Compression molding equipment for circuit board molding processing

Abstract

The utility model relates to compression molding equipment, in particular to compression molding equipment for molding and processing a circuit board. Comprising an equipment base, supporting columns, an upper top plate, hydraulic cylinders, a lower die, an upper die and the like. Supporting columns are fixedly welded to the left side and the right side of the rear portion of the equipment base, an upper top plate is fixedly connected between the front portions of the supporting columns, a hydraulic cylinder is installed on the upper top plate, an upper die is fixedly connected to a hydraulic rod of the hydraulic cylinder, and a lower die is fixedly arranged on the upper portion of the equipment base. According to the utility model, when the circuit board is quickly positioned and placed through the positioning pin and when the upper die moves downwards and the heating block extrudes the circuit board on the material table, the positioning pin is matched with the lifting pin, so that the target position on the circuit board is always in a position limiting state under the condition that the process of compression molding is not influenced; when the circuit board is pressed, the whole position of the circuit board does not deflect, and the pressing forming effect is ensured.

Description

Technical Field

[0001] The utility model relates to a pressing and forming device, in particular to a pressing and forming device for circuit board forming and processing. Background Art

[0002] Circuit board lamination is to cover prefabricated copper foils and resins on a substrate, and then laminate them together at one time, usually by hot pressing, using heat and pressure to press multiple layers of PCB materials together.

[0003] The pressing of circuit boards usually uses special lamination equipment to achieve. During the hot pressing process, it is necessary to control the temperature, pressure and time well to ensure good bonding between layers and minimize internal stress. When laminating, the circuit boards to be laminated are usually placed on a customized tooling with positioning grooves, and are manually placed at the precise position in the tooling. Subsequently, the circuit boards are pressed by the lamination equipment. However, due to the lack of a structure for mutual positioning between the stacked layers, during pressing, due to uneven pressure or temperature changes, there will be an offset between the stacked layers, resulting in deformation of the pressed circuit board, accidental contact between conductors of different signal layers, leading to circuit board function failure and safety problems, and even damaging the circuit, affecting subsequent component installation and use. Summary of the Utility Model

[0004] In order to overcome the drawback that there is no structure for mutual positioning between the stacked layers, during pressing, due to uneven pressure or temperature changes, there will be an offset between the stacked layers, resulting in deformation of the pressed circuit board, affecting subsequent component installation and use, and even damaging the circuit, the purpose is to provide a pressing and forming device for circuit board forming and processing, which is provided with a positioning mechanism during pressing, so that the board surfaces between layers on the circuit board are always in a state of position limitation, ensuring that the overall position of the circuit board does not deviate during pressing, and ensuring the pressing and forming effect.

[0005] The technical implementation solution of the present utility model is: A pressing and forming device for circuit board forming and processing, including a device base, support columns, an upper top plate, a hydraulic cylinder, a lower mold, a material table, positioning pins, elastic members, an upper mold, guide columns, heating blocks, and ejector pins. On both the left and right sides of the rear part of the device base, support columns are fixedly welded. Between the front parts of the support columns, an upper top plate is fixedly connected. A hydraulic cylinder is installed on the upper top plate. The hydraulic rod of the hydraulic cylinder is fixedly connected with an upper mold. A lower mold is fixedly arranged on the upper part of the device base. A material table is arranged above the lower mold. Positioning pins are slidably arranged around the upper part of the material table. The bottom of the positioning pins is connected with elastic members. The positioning pins are elastically connected to the material table through the elastic members. A square cavity is arranged inside the upper mold. The square cavity is located at the central position inside the upper mold. The directional cavity on the upper mold is located directly above the material table, and the size and shape of the cavity are consistent with the material table. A heating block is fixedly connected inside the square cavity of the upper mold. Four ejector pins are connected to the periphery of the bottom of the heating block. The four ejector pins and the positioning pins on the same side of the material table are concentric. On both the front and rear sides of the bottom of the upper top plate, guide columns are symmetrically arranged left and right. The four guide columns all pass through the upper mold downward and are fixedly connected with the lower mold. The upper mold slides up and down between the guide columns.

[0006] Furthermore, it also includes a top block, a wedge block, a guide rod, and a spring. The edges around the square cavity at the bottom of the upper mold are all fixedly connected with top blocks. Around the material table on the lower mold, wedge blocks corresponding to the positions of the four top blocks are slidably arranged. The lower parts of the wedge blocks are all slidably connected with the lower mold through guide rods. Springs are wound around the outer sides of the guide rods. The two ends of the springs are respectively connected with the wedge blocks and the lower mold. Under the action of the springs, the four wedge blocks are all on the side close to the material table.

