Chip pre-splitting board structure
By opening a V-shaped groove at the connection of the PCB board and setting drilling holes between the grooves, the core stress of the plate is damaged, and the problem of tin crack caused by traditional V-CUT plate separation is solved, thereby achieving an efficient and high-quality plate separation process.
Patent Information
- Application Number
- CN202422292162.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-19
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-09-19
AI Technical Summary
The traditional V-CUT plate separation method causes the chip soldering position of the tin crack and open circuit, affecting the quality and user experience of the plate separation.
Open a V-shaped groove at the connection of the PCB board and set up drilling holes between the grooves to destroy the stress of the board core, achieve easy plate separation and avoid tin cracks in the tin ball.
Ensure the quality of the partition board, optimize the user experience, avoid the chip tin ball and tin cracking, and improve the efficiency of the partition board.
Smart Images
Figure CN223168469U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chips, and more specifically, to a chip pre-splitting board structure. Background Art
[0002] A solid state drive (SSD) uses flash memory chips as storage media and reads and writes data through the transmission of electronic signals. Among them, the 2.5-inch K board (small-size 2.5 inches) is applied to device terminals such as laptops and desktop computers and is a widely used storage disk.
[0003] For traditional 2.5-inch K board solid state drives, the boards are joined together by the V-CUT method. V-CUT means using a rotary cutter to roll out a "V" groove on the upper and lower surfaces between the boards. After welding components, the boards are then broken at the "V" groove to achieve the purpose of splitting the boards. Although there are burrs remaining after splitting with this method of joining boards, since the 2.5-inch K board solid state drive needs to be assembled with a housing, burrs are allowed to exist. Secondly, the V-CUT method of joining boards is simple to operate and does not require equipment such as a routing machine. The board splitting can be completed by relying on a simple board splitting jig, with high efficiency and low cost. In addition, the V-CUT method of joining boards is also the most PCB circuit board area-saving method of joining boards, and there is no need for a process board connection between the boards, with extremely low waste.
[0004] As the chip manufacturing process becomes more and more advanced, the performance of the chips has been improved, but the size has become smaller and the diameter of the solder balls has become smaller, showing a trend of developing from 0.5 mm to 0.35 mm, 0.3 mm or smaller. The breaking of the V-CUT split board will cause the PCB circuit board to be slightly bent and deformed, resulting in the solder joints at the solder ball welding positions of the chips being cracked and open-circuited, and the product losing its function.
[0005] In response to this, this solution provides a chip pre-splitting board structure, which solves the problem of the solder joints at the solder ball welding positions of the chips being cracked and open-circuited caused by the current board splitting, thus ensuring both the quality of the board splitting and optimizing the user experience. Content of the Utility Model
[0006] In order to overcome the deficiencies of the prior art, the utility model provides a chip pre-splitting board structure, which solves the problem of the solder joints at the solder ball welding positions of the chips being cracked and open-circuited caused by the current board splitting, thus ensuring both the quality of the board splitting and optimizing the user experience.
[0007] The technical solution adopted by the present utility model to solve its technical problems is as follows: A chip pre-splitting board structure, the improvement lies in that the chip pre-splitting board structure includes a first PCB board, a second PCB board and a third PCB board; the second PCB board is fixedly connected between the first PCB board and the third PCB board; several first top V-grooves and several first bottom V-grooves are provided at the connection between the second PCB board and the first PCB board and at the connection between the second PCB board and the third PCB board, and several first drill holes are provided between the first top V-grooves and the first bottom V-grooves.
[0008] In the above structure, the size of the first top V-groove is adapted to the size of the first bottom V-groove.
[0009] In the above structure, the size of the first top V-groove is slightly larger than the size of the first bottom V-groove.
[0010] In the above structure, the size of the first top V-groove is slightly smaller than the size of the first bottom V-groove.
[0011] In the above structure, the first drill holes are arranged in an array between the first top V-groove and the first bottom V-groove.
