Circuit board structure with FPC welded on two sides

Abstract

The utility model relates to a circuit board structure with two sides welded with FPCs, which comprises an FPC board, a buffer layer and a PCBA board, the FPC board comprises a front FPC board and a back FPC board, the front FPC board and the back FPC board are connected through a bending part, the front of the PCBA board is provided with a front welding disc, the back of the PCBA board is provided with a back welding disc, the front FPC board is provided with a welding area corresponding to the front welding disc, and the welding area is welded with the front welding disc. The back FPC board is provided with a welding area corresponding to the back welding disc, the welding area of the back FPC board is welded with the back welding disc after the back FPC board is turned over, and the buffer layer is clamped between the front FPC board and the back FPC board. According to the utility model, the FPC board is extended into the front FPC board and the back FPC board, and then the PCBA board is welded between the folded front FPC board and back FPC board, so that the boundary dimension of the PCBA board can be reduced, and the problem of insufficient space during structural arrangement of a client is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of power battery sampling modules, and particularly relates to a circuit board structure with double-sided welded FPCs. Background Art

[0002] With the rapid development of new energy modules, the client has diversified requirements for the module structure design. The pads between the FPC and the PCBA are welded by hotbar welding, and the welding surfaces of both are designed on the same side. The more the loop traces, the larger the outer dimension of the PCBA. As the client module structure becomes larger and larger, there is not enough space to arrange the outer shape of the PCBA.

[0003] In order to meet the requirements in the case of insufficient structural space and a large number of loops at the client side, it is necessary to design a product structure that reduces the space occupied by the outer dimension of the PCBA when arranging the module structure. Summary of the Invention

[0004] In order to overcome the disadvantages and deficiencies existing in the prior art, the purpose of the utility model is to provide a circuit board structure with double-sided welded FPCs. By extending the FPC board into a front FPC board and a back FPC board, and then welding the PCBA board between the folded front FPC board and the back FPC board, the outer dimension of the PCBA can be reduced by half, effectively solving the requirements in the case of insufficient space during the structural layout at the client side.

[0005] The purpose of the utility model is achieved by the following technical solutions: A circuit board structure with double-sided welded FPCs, comprising an FPC board, a buffer layer, and a PCBA board. The FPC board includes a front FPC board and a back FPC board, and the front FPC board and the back FPC board are connected by a bending part. The front side of the PCBA board is provided with a plurality of front welding pads, and the back side of the PCBA board is provided with a plurality of back welding pads. The front FPC board is provided with a welding area corresponding to the front welding pads and is welded to the front welding pads. The back FPC board is provided with a welding area corresponding to the back welding pads, and after the back FPC board is folded, its welding area is welded to the back welding pads. The buffer layer is sandwiched between the front FPC board and the back FPC board and is located on one side of the PCBA board.

[0006] Further, one side of the PCBA board away from the front welding pads or the back welding pads extends out of the sandwich between the front FPC board and the back FPC board.

[0007] Further, a receiving groove is recessed in the welding area of the front FPC board corresponding to the front welding pad, and a plurality of electric welding holes penetrating the front FPC board are provided in the receiving groove; a receiving groove is recessed in the welding area of the back FPC board corresponding to the back welding pad, and a plurality of electric welding holes penetrating the back FPC board are provided in the receiving groove.

[0008] Further, the PCBA board is provided with a set of first positioning holes penetrating the PCBA board, and the first positioning holes are respectively located on both sides of the front welding pad or the back welding pad.

[0009] Further, the front FPC board and the back FPC board are both provided with second positioning holes corresponding to the first positioning holes.

[0010] Further, one side of the bending part is provided with a notch, and when the front FPC board and the back FPC board are folded relative to each other, the PCBA board clamped inside is not wrapped by the bending part and the notch is exposed on the side close to the notch.

[0011] Further, an extension part is provided on the side of the front FPC board away from the bending part.

[0012] Further, the buffer layer is a foam layer.