[0007] Furthermore, it also includes a liquid cooling device and a pipeline. A liquid cooling device is installed at the front part inside the material table. The rear part of the liquid cooling device is connected and communicated with a pipeline. The pipeline is evenly arranged on the inner upper wall of the material table.

[0008] Furthermore, it also includes air holes and air connectors. There are no less than three air holes opened on the upper part of the material table. The lower ends of the air holes are all connected with air connectors.

[0009] Furthermore, the material table is fixed inside the lower mold through screws.

[0010] The present utility model has the following advantages: 1. While the present utility model quickly positions and places the circuit board through the positioning pins, when the upper mold moves downward and the heating block presses the circuit board on the material table, the positioning pins and the ejector pins cooperate. Without affecting the pressing and forming process, the target positions on the circuit board are always in a state of position limitation, ensuring that when the circuit board is pressed, the overall position of the circuit board does not deviate, and ensuring the pressing and forming effect.

[0011] 2. The utility model is connected to an external negative pressure device through an air joint, so that a negative pressure is formed on the surface of the material table through the air holes, and the circuit board is adsorbed on the material table. After pressing and forming, it can avoid the adhesion between the heating block and the circuit board. When the circuit board is carried to a high place, there is a risk that the circuit board may fall and be damaged by hitting hard objects.

[0012] 3. The utility model circulates the cooling liquid through the cooling device and the pipeline to cool the surface of the material table and the circuit board on the surface, avoiding the harm caused to people when the high-temperature circuit board is unloaded after pressing, accelerating the cooling process of the circuit board, and reducing the waiting time for the circuit board to cool in subsequent processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0014] Figure 2 It is a three-dimensional structural schematic diagram of components such as the lower die and the material table of the utility model.

[0015] Figure 3 It is a cross-sectional view of components such as the material table, the positioning pin and the elastic member of the utility model.

[0016] Figure 4 It is a three-dimensional structural schematic diagram of components such as the wedge block, the guide rod and the spring of the utility model.

[0017] Figure 5 It is a three-dimensional structural schematic diagram of components such as the upper die, the heating block and the top block of the utility model.

[0018] In the above drawings: 1: equipment base, 2: support column, 3: upper top plate, 4: hydraulic cylinder, 5: lower die, 50: material table, 51: positioning pin, 52: elastic member, 6: upper die, 60: guide column, 61: heating block, 62: top pin, 8: top block, 81: wedge block, 82: guide rod, 83: spring, 9: liquid cooling device, 91: pipeline, 10: air hole, 11: air joint. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] Referring to the embodiments herein means that the specific features, structures or characteristics described in connection with the embodiments may be included in at least one embodiment of the utility model. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0020] Embodiment 1: A pressing and forming device for circuit board forming and processing, as Figures 1-5As shown in the figure, it includes a device base 1, support columns 2, an upper top plate 3, a hydraulic cylinder 4, a lower mold 5, a material table 50, positioning pins 51, elastic members 52, an upper mold 6, guide columns 60, heating blocks 61, and ejector pins 62. Support columns 2 are fixedly welded on the left and right sides at the rear of the device base 1. An upper top plate 3 is fixedly connected between the front parts of the support columns 2. A hydraulic cylinder 4 that provides a downward pressure during pressing is installed on the upper top plate 3. The hydraulic rod of the hydraulic cylinder 4 is fixedly connected with an upper mold 6. A lower mold 5 is fixedly arranged on the upper part of the device base 1. A material table 50 is arranged on the upper part of the lower mold 5. The material table 50 is used for placing the circuit board to be pressed. Positioning pins 51 are slidably arranged around the upper part of the material table 50. The prerequisite for setting the positioning pins is that before pressing, the stacked circuit boards will be drilled with targets to drill a number of target holes for the positioning of subsequent circuit board processing. The bottom of the positioning pin 51 is connected with an elastic member 52. The positioning pins 51 are elastically connected to the material table 50 through the elastic members 52. When pressing the positioning pins 51, the positioning pins 51 will slide downward into the lower mold 5. A square cavity is arranged in the upper mold 6. The square cavity in the upper mold 6 is located at the central position in the upper mold 6. The direction cavity on the upper mold 6 is located directly above the material table 50, and the cavity size and the slot opening shape match the material table 50. A heating block 61 for heating the board surface during hot pressing is fixedly connected in the square cavity of the upper mold 6. When the upper mold 6 and the lower mold 5 are closed, the heating block will wrap the circuit board on the material table 50. Ejector pins 62 are connected to the four peripheries of the bottom of the heating block 61. The four ejector pins 62 and the positioning pins 51 in the same orientation on the material table 50 are in concentric positions. During the process of the upper mold 6 pressing downward, the ejector pins 62 will contact the positioning pins 51 and press the positioning pins into the lower mold 5. Guide columns 60 are symmetrically arranged on the left and right on the front and rear sides of the bottom of the upper top plate 3. The four guide columns 60 all pass downward through the upper mold 6 and are fixedly connected with the lower mold 5. The upper mold 6 slides up and down between the guide columns 60. The purpose of setting the guide columns 60 is to guide the downward movement of the upper mold 6 and reduce the situation of jitter and deviation of the upper mold 6 when applying extrusion pressure during pressing.