[0012] In the above structure, the first PCB board, the second PCB board and the third PCB board all include a board core layer, a copper-clad layer, a copper circuit layer and a solder mask layer; and the first PCB board, the second PCB board and the third PCB board are all designed with a symmetric structure, and from the inside to the outside are the board core layer, the copper-clad layer, the PP board core layer, the copper circuit layer and the solder mask layer.
[0013] In the above structure, the chip pre-splitting board structure further includes a process edge, and the process edge is fixedly connected to the side of the first PCB board away from the second PCB board and the side of the third PCB board away from the second PCB board.
[0014] In the above structure, several second top V-grooves and several second bottom V-grooves are provided at the connection between the process edge and the first PCB board and at the connection between the process edge and the third PCB board, and second drill holes arranged in an array are provided between the second top V-groove and the second bottom V-groove.
[0015] The beneficial effect of the present utility model is as follows: In this solution, several drill holes are added between the first top V-groove and the first bottom V-groove to destroy the stress of the middle board core. The first drill holes do not affect the flatness and connection of the entire panel, but when folding, due to the stress of the middle board core being destroyed by the first drill holes, it can be easily separated, and it is avoided that the first PCB board, the second PCB board and the third PCB board are deformed to cause the chip solder balls to crack and open the circuit, so that both the quality of the board splitting can be ensured and the user experience can be optimized. Description of the Drawings
[0016] Figure 1 is a schematic diagram of the overall structure of a chip pre-splitting board structure of the present utility model;
[0017] Figure 2 is a schematic cross-sectional view of a chip pre-splitting board structure of the present utility model Figure 1 ;
[0018] Figure 3 is a schematic cross-sectional view of a chip pre-splitting board structure of the present utility model Figure 2 ;
[0019] Figure 4 is a schematic cross-sectional view of a chip pre-splitting board structure of the present utility model Figure 3 ;
[0020] Figure 5 is a schematic cross-sectional view of the first PCB board / second PCB board / third PCB board of a chip pre-splitting board structure of the present utility model. Detailed implementation manners
[0021] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.
[0022] The concept, specific structure and technical effects of the present utility model will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings, so as to fully understand the purpose, features and effects of the present utility model. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, other embodiments obtained by those skilled in the art without creative efforts shall fall within the scope of protection of the present utility model. In addition, all the connection / connection relationships involved in the patent do not refer only to the direct connection of components, but refer to the more optimal connection structure that can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present utility model can be combined with each other without conflicting with each other.
[0023] Embodiment 1:
[0024] Referring to Figure 1 and Figure 2 as shown, the present utility model discloses a chip pre-splitting board structure, the chip pre-splitting board structure includes a first PCB board 1, a second PCB board 2 and a third PCB board 3; the second PCB board 2 is fixedly connected between the first PCB board 1 and the third PCB board 3; a plurality of first top V-grooves 5 and a plurality of first bottom V-grooves 6 are opened at the connection between the second PCB board 2 and the first PCB board 1 and at the connection between the second PCB board 2 and the third PCB board 3, and a plurality of first drill holes 7 are arranged between the first top V-grooves 5 and the first bottom V-grooves 6.
[0025] It should be noted that in this embodiment, the first PCB board 1, the second PCB board 2, and the third PCB board 3 form a PCB panel. After production, the PCB panel needs to be separated. To this end, a first top V-groove 5 and a first bottom V-groove 6 are opened at the connection between the first PCB board 1 and the second PCB board 2 and at the connection between the second PCB board 2 and the third PCB board 3, so as to facilitate folding along the first top V-groove 5 and the first bottom V-groove 6 to achieve the purpose of separating the board. In addition, this embodiment also takes into account that during the folding process, the entire PCB panel may be bent because the turntable cutter does not cut the core of the PCB panel when opening the first top V-groove 5 and the first bottom V-groove 6, resulting in the problem of open circuit of the chip solder balls. Therefore, a number of first drill holes 7 are provided between the first top V-groove 5 and the first bottom V-groove 6 to break the stress of the core at the connection between the first PCB board 1 and the second PCB board 2 and at the connection between the second PCB board 2 and the third PCB board 3, so as to achieve easy folding and separation of the board, and avoid the open circuit of the chip solder balls, thereby ensuring the quality of the board separation and optimizing the user experience.