[0013] The beneficial effects of the present utility model are as follows: The circuit board structure of the present utility model can reduce the external dimension of the PCBA by half by extending the FPC board into a front FPC board and a back FPC board and then welding the PCBA board between the folded front FPC board and the back FPC board, effectively solving the requirements of the client in the case of insufficient space in the structural layout. Description of the Drawings

[0014] Figure 1 is a perspective view of the present utility model;

[0015] Figure 2 is a perspective view of another angle of the present utility model;

[0016] Figure 3 is a schematic structural diagram when the circuit board structure of the present utility model is unfolded;

[0017] Figure 4 is Figure 3 is a schematic structural diagram of another angle of

[0018] Figure 5 is Figure 4 is an exploded schematic diagram of

[0019] Figure 6 is a schematic structural diagram of the front welding pad of the present utility model;

[0020] Figure 7It is a schematic structural diagram of another perspective of the front welding pad of the present utility model;

[0021] Figure 8 It is a schematic diagram of the front welding pad of the present utility model embedded in the accommodation groove.

[0022] The attached drawing reference numerals are: 1 - FPC board, 11 - front FPC board, 111 - extension part, 12 - back FPC board, 13 - bending part, 14 - welding area, 15 - accommodation groove, 151 - electric welding hole, 16 - second positioning hole, 17 - notch, 2 - buffer layer, 3 - PCBA board, 31 - first positioning hole, 41 - front welding pad, and 42 - back welding pad. Detailed implementation manners

[0023] For the convenience of understanding by those skilled in the art, the present utility model will be further described below in conjunction with the embodiments and the attached Figure 1-8 drawings. The content mentioned in the implementation manners does not limit the present utility model.

[0024] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element.

[0025] When an element is referred to as "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0026] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the attached drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0027] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0028] In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0029] See Figure 1-8, A circuit board structure for double-sided welding FPC, comprising an FPC board 1, a buffer layer 2, and a PCBA board 3. The FPC board 1 includes a front FPC board 11 and a back FPC board 12. The front FPC board 11 and the back FPC board 12 are connected by a bending portion 13. The front side of the PCBA board 3 is provided with a plurality of front welding pads 41, and the back side of the PCBA board 3 is provided with a plurality of back welding pads 42. The front FPC board 11 is provided with a welding area 14 corresponding to the front welding pads 41, and the welding area 14 is welded to the front welding pads 41. The back FPC board 12 is provided with a welding area 14 corresponding to the back welding pads 42, and after the back FPC board 12 is folded over, its welding area 14 is welded to the back welding pads 42. The buffer layer 2 is sandwiched between the front FPC board 11 and the back FPC board 12 and is located on one side of the PCBA board 3; the side of the PCBA board 3 away from the front welding pads 41 or the back welding pads 42 extends out of the sandwich between the front FPC board 11 and the back FPC board 12, and the buffer layer 2 is a foam layer.

[0030] In this embodiment, the PCBA board 3 is provided with a set of first positioning holes 31 penetrating through the PCBA board 3, and the first positioning holes 31 are respectively located on both sides of the front welding pads 41 or the back welding pads 42; the front FPC board 11 and the back FPC board 12 are both provided with second positioning holes 16 corresponding to the first positioning holes 31.

[0031] In this embodiment, the circuit board structure welds the front welding pads 41 and the back welding pads 42 to both sides of the PCBA board 3 by using the hotbar welding process. Align and fit the welding pads on the front side of the PCBA board 3 and the welding area 14 of the front FPC board 11 through the first positioning holes 31, the second positioning holes 16, and an external tooling, and pre-fix to avoid deviation. Then fold the back FPC board 12 along the bending portion 13. Align and fit the welding pads on the back side of the PCBA board 3 through the second positioning holes 16 and the tooling, and pre-fix to avoid deviation. A buffer layer 2 is sandwiched between the folded front FPC board 11 and the back FPC board 12 for buffering, and then hot pressing and hotbar welding are performed, improving the production efficiency and the yield rate; this solution can reduce the external dimension of the PCBA by half, effectively solving the requirements of the client in the case of insufficient space in the structural layout.