[0021] Initially, the hydraulic rod of the hydraulic cylinder 4 is in a retracted state. The upper die 6 is located between the upper parts of the guide columns 60. The stacked circuit boards are placed on the material table 50. The drilling target holes on the edge of the circuit board are aligned with the positioning pins 51 on the material table 50 for quick positioning and placement. After placement, the heating block 61 is controlled to heat up. The hydraulic rod is controlled to extend downward to drive the upper die 6 to move downward. The upper die 6 and the lower die 5 are closed. The heating block 61 presses the circuit board on the material table 50. Through the simultaneous application of pressure and heat, the stacked circuit boards are laminated, pressed, and bonded. During the downward movement of the upper die 6, the top pin 62 will contact the positioning pin 51 and press it downward into the material table 50. While the positioning pin 51 quickly positions and places the circuit board, when the upper die 6 moves downward and the heating block 61 presses the circuit board on the material table 50, the positioning pin 51 and the top pin 62 cooperate to keep the target position on the circuit board in a position-limited state without affecting the pressing process, ensuring that the overall position of the circuit board does not skew when being pressed and guaranteeing the pressing effect.

[0022] Embodiment 2: On the basis of Embodiment 1, as Figure 1 , Figure 4 and Figure 5 shown, it further includes a top block 8, a wedge block 81, a guide rod 82, and a spring 83. The edges around the square hole at the bottom of the upper die 6 are fixedly connected with top blocks 8. Wedge blocks 81 corresponding to the positions of the four top blocks 8 are slidably arranged around the material table 50 on the lower die 5. The upper parts of the wedge blocks 81 are provided with inclined surfaces. During the downward movement of the top block 8 with the upper die 6, it will contact the inclined surfaces of the upper parts of the wedge blocks 81. The lower parts of the wedge blocks 81 are slidably connected to the lower die 5 through guide rods 82. Springs 83 are wound around the outer sides of the guide rods 82. The two ends of the springs 83 are respectively connected to the wedge blocks 81 and the lower die 5. Under the action of the springs 83, the four wedge blocks 81 are all on the side close to the material table 50. When the top block 8 contacts the wedge block 81 and applies a squeezing force to it, the four wedge blocks 81 will simultaneously move away from the material table 50 on the side of the force, and the springs 83 are squeezed. After the top block 8 and the wedge block 81 are separated from contact, the wedge block 81 moves back under the restoring force of the spring 83.

[0023] As Figure 3 and Figure 4 , it further includes a liquid cooling device 9 and a pipeline 91. The liquid cooling device 9 is installed at the front part inside the material table 50. The liquid cooling device 9 is provided with cooling liquid. The rear part of the liquid cooling device 9 is connected and communicated with a pipeline 91. The pipeline 91 is evenly arranged on the inner upper wall of the material table 50. The liquid device 9 circulates the cooling liquid through the pipeline 91 to cool down the material table 50.

[0024] As Figures 2-3As shown in the figure, it also includes air holes 10 and air connectors 11. There are at least three air holes 10 opened in the upper part of the material table 50. The installation positions of the air holes 10 should avoid the pipeline 91. The lower ends of the air holes 10 are all connected with air connectors 11. The air connectors 11 are used to connect to the negative pressure device outside the equipment, and a negative pressure area is formed on the surface of the material table 50 through the air holes 10. When an object with a relatively smooth surface is placed on the material table 50, it will be firmly sucked.