[0026] Refer to Figure 2 As shown, the size of the first top V-groove 5 is adapted to the size of the first bottom V-groove 6.
[0027] It should be noted that in this embodiment, the adaptation of the size of the first top V-groove 5 to the size of the first bottom V-groove 6 helps to ensure uniform stress distribution of the PCB panel during board separation, prevent uneven bending or deformation of the board during board separation, further avoid open circuit of the chip solder balls, further ensure the quality of the board separation, and optimize the user experience.
[0028] Refer to Figure 2 As shown, the first drill holes 7 are arranged in an array between the first top V-groove 5 and the first bottom V-groove 6.
[0029] It should be noted that in this embodiment, the array arrangement of the first drill holes 7 can ensure effective destruction of the stress of the core at the connection between the first PCB board 1 and the second PCB board 2 and at the connection between the second PCB board 2 and the third PCB board 3.
[0030] Refer to Figure 5 As shown, the first PCB board 1, the second PCB board 2, and the third PCB board 3 each include a core layer 11, a copper-clad layer 12, a PP core layer 13, a copper circuit layer 14, and a solder mask layer 15; and the first PCB board 1, the second PCB board 2, and the third PCB board 3 are all designed with a symmetric structure, and from the inside to the outside are the core layer 11, the copper-clad layer 12, the PP core layer 13, the copper circuit layer 14, and the solder mask layer 15 in sequence.
[0031] It should be noted that in this embodiment, the core layer 11 of the board serves as the core layer of the first PCB board 1, the second PCB board 2, and the third PCB board 3. It is usually composed of an insulating material, providing the main thickness and structural stability of the board material; the copper-clad layer 12 covers both sides of the core layer 11 to provide electrical connection and signal conduction; the PP core layer 13 is used to provide additional structural support and isolation, and can enhance the overall strength of the PCB panel; the copper circuit layer 14 is the circuit layer after the copper-clad layer 12 is etched, forming specific circuit paths for connecting different electronic components; the solder mask layer 15 is used for installing and soldering electronic components to ensure the fixation and electrical connection of the components; and the structural designs of the first PCB board 1, the second PCB board 2, and the third PCB board 3 are all symmetric, that is, the hierarchical structure from the inside to the outside remains consistent. Such a symmetric structural design helps to improve the mechanical stability and electrical performance of the first PCB board 1, the second PCB board 2, and the third PCB board 3.
[0032] Refer to Figure 1 As shown, the chip pre-separation board structure further includes a process edge 4, and the process edge 4 is fixedly connected to the side of the first PCB board 1 away from the second PCB board 2 and the side of the third PCB board 3 away from the second PCB board 2.
[0033] It should be noted that in this embodiment, the process edge 4 is an additional edge area added during the manufacturing process of the PCB panel to provide additional structural support, helping to maintain the stability of the PCB panel during the manufacturing process and avoiding deformation or displacement.
[0034] Refer to Figure 2 As shown, a plurality of second top V-grooves 8 and a plurality of second bottom V-grooves 9 are provided at the connection between the process edge 4 and the first PCB board 1 and at the connection between the process edge 4 and the third PCB board 3, and second drill holes 10 are arranged in an array between the second top V-grooves 8 and the second bottom V-grooves 9.