[0032] In this embodiment, the welding area 14 of the front FPC board 11 is recessed with a receiving groove 15 corresponding to the front welding pads 41, and a plurality of welding holes 151 penetrating through the front FPC board 11 are provided in the receiving groove 15; the welding area 14 of the back FPC board 12 is recessed with a receiving groove 15 corresponding to the back welding pads 42, and a plurality of welding holes 151 penetrating through the back FPC board 12 are provided in the receiving groove 15.

[0033] In this embodiment, accommodation grooves 15 are respectively provided on the front FPC board 11 and the back FPC board 12 corresponding to the front welding pads 41 and the back welding pads 42, which is conducive to respectively embedding the corresponding front welding pads 41 and the back welding pads 42 in the accommodation grooves 15 and using the provided electric welding holes 151 to perform hot pressing and hot bar welding on the welding area 14, the front welding pads 41 and the back welding pads 42, improving the production efficiency and the yield rate.

[0034] In this embodiment, a notch 17 is provided on one side of the bending part 13. After the front FPC board 11 and the back FPC board 12 are folded relative to each other, the PCBA board 3 clamped inside is not wrapped by the bending part 13 near the notch 17 and the notch 17 is exposed.

[0035] In this embodiment, an extension part 111 is provided on the side of the front FPC board 11 away from the bending part 13 to facilitate welding with an external component.

[0036] The above embodiment is a preferred implementation solution of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present invention is within the protection scope of the present invention.

Claims

1. A circuit board structure for double-sided welding FPC, characterized in that: It includes an FPC board, a buffer layer and a PCBA board. The FPC board includes a front FPC board and a back FPC board. The front FPC board and the back FPC board are connected by a bending part. The front of the PCBA board is provided with a number of front welding pads, and the back of the PCBA board is provided with a number of back welding pads. The front FPC board is provided with a welding area corresponding to the front welding pads and is welded to the front welding pads. The back FPC board is provided with a welding area corresponding to the back welding pads, and after the back FPC board is folded over, its welding area is welded to the back welding pads. The buffer layer is sandwiched between the front FPC board and the back FPC board and is located on one side of the PCBA board.

2. The circuit board structure of a double-sided welded FPC according to claim 1, characterized in that: One side of the PCBA board away from the front welding pads or the back welding pads extends out of the interlayer between the front FPC board and the back FPC board.

3. The circuit board structure of a double-sided welded FPC according to claim 1, characterized in that: The welding area of the front FPC board is recessed with a receiving groove corresponding to the front welding pads, and a number of electric welding holes penetrating the front FPC board are arranged in the receiving groove; the welding area of the back FPC board is recessed with a receiving groove corresponding to the back welding pads, and a number of electric welding holes penetrating the back FPC board are arranged in the receiving groove.

4. The circuit board structure of a double-sided welded FPC according to claim 1, characterized in that: The PCBA board is provided with a set of first positioning holes penetrating the PCBA board, and the first positioning holes are respectively located on both sides of the front welding pads or the back welding pads.

5. The circuit board structure of a double-sided welded FPC according to claim 4, characterized in that: Both the front FPC board and the back FPC board are provided with second positioning holes corresponding to the first positioning holes.

6. The circuit board structure of a double-sided welded FPC according to claim 1, characterized in that: One side of the bending part is provided with a notch, and when the front FPC board and the back FPC board are folded relative to each other, one side of the PCBA board clamped inside and close to the notch is not wrapped by the bending part.

7. The circuit board structure of a double-sided welded FPC according to claim 1, characterized in that: One side of the front FPC board away from the bending part is provided with an extension part.

8. The circuit board structure of a double-sided welded FPC according to claim 1, characterized in that: The buffer layer is a foam layer.

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