[0025] The circuit board is quickly positioned on the material table 50 under the guidance of the wedge block 81, without the need for manual and relatively precise alignment of the circuit board target holes to the positioning pins 51. When the upper die 6 moves downward, a negative pressure device outside is connected through the air connector 11. The negative pressure device performs suction through the air connector 11, and a negative pressure is formed on the surface of the material table 50 through the air holes 10 to adsorb the circuit board on the material table 50. After pressing and forming, to avoid the heating block 61 sticking to the circuit board, the circuit board is carried to a high place. There is a risk that the circuit board will fall and hit hard objects at a high place, which will affect the normal blanking of the circuit board. After pressing is completed, the upper die 6 moves upward and disengages from the lower die 5. The cooling device starts to work and circulates the cooling liquid through the pipeline 91 to cool the surface of the material table 50 and the circuit board on the board surface, avoiding injury to people when the high-temperature circuit board is blanked after pressing, accelerating the cooling process of the circuit board, and reducing the waiting time for the circuit board to cool in subsequent processing.

[0026] In a preferred embodiment: The material table 50 is fixed in the lower die 5 by screws. Through the connection method of bolts, the material table 50 can be firmly installed in the lower die 5, and the material table 50 can be quickly changed according to the model of the processed circuit board.

[0027] The above are only the embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A pressing and forming device for circuit board forming processing, including a device base (1), support columns (2), an upper top plate (3), a hydraulic cylinder (4), a lower mold (5) and an upper mold (6). On the left and right sides of the rear part of the device base (1), support columns (2) are fixedly welded. Between the front parts of the support columns (2), an upper top plate (3) is fixedly connected. A hydraulic cylinder (4) is installed on the upper top plate (3). An upper mold (6) is fixedly connected to the hydraulic rod of the hydraulic cylinder (4). A lower mold (5) is fixedly arranged on the upper part of the device base (1). It is characterized in that: It further includes a material table (50), positioning pins (51), elastic members (52), guide columns (60), heating blocks (61) and ejector pins (62). A material table (50) is arranged on the upper part of the lower mold (5). Positioning pins (51) are slidably arranged around the upper part of the material table (50). Elastic members (52) are connected to the bottoms of the positioning pins (51). The positioning pins (51) are elastically connected to the material table (50) through the elastic members (52). A square cavity is arranged in the upper mold (6). The square cavity is located at the center position inside the upper mold (6). The directional cavity on the upper mold (6) is located directly above the material table (50), and the size and shape of the cavity match the material table (50). Heating blocks (61) are fixedly connected in the square cavity of the upper mold (6). Ejector pins (62) are connected to the peripheries of the bottoms of the heating blocks (61). The four ejector pins (62) and the positioning pins (51) in the same orientation on the material table (50) are in concentric positions respectively. Guide columns (60) are symmetrically arranged on the left and right sides of the front and rear parts of the bottom of the upper top plate (3). The four guide columns (60) all pass through the upper mold (6) downward and are fixedly connected to the lower mold (5). The upper mold (6) slides up and down between the guide columns (60).

2. The pressing and forming equipment for circuit board forming and processing according to claim 1, characterized in that: It further includes a top block (8), a wedge block (81), a guide rod (82) and a spring (83). Top blocks (8) are fixedly connected to the peripheries of the edges of the square cavity at the bottom of the upper mold (6). Wedge blocks (81) corresponding to the positions of the four top blocks (8) are slidably arranged around the material table (50) on the lower mold (5). The lower parts of the wedge blocks (81) are slidably connected to the lower mold (5) through the guide rods (82). Springs (83) are wound around the outer sides of the guide rods (82). The two ends of the springs (83) are respectively connected to the wedge blocks (81) and the lower mold (5). Under the action of the springs (83), the four wedge blocks (81) are all on the side close to the material table (50).

3. A pressing and forming device for circuit board forming and processing according to claim 2, characterized in that: It further includes a liquid cooling device (9) and a pipeline (91). A liquid cooling device (9) is installed at the front part inside the material table (50). The rear part of the liquid cooling device (9) is connected and communicated with a pipeline (91). The pipeline (91) is evenly arranged on the inner upper wall of the material table (50).

4. A pressing and forming device for circuit board forming and processing according to claim 3, characterized in that: It further includes air holes (10) and air connectors (11). No less than three air holes (10) are opened on the upper part of the material table (50). The lower ends of the air holes (10) are all connected with air connectors (11).

5. A pressing and forming device for circuit board forming and processing according to claim 4, characterized in that: The material table (50) is fixed in the lower mold (5) by screws.

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