[0035] It should be noted that in this embodiment, a second top V-groove 8 and a second bottom V-groove 9 are formed at the connection between the process edge 4 and the first PCB board 1 and at the connection between the process edge 4 and the third PCB board 3, so as to facilitate folding along the second top V-groove 8 and the second bottom V-groove 9 to achieve the purpose of separating the process edge 4 from the PCB panel. Additionally, similarly, this embodiment also takes into account that during the folding process, the entire PCB panel may be bent because the rotary cutter does not cut the core of the PCB panel when opening the second top V-groove 8 and the second bottom V-groove 9, resulting in the problem of open circuit of the chip solder balls. Therefore, a number of second drill holes 10 are provided between the second top V-groove 8 and the second bottom V-groove 9 to break the stress of the core at the connection between the first PCB board 1 and the process edge 4 and at the connection between the process edge 4 and the third PCB board 3, so as to achieve easy folding and separation of the process edge 4 from the PCB panel, and avoid the open circuit of the chip solder balls, thereby further ensuring the quality of board separation and optimizing the user experience.
[0036] Embodiment 2:
[0037] Referring to Figure 1 and Figure 3 As shown, the present utility model discloses a chip pre-separation board structure, which includes a first PCB board 1, a second PCB board 2, and a third PCB board 3; the second PCB board 2 is fixedly connected between the first PCB board 1 and the third PCB board 3; a number of first top V-grooves 5 and a number of first bottom V-grooves 6 are formed at the connection between the second PCB board 2 and the first PCB board 1 and at the connection between the second PCB board 2 and the third PCB board 3, and a number of first drill holes 7 are provided between the first top V-grooves 5 and the first bottom V-grooves 6.
[0038] It should be noted that in this embodiment, the first PCB board 1, the second PCB board 2, and the third PCB board 3 form a PCB panel. After production, the PCB panel needs to be separated. To this end, a first top V-groove 5 and a first bottom V-groove 6 are opened at the connection between the first PCB board 1 and the second PCB board 2 and at the connection between the second PCB board 2 and the third PCB board 3, so as to facilitate folding along the first top V-groove 5 and the first bottom V-groove 6 to achieve the purpose of separating the board. In addition, this embodiment also considers that during the folding process, the entire PCB panel may be bent because the rotary cutter does not cut the core of the PCB panel when opening the first top V-groove 5 and the first bottom V-groove 6, resulting in the problem of open circuit of the chip solder balls. Therefore, a number of first drill holes 7 are provided between the first top V-groove 5 and the first bottom V-groove 6 to destroy the stress of the core at the connection between the first PCB board 1 and the second PCB board 2 and at the connection between the second PCB board 2 and the third PCB board 3, so as to achieve easy folding and separation of the board, and avoid open circuit of the chip solder balls, thus ensuring the quality of board separation and optimizing the user experience.
[0039] Refer to Figure 3 As shown, the size of the first top V-groove 5 is slightly larger than that of the first bottom V-groove 6.
[0040] It should be noted that in this embodiment, the first top V-groove 5 and the first bottom V-groove 6 are nearly balanced. Considering that in the actual processing process, due to the sharpness of the upper and lower rotary cutters and the difference in the uniformity of the PCB panel material, the size of the first top V-groove 5 may be slightly larger than that of the first bottom V-groove 6. This solution can also set a number of first drill holes 7 between the first top V-groove 5 and the first bottom V-groove 6 to destroy the stress of the core at the connection between the first PCB board 1 and the second PCB board 2 and at the connection between the second PCB board 2 and the third PCB board 3, so as to achieve easy folding and separation of the board.
[0041] Refer to Figure 3 As shown, the first drill holes 7 are arranged in an array between the first top V-groove 5 and the first bottom V-groove 6.
[0042] It should be noted that in this embodiment, the array arrangement of the first drill holes 7 can ensure effective destruction of the stress of the core at the connection between the first PCB board 1 and the second PCB board 2 and at the connection between the second PCB board 2 and the third PCB board 3.
