing chip damage during die bonding according to claim 4, characterized in that: On the top surface of the installation block (2), there is a fixedly installed guiding barrel (5). The guiding insertion rod (6) is fixedly installed on the bottom surface of the object placing plate (9).
6. The lifting mechanism for reducing chip damage during die bonding according to claim 5, wherein: The number of both the guiding insertion rod (6) and the guiding barrel (5) is four. The guiding insertion rod (6) is adapted to the guiding barrel (5).
7. The lifting mechanism for reducing chip damage during die bonding according to claim 6, characterized in that: Through holes (15) and docking slots (13) are penetrated and opened on the inner walls of the support block (1) and the installation block (2).
8. The lifting mechanism for reducing chip damage during die bonding according to claim 7, wherein: On one side of the threaded rod (7), there is a rotating handle (8). The four guiding insertion rods (6) are all in the guiding barrel (5) in the initial state.