[0043] Refer to Figure 5As shown, the first PCB board 1, the second PCB board 2, and the third PCB board 3 all include a board core layer 11, a copper-clad layer 12, a PP board core layer 13, a copper circuit layer 14, and a solder mask layer 15; and the first PCB board 1, the second PCB board 2, and the third PCB board 3 are all designed with a symmetric structure, and from the inside to the outside are successively the board core layer 11, the copper-clad layer 12, the PP board core layer 13, the copper circuit layer 14, and the solder mask layer 15.
[0044] It should be noted that in this embodiment, the board core layer 11, as the core layer of the first PCB board 1, the second PCB board 2, and the third PCB board 3, is usually composed of an insulating material, providing the main thickness and structural stability of the board; the copper-clad layer 12 covers both sides of the board core layer 11 to provide electrical connection and signal conduction; the PP board core layer 13 is used to provide additional structural support and isolation, and can enhance the overall strength of the PCB panel; the copper circuit layer 14 is the circuit layer after the copper-clad layer 12 is etched, forming specific circuit paths for connecting different electronic components; the solder mask layer 15 is used for installing and soldering electronic components to ensure the fixation and electrical connection of the components; and the structural designs of the first PCB board 1, the second PCB board 2, and the third PCB board 3 are all symmetric, that is, the hierarchical structure from the inside to the outside remains consistent. This symmetric structure design helps to improve the mechanical stability and electrical performance of the first PCB board 1, the second PCB board 2, and the third PCB board 3.
[0045] Refer to Figure 1 As shown, the chip pre-splitting board structure further includes a process edge 4, and the process edge 4 is fixedly connected to the side of the first PCB board 1 away from the second PCB board 2 and the side of the third PCB board 3 away from the second PCB board 2.
[0046] It should be noted that in this embodiment, the process edge 4 is an additional edge area added during the manufacturing process of the PCB panel to provide additional structural support, helping to maintain the stability of the PCB panel during the manufacturing process and avoiding deformation or displacement.
[0047] Refer to Figure 3 As shown, a plurality of second top V-grooves 8 and a plurality of second bottom V-grooves 9 are provided at the connection between the process edge 4 and the first PCB board 1 and at the connection between the process edge 4 and the third PCB board 3, and second drill holes 10 are arranged in an array between the second top V-grooves 8 and the second bottom V-grooves 9.
[0048] It should be noted that in this embodiment, the second top V-groove 8 and the second bottom V-groove 9 are opened at the connection between the process edge 4 and the first PCB board 1 and at the connection between the process edge 4 and the third PCB board 3, so as to facilitate folding along the second top V-groove 8 and the second bottom V-groove 9 to achieve the purpose of separating the process edge 4 from the PCB panel. Additionally, similarly, this embodiment also takes into account that during the folding process, the entire PCB panel may bend because the rotary cutter does not cut the core of the PCB panel when opening the second top V-groove 8 and the second bottom V-groove 9, resulting in the problem of open circuit of the chip solder balls. Therefore, a number of second drill holes 10 are provided between the second top V-groove 8 and the second bottom V-groove 9 to break the stress of the core at the connection between the first PCB board 1 and the process edge 4 and at the connection between the process edge 4 and the third PCB board 3, so as to achieve easy folding and separation of the process edge 4 from the PCB panel, and avoid the open circuit of the chip solder balls, thereby further ensuring the quality of board separation and optimizing the user experience.
[0049] Embodiment 3:
[0050] Referring to Figure 1 and Figure 4 As shown, the present utility model discloses a chip pre-board separation structure, which includes a first PCB board 1, a second PCB board 2 and a third PCB board 3; the second PCB board 2 is fixedly connected between the first PCB board 1 and the third PCB board 3; a number of first top V-grooves 5 and a number of first bottom V-grooves 6 are opened at the connection between the second PCB board 2 and the first PCB board 1 and at the connection between the second PCB board 2 and the third PCB board 3, and a number of first drill holes 7 are provided between the first top V-groove 5 and the first bottom V-groove 6.
[0051] It should be noted that in this embodiment, the first PCB board 1, the second PCB board 2, and the third PCB board 3 form a PCB panel. After production, the PCB panel needs to be separated. To this end, a first top V-groove 5 and a first bottom V-groove 6 are opened at the connection between the first PCB board 1 and the second PCB board 2 and at the connection between the second PCB board 2 and the third PCB board 3, so as to facilitate folding along the first top V-groove 5 and the first bottom V-groove 6 to achieve the purpose of separating the board. In addition, this embodiment also considers that during the folding process, the entire PCB panel may bend because the rotary cutter does not cut the core of the PCB panel when opening the first top V-groove 5 and the first bottom V-groove 6, resulting in the problem of open circuit of the chip solder balls. Therefore, a number of first drill holes 7 are provided between the first top V-groove 5 and the first bottom V-groove 6 to destroy the stress of the core at the connection between the first PCB board 1 and the second PCB board 2 and at the connection between the second PCB board 2 and the third PCB board 3, so as to achieve easy folding and separation of the board, and can avoid open circuit of the chip solder balls, thus ensuring the quality of board separation and optimizing the user experience.
[0052] Referring to Figure 4 As shown, the size of the first top V-groove 5 is slightly smaller than that of the first bottom V-groove 6.
[0053] It should be noted that in this embodiment, the first top V-groove 5 and the first bottom V-groove 6 are nearly balanced. Considering that in the actual processing process, due to the sharpness of the upper and lower rotary cutters and the difference in the evenness of the PCB panel material, the size of the first top V-groove 5 may be slightly smaller than that of the first bottom V-groove 6. This solution can also set a number of first drill holes 7 between the first top V-groove 5 and the first bottom V-groove 6 to destroy the stress of the core at the connection between the first PCB board 1 and the second PCB board 2 and at the connection between the second PCB board 2 and the third PCB board 3, so as to achieve easy folding and separation of the board.
[0054] Referring to Figure 4 As shown, the first drill holes 7 are arranged in an array between the first top V-groove 5 and the first bottom V-groove 6.
[0055] It should be noted that in this embodiment, the array arrangement of the first drill holes 7 can ensure effective destruction of the stress of the core at the connection between the first PCB board 1 and the second PCB board 2 and at the connection between the second PCB board 2 and the third PCB board 3.
[0056] Referring to Figure 5As shown, the first PCB board 1, the second PCB board 2, and the third PCB board 3 all include a board core layer 11, a copper-clad layer 12, a PP board core layer 13, a copper circuit layer 14, and a solder mask layer 15; and the first PCB board 1, the second PCB board 2, and the third PCB board 3 are all designed with a symmetric structure, and from the inside to the outside are successively the board core layer 11, the copper-clad layer 12, the PP board core layer 13, the copper circuit layer 14, and the solder mask layer 15.
[0057] It should be noted that in this embodiment, the board core layer 11 serves as the core layer of the first PCB board 1, the second PCB board 2, and the third PCB board 3, and is usually composed of an insulating material, providing the main thickness and structural stability of the board; the copper-clad layer 12 covers both side surfaces of the board core layer 11 to provide electrical connection and signal conduction; the PP board core layer 13 is used to provide additional structural support and isolation, and can enhance the overall strength of the PCB panel; the copper circuit layer 14 is the circuit layer after the copper-clad layer 12 is etched, forming specific circuit paths for connecting different electronic components; the solder mask layer 15 is used for mounting and soldering electronic components to ensure the fixation and electrical connection of the components; and the structural designs of the first PCB board 1, the second PCB board 2, and the third PCB board 3 are all symmetric, that is, the hierarchical structure from the inside to the outside remains consistent. This symmetric structural design helps to improve the mechanical stability and electrical performance of the first PCB board 1, the second PCB board 2, and the third PCB board 3.
[0058] Refer to Figure 1 As shown, the chip pre-splitting board structure further includes a process edge 4, and the process edge 4 is fixedly connected to the side of the first PCB board 1 away from the second PCB board 2 and the side of the third PCB board 3 away from the second PCB board 2.
[0059] It should be noted that in this embodiment, the process edge 4 is an additional edge area added during the manufacturing process of the PCB panel to provide additional structural support, helping to maintain the stability of the PCB panel during the manufacturing process and avoiding deformation or displacement.
[0060] Refer to Figure 4 As shown, a plurality of second top V-grooves 8 and a plurality of second bottom V-grooves 9 are provided at the connection between the process edge 4 and the first PCB board 1 and at the connection between the process edge 4 and the third PCB board 3, and second drill holes 10 are arranged in an array between the second top V-grooves 8 and the second bottom V-grooves 9.
[0061] It should be noted that in this embodiment, a second top V-groove 8 and a second bottom V-groove 9 are opened at the connection between the process edge 4 and the first PCB board 1 and at the connection between the process edge 4 and the third PCB board 3, so as to facilitate folding along the second top V-groove 8 and the second bottom V-groove 9 to achieve the purpose of separating the process edge 4 from the PCB panel. Additionally, similarly, this embodiment also considers that during the folding process, the entire PCB panel may be bent because the rotary cutter does not cut the core of the PCB panel when opening the second top V-groove 8 and the second bottom V-groove 9, resulting in the problem of open circuit of the chip solder balls. Therefore, a number of second drill holes 10 are provided between the second top V-groove 8 and the second bottom V-groove 9 to destroy the stress of the core at the connection between the first PCB board 1 and the process edge 4 and at the connection between the process edge 4 and the third PCB board 3, so as to achieve easy folding and separation of the process edge 4 from the PCB panel, and avoid open circuit of the chip solder balls, thereby further ensuring the quality of board separation and optimizing the user experience.
[0062] The above is a specific description of the preferred embodiment of the present invention, but the present invention is not limited to the described embodiment. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included within the scope defined by the claims of this application.
Claims
1. A chip pre-splitting board structure, characterized in that, The chip pre-splitting board structure includes a first PCB board, a second PCB board, and a third PCB board; the second PCB board is fixedly connected between the first PCB board and the third PCB board; a plurality of first top V-grooves and a plurality of first bottom V-grooves are formed at the joints between the second PCB board and the first PCB board and between the second PCB board and the third PCB board, and a plurality of first drill holes are arranged between the first top V-grooves and the first bottom V-grooves.
2. The chip pre-splitting board structure according to claim 1, wherein The size of the first top V-groove is adapted to the size of the first bottom V-groove.
3. A chip pre-splitting board structure according to claim 1, characterized in that The size of the first top V-groove is slightly larger than the size of the first bottom V-groove.
4. A chip pre-splitting board structure according to claim 1, characterized in that, The size of the first top V-groove is slightly smaller than the size of the first bottom V-groove.
5. A chip pre-splitting board structure according to claim 2 or 3 or 4, characterized in that, The first drill holes are arranged in an array between the first top V-groove and the first bottom V-groove.
6. A chip pre-splitting board structure according to claim 1, characterized in that The first PCB board, the second PCB board, and the third PCB board all include a board core layer, a copper-clad layer, a copper circuit layer, and a solder mask layer; and the first PCB board, the second PCB board, and the third PCB board are all designed with a symmetric structure, and from the inside to the outside are successively the board core layer, the copper-clad layer, the PP board core layer, the copper circuit layer, and the solder mask layer.
7. A chip pre-splitting board structure according to claim 6, characterized in that, The chip pre-splitting board structure further includes a process edge, and the process edge is fixedly connected to the side of the first PCB board away from the second PCB board and the side of the third PCB board away from the second PCB board.
8. A chip pre-splitting board structure according to claim 7, characterized in that A plurality of second top V-grooves and a plurality of second bottom V-grooves are provided at the joints between the process edge and the first PCB board and between the process edge and the third PCB board, and second drill holes arranged in an array are provided between the second top V-grooves and the second bottom V-grooves.